TW200537529A

TW200537529A - Conductive film for touch panel and method for manufacturing

Info

Publication number: TW200537529A
Application number: TW094114821A
Authority: TW
Inventors: Hironobu Shinohara
Original assignee: Hs Planning Ltd
Priority date: 2004-05-07
Filing date: 2005-05-09
Publication date: 2005-11-16
Also published as: KR20070009724A; TWI291182B; JPWO2005109449A1; JP4763597B2; WO2005109449A1; KR101186894B1

Abstract

The goal of this invention is to utilize a conductive polyethylene terephthalate (PET) film for touch panels that is small in shrinkage and dimensional change conductive film. The change conductive film of touching panel possesses the excellent high-temperature resistance and markedly excellent sliding resistance. This invention provides a conductive film for touch panels, its characteristic is that a base with at least a layer composed PET and a cured layer obtained by curing a crosslinkable substance and a conductive film formed on the base. The shrinkage of the base after heating at 150 DEG C for 1 hour is not more than 0.5% in both longitudinal direction (MD) and transverse direction (TD). Particularly, it is a conductive film for touch panels. The touch panel is obtained by attaching a transparent conductive film to a PET film base. The PET film has a shrinkage of not more than 0.5%, It is obtained by curing a crosslinkable substance on a PET film at 100 DEG C~180 DEG C before attaching an inorganic transparent conductive film such as an ITO film to the PET film base by sputtering, etc.

Description

200537529 玖、發明說明：【發明所屬之技術領域】本發明係有關作為觸控面板顯示器之透明導電性膜所使用之觸控面板用導電性膜，及其製造方法。詳細而言，有關即使高溫仍安定，且滑動所造成之劣化小之觸控面板用導電性膜及其製造方法。【先前技術】透明導電性膜係作為觸控面板（以下可能稱為τρ)之電極、液晶顯示器之電極、電致發光顯示器之電極等光學顯示器之電極而使用。例如：於電阻膜方式之觸控面板，_ 般而言，透明導電玻璃板及透明導電性膜係作為電極，經由間隔物而對向地使用，其中該透明導電玻璃板係氧化鋼錫（以下亦可能稱為ΙΤΟ)以濺鍍等方法附著，該透明導電性膜係ΙΤΟ以濺鑛等方法’附著於聚對苯二甲酸乙二酿膜等塑膠膜（以下亦可能稱為ρΕΊΓ膜）等塑膠膜。觸控面板廣泛地被使用，其配置於顯示裝置上，藉由一面觀看顯示，一面以手指或筆等按壓，可輸入資料或指示、命令。在用於觸控面板之透明導電性膜，需要圖案化或使銀糊硬化之工序，為了此硬化，必須以120 C至170°c之溫度’保持數分鐘至數小時。然而，pet膜之炫點雖在3 0 0 C以上’但玻璃轉移溫度卻低至7 〇多。。，且由於為結晶性樹脂，多被延伸，若施以上述溫度之後，再A 卻至室溫，具有膜會大幅收縮的問題。因此，於導電性膜輕曲或對向電極為附ITO之玻璃之情況，與由於熱膨脹係 200537529 面板亦傾向大型化’由於此類溫度變化，亦具有在尺寸發生紊亂，或產生電極間之位置偏差的問題。數小’即使加熱仍幾乎不會有尺寸變化之附ιτ〇之玻璃間 ’將產生圖案化電極之位置偏差的問題。X，觸控面板亦使用於車内等高溫環境，因此PET膜具有由於每次重複膨脹收縮而產生敵紋，或產生波浪紋的問題。近年來，觸控200537529 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a conductive film for a touch panel used as a transparent conductive film for a touch panel display, and a method for manufacturing the same. Specifically, the present invention relates to a conductive film for a touch panel that is stable even at high temperatures and has less deterioration due to sliding, and a method for manufacturing the same. [Prior art] Transparent conductive films are used as electrodes of optical displays such as electrodes of touch panels (hereinafter may be referred to as τρ), electrodes of liquid crystal displays, electrodes of electroluminescent displays, and the like. For example, in a touch panel with a resistive film method, in general, a transparent conductive glass plate and a transparent conductive film are used as electrodes and are used to face each other through a spacer. The transparent conductive glass plate is steel tin oxide (hereinafter (It may also be referred to as ΙΟ). It is attached by sputtering or the like. The transparent conductive film ITO is' attached to a plastic film such as polyethylene terephthalate by sputtering or the like (hereinafter may also be called ρΕΊΓ film), etc. Plastic film. Touch panels are widely used. They are arranged on display devices. By viewing the display and pressing with a finger or a pen, you can enter data or instructions and commands. In the transparent conductive film used for a touch panel, a process of patterning or hardening the silver paste is required. In order to harden it, it must be held at a temperature of 120 C to 170 ° c for several minutes to several hours. However, although the dazzling point of the pet film is above 300 ° C, the glass transition temperature is as low as more than 700. . Moreover, since it is a crystalline resin, it is often stretched. If A is brought to room temperature after the above temperature is applied, there is a problem that the film shrinks significantly. Therefore, when the conductive film is slightly curved or the counter electrode is glass with ITO, the panel also tends to become larger due to the thermal expansion system. The problem of deviation. If the number is small, there is a problem that there is almost no dimensional change in the inter-glazed glass even when heated, and the positional deviation of the patterned electrode is caused. X. The touch panel is also used in high-temperature environments such as the interior of a car. Therefore, the PET film has the problem of generating hostility or wavy patterns due to repeated expansion and contraction. In recent years, touch

另一方面’提高透明導電性膜之_滑純，亦成為重大的課題。觸控面板有僅感測手指觸碰之開啟—關閉即可之數位方式，及能以筆等輸人圖像或文字之類比方式。其中特別是在類比方式，由於直接以筆等，在透明導電性膜上輸入’因此每次輸人時，具有彈力之PET膜撓曲，故應力 2加於附著在其表面之ΙΤ0β通常，以250g程度之荷重，實施10萬次以上之直線書寫或文字t寫之滑動測試，於 ITO之在接（·生不佳之情況，由於重複筆輸入，於ITO產生細 Μ裂縫或離，具有電阻值大幅上升，導電機能消失的問題。又，於密接性良好之情況，由於重複滑動所造成之應力’亦可能於⑽產生相同問題。近年來，此滑動性係要求以500g之荷重，進行3〇萬次測試合格，再者，更加要求滑動特性優異之透明導電性膜。為了改善此附ITO之PET膜之滑動特性，係進行各種檢討例如.於曰本專利公報第2667680號，以特定黏著劑貼合厚125/zm程度之PET膜及厚度之附IT〇之pET膜，於較厚之PET膜上，利用黏著劑之緩衝性，吸收以筆輸入時之施力，使ITO不至受損，改善滑動特性。然而，於此 4 200537529 Μ 方式，多數仍未必符合以5〇〇g荷重，進行3〇萬次的筆滑動，具有以下問題：在黏著層剝離，黏著劑偏黃地著色的問題，由於黏著劑之耐熱性或吸濕性不佳，在嚴苛的環境下變枭的問題；及相較於未進行而直接於PET附著IT〇之單片構成之ΙΤΟ膜，構成較複雜，因此製造工序複雜，變得昂貴的問題。並且’為了改善滑動性，嘗試使ΙΤ〇變得緻密且高強度。此方法係以濺鍍法，在ΡΕΤ膜附加非晶質ΙΤ〇之後，以 φ C程度之溫度，進行數小時至數十小時之退火，使非晶質 ΙΤΟ成為結晶化ΙΤΟ。相較於附著有非晶性ΙΤ〇之透明導電性膜，附著有此結晶化ΙΤ0之透明導電膜係滑動性較佳，但作為筆輸入之ΤΡ，並未符合所有條件。又，由於需要長時間的退火，具有透明性將受損或偏黃地著色，變得昂貴的問題。又，於PET膜形成ΙΤΟ層之後，如此地以15〇t：w 近之溫度進行退火處理，可使MD及TD方向之熱收縮率為 0.5%以下，但於此情況，IT〇層本身雖成為結晶性，變得籲高強度，但由於重複的滑動，ΙΤΟ層可能從ΡΕΤ膜剝離，或視情況，可能產生細微裂縫。如此，關於耐滑動性優異之透明導電性膜，雖已進行各種檢討，但不僅未必會符合所要求之耐滑動型，而且以往的構造複雜，或者製造工序複雜，因此具有犧牲滑動特性以外的光學特性’或成本上升的缺陷。並且，ΤΡ之導電性膜有必須防止筆或手指摩擦而損傷、防止圖像偏差或防止發生牛頓環之情況。又，為了使圖像 200537529 清晰或明亮，亦要求高透光率。再者，於tp用導電性膜，自以往為 Ρ Τη Τ* * 万止表面才貝傷，於 ΡΕΤ^表面設置紫外線硬化偉& H 但此紫外線硬化樹脂每糸作為用以提高表面硬度之討作|万止知知層而設置，並未檢 4作為改善基體之熱安定性，性之方法。飞改。作為導電性膜之滑動【發明内容】 =明之㈣在於完全解決前述以往之關題，達成以产亦p本發明之目的在於提供—種即使在嚴苛環兄下’尺寸變化仍小，且滑動特性㈣特別優異之觸控面板用 ¥冤性膜，以及其製造方法。 :了解決前述課題而進行銳意檢討，發現一種導電性膜，一次解決前述問題，且成為滑動特性特別優異之觸控面板用導電性膜；其中該導電性膜係於至少具有由PET膜所形成之層’及架橋性物質已硬化成膜之硬化層之基體上，形成導電膜而成；且前述基體在以150。0 長度方向㈣及寬度方向(TD)之收縮率均為= 下。亦即，發明者設想在PET膜所組成之透明導電性膜，於加熱之情況’線膨脹係數相較於有機物之ρΕτ膜遠遠較小之1τ〇等無機氧化物，作為導電膜附著於表面，因此不僅於用=銀糊硬化之15(rc程度之加熱工序後或高溫環境之 ^寸此等無機氧化物與PET膜之間之熱所造成之膨脹率或收縮率之不同，將成為導電性膜翹曲或產生皺紋之原 I · ；200537529 、口而且由於此熱所造成之膨脹率或收縮率之不同，成為 . #電膜從膜剝落或於導電膜產生裂縫的主要原因，引起導電性降低或作為電極無法作用之狀態。又，即使於導電膜未從PET膜剝離或未產生裂缝之情況，仍設想由於上述高 ,、、、處理或條件，於IT〇等無機化合物或ρΕτ膜之界面會殘留應力’利用於觸控面板之情況，若重複利用筆之滑動，會產生剝離或裂縫。此類現象可能對於对滑動性造成不良影響。根據此設想，獲得新的酌見，其係抑制基體之熱所造 _ 成之收縮率及尺寸變化’藉由硬化層使基體安定，將顯著改善對於觸控面板之透明導電性膜所特別要求之滑動特性，並終至完成本發明。亦即’用以解決前述課題之方法係如下。〈1〉一種觸控面板用導電性膜，其特徵在於：在至少具有由聚對苯二甲酸乙二醋膜所形成之層，及架橋性物/已被硬化成膜之硬化層之基體上，形成導電膜而成；前述基體在以15(rc加熱i小時之後之長度方向（MD)及寬度方向 ® ( TD)之收縮率均為0.5%以下。〈2〉如岫述〈1〉所記載之觸控面板用導電性膜，其中作為硬化層者，基體係具有熱架橋性物質已硬化成狀硬化層。〈3>如前述〈2〉所記載之觸控面板用導電性膜，直中基體係進一步具有：藉由光或電子線之架橋性物質已硬化成膜之硬化層。〈4〉如前述〈3〉所記载之觸控面板用導電性膜，其中On the other hand, 'improving the smoothness of transparent conductive films' has also become a major issue. The touch panel has a digital mode that can only be turned on and off by sensing the touch of a finger, and an analog method that can input images or text with a pen or the like. Especially in the analog method, since a pen or the like is directly inputted on a transparent conductive film, each time a person is input, the elastic PET film is flexed, so the stress 2 is applied to the ITO 0β attached to the surface. A load of 250g is used to perform a sliding test of more than 100,000 straight-line writing or text t-writing. In the case of poor connection, due to repeated pen input, fine Μ cracks or separation occur in ITO, which has a resistance value. The problem that the conductive function disappears greatly. In the case of good adhesion, the same problem may occur in the stress due to repeated sliding. In recent years, this sliding property requires a load of 500g for 3 °. Passed 10,000 tests, and moreover, a transparent conductive film with excellent sliding characteristics is required. In order to improve the sliding characteristics of this ITO-attached PET film, various reviews are performed. For example, in Japanese Patent Publication No. 2667680, specific adhesives are used. Laminate a PET film with a thickness of 125 / zm and a pET film with IT0 thickness. On the thicker PET film, use the cushioning property of the adhesive to absorb the force applied by pen input, so that ITO will not be damaged, and the sliding characteristics are improved. However, in this method of 2005200529M, most of them still may not meet the requirement of performing 300,000 pen swipes with a load of 500g, which has the following problems: peeling in the adhesive layer, adhesive The problem of yellowish coloration, due to the poor heat resistance or hygroscopicity of the adhesive, and the problem of tarnishing in harsh environments; and ITO, which is a single piece of IT0 that is directly adhered to PET compared to the non-processed one. The film has a complicated structure, so the manufacturing process is complicated, and it becomes expensive. Also, 'to improve the sliding properties, try to make ITO dense and high-strength. This method uses sputtering to add amorphous to the PET film. After ITO, annealing is performed at a temperature of about φ C for several hours to tens of hours, so that the amorphous ITO becomes crystallized ITO. Compared to a transparent conductive film having an amorphous ITO attached to it, The crystallized ITO transparent conductive film has better sliding properties, but the TP input as a pen does not meet all conditions. Moreover, because it requires a long time for annealing, the transparency will be damaged or colored yellowish, which will make it expensive. This is an expensive problem. After the PET film is formed with the ITO layer, annealing treatment at a temperature of about 15 t: w can make the thermal shrinkage in the MD and TD directions less than 0.5%. However, in this case, IT Although the 〇 layer itself is crystalline and has a high strength, the ITO layer may be peeled from the PET film due to repeated sliding, or micro cracks may be generated depending on the situation. Thus, regarding a transparent conductive film having excellent sliding resistance, Although various reviews have been carried out, not only do not necessarily meet the required sliding resistance type, but also the conventional structure is complicated or the manufacturing process is complicated, so it has the disadvantage of sacrificing optical characteristics other than sliding characteristics or increased cost. Moreover, the conductive properties of TP Sexual film may prevent damage by pen or finger friction, image deviation, or Newton's ring. In addition, in order to make the image 200537529 clear or bright, a high light transmittance is also required. In addition, a conductive film for tp has been previously used as P Τη Τ * * only the surface has been damaged, and UV curing is set on the PET ^ surface. However, each UV curing resin is used to improve the surface hardness. It is set up as a universal knowledge layer, and has not been examined as a method to improve the thermal stability and properties of the substrate. Flying change. Sliding as a conductive film [Inventive content] = The clear idea is to completely solve the previous problems and achieve production. The purpose of the present invention is to provide a kind of dimensional change that is small even under severe conditions and sliding Features: Particularly good film for touch panels and its manufacturing method. : An intensive review was made to solve the aforementioned problems, and a conductive film was found that solved the aforementioned problems at one time and became a conductive film for a touch panel with particularly excellent sliding characteristics; wherein the conductive film is formed of at least a PET film The layer 'and the bridging substance have been cured to form a conductive film on the substrate of the hardened layer, and a conductive film is formed; and the shrinkage ratios of the aforementioned substrate in the length direction 150 ′ and the width direction (TD) are both below. That is, the inventor envisages that when a transparent conductive film composed of a PET film is heated, the linear expansion coefficient of the transparent conductive film, which is much smaller than that of an organic ρΕτ film, such as 1τ〇, is attached to the surface as a conductive film. Therefore, it will become conductive only if the difference between the expansion rate or the shrinkage rate caused by the heat between these inorganic oxides and the PET film after a heating process of 15 (rc degree hardening with silver paste or a high temperature environment ^ inch). The original I · of the warped or wrinkled film; 200537529, and the difference in expansion or contraction caused by this heat becomes. # The main reason for the peeling of the electric film from the film or the cracks in the conductive film, which cause conductivity. In a state where the properties are reduced or it cannot function as an electrode. Even if the conductive film is not peeled from the PET film or cracks do not occur, it is still assumed that due to the above-mentioned high ,,,, or processing, the inorganic compounds such as IT0 or ρΕτ film The residual stress on the interface is used in the case of the touch panel. If the sliding of the pen is reused, peeling or cracking will occur. Such phenomena may adversely affect the sliding property. Root This idea has gained new insights. It is to suppress the shrinkage and dimensional changes caused by the heat of the substrate. The stabilization of the substrate by the hardened layer will significantly improve the special requirements for the transparent conductive film of the touch panel. The sliding characteristics, and finally the present invention is completed. That is, the method to solve the aforementioned problems is as follows. <1> A conductive film for a touch panel, characterized in that it has at least polyethylene terephthalate The layer formed by the vinegar film, and the conductive material formed on the substrate of the bridging material / hardened layer that has been hardened into a film; the length direction (MD) and width direction of the aforementioned substrate after heating at 15 (rc for 1 hour) ® (TD) has a shrinkage rate of less than 0.5%. <2> The conductive film for touch panels as described in <1> above, where as the hardened layer, the base system has a thermally bridging substance that has hardened into a shape Hardened layer. <3> The conductive film for a touch panel as described in <2> above, the straight-based system further includes: a hardened layer that has been hardened into a film by a bridging substance of light or electron wire. <4> As described in the aforementioned <3> The touch panel with a conductive film, wherein

(S 9 200537529 -基體係於PET膜層之兩側，具有藉由光或電子線之架橋性物質已硬化成膜之硬化層。，⑸如前述⑴至“〉中任-項所記載之觸控面板用導電性膜’其令導電膜為非晶性IT〇 (氧化銦錫）。〈6〉如刖述〈1〉至〈5〉中任一項所記载之觸控面板用導電性膜’其藉由預先在處理成以15代加熱〗小時之後之長度方向（MD)及寬度方向（TD)之收縮率均為⑺州以下之基體，使導電膜附著所獲得。 • ⑺如前述<6〉所記載之觸控面板用導電性膜，其中至少1層之硬化層係在以10(rc至丨8(rc間之溫度，將ΡΕΤ膜進行熱處理之同時，或以100<1:至180。(：間之溫度，將ΡΕΤ 膜進行熱處理之後，使架橋性物質在前述ΡΕΤ膜之至少一面硬化所獲得。〈8〉如前述〈7〉所記載之觸控面板用導電性膜，其中至少1層之硬化層係在以l〇(TCS18(rc間之溫度，將叩丁膜進行熱處理之同時，或以間之溫度，將ρΕτ _ 膜進行熱處理之後，且前述PET膜冷卻至室溫之前，使架橋性物質在前述PET膜之至少一面硬化所獲得。〈9〉如前述〈7〉所記載之觸控面板用導電性膜，其中至少1層之硬化層係在以12(TC至180。〇間之溫度，將pET膜進行熱處理之同時，或以120。(：至180。(：：間之溫度，將ρΕτ 膜進行熱處理之後，使架橋性物質在前述ΡΕΤ膜之至少一面硬化所獲得。〈10〉如前述〈1〉至〈9〉中任一項所記載之觸控面板 10 200537529 $ 4 名用導電性膜，其中PET膜為二軸延伸之pE丁膜。〈1 1〉如鈾述〈2〉所§己載之觸控面板用導電性膜，其中架橋性物質藉由熱而硬化成膜之硬化層之厚度為〇·丨#㈤至 5 // m 〇〈12〉如别述〈3〉所§己載之觸控面板用導電性膜，其中導電性膜之與導電膜相反側之表面之鉛筆硬度為3H以上。〈13〉如前述〈1〉至〈12〉中任一項所記載之觸控面板用導電性膜，其中硬化層之至少！層係霾值為1至2〇%之具 φ 有反眩光機能之層。〈14〉如前述〈1〉至〈13〉中任一項所記載之觸控面板用導電性膜，其中於基體，將使導電膜附著之層作為反眩光層。〈15〉如前述〈1〉至〈14〉中任一項所記載之觸控面板用導電性膜，其中在與作為前述基體之第一基體之導電膜相反側之面，經由接著層進一步具有第二基體。〈16〉一種觸控面板用導電性膜之製造方法，其特徵在籲於具有：基體準備工序，其係準備基體，該基體至少具有由PET膜所形成之層，及架橋性物質已硬化成膜之硬化層 ’在以150°C加熱1小時之後之長度方向（md)及寬度方向 (TD)之收縮率均為〇·5%以下；及導電膜附著工序，其係使導電膜附著於藉由前述基體準備工序所準備之基體者；於前述基體準備工序，以iOOt至180°C間之溫度，將pet 膜進行熱處理之同時，或以l〇〇°c至WOt：間之溫度，將pET 膜進行熱處理之後，使架橋性物質在前述PET膜之至少一 11 4 200537529 Λ 面硬化，以使至少1層之硬化層硬化成膜而形成。〈1 7〉如前述〈1 6〉所記載之觸控面板用導電性膜之製 " 造方法，其中於前述基體準備工序，以100°C至180°c間之溫度，將PET膜進行熱處理之同時，或以l〇〇°C至180°C間之溫度，將PET膜進行熱處理之後，且前述PET膜冷卻至室溫之前，使架橋性物質在前述PET膜之至少一面硬化，以使至少1層之硬化層硬化成膜而形成。〈1 8〉如前述〈1 6〉所記載之觸控面板用導電性膜之製 Φ 造方法，其中基體準備工序係於PET膜之至少一面，使熱架橋性物質硬化上，包含將5]^化1112至5〇]^/(：1112之力施加於長度方向（MD)之狀態下，於1〇〇。〇至i8〇°c之範圍之溫度使之硬化之工序。【實施方式】以下，說明本發明之實施型態。本發明之觸控面板用導電性膜係在至少具有ΡΕτ膜層及架橋性物質已硬化成膜之硬化層之基體上，形成導電膜而(S 9 200537529-The base system is on both sides of the PET film layer, and has a hardened layer that has been hardened to form a film by a bridging substance of light or electron wire.) "Conductive film for control panel" The conductive film is made of amorphous IT0 (indium tin oxide). <6> Conductivity for touch panels as described in any one of <1> to <5> The film is obtained by attaching a conductive film to a substrate having a shrinkage in the length direction (MD) and the width direction (TD) after being processed to be heated in 15 generations in advance for hours. • 膜 As mentioned above < 6> The conductive film for touch panel described in the present invention, wherein at least one hardened layer is heat-treated at a temperature of 10 (rc to 8 (rc), or 100 < 1 : To 180. (: between the temperature, heat-treated PET film, and the bridging substance hardened on at least one side of the aforementioned PET film. <8> The conductive film for touch panels according to the aforementioned <7> In which at least one hardened layer is heated at a temperature between 10 (TCS18 (rc), At the same time, or after the heat treatment of the ρΕτ _ film at an intermediate temperature, and before the PET film is cooled to room temperature, the bridging substance is hardened on at least one side of the PET film. <9> As described above <7 The conductive film for touch panel described in the above, in which at least one hardened layer is heat-treated at a temperature of 12 ° C to 180 °, or 120 ° (: to 180 °). (:: Temperature, obtained by heat-treating the ρΕτ film and hardening the bridging substance on at least one side of the aforementioned PET film. <10> Touch control as described in any one of the above <1> to <9> Panel 10 200537529 $ 4 conductive film, PET film is biaxially extended pE butyl film. 〈1 1〉 Conductive film for touch panel already contained in §2 of Uranium, 2 of which is bridging substance The thickness of the hardened layer that is hardened to form a film by heat is 〇 · 丨 # ㈤ to 5 // m 〇 <12> As already mentioned in <3>, the conductive film for touch panel has been already included, in which the conductive film The pencil hardness of the surface opposite to the conductive film is 3H or more. <13> As mentioned above <1 The conductive film for a touch panel according to any one of <12>, in which at least the hardened layer! The layer is a layer having an anti-glare function of φ with a haze value of 1 to 20%. <14> As described above The conductive film for a touch panel according to any one of <1> to <13>, wherein a layer on which a conductive film is adhered is used as an anti-glare layer on a substrate. <15> As described in the above <1> to <14> The conductive film for a touch panel according to any one of the preceding claims, further comprising a second substrate via an adhesive layer on a surface opposite to the conductive film of the first substrate as the aforementioned substrate. <16> A touch panel The method for manufacturing a conductive film is characterized by having a substrate preparation step which prepares a substrate, the substrate having at least a layer formed of a PET film, and a hardened layer where a bridging substance has been hardened to form a film. The shrinkage in the length direction (md) and width direction (TD) after heating at 1 ° C for 1 hour are both 0.5% or less; and the conductive film attachment step is to attach the conductive film to the substrate prepared by the aforementioned substrate preparation step. Substrate; in the aforementioned substrate preparation process After the PET film is heat-treated at a temperature between iOOt and 180 ° C, or after the pET film is heat-treated at a temperature between 100 ° C and WOt :, the bridging substance is placed in at least one of the aforementioned PET films. 11 4 200537529 The Λ surface is hardened to form at least one hardened layer. <1 7> The method for producing a conductive film for a touch panel as described in <1 6> above, wherein the PET film is processed at a temperature between 100 ° C and 180 ° c in the aforementioned substrate preparation step. At the same time as the heat treatment, or after the PET film is heat-treated at a temperature between 100 ° C and 180 ° C, and before the PET film is cooled to room temperature, the bridging substance is hardened on at least one side of the PET film. It is formed by hardening at least one hardened layer into a film. <1 8> The method for manufacturing a conductive film for a touch panel as described in <1 6> above, wherein the substrate preparation step is performed on at least one side of a PET film to harden a thermally bridging substance, including 5] ^ 1112 to 5〇] ^ / (: A process of hardening a force of 1112 in a lengthwise (MD) state at a temperature in the range of 100 to 800 ° C. [Embodiment] The following describes the embodiment of the present invention. The conductive film for a touch panel of the present invention is formed on a substrate having at least a PEE film layer and a cured layer having a bridging substance hardened to form a conductive film.

成；前述基體在以15(TC加熱丨小時之後2MD (長度方向（膜流動方向））及TD (寬度方向（膜寬度方向））之收縮率均為0.5%以下。發明之導電性膜由於以PET膜作為基體之主要構素因此具有透明性，作為觸控面板用導電性膜而使本^月之‘電性膜之透明性並未特別限制，但用於Tp. :兄：透明性甚為重要，可視光之透過率宜為70%以上 %以上尤佳。&了基材之PET膜之透過率以外，透明（jThe shrinkage of the aforementioned substrate after 2 hours of heating at 15 ° C for 2MD (length direction (film flow direction)) and TD (width direction (film width direction)) are both 0.5% or less. PET film as the main structure of the substrate is therefore transparent. As a conductive film for touch panels, the transparency of the electrical film of this month is not particularly limited, but it is used for Tp .: Brother: Transparency For the sake of importance, the transmittance of visible light should preferably be 70% or more. &Amp; The transmissivity of the PET film of the base material is transparent, (j

(S 12 4 200537529 按照各種架橋性物質之種類、厚度或硬化條件、ιτ〇之氧化程度或厚度、結晶性或非晶性之種類不同等而變化，宜 -調整此等所有變化要因，以獲得高透明。前述PET膜亦可進行不損及透明性或耐熱性等特性之程度之變質。又，於PET膜中，亦可含有防止氧化劑、紫外線吸收劑、著色劑、滑劑等以各種目的所添加之添加劑。又，為了提升附著於表面之硬化性物質或ΙΤ〇等導電膜之密接性，多半使用有施加可羅那處理或電漿處理，或者預 # 先塗布用以提升接著性之丙烯酸樹脂等易接著層者，反而較適合使用。泊述PET膜之厚度並未特別限定，但用於τρ之情況，從作業性方面或韌性強度的觀點考量，宜為厚度5〇〜4〇〇#m 之膜，特別是厚度80〜250 // m之膜較佳。貼合2片PET以提升滑動性時，於適用本技術之情況，2片pET膜之合計厚度宜為上述厚度。關於則述基體之層構成，除了至少具有pET膜層及架橋 ❿丨生物夤已硬化成膜之硬化層以外，並未特別限制，具有單一硬化層或複數硬化層均可。又，硬化層層疊於藉由ρΕτ 膜所形成之層之導電膜側、層疊在與導電膜相反側或層疊於兩側均可。刚述架橋性物質已硬化成膜之硬化層係硬，化於ρΕΤ膜表面’由於PET膜對於熱安定，即使進行使ΙΤ〇附著於此膜之後，再以1 50 C程度之溫度使銀糊硬化之處理，由於尺寸變化小’可大幅改善導電性膜之耐滑動性。 13 i 4 200537529 作為架橋性物質並未特別限定，可使用習知者，可採用熱架橋性物質、如紫外線架橋物質之藉由光之架橋性物質 ^ 、及藉由電子線之架橋性物質等。作為例如：熱架橋性物質、藉由光之架橋性物質及藉由電子線之架橋性物質，可舉出··三聚氰胺系樹脂、胺曱酸乙酯系樹脂、胺甲酸乙酯丙烯酸系樹脂、酸醇樹脂、丙烯酸樹脂、矽酮系樹脂、環氧系樹脂等硬化型樹脂等，此等可使用混合2種以上或在構造上將2種以上混成者。為了硬化，分別調製引發劑或分子 φ 量調節劑等。舉出在本發明所使用之架橋性物質之一例。例如：於分子内具有2個以上丙烯酸系或曱基丙烯酸系雙重結合之架橋性單體、於分子内具有2個以上之烯丙基之架橋性單體、於分子内具有2個以上之芳香性乙烯系雙重結合之架橋性單體、或此等之低聚物或聚合物。作為市售品，例示於分子内具有2個以上丙烯酸系或曱基丙烯酸系雙重結合之架橋性單體等，可舉出：BISCOAT700 # (大阪有機化學工業股份有限公司製）、KAYARAD R-551 (曰本化學股份有限公司製）、ARONIX M-3 1 5 (東亞合成股份有限公司製）、ARONIX M-210 (同）、BP-4PA ( 共榮社油脂股份有限公司製）、BP-4EA (同）、UVIMAR UVSA-1002 (三菱油化股份有限公司製）、UVIMAR UVSA-2006 (同）等。又，作為於分子内具有2個以上之烯丙基之架橋性單體，可舉出：苯二甲酸二烯丙基酯、對苯二甲酸二烯丙基酯、 14 (§ 2Q0537529 異苯二甲酸二烯丙基酯、三烯丙基三聚異氰酸酯、三烯丙基二聚氰酸酯、二乙二醇雙烯丙基碳酸酯等。亚且，作為於分子内具有2個以上之芳香性乙烯系雙重結合之架橋性單體，可舉出··=乙烯基苯、二異丙烯基苯、一乙烯基甲笨、二乙烯基苯、二異丙烯基甲苯、二乙烯基萘、二異丙烯基萘、4,4，_二乙烯基聯苯、4,4、二異丙烯基聯苯等。並且，架橋性物質中，作為低聚物可舉出前述架橋性單 _ 體之低聚物’其聚合度通常為2〜1，000，更好是2〜1〇〇程並且，架橋性物質中，作為聚合物可舉出：於分子末端具有起因於丙烯酸系或甲基丙烯酸系雙重結合之乙烯性不飽和基之聚醚聚胺甲酸乙_、聚酯聚胺甲酸乙酯、聚己内酯聚胺甲酸乙酯等。並且可使用於環氧基丙烯酸酯預聚物中添加矽氧烷耦合 W者石夕氧烧耗合劑之添加量一般添加〇 · 5〜1重量％，宜 • 具有環氧基、胺基、硫醇基。作為胺甲酸乙酯系樹脂，宜使用將丨分子内具有2個以上之羥基之多元醇化合物，以多官能異氰酸酯化合物所硬化者。作為多元醇化合物，可舉出：乙二醇、二乙二醇等之聚醚多元醇；環氧樹脂變性多元醇、聚醋多元醇、乙撐基乙稀醇共聚物之鹼化物、苯氧系樹脂等。再者，架橋性物質作為熱架橋性物質使用之情況，亦可 15 200537529 4. , μ •添加具有熱聚合性之其他單體、低聚物或聚合物。 W ’若熱架橋性物質之比例變少，獲得有強度的覆膜，因此其比例至少含有20重量^上里％以上，並且更好是含有5〇重量％以上。又’作為熱架橋性物質使用之情況，亦可添合引發劑。土Λ :為此自由基聚合引發劑，可舉例如：過氧化物、偶氮化曰物二更具體而言，可舉出：過氧化苯甲醯基、l•過氧 =:二甲：醋、偶氮雙異丁腈等。此自由基聚合引發劑可為早獨1種，或併用2種以上。此自由基聚合引發劑之添力吾從舌旦A J之添加里係對於熱架橋性物質100 里口p，使用〇〜2重量部，更好是ο.οοι、〗重量邛另一方面，架橋性物質作為紫外線等之光架橋性物質使 π二’亦可添加光聚合成之其他單體、低聚物或聚合 :。此情況’若光架橋性物質之比例變少，無法獲得有強度之覆膜’其比例必須至少含有20重量％以上，宜含有3〇重量％以上，更好是含有5〇重量％以上。又，於作為光架橋性物質使為使用之情況’亦可添加光聚合發劑。作為此光聚合引發劑，可與(S 12 4 200537529 varies according to the type, thickness or hardening conditions of various bridging substances, the degree of oxidation or thickness of ιτ〇, the type of crystalline or amorphous, etc., it should be adjusted-all these factors of change should be adjusted to obtain High transparency. The PET film may be deteriorated to such an extent that the properties such as transparency and heat resistance are not impaired. In addition, the PET film may contain an oxidizing agent, an ultraviolet absorber, a colorant, and a lubricant for various purposes In addition, in order to improve the adhesion of hardened substances or conductive films such as ITO, which are attached to the surface, most of them are treated with Krona or plasma treatment, or pre-coated to improve adhesion. Those that are easy to adhere to, such as acrylic resin, are more suitable for use. The thickness of the PET film is not particularly limited, but when used for τρ, the thickness is preferably 50 to 4 from the viewpoint of workability or toughness. 〇 # m film, especially film with thickness of 80 ~ 250 // m is better. When two pieces of PET are laminated to improve the sliding property, the total thickness of two pET films should be above when applying this technology. The thickness of the substrate is not particularly limited except that it has at least a pET film layer and a hardened layer that has been cured to form a bridge. The single layer may have a single hardened layer or a plurality of hardened layers. The layer can be laminated on the conductive film side of the layer formed by the ρΕτ film, on the opposite side to the conductive film, or on both sides. The hardened layer that has been hardened to form the film is hard, and is formed on the ρΕΤ film. The surface of the PET film is thermally stable. Even if ITO is attached to the film, and then the silver paste is cured at a temperature of about 150 ° C, the dimensional change is small, which can greatly improve the sliding resistance of the conductive film. 13 i 4 200537529 is not particularly limited as a bridging substance, and those skilled in the art can use thermal bridging substances, such as ultraviolet bridging substances, bridging substances by light ^, and bridging substances by electronic wires. For example, as a thermal bridging substance, a bridging substance by light, and a bridging substance by electron wire, melamine resin, ethyl amine resin, Hardened resins such as urethane acrylic resins, acid-alcohol resins, acrylic resins, silicone resins, and epoxy resins can be used as a mixture of two or more types or a combination of two or more types. Hardening, preparing initiators or molecular φ amount regulators, etc. One example of a bridging substance used in the present invention. For example: a bridging monomer having two or more acrylic or fluorenyl acrylic double bonds in the molecule. Body, a bridging monomer having two or more allyl groups in the molecule, a bridging monomer having two or more aromatic vinyl double bonds in the molecule, or an oligomer or polymer of these. Examples of commercially available products are bridging monomers having two or more acrylic or fluorenyl acrylic double bonds in the molecule. Examples include: BISCOAT700 # (manufactured by Osaka Organic Chemical Industry Co., Ltd.), KAYARAD R-551 (Manufactured by Yueben Chemical Co., Ltd.), ARONIX M-3 1 5 (manufactured by Toa Synthesis Co., Ltd.), ARONIX M-210 (same), BP-4PA (manufactured by Kyoeisha Oil Co., Ltd.), BP-4E A (same), UVIMAR UVSA-1002 (manufactured by Mitsubishi Petrochemical Co., Ltd.), UVIMAR UVSA-2006 (same), etc. Examples of the bridging monomer having two or more allyl groups in the molecule include diallyl phthalate, diallyl terephthalate, and 14 (§ 2Q0537529 isophthalene Diallyl formate, triallyl trimer isocyanate, triallyl dipolycyanate, diethylene glycol diallyl carbonate, etc. It has two or more aromatics in the molecule. Ethylene-based double-linking bridging monomers include vinylbenzene, diisopropenylbenzene, monovinylmethylbenzene, divinylbenzene, diisopropenyltoluene, divinylnaphthalene, Isopropenylnaphthalene, 4,4, _divinylbiphenyl, 4,4, diisopropenylbiphenyl, etc. Among the bridging substances, the low level of the bridging monomers mentioned above can be cited as oligomers. The polymer has a degree of polymerization of usually 2 to 1,000, and more preferably 2 to 100 passes. Among the bridging substances, examples of the polymer include an acryl-based or methacrylic-based polymer at the molecular end. Double-bonded ethylenically unsaturated polyether polyurethane, polyester polyurethane, polycaprolactone poly Ethyl urethane, etc. And can be used for epoxy acrylate prepolymer to add siloxane coupling W Shishi oxygen burning consumable additive amount is generally added 0.5 ~ 1% by weight, preferably • with epoxy As the urethane-based resin, a polyhydric alcohol compound having two or more hydroxyl groups in the molecule is preferably used, which is hardened with a polyfunctional isocyanate compound. Examples of the polyhydric alcohol compound include Out: Polyether polyols such as ethylene glycol, diethylene glycol, etc .; epoxy resin denatured polyols, polyester polyols, alkali compounds of ethylene vinyl alcohol copolymers, phenoxy resins, etc. When cross-linking substances are used as thermal cross-linking substances, 15 200537529 4., μ • Adding other monomers, oligomers or polymers with thermal polymerizability. W 'If the proportion of thermal cross-linking substances becomes smaller, A strong film is obtained, so the proportion thereof contains at least 20% by weight or more, and more preferably 50% by weight or more. When used as a thermal bridging substance, an initiator may be added. Λ: for this Examples of radical polymerization initiators include peroxides and azo compounds. More specifically, benzoyl peroxide, l · peroxy =: dimethyl: vinegar, azobisiso Nitrile, etc. This radical polymerization initiator can be used alone or in combination of two or more. The addition of this radical polymerization initiator is based on the addition of Tongdan AJ to the thermal bridging substance. 100 p Use 0 ～ 2 parts by weight, more preferably ο.οοι, 〖weight 邛 On the other hand, as a bridging substance such as ultraviolet light, a bridging substance can make π ′ ′ also add other monomers and oligomerized by photopolymerization. Material or polymerization: In this case, 'If the proportion of optically bridging substances is reduced, a strong film cannot be obtained', the proportion must contain at least 20% by weight or more, preferably 30% by weight or more, and more preferably 50%. Above weight%. In the case where it is used as an optical bridging substance ', a photopolymerizing agent may be added. As this photopolymerization initiator,

了舉例如· 1-羥基環己基苯基酮、2,2-二曱氧基-2-笨基m J 本乙酮、本乙蚵、二苯曱酮、氧雜蒽酮、芴酮、笨並曱酸& ’、 %、蒽醌、三苯基胺、卡唑、3· 甲基苯乙_、4-氣二苯曱两本甲明、心4，-二甲氧基二苯曱酉同、- 二胺二苯曱酮、米希勒_ ^ 7 本偶姻丙基_、苯偶姻乙基喊 16 200537529 ；、苯甲基二曱基縮_、異丙基苯基）_2_羥基—2-曱基丙烷-1-酮、2-羥基-2-曱基—苯基丙烷—丨-酮、硫氧雜蒽酮系化合物、2-甲基-1-[4-(曱基硫）苯基]—2 —嗎啉基—丙烷一j-酮、2,4,6-三甲基苯甲醯基二苯基-磷氧化物等。此等光聚合引發劑可為單獨1種，或併用2種以上。相對於光架橋性物質100重量部，光聚合引發劑之添加量為0〜5重量部，宜為0」〜3重量部，更好是〇 2〜3重量部。又，於光聚合引發劑，可因應需要而併用胺系化合物等之春光增感劑（聚合促進劑）。使用於本發明之架橋性物質，除了因應需要所添加之溶媒，亦可调配反應性稀釋劑、防止老化劑、聚合禁止劑、平滑劑、界面活性劑等。此等硬化性樹脂亦可組合使用，亦可數層重疊塗布，於藉由熱之硬化層之上，層疊藉由紫外線等之光之硬化層等。從透明性等觀點來看，適合使用丙烯酸系或胺甲酸二醋丙稀酸系、石夕酮系樹脂。以通常溶液，將添加有防止帶電鲁齊!或聚合引發劑等各種添加物而成之組成物稀釋，並調整成架橋性樹脂固體物為20〜80重量％而使用。此等硬化後之層厚度並未制限定，但從熱安定性及对滑動性的觀點考量，宜為(M# m以上，m以上更佳。又，從生產性的觀點考量’ ！層宜1〇"m以下，5心以下更佳 ’特別是熱硬化性硬化層之情況，從硬化所需之生產性之觀點來看，特別宜為5 /z m以下。圖1係例示本發明之觸控面板用導電性膜之較佳構成。圖 17 ；200537529 、1A為具有基體1及導電膜2之導電性膜，基體！係在由打丁 ' 膜所形成之層3之單側，形成有架橋性物質已硬化成膜之硬化層4 ’於其上具有導電膜2之例。又，圖⑶係基體1在由 ΡΕΤ膜所形成之層3之單側，形成有架橋性物質已硬化成膜之硬化層4 ’在由ΡΕΤ膜所形成之層3之相反㈣，形成有導电層2之例。如此，丽述硬化層設在由前述膜所形成之層之導電膜側、設在與導電膜相反側或設在兩侧均可。於任-情況，作為硬化層，可從熱架橋性物質已硬化成膜之 _ 硬化層、藉由光之架橋性物質已硬化成膜之硬化層、及藉由電子線之架橋性物質已硬化成膜之硬化層等適當地選擇使用。作為前述硬化層，在由前述PET膜所形成之層3，具有架橋性物質藉由熱而硬化成膜之硬化層，如後面詳述，在能以簡化之工序製造，獲得優異耐滑動性之點來看較適宜。又，圖1C、D、係硬化層4有複數之例，例如：於圖 1C及圖1D’舉出作為硬化層4a’具有熱架橋性物質已硬化 _成膜之硬化層，作為熱硬化層4b，具有光或電子線架橋性物質已硬化成膜之硬化層之構成等。作為本發明之導電性膜之較佳態樣，舉例—種導電性膜，其係基體包含熱架橋性物質已硬化成膜之硬化層，並且至少具有1層之藉由光或電子線之架橋性物質已硬化成膜之硬化層者。作為前述硬化層，使用架橋性物質由於熱而硬:成膜之硬化層’在可簡化工序且獲得優異耐滑動性之點來看，較適宜，但於例如：TP等需要防止損傷之用途， 18 4 200537529 -僅以熱硬化性樹脂，使之具有TP之觸控面用之導電性膜之防止損傷效果，在硬度上仍不足。一般而言，作為τρ電極 — 使用之情況，以手指或筆觸碰或以筆摩擦，因此為了難以損傷，ΙΤΟ層等導電膜之相反面（觸控面）要求3Η以上之高硬度。通常於5// m以下之厚度，熱架橋性物質之硬度多半以Η或2H為限度，只要未實施在經濟上不利之長時間硬化，或使膜厚變厚，難以達成此以上之硬度。相對於此，以光或電子線所架橋之硬化層，可在短時間獲得3 Η之硬度 • ，因此例如：於圖1C&D之構成，主要作為低收縮且用以熱安定化之硬化層，使硬化層4a成為厚度5//m以下之熱硬化樹脂層，作為兼具獲得表面硬度之損傷防止層之作用之硬化層，使硬化層4b成為硬化速度快、硬度充分之藉由光或電子線之架橋性物質已硬化成膜之硬化層（特別是紫外線硬化樹脂層或電子線硬化樹脂層），在同時達成生產性及較大硬度，並且熱安定性或耐滑動性優異之點來看，較適宜。從防止損傷的觀點來看，前述藉由光或電子線之架 _ 橋性物質已硬化成膜之硬化層，宜至少設在與藉由PE丁膜所形成之層3之導電膜2相反側，使之為觸控面。於本發明，最初將藉由熱所架橋之硬化層4a，形成在由pET膜所形成之層3之單側，以謀求對於熱之安定化，其後宜形成以光或電子線架橋硬化之層。圖丨C係熱硬化層4a及光或電子線硬化層4b重疊形成於觸控面，導電膜直接形成於PET層3。圖1 D係熱硬化層4a及光或電子線硬化層4b形成於ρΕΊΓ層3 之兩側’導電膜2形成於熱硬化層4a上。圖1D係至少於兩 19 200537529 · . . $ 4 側形成硬化層，於作為帝愛《、作4包極使用之情況，難以發生翹曲之士來看 <>[列如·於此層疊膜形成ΐτ〇等之工序或於處理 f 難以發生擦痕等點來看，為較佳構成。又，對於在卜:H吏用之TP，$ 了提高視認性，亦可使4a或4b之硬化層成為亦具備反眩光效果之硬化層。再者如七述，藉由熱所架橋之硬化層由於硬度稍微不足，以防止損傷為目的，不使用在設於與ITO面相反側之觸控面之以往之樹脂層。於現在所使用之τρ電極，多半於 TP之觸控面，形成藉由光所架橋之硬化層。又，從進一步提高耐滑動性之觀點來看，宜進一步設置 :更化層。又，於圖1E及圖1F，舉出作為硬化層4a，具有熱木橋性物質已硬化成膜之硬化層，作為硬化層处及訃，具有光或電子線架橋性物質已硬化成膜之硬化層之構成等。 4b 4c層存在於由PET膜所形成之層之兩侧之構成，係觸控面獲得3H以上之硬度，可賦予反牛頓環性能，於兩面具 • 有硬化層，可達成機械強度平衡，難以翹曲，而且兩面為 3H以上，在工序或處理上，難以發生擦痕等，為最適當的構成。於圖1E及圖1F，首先於PET膜層3，塗布藉由熱所架橋之硬化層4a，以l〇(TC至丨⑽艺使之乾燥及硬化。此後，於4a層上或塗布有4&層之面之任一者，形成以光或電子線所架橋之硬化層，其次可於相反面，同樣地形成硬化層。此情況，為了使TP之觸控面成為3H以上，宜選定樹脂種類、厚度或架橋度。塗布有ITO等導電膜之面之硬度，未必要3H，但以可抑制工序或處理上發生損傷之點來看，可考 (§ 20 200537529 «. j 慮兩面機械強度之平衡，選定樹脂種類、厚度、架橋度等〇又，於兩面設置硬化層之情況，選定兩面具有相同程度之熱膨脹係數者，以達成強度平衡、暴露於高熱時不易2 生皺紋或裂缝之點來看，較適宜。以實用於Tp之觀點來看，此圖1Ε及圖1F為最佳構成。層疊熱架橋性物質已硬化成膜之硬化層，及藉由光或電子線之架橋性物質之已硬化成膜之硬化層之情況，重疊塗 φ 布之層之全體厚度只要按照必要厚度決定即可，若是一般所需之3Η程度，宜為2 /z m〜10 // m。若從生產性、低收縮性、其安定性及硬度等綜合地判斷，熱硬化性樹脂層宜為 0·5/ζ m〜5/z m，塗布於其上之紫外線硬化層等宜為1〜6“ m ° 又，為了 TP用導電膜所需之防止圖像偏差、防止反射、防止牛頓環發生等之處理，可於前述硬化層（於硬化層有複數之情況，為至少任一層）加入各種添加物或施加處理 •。又，為了此等目的，亦可於前述基體進一步添加熱或紫外線硬化樹脂。可使形成導電膜之面之下側之硬化層，例如：於圖1E為 4c層，於圖1F為4b層，具有反牛頓環效果。具體而言，為了使霾值為0.5至3%，可使於藉由光或電子線所架橋之樹脂成分，含有丙烯酸粒子等有機系粒子或矽粒子等無機系粒子者硬化。調配成霾值小之情況，反牛頓效果小，大的情況，可能圖像會出現偏差，此層之霾值宜調整為〇 5%至 21 200537529 Λ i * Λ 3%之間。從取得反牛頓性與防止圖像偏差之平衡的觀點來看，此等之粒子係混入直徑不同者比具有均勻粒徑者適宜。具體而言，宜混入1〜6// mg圍之直徑不同的粒子，混入2〜5// m範圍之直徑不同之粒子更佳。反眩光適於在外部使用之顯示器。使具有反炫光效果之情況’例如：於圖E及圖F之4a、4b、4c層，可控制霾值，選定總和的霾值。一般而言，霾值可選定於2%至2〇%之間。霾值係使架橋之樹脂成分中混入丙烯酸粒子或矽粒子者 • 硬化所獲得。為了獲得作為目標之霾值，將以光或電子線架橋之樹脂硬化之4b及4c，係作為相同霾值而調整，但從可減少獲得硬化層之樹脂種類之點來看，較為適宜。又，硬化層之至少1層為具有霾值丨至加％之反眩光機能之層之態樣較佳。胃又，在與PET膜之導電膜相反面之硬化層，宜使之含有石夕粒子等，以便具有反眩光或防止牛頓環效果。For example, 1-hydroxycyclohexylphenyl ketone, 2,2-dioxo-2-benzyl m J Benzophenone, Benzophenone, Dibenzophenone, Xanthenone, Fluorenone, Benzophenone Pyridoxine & ',%, Anthraquinone, Triphenylamine, Carbazole, 3 · Methylphenethyl _, 4-Phenylenediphenylpyrene, Benzomethoxamine, Heart 4,4-Dimethoxydiphenylpyrene Identical,-Diamine benzophenone, Michler ^ 7 Benzoylpropyl, Benzoylethyl 16 200537529;, Bentyl difluorenyl, isopropylphenyl) _2 _Hydroxy-2-fluorenylpropane-1-one, 2-hydroxy-2-fluorenyl-phenylpropane- 丨 -one, thioxanthone-based compounds, 2-methyl-1- [4- (曱Thio) phenyl] -2-morpholinyl-propane-j-one, 2,4,6-trimethylbenzylidene diphenyl-phosphorus oxide, and the like. These photopolymerization initiators may be used alone or in combination of two or more. The addition amount of the photopolymerization initiator is 0 to 5 parts by weight, preferably 0 to 3 parts by weight, and more preferably 2 to 3 parts by weight with respect to 100 parts by weight of the optically bridging substance. As the photopolymerization initiator, a spring light sensitizer (polymerization accelerator) such as an amine compound may be used in combination as necessary. The bridging substance used in the present invention can be formulated with a reactive diluent, an anti-aging agent, a polymerization inhibitor, a smoothing agent, a surfactant, and the like in addition to the solvent added as required. These hardening resins can also be used in combination, or several layers can be superimposed, and a hardening layer by light such as ultraviolet rays can be laminated on the hardening layer by heat. From the viewpoints of transparency, etc., acrylic resins, urethane-acrylic acid-based resins, and syringone-based resins are suitably used. A composition obtained by adding various additives such as anti-charge Luqi! Or a polymerization initiator is diluted with a normal solution, and adjusted to a bridging resin solid content of 20 to 80% by weight. The thickness of these hardened layers is not limited, but from the viewpoint of thermal stability and sliding properties, it should be (M # m or more, more preferably m or more. Also, from the viewpoint of productivity, '! 10% or less, more preferably 5 cores or less, especially in the case of a thermosetting hardened layer, from the viewpoint of productivity required for hardening, it is particularly preferably 5 / zm or less. Fig. 1 illustrates an example of the present invention. The preferred structure of the conductive film for touch panel. Figure 17; 200537529, 1A is a conductive film with a substrate 1 and a conductive film 2, the substrate! It is formed on one side of layer 3 formed by a Ding 'film. The hardened layer 4 ′ where the bridging substance has been hardened to form a film has an electrically conductive film 2 thereon. Also, FIG. 3B shows the substrate 1 on one side of the layer 3 formed of the PET film, and the bridging substance is hardened The film-forming hardened layer 4 ′ is formed on the opposite side of the layer 3 formed by the PET film, and the conductive layer 2 is formed. In this way, the beautiful hardened layer is provided on the conductive film side of the layer formed by the foregoing film. Either on the opposite side of the conductive film or on both sides. In any case, as a hardened layer, you can The hardened layer that has been hardened and formed into a film_ a hardened layer that has been hardened to form a film by a bridging substance by light and a hardened layer that has been formed into a film by a bridging substance by an electron beam, etc. are appropriately selected and used as the foregoing. The hardened layer is a layer 3 formed of the aforementioned PET film. The hardened layer has a hardened layer which is formed by bridging the material and is hardened by heat. As described in detail later, it can be manufactured in a simplified process to obtain excellent sliding resistance. 1C, D, and the system hardened layer 4 have a plurality of examples. For example, in FIG. 1C and FIG. 1D ', a hardened layer having a thermally bridging substance that has been cured_formed as the hardened layer 4a' is given, As the thermally hardened layer 4b, it has a composition of a hardened layer that has been cured into a film by a light or electronic wire bridging substance, etc. As a preferred aspect of the conductive film of the present invention, an example is a conductive film whose matrix contains heat A bridging substance that has been hardened to form a film and has at least one layer of a bridging substance that has been hardened to form a film by light or electrons. As the aforementioned hardening layer, the bridging substance is hardened due to heat: Film hardening 'It is more suitable in terms of simplification of the process and excellent sliding resistance, but for applications such as TP that need to be prevented from damage, 18 4 200537529-Only with thermosetting resin, it has the touch surface of TP The damage prevention effect of the conductive film used is still insufficient in hardness. In general, as a τρ electrode-when used, it is touched with a finger or a pen or rubbed with a pen. Therefore, in order to prevent damage, the conductive film such as the ITO layer is the opposite. The surface (touch surface) requires a high hardness of more than 3Η. Generally, the thickness of the thermal bridging material is limited to Η or 2H for a thickness of 5 // m or less, as long as it is not economically unfavorable for a long time, or Making the film thicker makes it difficult to achieve the above hardness. In contrast, the hardened layer bridged by light or electron wire can obtain a hardness of 3 • in a short time. Therefore, for example, the structure shown in Figure 1C & D, It is mainly used as a hardening layer with low shrinkage and thermal stability, so that the hardened layer 4a becomes a thermosetting resin layer with a thickness of 5 // m or less. The chemical conversion layer 4b becomes a hardening layer (especially an ultraviolet hardening resin layer or an electron wire hardening resin layer) that has been hardened into a film with a hardening speed and sufficient hardness by a bridging substance made of light or electrons. It is suitable from the viewpoint of large hardness and excellent thermal stability or sliding resistance. From the standpoint of preventing damage, the aforementioned hardened layer of the aforementioned frame by light or electron _ bridging substance has been hardened to form a film, and should preferably be provided at least on the opposite side of the conductive film 2 of the layer 3 formed by a PE butyl film To make it a touch surface. In the present invention, a hardened layer 4a bridged by heat is initially formed on one side of layer 3 formed by a pET film, in order to stabilize the heat, and it is desirable to form a hardened layer bridged by light or electrons. Floor. Figure 丨 The C-type thermosetting layer 4a and the light or electron wire curing layer 4b are formed on the touch surface in an overlapping manner, and the conductive film is directly formed on the PET layer 3. Fig. 1 The D-type heat-hardened layer 4a and the light or electron wire hardened layer 4b are formed on both sides of the ρΕΊΓ layer 3. The conductive film 2 is formed on the heat-hardened layer 4a. Figure 1D is a hardened layer formed on at least two sides. 200537529 ·... $ 4 side. In the case of using as a package of Emperor Love, as a 4 pack pole, it is difficult for warping to occur. &Lt; > The step of forming a laminated film such as 〇τ〇 or the like is preferable because it is difficult to cause scratches in the process f. In addition, for the TP used in BU, the visibility can be improved, and the hardened layer of 4a or 4b can also be a hardened layer that also has an anti-glare effect. Furthermore, as described in the seventh, the hardened layer bridged by heat is slightly inadequate in hardness, and for the purpose of preventing damage, the conventional resin layer provided on the touch surface opposite to the ITO surface is not used. The τρ electrode currently used is mostly on the touch surface of TP, forming a hardened layer bridged by light. From the viewpoint of further improving the sliding resistance, it is desirable to further provide a modification layer. In FIG. 1E and FIG. 1F, as the hardening layer 4a, a hardening layer having a hot-wood bridged material that has been hardened to form a film, and a hardening layer and a puppet having a light or electronic wire bridging material that is hardened to form a film, The composition of the layers. The 4b 4c layer exists on both sides of the layer formed of PET film. The touch surface has a hardness of 3H or higher, which can impart anti-Newton ring performance. With two masks • Hardened layers can achieve mechanical strength balance, which is difficult It is warped, and both sides are 3H or more. It is the most suitable structure because scratches and the like are hard to occur in the process or process. In FIG. 1E and FIG. 1F, the PET film layer 3 is first coated with a hardened layer 4a bridged by heat, and dried and hardened by 10 (TC to ⑽). Thereafter, 4 & On either side of the layer, a hardened layer bridged by light or electronic wires is formed, and then a hardened layer can be formed similarly on the opposite side. In this case, in order to make the touch surface of TP 3 or more, resin should be selected. Type, thickness, or bridging degree. The hardness of the surface coated with conductive film such as ITO is not necessarily 3H, but it can be considered from the point of suppressing damage in the process or processing (§ 20 200537529 «. J Considering mechanical strength on both sides For the balance, select the resin type, thickness, bridging degree, etc., and when setting hardened layers on both sides, select those with the same degree of thermal expansion coefficient on both sides to achieve the strength balance and not easy to produce wrinkles or cracks when exposed to high heat It is more suitable. From the point of view of practical application to Tp, this figure 1E and FIG. 1F are the best structures. The thermally bridging material has been hardened into a film-hardened layer, and the bridging material by light or electron wire is laminated. Hardened into a film In the case of a chemical layer, the overall thickness of the layer coated with φ cloth can be determined according to the necessary thickness. If it is generally 3 degrees, it should be 2 / zm ~ 10 // m. If it is from productivity, low shrinkage, The stability and hardness are comprehensively judged. The thermosetting resin layer should preferably be 0.5 / ζ m ~ 5 / zm, and the UV curing layer applied on it should be 1 ~ 6 "m °. For TP use Various treatments such as preventing image deviation, preventing reflection, and preventing Newton rings from occurring in the conductive film can be added to the aforementioned hardened layer (at least any one of the cases where the hardened layer is plural). For these purposes, a thermal or ultraviolet curing resin may be further added to the aforementioned substrate. A hardened layer may be formed on the underside of the conductive film, for example: layer 4c in FIG. 1E and layer 4b in FIG. 1F. Anti-Newton's ring effect. Specifically, in order to make the haze value of 0.5 to 3%, the resin component bridged by light or electron rays can be hardened if it contains organic particles such as acrylic particles or inorganic particles such as silicon particles. .When the deployment is small If the anti-Newton effect is small and large, the image may be deviated. The haze value of this layer should be adjusted between 05% and 21 200537529 Λ i * Λ 3%. Obtaining anti-Newton property and preventing image deviation From the viewpoint of balance, it is more suitable to mix these particles with different diameters than those with uniform diameters. Specifically, it is better to mix particles with different diameters around 1 ~ 6 // mg and 2 ~ 5 // m. Particles with different diameters in the range are better. Anti-glare is suitable for display for external use. In the case of having anti-glare effect ', for example, in layers 4a, 4b, and 4c of Figure E and Figure F, the haze value can be controlled. The total haze value. Generally speaking, the haze value can be selected between 2% and 20%. Haze values are obtained by mixing acrylic resin or silicon particles into the resin component of the bridge. In order to obtain the target haze value, the hardened resins 4b and 4c bridged by light or electrons are adjusted as the same haze value, but it is more suitable from the viewpoint of reducing the type of resin to obtain the hardened layer. In addition, it is preferable that at least one layer of the hardened layer is a layer having an anti-glare function having a haze value of 1 to 10%. The stomach and the hardened layer on the opposite side of the conductive film of the PET film should preferably contain stone evening particles, etc. in order to have anti-glare or prevent Newton's ring effect.

清晰塗層之情況，宜在任一硬化層均未含有矽或丙烯酸等粒子，全體之霾值宜抑制在2%以下。於此情況，亦可能避免牛頓環發生，可使ITO層下側之硬化層中含有矽或丙烯酸粒子，宜將霾值調整在2%以下。矽粒子為非晶質且多孔性。作為代表例可舉出矽膠。為有機系粒子之代表例為丙烯酸粒子。作為此等之平均徑，通常為以下，更好是2〜15"m程度，調配比係相對於硬化性樹脂100重量部，粒子宜為〇丨〜1〇重量。又，使相接於基體之導電膜之層’成為含有粒子之反In the case of clear coatings, it is preferable that no particles such as silicon or acrylic are contained in any hardened layer, and the total haze value should be suppressed below 2%. In this case, it is also possible to avoid the occurrence of Newton's ring, which can make the hardened layer under the ITO layer contain silicon or acrylic particles. It is advisable to adjust the haze value below 2%. The silicon particles are amorphous and porous. A typical example is silicone. A typical example of organic particles is acrylic particles. The average diameter of these particles is usually as follows, more preferably about 2 to 15 " m, and the blending ratio is preferably from 100 to 10 weight per 100 parts by weight of the curable resin. In addition, the layer of the conductive film that is in contact with the substrate is made to contain particles.

(S 22 200537529 气 ^ 光層或反牛頓環層，可使耐滑動性更加優異。亦即，使之 ^有防止牛頓環效果之際，使含有石夕等之粒子之硬化層附著之情況，若於此上部形成導電性物質，含有粒子之硬化層位於導電膜之下部的話，可提升滑動性，因此為適當構成。本發明之導電性膜之要件為，基體在以i 5〇〇c加熱丨小時之後之長度方向（MD )及寬度方向（TD )之收縮率均為〇·5%以下。在此，「以15〇。^加熱丨小時之後之長度方向（ • MD )及寬度方向（TD )之收縮率」，其係以室溫將基體取得尺寸後，加熱至15(TC，並保持工小時之後，回復到室 /皿’再度取得尺寸所計測之收縮率。為了符合熱之尺寸安定性或TP之250g、10萬次之滑動測試，若於MD及TD，使本發明之導電性膜之15〇°c之熱收縮率均為0.5%以下即可獲得，但為了符合5〇〇g、3〇萬次之滑動測試，宜使MD及TD之收縮率為〇·4%以下，在〇·3%以下更佳。 II 低收縮化之方法並未特別限制，但必須在使導電膜附著之前，使基體低收縮率化。又，至少i層之硬化層係在以1〇〇 °C至180°C間之溫度，將PET膜進行熱處理之同時，或者以以100°C至180°C間之溫度，將PET膜進行熱處理之後，使架橋性物質在前述PET膜之至少一面硬化所獲得，在抑制 PET膜之收縮率且使之安定上，較為適宜。熱處理在12〇它以上更佳，120°C〜160°C間之溫度尤佳。為了在ITO層附著後，使ITO結晶化，據知係以150°C附近之溫度進行退火 23 200537529 。此情況，作為亦含有硬化層之透明導電膜，MD及丁时向之熱收縮率可均為0·5%以下，但由於汀〇等導電膜盘 ΡΕΤ膜等有機物之熱特性不同，藉由此退火處理，可能於 IT〇層與有機物界面之間殘留應力，由於筆等之滑動，IT〇層剝離，於層產生裂縫。作為前述基體之由ΡΕΤ膜所形成之層之材料而使用之 PET膜，能以熔融壓出法等習知方法製造。可從表面平滑度或透明性、機械強度、耐熱性等觀點，選擇變質程度、馨製造法。若以此觀點來看，特別是藉由二軸延伸所製造之 PET膜較佳。二軸延伸膜係縱橫延伸，一般加熱時係大幅收縮。若採用本發明之手法，以即使是二軸延伸膜，仍可較低地保持收縮率，可安定之點來看，較為適宜。於如此製造之PET膜表面，多半施加有用以提高表面硬度、防止作為觸控面板使之偏差或防止反射之塗層，因此亦可使用於單面或雙面塗布有易接著處理者。作為易接著處理，可使用可羅那放電、紫外線照射、電漿處理、濺鍍蝕刻處理籲、打底處理等習知方法。作為打底處理之易接著層之塗層劑，只要是具有該效果者，並未特別限定，據知塗布例如 :聚s旨系聚合物或丙烯酸系聚合物。於此層亦可含有石夕等之微粒’以作為滑材。说述一軸延伸ΡΈΤ膜之1 50°c、1小時之收縮率，通常 (流動方向）為1.0〜1·8%，TD (橫向）為0J〜1〇%。為了將此在未設置硬化層之狀態，縮小收縮率，可採用：將已製造之二軸延伸PET膜，一面連續地施加2kg/cm2至 24 200537529 ； Λ 50kg/cm2之張力，以l〇〇°C至180°C進行加熱處理之方法· 暫且將PET膜捲成輥狀之後，將此輥置入電爐等之中，以 ' 1 50°C附近之溫度進行處理之方法；及進行此等雙方之方法等。本發明之導電性膜係預先準備以前述方法進行低收縮處理之PET膜，將此PET膜層疊於硬化層亦可，但藉由預先進行低收縮處理，以取得本發明之收縮率範圍之PET膜，需要長時間之處理，產生成本上的問題。將1 5 0 °C、1小時之 φ 收縮率為〇·5%以上，未進行低收縮處理之二軸延伸膜作為材料使用’在生產線上同時或連續進行層疊低收縮工序及熱硬化層之工序，從成本及作為導電膜之情況之提升耐滑動性之觀點來看較適宜。於本發明之較佳實施態樣，架橋性物質已硬化成膜之硬化層係可藉由對於從輥狀之ΡΕΤ膜，一面施加2kg/cm2至 50kg/cm2之應力，一面連續地供給之PET膜，藉由晶片塗層機、反向塗層機、凹版塗層機、微凹版塗層機、喷霧塗層 ® 機、槽孔塗層機、輥塗層機、絲網印刷等方法，塗布架橋性物質，架橋性物質為熱架橋性物質之情況，通過設定為 l〇〇°C至180°C之爐中，使之硬化並捲取等方法做成。此時以100 C〜1 80 C之溫度，架橋性物質之硬化及jpg丁膜之 …、處理在生產性上，通常宜將此爐在1分至分之間通過。爐亦可為1室，但分割成數室，調整溫度，可抑制氣泡產生，提高硬化速度，提升硬化膜之平滑度。於此方法，無須預先將PET膜熱處理，進行低收縮化，在工序上可簡化 25 200537529 點來看，較適宜。又，㈣進行之熱處理及硬化層硬化之基體係滑動性亦良好。 #於用以取代熱架橋性物質，塗布之架橋性物質係首先使精由光之架橋性（例如：紫外線架橋性）或藉由電子線之架橋性物質硬化，提高P_之熱安定性之情況，與孰架 :性物質相同，通過爐之前，先塗布架橋性物質，通過設定於UKTC〜18CTC之爐之後，照射紫外線等使之硬化，或通過設定於1GGt〜⑽。^爐之後，進行冷卻，塗布架橋性物質，通過設定於机〜13(rc程度之爐並乾燥之後，照射紫外線等以使之硬化而做成。A 了上述PET膜安定化以外之目的’例如：將硬度提升至311等，將光或電子線所架橋之物質塗布硬化之情況’可採用習知之方法。例如：以凹版塗層機將紫外線硬化樹脂塗布PET膜，乾燥後照射紫外線以使之硬化。作為前述光架橋性物質之硬化條件，可舉出將波長200 〜5〇〇nm範圍内之紫外線照射〇」秒以上更好是〇 5〜6〇秒間等。再者，於此，照射量之積算量通常為3〇〜5,〇〇〇mj/cm2，作為光源可使用低壓水銀燈、高壓水銀燈、碳電弧、金屬聚光燈”JC銀放電管、鶊燈、_素燈、納放電管、氛放電管等。刖述收縮率可藉由硬化性樹脂塗布時之ρΕΤ膜之張力或爐溫度、硬化速度等控制。於如此所獲得之具有低收縮率之基體，以濺鍍等手法使(S 22 200537529 Gas light layer or anti-Newton's ring layer, can make sliding resistance more excellent. That is, when the effect of preventing Newton's ring is made, the hardened layer containing particles such as Shi Xi may be attached, If a conductive substance is formed on the upper part, and the hardened layer containing particles is located below the conductive film, the sliding property can be improved, so it is a suitable structure. The essential part of the conductive film of the present invention is that the substrate is heated at 500 ° C. The shrinkage rate in the length direction (MD) and the width direction (TD) after the hour are both less than 0.5%. Here, "Heating at 15 °. ^ The length direction (MD) and width direction after the hour" TD ”shrinkage rate” is the shrinkage rate measured after the substrate has been dimensioned at room temperature, heated to 15 ° C, and held for one hour, then returned to the chamber / dish 'to obtain the dimensions again. In order to meet the thermal dimensions 250g, 100,000 times sliding test of stability or TP, if MD and TD, make the thermal shrinkage of the conductive film of the present invention at 150 ° C is less than 0.5%, but in order to meet 50 〇g, 300,000 times of sliding test, should make MD and The shrinkage rate of TD is 0.4% or less, and more preferably 0.3% or less. II The method for reducing shrinkage is not particularly limited, but it is necessary to reduce the shrinkage of the substrate before attaching the conductive film. Also, at least The hardened layer of layer i is after heat-treating the PET film at a temperature between 100 ° C and 180 ° C, or after heat-treating the PET film at a temperature between 100 ° C and 180 ° C. It is obtained by curing the bridging substance on at least one side of the aforementioned PET film, and is more suitable for suppressing and stabilizing the shrinkage of the PET film. The heat treatment is preferably 120 or more, and a temperature between 120 ° C and 160 ° C. Especially, in order to crystallize ITO after the ITO layer is adhered, it is known that annealing is performed at a temperature around 150 ° C. 23 200537529. In this case, as a transparent conductive film that also contains a hardened layer, MD and Ding Xiang are hot. The shrinkage can all be less than 0.5%, but due to the different thermal properties of organic materials such as conductive film disks such as TET 0, this annealing treatment may cause residual stress between the IT 0 layer and the organic material interface. When sliding, the IT0 layer is peeled off, and cracks occur in the layer. The PET film used as the material of the layer formed by the PET film of the aforementioned substrate can be manufactured by conventional methods such as melt extrusion. The degree of deterioration can be selected from the viewpoints of surface smoothness or transparency, mechanical strength, heat resistance, and the like. , Xin manufacturing method. From this point of view, especially the PET film manufactured by biaxial stretching is preferred. Biaxially stretched film is stretched vertically and horizontally, and it generally shrinks greatly when heated. If the method of the present invention is used, Even if it is a biaxially stretched film, the shrinkage rate can be kept low, and it is more suitable from the viewpoint of stability. For the PET film surface manufactured in this way, it is often applied to increase the surface hardness and prevent it from being deflected as a touch panel. Or anti-reflection coating, so it can also be used on one or both sides coated with easy adhesion. As the easy-adhesion treatment, conventional methods such as Krona discharge, ultraviolet irradiation, plasma treatment, sputtering etching treatment, and primer treatment can be used. The coating agent for the easy-adhesive layer of the primer treatment is not particularly limited as long as it has the effect, and it is known to apply, for example, a polys-based polymer or an acrylic polymer. Fine particles such as Shi Xi and the like may be contained in this layer as a sliding material. Talking about a 50 ° c, 1-hour shrinkage of a uniaxially stretched PP film, usually (flow direction) is 1.0 ~ 1.8%, and TD (transverse direction) is 0J ~ 10%. In order to reduce the shrinkage in a state where no hardened layer is provided, the following can be applied: the biaxially stretched PET film that has been manufactured is continuously applied with 2 kg / cm2 to 24 200537529 on one side; a tension of Λ 50 kg / cm2 is applied to 100%. Method for heat treatment from ° C to 180 ° C · After rolling the PET film into a roll, put the roll in an electric furnace, etc., and process it at a temperature around '150 ° C; and Both methods, etc. The conductive film of the present invention is a PET film that has been subjected to the low shrinkage treatment in the aforementioned method. The PET film may be laminated on the hardened layer. However, the low shrinkage treatment may be performed in advance to obtain the PET in the shrinkage range of the present invention. Membrane requires long time processing, which causes cost problems. A biaxially stretched film without a low shrinkage treatment at a temperature of 150 ° C for 1 hour with a φ shrinkage rate of 0.5% or higher is used as a material to simultaneously or continuously laminate the low shrinkage process and the thermosetting layer on the production line. The step is more suitable from the viewpoint of cost and improvement of sliding resistance in the case of a conductive film. In a preferred embodiment of the present invention, the hardened layer of the bridging substance that has been hardened and formed into a film can be a continuous supply of PET from a roller-shaped PET film while applying a stress of 2kg / cm2 to 50kg / cm2. Film, by wafer coating machine, reverse coating machine, gravure coating machine, micro gravure coating machine, spray coating ® machine, slot coating machine, roll coating machine, screen printing, etc. In the case where the cross-linking substance is coated, and the cross-linking substance is a thermal cross-linking substance, it is made by a method such as hardening and winding in a furnace set at 100 ° C to 180 ° C. At this time, at a temperature of 100 C to 1 80 C, the hardening of the bridging material and the jpg Ding film…, in terms of productivity, it is usually appropriate to pass the furnace between 1 minute and 1 minute. The furnace can also be a single chamber, but it can be divided into several chambers, and the temperature can be adjusted to suppress the generation of air bubbles, increase the curing speed, and improve the smoothness of the cured film. In this method, there is no need to heat-treat the PET film in advance to reduce the shrinkage, and the process can be simplified. 25 200537529 It is more suitable. In addition, the heat treatment and the hardening of the hardened layer by rhenium also have good sliding properties. # 于 is used to replace the thermal bridging substance, the coated bridging substance is first to harden the bridging substance of light (for example: ultraviolet bridging) or the bridging substance of electronic wire to improve the thermal stability of P_ The situation is the same as that of the gantry: sexual material. Before passing through the furnace, the bridging material is applied. After passing through a furnace set at UKTC ~ 18CTC, it is irradiated with ultraviolet rays to harden it, or set at 1GGt ~ ⑽. ^ After the furnace, it is cooled and coated with a bridging substance. It is made by setting the furnace at a temperature of ~ 13 ° C and dried, and then irradiated with ultraviolet rays to harden it. A The purpose other than the stabilization of the PET film described above is for example : When the hardness is increased to 311, etc., and the materials bridged by light or electronic wires are coated and hardened, a conventional method can be used. For example, a UV curing resin is coated on a PET film by a gravure coating machine, and then dried to irradiate ultraviolet rays to make it Hardening. Examples of the hardening conditions of the optically bridging substance include irradiating ultraviolet rays having a wavelength in the range of 200 to 5000 nm for more than 0 seconds, more preferably between 5 to 60 seconds. Furthermore, here, the irradiation The cumulative amount of the amount is usually 30 ~ 5, 000mj / cm2. As the light source, low-pressure mercury lamps, high-pressure mercury lamps, carbon arcs, and metal spotlights can be used. "JC silver discharge tubes, krypton lamps, prime lamps, nano-discharge tubes, Ambient discharge tube, etc. The shrinkage rate can be controlled by the tension of the ρET film or the furnace temperature, the curing speed, etc. when the curable resin is applied. The substrate with low shrinkage rate obtained in this way is sputter-plated. The way

(S 26 200537529 導：：物質附著，形成導電膜，可製成以低收縮膜為基材之‘兒丨生膜。於PE丁膜之單面具有硬化層之構成之情況，導電性物質亦可附著於設有該硬化層之側之表面，及未設有硬化層之側之表面之任一。作為導電性薄膜之形成方法可使用真空瘵鍍法、濺鍍法、離子鍍層法等習知技術之任“，但從膜之均勻性或薄膜對於PET基材之密接性之觀點來看，宜以濺鍍法形成薄膜。實施濺鍍法時之溫度，特別只要可料適MTP之電阻值即可，並未特別限制，但⑼ C〜200 C較佳。為了使IT〇膜充分氧化，提升ιτ〇膜之密接性，6〇C以上較佳，更好是l〇〇°C以上。若200°c以上，殘存於PET膜之低聚物將析出，會使之白濁，並不適宜。如此，於濺鍍時，亦需要高溫，因此可能產生翹曲，但藉由本發明之熱硬化樹脂而安定化之PET膜，亦具有不合產生翹曲的特徵。又，關於導電性之薄膜材料並未特別限制，例如：含有氧化錫、氧化銦錫（稱為IT〇)、銻之氧化錫等金屬氧化物、錫之氟添加氧化物、氧化鋅之外，亦可使用金、銀、鉑 1巴、銅、鋁、鎳、鉻、鈦、鈷、錫或此等之混合物或合金等。此導電性薄膜之厚度只要可賦予導電性均可，均未特別限疋但可為5〇Α以上，若過薄，表面電阻值變高，於作為τρ之電極使用之情況，成為1〇〇〇Ω/□以上，難以成為具有良好導電性之連續薄膜。另一方面，若過厚，會使透明性降低’因此適合之厚度為1〇〇〜2〇〇〇人。作為導電性物質，以透.明性或導電性之觀點來看，使用 27 200537529 以濺鍍使ITO附著者較佳，但此ITO—般在附著時點為非晶質。為了提升耐擦傷性、耐滑動性及環境安定性，據知係嘗試如前述實施熱處理，使ΙΤΟ結晶化。於要求高可靠性之導電性膜，此結晶化處理者雖增加，但此結晶化處理係以高溫實施1至數十小時，使ΙΤΟ膜變得昂貴。又，耐滑動性亦未必充分。本發明之使用低收縮基體之導電性膜，即使使用以往認為滑動性不佳之非晶質ΙΤΟ，仍可達成優異之耐滑動性。又，於使用結晶化ΙΤΟ之導電性膜，耐滑動性亦提升。於使用結晶化ΙΤΟ之導電性膜，耐滑動性未必充分，可能是因為由於用以ΙΤΟ結晶化之熱處理，ΙΤΟ之強度或緻密性雖增加，但由於施以熱而導致PET膜膨脹收縮，由於ITO與PET膜之膨脹率及收縮率不同，甚大之應力殘留於ITO層所致。由此可知，於本發明可使用非結晶ITO，以及一部分或幾乎全部結晶之ITO之任一者，但從無需結晶化處理，降低成本的觀點來看，可使用非結晶ITO之優點甚大。於此導電膜下，或於PET膜之相反面，若使高折射材料附著，於其上附著低折射材料的話，可製成低反射之導電性膜。高折射材料能以蒸鍍或濺鍍等手法，使氧化鈦或氧化锆附著，或者使此等粒子含於藉由紫外線或熱所硬化之材料中，使之硬化附著。低折射材料能以蒸鍍或丨賤鐘，使下述所示之介電體之SiOx ( x = 1〜2)等附著，以熱或紫外線使氟系樹脂硬化而附著。此為了低反射之層實施於PET 膜之任一單面，或者為了進一步低反射而實施於雙面均可 28 200537529 。近年來，高透過率之TP之需求高漲，適於使用形成防止反射層者。若於上述導電性薄膜上形成透明介電體薄膜，將進一步改善㈣性及耐擦傷性，可能較適宜。此介電體薄膜宜比導電性薄膜之折射率小，通常具有13〜】8之折射率，使用例如：CaF2、MgF2、Al2〇3、Si〇x(x==i〜2)等，盆中又以狐較廉價，較為適宜。此等材料可組合2種以上使用。介電體之膜厚並未特別限定’但通常為i〇〇〜3_A，2〇〇〜1500A更佳。若過薄，難以獲得連續薄膜，若過厚，導電性或透明性惡化，容易產生裂縫。又’導電性膜用於顯示器裝置等之情況，於加工時或使用時’可能於其表面產生指紋或污垢。為了解決此問題， 2㈣成有導電膜之面之相反最外層面，使防水或防污二：二！為具有此類效果之材料，除了例如：由含有經 =乙:基之二甲基聚石夕氧燒及甲基水二婦聚石夕氧烧之組之切酮化合物；及四氣乙埽、聚氯三氣乙稀等糸树月曰以外’亦可單獨或混合使用硫化經等。此等之來成方法並未特別㈣，按照材料可採用塗布法、喷霧法、/ 燒附法等。處理層之厚度並未特別上心程度。此處理亦可組合2種以上而貝轭’若與硬化性樹脂組合使用較有效率。 :=成，本發明之導電性膜具有良好滑動性，但亦 ==作為第一基體，在與第-基體之導電膜相反面，、_接著層進—步具有第二基體。在此，不止是 29 200537529 基體，第二基體亦可藉由已述之方法，使熱收縮率為 ▲。以下，進-步謀求提升耐滑動性。亦可僅使第一基體為低收縮率，但㈣本發明之方法，使兩基體均為低收缩 ’以耐滑動性效果變大之點來看，較為適宜。(S 26 200537529 Guide: The substance adheres to form a conductive film, which can be made into a "green" film with a low-shrink film as the base material. In the case of a hardened layer on one side of a PE butyl film, the conductive substance is also It can be attached to either the surface on the side where the hardened layer is provided or the surface on the side where the hardened layer is not provided. As a method for forming the conductive film, a vacuum plating method, a sputtering method, and an ion plating method can be used. Known technology ", but from the viewpoint of the uniformity of the film or the adhesion of the film to the PET substrate, it is preferable to form a thin film by a sputtering method. The temperature at which the sputtering method is performed, especially if the resistance of the MTP is suitable The value is not particularly limited, but ⑼ C ~ 200 C is preferred. In order to fully oxidize the IT0 film and improve the adhesion of the ιτ〇 film, a temperature of 60 ° C or higher is preferred, and a temperature of 100 ° C or higher is preferred. If it is above 200 ° C, the oligomer remaining in the PET film will precipitate, making it white and cloudy, which is not suitable. In this way, high temperature is also required during sputtering, so warpage may occur, but by the heat of the present invention PET film stabilized by hardening resin also has characteristics that are not suitable for warping. In addition, the conductive thin film material is not particularly limited, for example, metal oxides such as tin oxide, indium tin oxide (referred to as IT0), antimony tin oxide, fluorine-added oxide of tin, and zinc oxide. In addition, gold, silver, platinum, 1 bar, copper, aluminum, nickel, chromium, titanium, cobalt, tin, or a mixture or alloy thereof may be used. The thickness of the conductive film may be any thickness as long as it can impart conductivity. It is not particularly limited, but may be 50 Å or more. If it is too thin, the surface resistance value becomes high. When it is used as an electrode of τρ, it becomes 1000 Ω / □ or more. It is difficult to become a continuous thin film with good conductivity. On the other hand, if it is too thick, the transparency will be reduced. Therefore, a suitable thickness is 100 to 2000 people. As a conductive material, from the viewpoint of transparency or conductivity, 27 is used. 200537529 Sputter plating is preferred for ITO authors, but this ITO is generally amorphous at the point of attachment. In order to improve scratch resistance, sliding resistance, and environmental stability, it is known that the heat treatment is attempted as described above to crystallize ITO Guide for high reliability Although the number of crystallization treatments is increased, the crystallization treatment is performed at a high temperature for 1 to several tens of hours, making the ITO film expensive. Moreover, the sliding resistance is not necessarily sufficient. The conductive film can achieve excellent sliding resistance even when the amorphous ITO, which was previously considered to have poor sliding properties, is used. In addition, when a crystalline ITO conductive film is used, the sliding resistance is also improved. When a crystalline ITO is used, The conductive film may not have sufficient sliding resistance. It may be because the strength or compactness of ITO is increased due to the heat treatment used for crystallization of ITO, but the expansion and contraction of PET film is caused by the application of heat. The expansion of ITO and PET film Different rates and shrinkage rates are caused by very large stress remaining in the ITO layer. It can be seen that any of amorphous ITO and some or almost all crystalline ITO can be used in the present invention, but the crystallization treatment is never needed, reducing From a cost point of view, the advantage of using amorphous ITO is significant. Under this conductive film or on the opposite side of the PET film, if a high-refractive material is attached and a low-refractive material is attached to it, a low-reflection conductive film can be made. High-refractive materials can adhere titanium oxide or zirconium oxide by means of vapor deposition or sputtering, or these particles can be contained in a material hardened by ultraviolet or heat to harden and adhere. The low-refractive material can be adhered to SiOx (x = 1 to 2) of the dielectric material shown below by vapor deposition or low-temperature bellows, and the fluorine-based resin can be hardened and attached by heat or ultraviolet rays. This layer can be implemented on either side of the PET film for low reflection or on both sides for further low reflection. 28 200537529 In recent years, the demand for TP with high transmittance has increased, and it is suitable for use in forming an antireflection layer. If a transparent dielectric film is formed on the above-mentioned conductive film, it may be more suitable to further improve the resistance and scratch resistance. The dielectric film should have a refractive index smaller than that of the conductive film, and usually has a refractive index of 13 to 8; for example, CaF2, MgF2, Al2O3, Si0x (x == i ~ 2), etc. The Chinese and the foxes are cheaper and more suitable. These materials can be used in combination of two or more. The film thickness of the dielectric is not particularly limited, but it is usually 100 to 3_A, and more preferably 200 to 1500A. If it is too thin, it is difficult to obtain a continuous film, and if it is too thick, conductivity or transparency is deteriorated, and cracks are liable to occur. When the "conductive film" is used in a display device or the like, fingerprints or dirt may be generated on the surface during processing or use. In order to solve this problem, 2 is formed into the outermost layer on the opposite side of the surface with a conductive film to make it waterproof or stain-proof. It is a material with such effects, except for example: a ketone compound containing a group of dimethyl polylithium oxalate and methyl water dihydrate poly oxalate; and four gas acetamidine , Polychlorinated triazine, etc. In addition to the sassafras month, it can also be used alone or in combination. These methods of formation are not particularly limited, and a coating method, a spray method, a sintering method, etc. may be used depending on the material. The thickness of the treatment layer is not particularly focused. This treatment can also be used in combination of two or more types. It is more effective to use yoke 'in combination with a curable resin. : = Yes, the conductive film of the present invention has good sliding properties, but also == as the first substrate, on the opposite side to the conductive film of the -substrate, the next step further has a second substrate. Here, it is not only the 2005 200529 substrate, but the second substrate can also make the thermal shrinkage rate ▲ by the method described above. Hereinafter, the sliding resistance is further improved. It is also possible to make only the first substrate a low shrinkage ratio. However, according to the method of the present invention, it is preferable that both substrates have low shrinkage because the sliding resistance effect becomes larger.

、作為具有此類第二基體之構成，亦可例如：於形成有前述V電性薄膜之低收縮基體之另—面，經由透明黏著劑層、口透明基體。此貼合係於透明基體上設置黏著劑層，於此貼合形成有前述導電性薄膜之低收縮基體，或者相反地’於形成有前述導電性薄膜之低收縮基體上，設置黏著 d層/於此貼合透明基體均可。從可使膜基劑成為輕狀，連只化成黏著劑層的觀點來看，於前述低收縮基體上設置黏著劑層係於生產面較有利。又二亦可例如：於前述低收縮之第一基體上，經由透明著切層，貼合第二透明基體，使總厚度在4〇〜#仍、内之後，於前述基體上設置導電性薄膜。作為黏著劑層，只要是具有透明性者均可，可無特別限制：使用，可舉例如：丙烯酸系黏著劑、矽酮系黏著劑、橡膝系黏著劑等。從提升導電性膜之耐擦傷性及打點特性的觀點來看’宜將其彈性係數設定於lxlG5〜lxloMyn/cm2 之知圍，將厚度設定於以上，通常設定於5〜100/zm 1圍右上述彈性係數未滿1 χ 1 〇5dyn/Cm2，由於黏著劑 2為非彈性，因此由於加壓容易變形，於基體甚至導電性 4膜產生凹凸’或者黏著劑同於從加工切斷面溢出，而且咸低耐擦傷性及打點特性之提升效果。另一方面，彈性係As a structure having such a second substrate, for example, on the other surface of the low-shrinkage substrate on which the above-mentioned V electrical film is formed, a transparent adhesive layer and a transparent substrate are used. This bonding is to set an adhesive layer on a transparent substrate, and to bond the low-contraction substrate on which the conductive film is formed, or conversely, to set the adhesive d layer on the low-contraction substrate on which the conductive film is formed. Any transparent substrate can be laminated here. From the standpoint that the film base can be made light and even become an adhesive layer, it is advantageous to provide an adhesive layer on the aforementioned low-shrinkage substrate to the production surface. For another example, a second transparent substrate may be bonded to the first substrate with low shrinkage through a transparent cutting layer so that the total thickness is within 40 ~ #, and then a conductive film is provided on the substrate. . The adhesive layer is not particularly limited as long as it has transparency. Examples of the adhesive layer include acrylic adhesives, silicone adhesives, and rubber knee adhesives. From the viewpoint of improving the scratch resistance and dot characteristics of the conductive film, 'the elastic coefficient should be set to the range of lxlG5 ~ lxloMyn / cm2, and the thickness should be set above, usually 5 ~ 100 / zm 1 The above-mentioned elastic coefficient is less than 1 χ 1 〇5dyn / Cm2, because the adhesive 2 is non-elastic, so it is easy to deform due to pressure, and unevenness is generated on the substrate or even the conductive 4 film. In addition, it has a low salt scratch resistance and an improvement of the dot characteristics. On the other hand, the elastic system

(S 30 4 4 200537529 數若超過ixloMyn/cm2，黏著劑層變硬’無法期待其緩衝效果，因此無法提升耐擦傷性及打點特性，不能期待貼合 •所帶來的效果。又，若黏著劑層之厚度未滿丨以爪，仍舊= 能期待其緩衝效果，因此無法提升耐擦傷性及打點特性，不能期待貼合所帶來的效果。再者，若過厚，會破壞透明性，或者在黏著劑層之形成或透明基體之貼合作業性、進而在成本面，難以獲得好結果。具有第二基體之構成之經由黏著劑層而貼合之第二基體 # ，於貼合此之後亦要求可撓性之情況，若塑膠膜未㈣要求可撓性之情況，係使用玻璃板、膜狀或板狀之塑膠。透明基體為塑膠膜之情況，前述低收縮之ρΕτ膜或其他塑膠膜均可。作為具體材料，可舉出：聚酿亞胺、聚喊硬、聚醚賴、聚礙酸醋、聚丙婦、聚酿胺、聚丙婦酸、乙酿基纖維素、聚芳酸醋、聚颯、冰片婦系之聚合物等。冰^ 系聚口物含有將具有冰片烯構造之單體及按照需要所添加之其他聚合性單體，進行開環聚合或附加聚合所獲得之聚籲合物’可例示：日本ΖΕ⑽股份有限公司之非極性冰片婦系聚合物之商品名稱：ΖΕ0ΝΕΧ或ZEONOR、JSR股份有限公司之極性冰片稀系聚合物之商品名稱：ARTON、三井化學股份有限公司之冰片烯系聚合物之商品名稱:a B E L、或：國H〇eChSt公司所開發之商品名稱·· TOPAS等’但並非限制於在此所舉出者，含有含冰片烯系構造體之聚合物。；苐基體之構成之經由黏著劑層所貼合之第二透明基體之厚度’宜為2〜3〇〇#m之範圍。若比薄無 31 200537529 法產生機械強度，缺乏製成貼合構造的意義，於使此基體成為秦b狀塗布黏著劑層，或進行後述之硬塗層處理等連績作業時’不僅會伴隨困難，亦可能於貼合產生皺紋等。、此觀,，、、έ厚度且為以上，上尤佳。若為3〇〇 // m以上，製成輥狀時會產生捲摺，不僅難以連續作業，而且由於殘留有捲摺，無法使用。以此觀點，較佳厚度為 250 "m以下，更好是23()/zm以下。如以上’本發明係使含有pET膜之基體以15〇°c加熱1小 • 時之後之熱收縮率，於MD及TD均為0.5%以下，以便獲得一種導電性膜，其係於作為TP之電極使用之情況，即使於製工序暴絡在尚溫之情況，仍不致產生輕曲，電極位置之紊亂小’且耐滑動性極端地改善者。特別是藉由在一面以100 C〜1 80 C進行熱處理，一面使架橋性樹脂硬化於 PET膜之基體，使導電膜附著所獲得之導電性膜，係於上述耐滑動性極端優異。本發明之觸控面板用導電性膜之製造方法係具有：基體 Φ 準備工序’其係準備基體，該基體至少具有由PET膜所形成之層，及架橋性物質已硬化成膜之硬化層，在以1 50〇C加熱1小時之後之長度方向（MD )及寬度方向（TD )之收縮率均為0 · 5 %以下；及導電膜附著工序，其係使導電膜附著於藉由前述基體準備工序所準備之基體者；於前述基體準備工序，以100°C至180°c間之溫度，將PET膜進行熱處理之同時，或以100°C至180°C間之溫度，將PET膜進行熱處理之後，使架橋性物質在前述PET膜之至少一面硬化，以 32 200537529 ；使至少1層之硬化層硬化成膜而形成。若根據本發明之製造方法，可獲得一種導電性膜，其係即使於製造工序暴露在高溫之情況，仍不致產生翹曲，電極位置之紊亂小，且耐滑動性極端地改善者。最有效的方法最初於PET膜塗布熱架橋型樹脂，以100°C 〜1 80°C之溫度保持數分鐘至數小時，以使之乾燥、硬化之方法。若根據此方法，能以一工序同時達到PET膜之尺寸安定性及熱安定性，且製造滑動性極優異之導電性膜。在 φ 工序上成為2工序，但亦可預先以100°C〜180°C，將PET膜進行熱處理，於其塗布以熱、光或電子線架橋之樹脂，使之硬化。如此所獲得之架橋性物質已硬化之PET膜，其後係因應目的而進一步層疊架橋型硬化層。於層疊有該硬化層之PET膜，附著有ITO等導電層。於本發明，在無機系之 ITO等導電層附著之前，必須使PET膜對於熱之收縮率減低，且安定化。又，於前述基體準備工序，若根據以100°C至180°c間之 φ 溫度，將PET膜進行熱處理之後，且前述PET膜冷卻至室溫之前，使架橋性物質在前述PET膜之至少一面硬化，以使至少1層之硬化層硬化成膜而形成之方法，可簡單地製造耐滑動性良好之導電性膜。特別是藉由使用未進行低收縮處理之二軸延伸PET膜，以100°C至180°C間之溫度，將PET膜進行熱處理之同時，使藉由熱所架橋硬化之硬化層在前述PET膜之至少一面硬化而形成，可使用廉價的材料，無需預先將PET膜進行熱 33 200537529 ； 4 處理之工序，且可製造耐滑動性極為優異之導電性膜。以下’以實施例更具體說明此發明。 (實施例1 )於二軸延伸之厚188 /z m之PET膜（東洋紡織製A4300)之一面，於輥上以張力10kg/cm2連續供給，並且以凹版塗層機，將丙烯酸樹脂（總研化學製U-230 ) 100重量部及硬化劑（曰本聚胺甲酸乙酯工業社製CORONET L ) 30重量部溶解於甲苯100重量部之溶液，塗布成乾燥後之塗布層厚度為2 // πι。 φ 一面以5m/分之速度，將此連續供給至設定於120°C、140(S 30 4 4 200537529 If the number exceeds ixloMyn / cm2, the adhesive layer will harden, and its cushioning effect cannot be expected. Therefore, it is not possible to improve the abrasion resistance and the dot characteristics, and the effect of bonding and adhesion cannot be expected. Also, if adhesion The thickness of the agent layer is less than 丨 with claws, still = its cushioning effect can be expected, so it is not possible to improve the scratch resistance and dot characteristics, and the effect brought by bonding cannot be expected. Moreover, if it is too thick, it will destroy transparency, Or it is difficult to obtain good results in the formation of the adhesive layer or the adhesion of the transparent substrate, and then in terms of cost. The second substrate # with the structure of the second substrate that is attached through the adhesive layer is attached here Later, when flexibility is required, if the plastic film does not require flexibility, glass plate, film or plate-shaped plastic is used. When the transparent substrate is a plastic film, the aforementioned low shrinkage ρΕτ film or other Plastic film is acceptable. Specific materials include polyimide, polyether, polyether, polyacid, vinegar, polypropylene, polyimide, polyacetic acid, ethyl cellulose, and polyarylate. Sour vinegar, polyfluorene Borneol polymers, etc. Ice-based polymers include polymer compounds obtained by ring-opening polymerization or additional polymerization of a monomer having a norbornene structure and other polymerizable monomers added as needed. Examples: Japan ’s non-polar borneol polymer polymer product name: ZE0NOE × or ZEONOR, JSR Co., Ltd. polar borneol polymer polymer product name: ARTON, Mitsui Chemical Co., Ltd., norbornene series Trade name of the polymer: a BEL, or: Trade names developed by the country's HoeChSt company ... TOPAS, etc. 'but not limited to those listed here, polymers containing a norbornene-based structure; 苐The thickness of the second transparent substrate bonded by the adhesive layer through the adhesive layer should be in the range of 2 ~ 300 # m. If the thickness is less than 31, the 200537529 method produces mechanical strength, which lacks the meaning of a bonded structure. "When this substrate is made into a Q-shaped b-coated adhesive layer, or when successive operations such as hard-coating treatment described below are performed, 'not only will it be accompanied by difficulties, but wrinkles may also be generated during bonding.' In this view, the thickness is more than the above, especially the upper. If it is 300 // m or more, it will be rolled when it is made into a roll, which is not only difficult to continuously operate, but also because it remains unusable. From this point of view, the preferred thickness is less than 250 " m, more preferably 23 () / zm or less. As described above, the present invention is to heat the substrate containing the pET film at 150 ° C for 1 hour. The shrinkage rate is less than 0.5% in both MD and TD, in order to obtain a conductive film, which is used when used as an electrode of TP. Even when the manufacturing process is exposed to the temperature, it will not cause light bending, the electrode Location disorder is small and the sliding resistance is extremely improved. Especially by heat treatment at 100 C ~ 1 80 C on one side, the bridging resin is hardened on the substrate of PET film, and the conductivity obtained by attaching the conductive film The film is extremely excellent in sliding resistance. The method for manufacturing a conductive film for a touch panel of the present invention includes: a substrate Φ preparation step, which prepares a substrate, the substrate having at least a layer formed of a PET film, and a hardened layer having a bridging substance hardened into a film, The shrinkage in the longitudinal direction (MD) and the width direction (TD) after heating at 1 500 ° C for 1 hour are both 0.5% or less; and a conductive film attachment step, which is to attach the conductive film to the substrate through the aforementioned substrate. For the substrate prepared in the preparation process; while the PET film is heat-treated at a temperature between 100 ° C and 180 ° c in the aforementioned substrate preparation step, or at a temperature between 100 ° C and 180 ° C, the PET film is processed. After the heat treatment, the bridging substance is hardened on at least one side of the PET film to form 32 200537529; at least one hardened layer is hardened to form a film. According to the manufacturing method of the present invention, it is possible to obtain a conductive film which does not cause warpage even when the manufacturing process is exposed to high temperatures, has small disturbances in electrode positions, and has extremely improved sliding resistance. The most effective method is to coat the PET film with a thermal bridging resin and hold it at a temperature of 100 ° C to 180 ° C for several minutes to several hours to dry and harden it. According to this method, the dimensional stability and thermal stability of the PET film can be achieved in one step, and a conductive film having excellent sliding properties can be manufactured. The φ step is two steps, but it is also possible to heat-treat the PET film in advance at 100 ° C to 180 ° C, and apply heat, light, or resin to bridge the resin to harden it. The thus-obtained PET film having the bridging substance hardened is further laminated with a bridging-type hardened layer according to the purpose. On the PET film laminated with the cured layer, a conductive layer such as ITO is attached. In the present invention, before a conductive layer such as an inorganic ITO is attached, it is necessary to reduce the heat shrinkage of the PET film and stabilize it. In the aforementioned substrate preparation step, if the PET film is heat-treated at a φ temperature between 100 ° C and 180 ° C, and before the PET film is cooled to room temperature, the bridging substance is placed at least in the PET film. A method in which one surface is hardened to harden at least one hardened layer into a film can easily produce a conductive film having good sliding resistance. In particular, by using a biaxially stretched PET film without a low shrinkage treatment, the PET film is heat-treated at a temperature between 100 ° C and 180 ° C, and the hardened layer bridged by heat is applied to the aforementioned PET. At least one side of the film is hardened and formed. An inexpensive material can be used, without the need to heat the PET film in advance. 33 200537529; 4 process, and a conductive film with excellent sliding resistance can be manufactured. Hereinafter, the present invention will be described more specifically with examples. (Example 1) On one side of a biaxially stretched 188 / zm thick PET film (A4300 manufactured by Toyobo), it was continuously supplied on a roller with a tension of 10 kg / cm2, and an acrylic resin (general U-230 made by chemical industry) 100 parts by weight and hardener (CORONET L manufactured by Polyurethane Industry Co., Ltd.) 30 parts by weight are dissolved in 100 parts by weight of toluene, and the thickness of the dried coating is 2 // πι. On the φ side, at a speed of 5m / min, this is continuously supplied to a setting of 120 ° C and 140 ° C.

C、1 50 c、130°c之分別長5m之4室所組成之乾燥爐，一面進行乾燥，同時使丙烯酸樹脂硬化。所獲得之膜設為膜 A1。於此膜A1之塗層面之相反面，藉由能以親狀連續供給膜A1之濺鑛裝置，在氬氣8〇%及氧2〇%所組成之〇〇〇4T〇rr 之氣氣中’藉由採用錮一錫合金之反應性錢鑛法，使厚度 450A之氧化銦及氧化錫之複合氧化物（ιτο )所組成之透明非晶性導電性薄膜附著，獲得全光線透過率88·2%、表 • 面電阻值420Ω/□之導電性膜（膜Β1)。此膜之特性評估結果係表示於表1 -1至1 -3。亦即，膜Α之熱收縮率記載於表J J ，膜B之特性值記載於表丨_2，膜B之作為τρ之電極之特性記載於表1_3。 (實施例2)除了使非晶性ιτο附著於膜八丨之塗層面，以取代使非晶性ΙΤΟ附著於膜^之塗層面之相反面以外，與貫施例相同地獲得膜Β2。於表1 -1表示特性評估結果。 (實施例3)與實施例1相同地獲得膜A1之後，於此塗層 34 200537529 ' 爲屬面’以晶片塗層機，將中國塗料製之〗〇〇重量部之AUREX 344及5部之IRUGACURE 184添加於甲苯100重量部之溶液 (塗層劑溶液），連續地塗布成厚度為3//m。與實施例！相同，將岫述膜以20m/分供給至4室所組成、設定於7〇°c、 100C、110°c、90°c之乾燥爐以進行乾燥之後，以120W/cm 之南壓水銀燈照射紫外線，使之硬化，獲得膜A3。於此膜 A3之塗層面之相反面，與實施例1相同，使非晶性IT〇附著 ’獲得膜Β3。特性評估結果表示於表丨_ 1。擊（貫施例4 )除了於實施例！所獲得之膜a丨之塗層面，使用於實施例3之塗層劑溶液添加平均粒徑8 m之矽粒子5 重里，並混合均勻之溶液以外，與實施例3相同地塗布、乾燥、硬化，獲得膜Α4。於此膜Α4之塗層面之相反面，與實施例1相同地使非晶性ΙΤ0附著，獲得膜Β4。於表1β1表示特性評估結果。 (實施例5)除了於實施例3所獲得之膜A3之塗層面之相反面，將於實施例3之塗層劑溶液添加平均粒徑8 #㈤之矽 _ 粒子2重量部，並使混合均勻之溶液相同地塗布、乾燥、硬化，獲得兩面塗層之膜A5。於此膜A5之含矽粒子之塗層面 ’與實施例1相同地使非晶性ITO附著，獲得膜B5。於表u 表示特性評估結果。 (實施例6 )於實施例4所獲得之膜A4之塗層面之相反面 ’使與實施例4完全相同之塗層液塗布、乾燥、硬化，獲得兩面塗層之膜A6。於此膜A6之最初塗層側之塗層面，與實施例1相同地使非晶性ITO附著，獲得膜B6。於表u表示 35 4 4 200537529 特性評估結果。 (實施例7〜9 )使用實施例3之膜A3、實施例5之膜A5 、實施例6之膜A6，依序藉由濺鍍法，於IT〇面之下設置厚度500Α之Ti〇2層及厚度600Α之Si〇2層之後，與實施例1相同地使ITO附著，獲得膜B7、膜B8、膜B9。於表l-丨表示特性評估結果。 (實施例10)於二軸延伸之厚188/zm之PET膜（東洋紡織製A4300 )，以晶片塗層機，將實施例3之中國塗料製之 φ AUREX 344稀釋於甲苯之溶液，塗布成厚度6/zm，以張力 l〇kg/cm2連續地供給，通過分別設定於8(^c、ι〇(Γ(：、ι2〇 C、150 C之4室所組成之乾燥爐以乾燥之後，以12〇w/cm 之高壓水銀燈照射紫外線，使之硬化，.獲得膜A7。於此膜八7 ’與實施例1相同，使ITO附著，獲得膜b 1 〇。特性評估結果表示於表1 -1。 (實施例11 )於實施例1 0之膜A7之塗層面之相反面，將含有實施例5之矽粒子之塗層液，與實施例5相同地塗布、籲乾燥、硬化，獲得膜A8。於此膜A8之含石夕粒子之塗布面，依序藉由濺鍍使與實施例7相同構成之Ti02、Si02、ITO附著，獲得膜B 1 1。於表1 -1表示特性評估結果。 (實施例12〜1 3 )於實施例1，除了使熱硬化樹脂之塗布後之乾燥速度設為3m/分及10m/分，以製造膜A9及A1 0以外，完全相同地獲得膜B12及膜B13。於表1_丨表示特性評估結果。 (實施例I4 )將厚1 88 // m之東洋紡織製A4300之輥，放 36 200537529 置於設在150°C之恆溫層24小時，進行埶卢 — 遣仃熟處理。於此塗布盥貫施例4相同之UV硬化型之塗布液。盥 /、一灵施例4相同地乾燥後y吏之硬化，獲得A11。於A11，與實施例4相同地使ιτ〇附著，獲得Β 14。於表1 -1表示特性評估結果。 (比較例1)不塗布塗層液，於二軸延伸之厚丨88# m之㈣膜（東洋紡織製A4300)(膜A12)’與實施⑷相同地附著ITO，獲得膜B15。於表卜丨表示特性評估結果。 (比較例2)於膜A12之單面，將實施例3之中國塗料製之AUREX 344稀釋於甲苯之溶液，塗布成厚度6心，通過 T別設定於m：、10(rc、10(rc、10〇。〇之4室所組成之乾燥爐以乾燥之後，以120w/cm之高壓水銀燈照射紫外線，使之硬化獲得膜A1 3，與實施例1相同，使IT〇附著，獲得膜Β16。特性評估結果表示於表丨]。C, 1 50 c, and 130 ° C, four-chamber drying ovens each having a length of 5 m, dry the acrylic resin while curing it. The obtained film was referred to as film A1. On the opposite side of the coating surface of this film A1, through a ore splashing device capable of continuously supplying the film A1 with an affinity, a gas of 0.004T0rr composed of 80% argon and 20% oxygen In the middle, a transparent amorphous conductive film composed of indium oxide and tin oxide composite oxide (ιτο) with a thickness of 450A was adhered by using a reactive gold mining method of a tin-tin alloy to obtain a total light transmittance of 88. • 2%, surface • Conductive film (film B1) with a surface resistance of 420Ω / □. The results of the characteristics evaluation of this film are shown in Tables 1-1 to 1-3. That is, the thermal shrinkage of the film A is described in Table J J, the characteristic values of the film B are described in Table 丨 _2, and the characteristics of the electrode of the film B as τρ are described in Table 1_3. (Example 2) A film B2 was obtained in the same manner as in the embodiment except that the amorphous ιτο was attached to the coating surface of the film VIII instead of the opposite surface where the amorphous ITO was attached to the coating surface of the film ^. . Table 1 -1 shows the results of the characteristic evaluation. (Example 3) After obtaining the film A1 in the same manner as in Example 1, the coating 34 200537529 was used as the surface of the wafer. Using a wafer coating machine, the weight of AUREX 344 made by China Paint and 5 parts IRUGACURE 184 is a solution (coating agent solution) added to 100 parts by weight of toluene, and is continuously applied to a thickness of 3 // m. And examples! Similarly, the described film was supplied to a 4-chamber consisting of 20m / min, and was set at 70 ° C, 100C, 110 ° c, and 90 ° c for drying, and then irradiated with a 120W / cm south pressure mercury lamp. Ultraviolet light was used to harden the film A3. On the opposite side of the coating surface of this film A3, as in Example 1, an amorphous IT0 was adhered 'to obtain a film B3. The characteristic evaluation results are shown in Table 丨 _ 1. (Executive Example 4) Except for the examples! The coating surface of the obtained film a 丨 was used in the coating agent solution of Example 3 to add 5 weights of silicon particles with an average particle diameter of 8 m, and the solution was mixed uniformly. It hardened and obtained the film A4. On the opposite side to the coating surface of this film A4, the amorphous ITO was adhered in the same manner as in Example 1 to obtain a film B4. The results of the characteristic evaluation are shown in Table 1β1. (Example 5) In addition to the coating surface of film A3 obtained in Example 3, the coating agent solution of Example 3 was added with an average particle size of 8 # ㈤ of silicon _ particles 2 parts by weight, and The uniformly mixed solution was applied, dried, and hardened in the same manner to obtain a film A5 with a double-sided coating. An amorphous ITO was adhered to the coating surface containing silicon particles on this film A5 in the same manner as in Example 1 to obtain a film B5. The results of the characteristic evaluation are shown in Table u. (Example 6) On the opposite side of the coating surface of the film A4 obtained in Example 4 ', the same coating liquid as in Example 4 was applied, dried, and hardened to obtain a double-coated film A6. On the coating surface on the first coating side of this film A6, amorphous ITO was adhered in the same manner as in Example 1 to obtain a film B6. Table 4 shows the results of 35 4 4 200537529 characteristic evaluation. (Examples 7 to 9) Films A3 of Example 3, Films A5 of Example 5, and Films A6 of Example 6 were used to sequentially set a thickness of 500A of Ti〇2 under the surface of IT0 by sputtering. After the layer and the SiO2 layer having a thickness of 600 A, ITO was adhered in the same manner as in Example 1 to obtain a film B7, a film B8, and a film B9. Table 1- 丨 shows the results of the characteristic evaluation. (Example 10) A 188 / zm-thick PET film (A4300 manufactured by Toyobo Co., Ltd.), which was biaxially stretched, was diluted with a solution of φ AUREX 344 manufactured by China Coatings of Example 3 in toluene using a wafer coating machine, and coated with The thickness is 6 / zm, and it is continuously supplied with a tension of 10 kg / cm2, and then dried by a drying furnace composed of 4 chambers set at 8 (^ c, ι〇 (Γ (:, ι20 ° C, 150 C), Film A7 was obtained by irradiating ultraviolet rays with a high-pressure mercury lamp at 120 watts / cm to obtain a film A7. Here, film 8 7 ′ is the same as in Example 1, and ITO was attached to obtain a film b 1 〇. The results of the characteristic evaluation are shown in Table 1. -1. (Example 11) On the opposite side of the coating surface of the film A7 of Example 10, the coating liquid containing the silicon particles of Example 5 was applied, dried, and hardened in the same manner as in Example 5. A film A8 was obtained. On the coating surface of the film A8 containing the stone eve particles, Ti02, SiO2, and ITO having the same structure as in Example 7 were sequentially adhered by sputtering to obtain a film B 1 1. The results are shown in Table 1-1. Results of characteristics evaluation (Examples 12 to 1 3) In Example 1, except that the drying speeds after coating the thermosetting resin were set to 3 m / min and 10 m / min, Except for the production of films A9 and A1 0, films B12 and B13 were obtained in the same manner. The results of the characteristics evaluation are shown in Table 1_ 丨. (Example I4) A roller of Toyobo A4300 with a thickness of 1 88 // m was placed in 36 200537529 Placed in a thermostatic layer set at 150 ° C for 24 hours, and carry out the curing process. Here, apply the UV curing coating liquid of the same as in Example 4. Here, the same as in Example 4 and Yiling After drying, it was cured to obtain A11. At A11, ιτ〇 was adhered in the same manner as in Example 4 to obtain B 14. The results of the property evaluation are shown in Table 1 to 1. (Comparative Example 1) Without coating liquid, Thickness of biaxial extension 丨 88 # m ㈣ film (Toyobo A4300) (film A12) 'was attached to ITO in the same manner as in Example ⑷ to obtain film B15. Table 丨 shows the results of the characteristic evaluation. (Comparative Example 2) On one side of the film A12, a solution of AUREX 344 made by China Coatings in Example 3 diluted in toluene was applied to a thickness of 6 cores, and T was set at m: 10 (rc, 10 (rc, 100.0). After drying in a drying furnace composed of 4 chambers, a high-pressure mercury lamp of 120 w / cm was used to irradiate ultraviolet rays and harden to obtain film A1 3, which The same as in Example 1, so IT〇 adhesion of the film obtained Β16. Characteristic evaluation results are shown in Table Shu].

37 4 200537529 j * •熱收縮率係將l〇cm見方之膜A，放置於設定為150°C之電爐中1小時之後，冷卻至室溫，從加熱前後之尺寸所算出。【表1-2】實施例及比較例膜B 透過率 (% ) 電阻值 (Ω/Π ) ITO之相反面錯筆硬度霾值 ~ (% ) 實施例1 B1 88.2 420 2H 0.8 實施例2 B2 87.8 418 B 0.8 — 實施例3 B3 88.0 422 3H 0.8 實施例4 B4 87.9 420 3H 5.3 實施例5 B5 88.0 425 3H 1.5 實施例6 B6 87.8 418 3H 9.8 實施例7 B7 92.3 420 3H 1.0 實施例8 B8 92.0 423 3H 1.5 實施例9 B9 87.8 422 3H 9.9 實施例1 0 B10 88.3 425 3H 1.0 實施例1 1 B1 1 92.6 409 3H 1.6 實施例12 B12 88.4 418 2H 0.8 實施例1 3 B13 88.1 ~419 2H 0.9 實施例14 B14 87.0 "420 ' ' 3H 12.5 比較例1 B15 87.8 "420~~ B 1.2 比較例2 B16 88.0 "425 3H 1.3 電阻值係採用4端子法，以寬度7〇〇mm、長度im，等間隔測定50點，計算平均值求出。 •透過率係採用分光透過計，測定波長550nm之光之透過率。 •鉛筆硬度係使用三菱Uni，以荷重5〇〇g，1〇次不會留下擦痕之硬度。 •霾值係以霾值計測定平行透過率及擴散透過率所算【表1-3】實施例及 150〇C、1 250g 、 10 比較例小時後之萬次直線纽曲滑動後之 (mm ) 電阻值變化（％ ) 50〇g 、 30 萬次直線滑動後之電阻值變化（％、 CO字之變} 、文後值％ og次動阻C 50萬滑電化 10字之變} 、文後值％ og次動阻C 25萬滑電化 38 200537529 實施例1 2.5 2.5 8.8 2.6 9.5 實施例2 2.8 2.9 9.0 2.6 9.9 實施例3 實施例4 2.2 〇〇 2.2 7.5 2.4 8.8 2.3 7.3 2.5 8.5 實施例5 0.8 1.0 4.5 1.3 4.3 貫施例6 實施例7 0.7 "Γ8~' 0.9 Χϊ-- 4.0 0.8_ ~2^3 Χο ~~—--------- 8.0 實施例8 0.7 0.9 3.8 0.8 4.0 賞例9 0.6 0.6 2.9 0.7 3.0 貫施例1 0 3.5 2.9 ΤΙ 3.0 9.8 貫施例1 1 1.0 2.6 9.0 2.6 9.2 貫施例1 2 1 · 8 2.3 7.6 2.2 8.0 貫施例1 3 3.1 4.0 13.5 4.3 12.8 貫德例1 4 比較例1 3.3 10.8 2.9 2.8 10.5 100以上 - 100以上 • 比較例2 8.9 25.8 100以上 30.9 100以上翹曲係將l〇cm見方之膜B，放置於設定在15〇。(：之電爐60分鐘，測定端部之浮起。 •直線滑動性及文字滑動性係經由玻璃ιτο及間隔物 ’做成TP模組，實施滑動性測試。直線滑動性係以0.8R聚縮醛筆，施加25〇§及5〇〇g之荷重1 〇萬-人之情況則來回5萬次，3 0萬次之情況則15 萬次來回，測定該部分之電阻值，計算電阻值從初始值之上升比例。 •文字滑動性亦與直線滑動性相同地測定。。如實施例所示可知，本發明之觸控面板用導電性膜係15() °c、1小時之加熱處理後之翹曲+，且即使實施作為τρ之電極使用時之直線及文字滑動性測試，電阻值之變化仍小，成為具有極優異之耐環境性及耐久性之之電極。【圖式簡單說明】圖1 Α係表示本發明之觸控面板用導電性膜之一例之圖。圖1B係表示本發明之觸控面板用導電性膜之其他一例 39 200537529 之圖。 ®】c係、表示本不ι月之觸控面板用導 i。电性膜之其他一例圖】D係表示本私日月性膜之其他一例之圖。圖1E係表示本發明圖。不七明之觸控面板用導電之觸控面㈣導電性膜之其他-例之37 4 200537529 j * • The thermal shrinkage is calculated by measuring 10 cm square film A in an electric furnace set at 150 ° C for 1 hour, and then cooling to room temperature. [Table 1-2] Examples and Comparative Examples Film B Transmittance (%) Resistance value (Ω / Π) ITO opposite side wrong pen hardness haze value ~ (%) Example 1 B1 88.2 420 2H 0.8 Example 2 B2 87.8 418 B 0.8 — Example 3 B3 88.0 422 3H 0.8 Example 4 B4 87.9 420 3H 5.3 Example 5 B5 88.0 425 3H 1.5 Example 6 B6 87.8 418 3H 9.8 Example 7 B7 92.3 420 3H 1.0 Example 8 B8 92.0 423 3H 1.5 Example 9 B9 87.8 422 3H 9.9 Example 1 0 B10 88.3 425 3H 1.0 Example 1 1 B1 1 92.6 409 3H 1.6 Example 12 B12 88.4 418 2H 0.8 Example 1 3 B13 88.1 ~ 419 2H 0.9 Example 14 B14 87.0 " 420 '' 3H 12.5 Comparative Example 1 B15 87.8 " 420 ~~ B 1.2 Comparative Example 2 B16 88.0 " 425 3H 1.3 The resistance value is a 4-terminal method with a width of 700 mm and a length of im. 50 points were measured at regular intervals, and the average value was calculated. • Transmittance is measured by using a spectroscopic transmissometer to measure the transmittance of light with a wavelength of 550 nm. • The hardness of the pencil is Mitsubishi Uni, with a load of 500g, and hardness that does not leave scratches 10 times. • The haze value is calculated by measuring the parallel transmittance and the diffuse transmittance with a haze value. [Table 1-3] After the 10,000 times of linear knurling of the example and 150 ° C, 1 250g, 10 hours after the comparative example (mm ) Change of resistance value (%) Change of resistance value after 500,000 linear slides (%, change of CO character), post value% og dynamic resistance C change of 500,000 slippery electricity by 10 characters}, text After value% og times dynamic resistance C 250,000 slip electrification 38 200537529 Example 1 2.5 2.5 8.8 2.6 9.5 Example 2 2.8 2.9 9.0 2.6 9.9 Example 3 Example 4 2.2 〇2.2 2.2 7.5 2.4 8.8 2.3 7.3 2.5 8.5 Example 5 0.8 1.0 4.5 1.3 4.3 Example 6 Example 7 0.7 " Γ8 ~ '0.9 χϊ-- 4.0 0.8_ ~ 2 ^ 3 Χο ~~ --------- 8.0 Example 8 0.7 0.9 3.8 0.8 4.0 Award Example 9 0.6 0.6 2.9 0.7 3.0 Implementation Example 1 0 3.5 2.9 TI 3.0 9.8 Implementation Example 1 1 1.0 2.6 9.0 2.6 9.2 Implementation Example 1 2 1 · 8 2.3 7.6 2.2 8.0 Implementation Example 1 3 3.1 4.0 13.5 4.3 12.8 Guande Example 1 4 Comparative Example 1 3.3 10.8 2.9 2.8 10.5 100 or more-100 or more • Comparative Example 2 8.9 25.8 100 or more 30.9 100 or more cm square film B, placed at 15 °. (: Electric furnace for 60 minutes, measuring the end of the float. • Linear sliding and text sliding properties are made of TP module through glass ιτο and spacers, and implemented Sliding test: The linear sliding performance is 0.8R polyacetal pen, with a load of 500,000§ and 500,000 g of 100,000-persons, back and forth 50,000 times, and 300,000 times, 150,000 times Measure the resistance value of the part back and forth, and calculate the increase ratio of the resistance value from the initial value. • The text sliding property is also measured in the same way as the linear sliding property. As shown in the examples, it can be seen that the conductive film for a touch panel of the present invention It is the warpage after heat treatment at 15 () ° C for 1 hour +, and even if the straightness and character sliding test when used as τρ electrode, the change in resistance value is still small, and it has excellent environmental resistance And durable electrodes. [Brief description of the drawings] Figure 1A is a view showing an example of the conductive film for a touch panel of the present invention. Figure 1B is another example of the conductive film for a touch panel of the present invention. 39 200537529 Figure. ®] c is the guide for the touch panel of this month. Another example of an electric film] Figure D is a diagram showing another example of the private sun-lunar film. Fig. 1E is a diagram showing the present invention. The conductive touch surface for the touch panel of Bumingming and other conductive films

圖1F係表示本發明之觸控面板用導電性膜之其他一例之【主要元件符號說明】 1 基體導電膜 4 、 4a 、 4b 由聚對苯二甲酸乙二酯膜（PET膜）所形成之層硬化層FIG. 1F shows another example of the conductive film for a touch panel of the present invention. [Description of main element symbols] 1 The base conductive film 4, 4a, 4b is formed of a polyethylene terephthalate film (PET film). Hardened layer

Claims

200537529 Λ Λ Λ 拾、申請專利範圍： 1. 一種觸控面板用導電性膜，其特徵在於：在至少具有由聚對苯二甲酸乙二酯膜所形成之層，及架橋性物質已硬化成膜之硬化層之基體上，形成導電膜而成；前述基體在以150°c加熱1小時之後之長度方向（MD)及寬度方向（TD )之收縮率均為〇 · 5 %以下。 2·如申請專利範圍第1項所述之觸控面板用導電性膜，其中作為硬化層者，基體係具有熱架橋性物質已硬化成膜籲之硬化層。 3 ·如申凊專利範圍第2項所述之觸控面板用導電性膜，其中基體係進一步具有：藉由光或電子線之架橋性物質已硬化成膜之硬化層。 4·如申請專利範圍第3項所述之觸控面板用導電性膜，其中基體係於藉由聚對苯二曱酸乙二酯膜所形成之層之兩側，具有藉由光或電子線之架橋性物質已硬化成膜之硬化層。 5·如申請專利範圍第1項所述之觸控面板用導電性膜，其中導電膜為非晶性ιτο (氧化銦錫）。 6·如申請專利範圍第1項所述之觸控面板用導電性膜，其藉由預先在處理成以1 50°C加熱1小時之後之長度方向（ MD )及寬度方向（TD)之收縮率均為〇·5%以下之基體，使導電膜附著所獲得。 7 ·如申請專利範圍第6項所述之觸控面板用導電性膜，其中至少1層之硬化層係在以100。〇至i8(rc間之溫度，將聚 41 200537529 Μ Μ Μ 對苯二甲酸乙二酯膜進行熱處理之同時，或以l〇〇°C至180 c間之溫度，將聚對苯二甲酸乙二酯膜進行熱處理之後，使&橋性物質在前述聚對苯二甲酸乙二酯膜之至少一面硬化所獲得。 • 一種觸控面板用導電性膜之製造方法，其特徵在於具有·基體準備工序，其係準備基體，該基體至少具有由聚對苯二甲酸乙二酯膜所形成之層，及架橋性物質已硬化成200537529 Λ Λ Λ The scope of patent application: 1. A conductive film for touch panel, characterized in that it has at least a layer formed of a polyethylene terephthalate film, and a bridging substance has been hardened into A conductive film is formed on the substrate of the hardened layer of the film; the shrinkage of the substrate in the longitudinal direction (MD) and the width direction (TD) after heating at 150 ° C for 1 hour is less than 0.5%. 2. The conductive film for a touch panel according to item 1 of the scope of application for a patent, wherein as a hardened layer, the base system has a thermally bridging substance that has been hardened to form a hardened layer. 3. The conductive film for a touch panel as described in item 2 of the patent claim, wherein the base system further has: a hardened layer that has been hardened into a film by a bridging substance of light or electron wire. 4. The conductive film for a touch panel according to item 3 of the scope of application for a patent, wherein the base system is on both sides of a layer formed by a polyethylene terephthalate film, and has light or electrons. The bridging substance of the wire has hardened into a hardened layer of the film. 5. The conductive film for a touch panel according to item 1 of the scope of application for a patent, wherein the conductive film is amorphous (indium tin oxide). 6. The conductive film for a touch panel according to item 1 of the scope of patent application, which is processed by shrinking in the longitudinal direction (MD) and the width direction (TD) after heating to 150 ° C for 1 hour in advance. Substrates with a yield of 0.5% or less were obtained by attaching a conductive film. 7 · The conductive film for touch panel according to item 6 of the scope of patent application, wherein at least one hardened layer is 100%. The temperature of 〇 to i8 (rc, polyethylene 41 200537529 Μ Μ Μ film while heat treatment, or at a temperature between 100 ° C and 180 c, polyethylene terephthalate After the diester film is heat-treated, the & bridging substance is hardened on at least one side of the aforementioned polyethylene terephthalate film. • A method for manufacturing a conductive film for a touch panel, which has a base The preparation step is to prepare a substrate having at least a layer formed of a polyethylene terephthalate film, and a bridging substance has been hardened into

膜之硬化層，在以15〇°c加熱i小時之後之長度方向（MD )及寬度方向（TD)之收縮率均為〇 5%以下；及導電膜附著工序，其係使導電膜附著於藉由前述基體準備工序所準備之基體者；於前述基體準備工序，以i〇〇t至 180 c間之溫度，將聚對苯二甲酸乙二酯膜進行熱處理之同時，或以1〇〇1至180。(：間之溫度，將聚對苯二甲酸乙二醋膜進行熱處理之後，使架橋性物質在前述聚對苯二甲酸乙二酯膜之至少一面硬化，以使至小]恳八從主v 1層之硬化層硬化成膜而形成。The shrinkage of the hardened layer of the film after being heated at 15 ° C for 1 hour in the longitudinal direction (MD) and width direction (TD) are both less than 05%; and the conductive film attaching step is to attach the conductive film to Those who have prepared the substrate through the aforementioned substrate preparation process; at the same time as the substrate preparation process, the polyethylene terephthalate film is heat-treated at a temperature between 100 and 180 c, or 100 1 to 180. (: Temperature, after heat-treating the polyethylene terephthalate film, the bridging substance is hardened on at least one side of the aforementioned polyethylene terephthalate film to make it small] 八八从主 v One hardened layer is formed by hardening into a film.

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