TW200521099A

TW200521099A - Glasses for display panels

Info

Publication number: TW200521099A
Application number: TW92136886A
Authority: TW
Inventors: Po-I Kuo; zheng-yu Lin
Original assignee: Po-I Kuo; zheng-yu Lin
Priority date: 2003-12-25
Filing date: 2003-12-25
Publication date: 2005-07-01
Also published as: TWI252844B

Abstract

A glass composition for display with consisting essentially of, as calculated in weight percent on an oxide basis, of 56.0% to 64.0% SiO2, 14.0% to 19.0% Al 2O3, 7.5% to 14.0% B2O3, 0.0% to 4.0% MgO, 3.0% to 10.0% CaO, 0.0% to 6.0% SrO, 0.0% to 10.0% BaO, 0.0% to 1.0% ZnO, 0.0% to 1.0% ZrO2, 0.0% to 2.0% As2O3, 0.0% to 1.0% Sb2O3, 0.0% to 1.0% SnO2 , 0.0% to 1.0% CeO2, and SiO2+Al2O3 > 71%, 1.0 to 2.1 Al2O3 B2O3, 3.0% to 10.0% MgO+CaO, 0.0% to 13.0% SrO+BaO, 0.3% to 2.Q% As2O3+Sb2O3+SnO2+CeO2.

Description

200521099 五、發明說明（1) 【發明所屬之技術領域本發明係有關一鍤^m > 用於生產平面顯示器破玻璃配方，尤指-種可 LCD )玻璃基板之破璃。土板’特別是用於液晶顯示器（【先前技術】按’顯示器可謂電腦部件中作用就是將主機發出& φ ^ :取重要的輸出设備，它的號，最終將文字ΐ开的；信=一系列處理後轉換成光信器(_等，然ΐ《：：；：示!!;=;、ί空螢光顯示器（VFD)是新一代顯干考==不f(ePDP)、真空蝥光顯示，因此尚未普& / 代表，但疋由於技術未臻成熟線管ί干ί 7c】t依)據\造材料和技術的不同可分為陰極射】! j不裔（CRT ) 、4離子顯示器（PDp )、發光二極管 ιίιΓ: (iED)、場致發光顯示器（ELD)、液晶顯示器（ CD )、電致變色顯示器（ECD )和電泳顯示器（Ερι〇 )等類^。其中彩色CRT (Cathode Ray Tube，陰極射線管） ^示器又分為薩r罩式CRT和電壓穿透式CRT。陰罩式CRT顯示器就是我們最常見的顯示器，利用電子搶^榮光屏之間有一用以形成栅孔或栅條的金屬蔭罩板而得名。雖然蔭罩式C^T顯示器比較耗電而且體積大，但價袼相對便宜、使用哥命較長，而且顯示效果也不錯。200521099 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a glass-breaking formula for the production of flat-panel displays, especially a glass-breakable glass substrate. Soil plate 'is especially used for liquid crystal display ([Previous technology] Pressing the' display can be described as a computer component is to send the host & φ ^: take the important output device, its number, and finally break the text; letter = After a series of processing, it will be converted into an optical transmitter (_ etc., but "《：：; ：示 !!; = ;, the empty fluorescent display (VFD) is a new generation of display test == not f (ePDP), vacuum蝥 Light display, so it has not been popular & representative, but 疋 because the technology is not mature, it can be divided into cathode shot according to different materials and technologies]! J 不族（CRT） , 4-ion display (PDp), light-emitting diodes: (iED), electroluminescence display (ELD), liquid crystal display (CD), electrochromic display (ECD), and electrophoretic display (Ερι〇), etc. Among them, color CRT (Cathode Ray Tube, cathode ray tube) monitors are divided into sar-type CRTs and voltage-through CRTs. Shade-type CRT displays are our most common displays. The use of electronics grabs the screen. Named after the metal shadow mask that forms the grid holes or bars. Although the shadow mask type C ^ The T display is relatively power consuming and bulky, but it is relatively cheap, has a long life span, and displays well.

200521099_ 五、發明說明（2) 雖然陰極射線管顯示器的綜合性能不錯，但是它仍有一些與生倶來的缺點，如體積龐大、耗電量大、輻射較強、容易受磁化等。然，上述這些缺點是由陰極射線管顯示器的工作原理造成的，不可能從根本上予以改變，只能進行後續的修補改進或在問題發生後再另行解決，為了解決上述種種缺陷，便發展出平面顯示器。所謂的平面顯示器是泛指非映像管（CRT )式的其他顯示器，但就產品技術差異而言，它包含有電漿顯示器（ PDP )、液晶顯示器（LCD )、有機電激發光顯示器（0LED )、真空螢光顯示器（VFD)、場效發射顯示器（FED)及微型顯示器（M i c r 〇 D i s p 1 a y )等多種類型。液晶顯示器包含下述優點： 1 ·結構和產品體積傳統顯示器由於使用CRT，必須透過電子槍發射電子束到螢幕，因而顯像管的管頸不能做得很短，當螢幕增大時也必然增大整個顯示器的體積。TFT液晶顯示器透過顯示屏上的電極控制液晶分子狀態來達到顯示目的，即使螢幕加大，它的體積也不會成正比的增加（只增加尺寸而不增加厚度，可以讓使用者更節省空間），而且在重量上比相同顯示面積的傳統顯示器要輕得多。同時TFT液晶顯示器由於功耗只在於電極和驅動的積體電路上，因而耗電量比傳統顯示器也要小得多。 2 ·幅射和電磁波干擾傳統顯示器由於採用電子槍發射電子束，在打到螢幕200521099_ V. Description of the invention (2) Although the overall performance of the cathode ray tube display is good, it still has some inherent disadvantages, such as large volume, large power consumption, strong radiation, and easy to be magnetized. However, these shortcomings are caused by the working principle of the cathode ray tube display, which cannot be fundamentally changed. They can only be repaired or improved after the problem occurs. In order to solve the above defects, they have been developed Flat display. The so-called flat-panel display refers to other non-image tube (CRT) type displays, but in terms of product technology differences, it includes a plasma display (PDP), a liquid crystal display (LCD), and an organic electroluminescent display (0LED) , Vacuum fluorescent display (VFD), field emission display (FED), and micro display (Micr OD isp 1 ay) and other types. The liquid crystal display includes the following advantages: 1. Structure and product volume. Traditional displays use CRTs, which must emit electron beams to the screen through an electron gun. Therefore, the neck of the picture tube cannot be made short. When the screen is enlarged, the entire display must be enlarged. volume of. TFT liquid crystal displays control the state of liquid crystal molecules through electrodes on the display screen to achieve display purposes. Even if the screen is enlarged, its volume will not increase proportionally (only increasing the size without increasing the thickness can allow users to save more space) , And is much lighter than conventional displays with the same display area. At the same time, the power consumption of the TFT liquid crystal display is only on the integrated circuit of the electrode and the driver, so the power consumption is much smaller than that of the traditional display. 2 · Radiation and electromagnetic wave interference Traditional displays are hitting the screen due to the use of electron guns to emit electron beams.

200521099 * 五、發明說明（3) 上後會產生幅射，儘管現有產品在技術上有很大的提高，把幅射損害降到最小，但不可能根除。在這一點上，T F T 液晶顯示器具有先天的優勢，它根本沒有幅射可言。至於 , 電磁波的干擾，TFT液晶顯示器只有來自驅動電路的少量電磁波，只要將外殼嚴格密封即可排除電磁波外泄，而傳統顯示器為了散熱，不得不將外殼鑽上散熱孔，所以電磁波干擾就不可避免了。所以液晶顯示器有稱為冷顯示器或環保顯示器。 3·平面直角和解析度 T F T液晶顯示器一開始就使用純平面的玻璃板，其平面直角的顯示效果比傳統顯示器看起來好得多。不過在解析度上，TFT液晶顯示器理論上可提供更高的解析度，但實際顯示效果卻差得多，因為它存在一個最佳解析度的問題。而傳統顯示器在較好顯示卡的支持下可以達到完美的顯示效果。 4. 附設現在很多液晶顯示器都内建了 USB Hub介面，隨著平面式音箱等的問世，液晶顯示器内置音箱或麥克風也會成為主流，種種附設使液晶顯示器有更大的選擇空間。液晶顯示器（LCD)比之傳統的CRT顯示器，有著圖像不失真、無閃爍、無輻射、輕、薄等利於健康和環保的優點 $ ，使其較傳統顯示器具有更好的發展空間。液晶顯示器是以液晶材料為基本元件，由於液晶是介於固態和液態之間，不但具有固態晶體光學特性，又具有200521099 * V. Invention description (3) Radiation will be generated after the introduction. Although the existing products have greatly improved in technology, the radiation damage is minimized, but it is impossible to eradicate. At this point, TFT LCD has inherent advantages, it has no radiation at all. As for the interference of electromagnetic waves, TFT liquid crystal displays only have a small amount of electromagnetic waves from the driving circuit. As long as the casing is tightly sealed, the leakage of electromagnetic waves can be ruled out. However, in order to dissipate heat, conventional displays have to drill holes in the casing, so electromagnetic interference is inevitable Already. So LCD displays are called cold displays or environmentally friendly displays. 3. Flat Right Angle and Resolution T F T LCDs use a pure flat glass plate from the beginning. The flat right angle display effect looks much better than traditional displays. However, in terms of resolution, TFT liquid crystal displays can theoretically provide higher resolution, but the actual display effect is much worse, because it has a problem of optimal resolution. The traditional monitor can achieve perfect display effect with the support of better graphics cards. 4. Attachments Many LCD monitors now have a built-in USB Hub interface. With the advent of flat-panel speakers, the built-in speakers or microphones of LCD monitors will also become mainstream. Various attachments make LCD monitors have more choices. Compared with traditional CRT displays, liquid crystal displays (LCDs) have health-friendly and environmental-friendly advantages such as non-distorted images, no flicker, no radiation, lightness, and thinness, which makes them have better development space than traditional displays. Liquid crystal displays are based on liquid crystal materials. Since liquid crystals are between solid and liquid, they not only have the optical properties of solid crystals, but also have

200521099200521099

五、發明說明（4)V. Description of the invention (4)

液態流動特性，所以已經可以說是一個中間相。而要了解液晶的所產生的光電效應，液晶的黏性和彈性從流體力學的觀點來看，可說是一個具有排列性質的液體，依照作用力量不同的方向，應該有不同的效果。此外，液晶除了有黏性的反應外，還具有彈性的反應，它們都是對於外加的力量，呈現了方向性的效果。也因此光線射入液晶物質中，必然會按照液晶分子的排列方式行進，產生了自然的偏轉現像。至於液晶分子中的電子結構，都具備著很強的電子共軛運動能力，所以當液晶分子受到外加電場的作用，便很容易的被極化產生感應偶極性（i n d u c e d d i ρ ο 1 a r )，這也是液晶分子之間互相作用力量的來源。一般電子產品中所用的液晶顯示器，就是利用液晶的光電效應，藉由外部的電壓控制，再透過液晶分子的折射特性，以及對光線的旋轉能力來獲得亮暗情況（或著稱為可視光學的對比），進而達到顯像的目的。Liquid flow characteristics, so it can already be said to be a mesophase. To understand the photoelectric effect produced by liquid crystals, the viscosity and elasticity of liquid crystals can be said to be a liquid with alignment properties from the point of view of fluid mechanics. According to the direction of different forces, they should have different effects. In addition, liquid crystals have elastic reactions in addition to viscous reactions. They are all directional effects on the applied force. Therefore, when light enters the liquid crystal material, it will inevitably proceed according to the arrangement of liquid crystal molecules, resulting in a natural deflection phenomenon. As for the electronic structure of the liquid crystal molecules, they all have a strong ability of electron conjugation, so when the liquid crystal molecules are subjected to an external electric field, they can be easily polarized to induce induced dipolarity (induced di ρ ο 1 ar). It is also the source of interaction forces between liquid crystal molecules. The liquid crystal display used in general electronic products is to use the photoelectric effect of liquid crystal, to control the external voltage, and then to pass through the refraction characteristics of liquid crystal molecules and the ability to rotate light to obtain light and dark conditions (also known as the contrast of visible optics). ) To achieve the purpose of imaging.

液晶顯示器，英文通稱為LCD (Liquid Crystal Display )，是屬於平面顯示器的一種，是依靠外部光源照明的平面顯示裝置，主要由二片玻璃基板及液晶等構成，依驅動方式來分類可分為靜態驅動（S t a t i c )、單純矩陣驅動（Simple Matrix)以及主動矩陣驅動（Active Matrix )三種。其中，單純矩陣型又可分為扭轉式向列型 (Twisted Nematic ;TN)、超扭轉式向列型（Super Twisted Nematic ;STN)及其他單純矩陣驅動液晶顯示器 ;而主動矩陣型大致可區分為薄膜式電晶體型（Th i ηLiquid crystal display, commonly known as LCD (Liquid Crystal Display) in English, is a type of flat display. It is a flat display device that relies on external light sources. It is mainly composed of two glass substrates and liquid crystal. It can be classified into static according to the driving method. There are three types of drivers: Static, Simple Matrix, and Active Matrix. Among them, the simple matrix type can be further divided into Twisted Nematic (TN), Super Twisted Nematic (STN) and other simple matrix driven liquid crystal displays; and the active matrix type can be roughly divided into Thin film transistor type (Th i η

第9頁 200521099 L------------ —_ 五、發明說明（5)Page 9 200521099 L ------------ —_ V. Description of the invention (5)

Film Transistor ; TFT)及二端子二極體型（Metal/ Insulator/Metal ;MIM)二種方式。目前在市場上常見的LCD有超扭轉向列型（STN)及薄 '膜電晶體型（TFT)，其中STN型屬於單純矩陣定址方式，而TFT型屬於主動矩陣定址方式，由於顯示效果比STn型更好，尤為市場上的主流。T F T型又常被分為非晶石夕型（ a-Si)及更先進的多晶石夕型（poly-Si)等二種構型。 LCD用的玻璃基板配合上述技術進程，而有種種組成、製造方式及特性上的區別。STN型一般使用驗石灰玻璃，T F T型則使用無鹼硼鋁矽酸鹽玻璃。於美國專利第5, 811，361號、第5, 851，939號、第6, 32 9, 310號等提到了作為TFT型LCD用之基板玻璃所必須具備下述的基本物理特性： 1、為了減少基板玻璃在TFT製程溫度下，因熱脹冷縮造成的熱震破壞，玻璃的熱膨脹係數必須夠低，一般需低於40 X 1 〇c 〇 2、應減少基板玻璃在TFT製程溫度下，因再熱緻密化引起的體積收縮和尺寸不安定性。具體要求是玻璃的應變點溫度應高於6 5 0 °C。 3、為了因應大尺寸基板玻璃輕量化的要求，玻璃的密度必須夠低，一般需低於2 · 6 ( g / c m3 )。 0 因此’為了生產符合上述基本需求的基板玻璃，現今常以熔融溢流法及浮式法等成型方式製造基板玻璃。然而，由於成型方式的需求，更衍生出對基板玻璃特性的進一Film Transistor; TFT) and two-terminal diode type (Metal / Insulator / Metal; MIM). The LCDs currently on the market are super-twisted nematic (STN) and thin-film transistor (TFT). The STN type is a simple matrix addressing method, while the TFT type is an active matrix addressing method. Type is better, especially the mainstream on the market. The T F T type is often divided into two configurations, such as amorphous crystalline (a-Si) and more advanced polycrystalline crystalline (poly-Si). The glass substrate for LCD is compatible with the above technical process, and there are various differences in composition, manufacturing method and characteristics. STN type generally uses lime glass, T F T type uses alkali-free boroaluminosilicate glass. U.S. Patent Nos. 5,811,361, 5,851,939, 6,32 9, 310, etc. mention that the substrate glass used as a substrate for TFT LCDs must have the following basic physical properties: 1. In order to reduce the thermal shock damage caused by thermal expansion and contraction of the substrate glass at the temperature of the TFT process, the thermal expansion coefficient of the glass must be sufficiently low, generally lower than 40 X 1 〇c 〇2, the substrate glass should be reduced at the TFT process temperature , Volume shrinkage and dimensional instability due to reheat densification. The specific requirement is that the strain point temperature of the glass should be higher than 65 ° C. 3. In order to meet the requirements for lightweighting of large-size substrate glass, the density of the glass must be low enough, generally lower than 2 · 6 (g / c m3). 0 Therefore, in order to produce a substrate glass that meets the above-mentioned basic needs, the substrate glass is currently manufactured by molding methods such as a melt overflow method and a float method. However, due to the needs of the molding method, further development of the glass characteristics of the substrate

200521099 五、發明說明（6) 步要求如下： 1、基板玻璃之液相溫度必須夠低，以免在成型過程中失透或析晶，影響到玻璃的外觀品質。液相溫度一般需低於 1 2 0 0 °C。 2、基板玻璃的氣泡含量必須減少，以免在TFT製程中造成斷路等缺陷，或影響到玻璃的外觀品質。一般需要每公斤基板玻璃中泡徑在0 · 5〜1 · 0 m m内的氣泡數目少於2 0 個。隨著多晶矽型（p〇ly-Si) TFT-LCD等次世代製程或產品需求的擴大’且為了因應poly-Si製程更高的精密度，對基板玻璃基本物理特性的要求，除了上述已經提及的部分之外，更進一步衍生出以下的要求： 1、熱膨脹係數繼續降低，一般需低於34 X 1 〇·7/ °C，除了減少熱震破壞，更希望與矽質驅動元件接近，以便曰後驅動元件電路直接製作在基板上（chip-〇n-glass) 時’減少玻璃和矽質間因熱膨脹係數失配引起的電路破壞。 2、 poly-Si TFT製程中，光學微影的精密度提升，電路線徑變窄’因此應變點溫度應再提高，最好高於6 6 5 °c ，以減少因再熱緻密化引起的體積收縮和尺寸不安定性，減輕曝光顯影過程中的對焦失準現象。 3、為了因應第五世代以上（n〇〇mnix 1250mm)玻璃基板的製造、搬運等的要求，玻璃基板需儘可能輕量化，因此’玻璃的禮、度需降低，一般需低於2·4 (g/cm3)。200521099 V. Description of the invention (6) The steps are as follows: 1. The liquidus temperature of the substrate glass must be low enough to avoid devitrification or crystallization during the molding process, which will affect the appearance quality of the glass. The temperature of the liquid phase generally needs to be below 120 ° C. 2. The bubble content of the substrate glass must be reduced to avoid defects such as disconnection in the TFT process or affect the appearance quality of the glass. Generally, the number of bubbles in a glass substrate with a bubble diameter of 0 · 5 ~ 1 · 0 mm per kg of substrate glass is less than 20. With the expansion of polysilicon (Poly-Si) TFT-LCD and other next-generation processes or product requirements' and in order to respond to the higher precision of poly-Si processes, the basic physical properties of substrate glass are required, in addition to the above-mentioned In addition to the parts that have been reached, the following requirements are further derived: 1. The thermal expansion coefficient continues to decrease, and generally needs to be lower than 34 X 1 0.7 / ° C. In addition to reducing thermal shock damage, it is more desirable to be close to the silicon drive element. In order to reduce the circuit damage caused by the thermal expansion coefficient mismatch between glass and silicon when the post-drive element circuit is directly fabricated on the substrate (chip-on-glass). 2. In the process of poly-Si TFT, the precision of optical lithography is improved, and the circuit wire diameter is narrowed. Therefore, the temperature of the strain point should be increased, preferably higher than 6 6 5 ° c, to reduce the risk of reheating and densification. Volume shrinkage and dimensional instability reduce the focus misalignment during exposure and development. 3. In order to meet the requirements for the manufacture and handling of glass substrates of the fifth generation and above (n0〇mnix 1250mm), the glass substrates need to be as light as possible, so 'the etiquette and degree of glass need to be reduced, generally lower than 2.4 (g / cm3).

200521099 五、發明說明（7) 由於液晶顯示器需求日漸殷切，然，用於顯示器板玻璃仍具有上述種種如：玻璃的熱膨脹係數需低於^基 1 〇-7/ °C、玻璃的應變點溫度應高於6 5 0 °C、玻璃的密户、x 須低於2· 6 (g/cm3 )、液相溫度需低於1 2 0 0 t：、每公板玻璃中泡徑在〇· 5〜1 · 〇mni内的氣泡數目少於20個等物基特性需克服。因此本發明人遂竭其心智研究克服，進硬發出一種顯示器用基板玻璃之組成，藉由特定比例之，研矽（si〇2)、氧化鋁（ai2〇3)、氧化硼（b2o3)、氧化鎂（Mg(^化氧化鈣（CaO)、氧化勰（Sr〇)、氧化鋇（BaO)、氧化鋅、、氧化鍅（zr〇2)、氧化砷（As2〇3)、氧化銻（Sb2〇3)、氣/〇) (Sn〇2)、氧化鈽（ce〇2)，能因應平面顯示器基板玻螭之種需求’且符合更嚴苛物理特性的要求如：熱膨脹係數低於34x 107/ C、應變點溫度高於665 °C、玻璃的密度低於 2. 4 (g/cm3)等〇【發明内容】 _ 由是’本發明的主要目的，即在設計一種可用於顯示為玻璃基板^破螭，藉由特定比例之氧化矽（S i 02)、氧化 t呂（A1=〇3)、氧化硼（B2 03 )、氧化鎂（MgO)、氧化鈣（CaO)、乳化，（Sr〇)、氧化鋇（BaO)、氧化鋅（ZnO)、氧化锆（Zr02 )、氧化神（As2〇3)、氧化銻（Sb203 )、氧化錫（Sn02)、氧化 #( Ce〇2 ) ’達到符合平面顯示器基板玻璃之種種需求。一抑為達上述目的，本發明是這樣實現的：一種可用於顯不$玻璃基板之坡璃，該玻璃之組成成份為重量百分比200521099 V. Description of the invention (7) Due to the increasing demand for liquid crystal displays, the glass used for display panels still has the above-mentioned types, such as: the thermal expansion coefficient of the glass needs to be lower than ^ base 10-7 / ° C, the strain point temperature of the glass It should be higher than 6 50 ° C, the density of the glass, x must be lower than 2 · 6 (g / cm3), the temperature of the liquid phase must be lower than 12 0 t: the bubble diameter of each male glass is 0 · The number of bubbles in 5 ~ 1 · 〇mni is less than 20, and other material-based characteristics need to be overcome. Therefore, the present inventors have exhausted their mental research to overcome, and hardly issued a composition of display substrate glass. With a specific ratio, research silicon (si02), aluminum oxide (ai203), boron oxide (b2o3), Magnesium oxide (Mg (calcium oxide (CaO), hafnium oxide (Sr0), barium oxide (BaO), zinc oxide, hafnium oxide (zr〇2), arsenic oxide (As2〇3), antimony oxide (Sb2 〇3), gas / 〇) (Sn〇2), hafnium oxide (ce〇2), can meet the requirements of flat glass substrates and meet more stringent physical characteristics such as: thermal expansion coefficient is less than 34x 107 / C, strain point temperature is higher than 665 ° C, the density of glass is lower than 2.4 (g / cm3), etc. [Abstract] _ You are the main purpose of the present invention, that is, in the design of a kind of glass that can be used for display The substrate is broken, with a specific proportion of silicon oxide (Si 02), oxide tlu (A1 = 03), boron oxide (B2 03), magnesium oxide (MgO), calcium oxide (CaO), emulsification, ( (Sr〇), barium oxide (BaO), zinc oxide (ZnO), zirconia (Zr02), god oxide (As2 03), antimony oxide (Sb203), tin oxide (Sn02), oxide # ( CeO2) ′ meets various requirements of glass for flat display substrates. In order to achieve the above purpose, the present invention is implemented as follows: a slope glass that can be used to display glass substrates, and the composition of the glass is a weight percentage

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第12頁 200521099 五、發明說明（8) 56.0% 至 64.0% 之氧化石夕、]4 n〇/2?in n r ^ 〆年吵丄4·以至19.0%之氧化鋁、7.5%至 14.0%之氧化侧、〇〇%至4π〇/夕备儿 Λ ft/ ^ · u 70主4 · 〇 /g之乳化鎂、3 . 0 %至1 〇 · 〇 %之氧 '，=·)二0%之氧化銷、〇· 0%至10· 0%之氧化鋇、〇. 至士。氧化辞、0· 0%至1· 〇%之氧化锆、0. 0%至2· 0% 之氧化砷、。0.(^至1〇%之氧化銻、〇〇%至1〇%之氧化錫、 0 · 0 %至1 .J) %之氧化鈽；且其中氧化矽與氧化鋁的總和超過 Ί · 〇 ^ ’氧化銘與氧化硼的比例介於1 · 〇與2 · 1之間，氧化鎮、氧化#5之總和介於3 · 〇 %至丨〇 · 〇 %之間，氧化勰、氧化鎖之，和介於0· 〇%至13· 〇%之間，氧化砷與氧化銻、氧化錫、氧化鈽之總和介於〇 · 3 %至2 · 〇 %之間；藉由特定之比例可使所生產之玻螭更符合平面顯示器基板玻璃之種種需求 ^ 為使貴審查委員瞭解本發明之目的、特徵及功效，兹藉由下述具體之實施例，對本發明做一詳細說明，說明如后：本發明之顯示器用基板玻璃之組成，其組成成分之重量百分比如下： (1 )重量百分比5 6 · 0 %至6 4 · 0 %之氧化矽（S i 02); (2 )重量百分比丨4 · 〇 %至1 9 · 0 °/。之氧化鋁（A 1 203 ); (3) 重量百分比7_5%至14.0%之氧化硼（62〇3); (4) 重量百分比〇·〇%至4.0%之氧化鎂（MgO); (5) 重量百分比3. 0%至10· 0%之氧化鈣（CaO); (6) 重量百分比〇·〇%至6.0%之氧化勰（SrO); (7) 重量百分比0· 0%至10· 0%之氧化鋇（BaO);Page 12 200521099 V. Description of the invention (8) 56.0% to 64.0% of oxidized stone,] 4 n〇 / 2? In nr ^ Noisy year after year 4. Alumina up to 19.0%, 7.5% to 14.0% Oxidation side, 〇% to 4π〇 / 备儿 ft / ^ · u 70 main 4 · 〇 / g of emulsified magnesium, 3.0% to 10% of oxygen ', = ·) 20% Oxidation pins, 0.0% to 10.0% barium oxide, 0.1 to ±. Oxidation, zirconia from 0.0% to 1.0%, arsenic oxide from 0.0% to 2.0%. 0. (^ to 10% of antimony oxide, 0.00% to 10% of tin oxide, 0. 0% to 1.J)% of hafnium oxide; and wherein the total of silicon oxide and alumina exceeds Ί · 〇 ^ 'The ratio of oxide oxide to boron oxide is between 1 · 〇 and 2 · 1, and the sum of oxidation town and oxidation # 5 is between 3 · 〇% and 丨〇 · 〇%. , And between 0.0% and 13.0%, and the sum of arsenic oxide and antimony oxide, tin oxide, thorium oxide is between 0.3% and 2.0%; by a specific ratio, The produced glass is more in line with the various requirements of flat display substrate glass ^ In order to make your reviewing committee understand the purpose, features and effects of the present invention, the following specific examples are used to describe the present invention in detail, as explained later : The composition of the substrate glass for a display according to the present invention, the weight percentages of its constituent components are as follows: (1) weight percentage 5 6 · 0% to 6 4 · 0% silicon oxide (S i 02); (2) weight percentage 丨4 · 〇% to 19 · 0 ° /. Aluminum oxide (A 1 203); (3) 7 to 5% to 14.0% by weight of boron oxide (62〇3); (4) 0.00 to 4.0% by weight of magnesium oxide (MgO); (5) 0% to 10.0% by weight of calcium oxide (CaO); (6) 0% to 6.0% by weight of thorium oxide (SrO); (7) 0% to 10% by weight % Of barium oxide (BaO);

第13頁 ! 200521099 五、發明說明（9) (8) 重量百分比0·0%至1.0%之氧化鋅（ZnO); (9) 重量百分比0·0%至1·0%之氧化锆（Zr02); , (1 0 )重量百分比0· 0%至2· 0%之氧化砷（As2 03 ); _ ( 1 1 )重量百分比0· 0%至1 · 0%之氧化銻（Sb2 03 ); (12) 重量百分比0.0%至1.0%之氧化錫（Sn02); (13) 重量百分比0·0%至1·0%之氧化鈽（Ce02); 其中氧化矽與氧化鋁的總和超過71.0%，氧化鋁與氧 - 化硼的比例介於1 . 0與2 . 1之間，氧化鎂、氧化鈣之總和介於3. 0%至1 0. 0%之間，氧化勰、氧化鋇之總和介於0· 0%至 1 1 3 . 0 %之間，氧化砷與氧化銻、氧化錫、氧化鈽之總和介於0 . 3 %至2 . 0 %之間。Page 13! 200521099 V. Description of the invention (9) (8) Zinc oxide (ZnO) from 0% to 1.0% by weight; (9) Zirconium oxide (Zr02) from 0% to 1.0% by weight );, (1 0) arsenic oxide (As2 03) by weight percentage of 0.0% to 2.0%; _ (1 1) antimony oxide (Sb2 03) by weight percentage of 0.0% to 1.0% (12) tin oxide (Sn02) from 0.0% to 1.0% by weight; (13) hafnium oxide (Ce02) from 0.0% to 1.0% by weight; wherein the total of silicon oxide and alumina exceeds 71.0%, The ratio of alumina to boron oxide is between 1.0 and 2.1, the sum of magnesium oxide and calcium oxide is between 3.0% and 1.0%, and the sum of hafnium oxide and barium oxide Between 0.0% and 13.0%, the total of arsenic oxide and antimony oxide, tin oxide, thorium oxide is between 0.3% and 2.0%.

^ 由上述本發明所揭露之玻璃組成，當僅具有TFT-LCD 玻璃基板所需的基本物理特性時，其組成成份之重量百分比分別為5 6 . 0 %至6 0 · 0 %之氧化矽，1 4 · 0 %至1 8 · 0 %之氧化鋁，7 · 5 %至1 4 · 0 °/。之氧化硼，0 · 0 %至2 · 0 °/。之氧化鎂，3 · 0 % 至7 · 0 %之氧化鈣，1 · 0 %至6 · 0 °/◦之氧化勰，2 · 0 %至1 0 · 0 %之氧化鋇，0 · 0 %至1 . 0 %之氧化鋅，0 · 0 %至1 · 0 %之氧化锆，0 · ’ 0 %至2 · 0 %之氧化砷，0 · 0 %至1 · 0 %之氧化銻，0 . 0 %至1 · 0 % 之氧化錫，0 . 0 %至1 · 0 %之氧化鈽，且其中氧化矽與氧化鋁的總和超過7 1 . 0 %，氧化鋁與氧化硼的比例介於1 . 0與2 . 1 之間，氧化鎂、氧化鈣之總和介於3. 0%至7. 0%之間，氧化 4鋰、氧化鋇之總和介於4 . 0 %至1 3 · 0 %之間，氧化砷與氧化 • 銻、氧化錫、氧化鈽之總和介於0. 3%至2. 0%之間。該等組成之玻璃，其熱膨脹係數低於40 X 1 〇-7/ °C ( 30〜4 0 0 °C )，^ It is composed of the glass disclosed in the present invention, and when it has only the basic physical properties required by the TFT-LCD glass substrate, the weight percentage of its composition is 56.0% to 60. 0% silicon oxide, 1 4 · 0% to 1 8 · 0% alumina, 7 · 5% to 1 4 · 0 ° /. Of boron oxide, 0 · 0% to 2 · 0 ° /. Magnesium oxide, 3 · 0% to 7 · 0% calcium oxide, 1 · 0% to 6 · 0 ° / ◦ hafnium oxide, 2 · 0% to 10 · 0% barium oxide, 0 · 0% To 1.0% zinc oxide, 0. 0% to 1.0% zirconia, 0. 0% to 2.0% arsenic oxide, 0. 0% to 1.0% antimony oxide, 0 0% to 1.0% tin oxide, 0.0% to 1.0% hafnium oxide, and the sum of silicon oxide and alumina exceeds 71.0%, the ratio of alumina to boron oxide is between Between 1.0 and 2.1, the sum of magnesium oxide and calcium oxide is between 3.0% and 7.0%, and the sum of 4 lithium oxide and barium oxide is between 4.0% and 1 3 · 0 0% 之间。 Between%, the total of arsenic oxide and antimony, antimony, tin oxide, thorium oxide is between 0.3% and 2.0%. The thermal expansion coefficient of these composed glasses is lower than 40 X 1 0-7 / ° C (30 ~ 400 ° C),

第14頁 200521099Page 14 200521099

五、發明說明（10) 應變點溫度南於6 C； η M . 低於1 2 0 0 °C，每八f ，始又低於2· 6 (g/Cm3 )，液相溫> 泡數目少於2 0個？、龙土板玻璃中泡徑在〇 · 5〜1 · 0 mm内的氣特性。滿足TFT-LCD玻璃基板所需之基本物理以下將氧化矽 5 6 · 0 % 至 6 0 . 玻璃熱膨脹含量多於60 一般熔解爐氧化鋁在1 4 · 0 %至1 易失透，也氧化銘含量而不利於以系成明上述該等組成限制的原因。〇 %二t場網路形成之主體’其較佳之含量為孫叙Γ氧化矽含量少於56.0%，則所製作出之你数太向，且玻璃將容易失透，然，若 • 0 % ’將導致玻璃之熔解溫度太高，則製造，且所製成之玻璃也容易失透。難乂係用以k局玻璃結構之強度，而較佳之含量係 8 · 〇 %間。若氧化鋁含量少於丨4 · 〇 %，破璃將容' 容易受到外界水氣或化學試劑之侵蝕，然，若多於18· 0%，亦將導致玻璃之熔解溫度太高，一般熔解爐製造。由此，氧化矽和氧化鋁共同為構成玻璃網路結構的主體，其較佳總和應超過7 1 . 0 %，若氧化矽與氧化鋁的總和少於7 1 . 0 %，則玻璃結構將不夠安定，容易失透，也容易受到外界水氣或化學試劑之侵蝕。氧化硼係作為助熔劑使用，主要用以降低熔製玻璃時玻璃膏之黏度，較佳之含量為7.5 %至14.0%。若氧化硼含量少於7 · 5 %，則其助熔劑效果即無法充分發揮，然，若氧化硼含量多於14.0%，由於氧化硼的揮發，不易製成均質的玻璃。V. Description of the invention (10) The temperature of the strain point is lower than 6 C; η M. It is lower than 1 2 0 0 ° C, every eight f, and then lower than 2 · 6 (g / Cm3), the liquidus temperature > Less than 20? 2. The gas characteristics of the slate glass with a bubble diameter within 0.5 mm to 1.0 mm. Satisfy the basic physics required for TFT-LCD glass substrate. The silicon oxide is 5 6 · 0% to 60. The glass thermal expansion content is more than 60. Generally, the melting furnace alumina is 1 4 · 0% to 1 which is easily devitrified and oxidized. The content is not conducive to the reasons for these composition restrictions. 〇% The main body formed by the two-t field network's better content is Sun Xu Γ The content of silicon oxide is less than 56.0%, the number of you produced is too direct, and the glass will easily devitrify. However, if • 0% 'It will cause the melting temperature of glass to be too high, it will be manufactured, and the glass produced will also be easily devitrified. Difficulty refers to the strength of the glass structure of k rounds, and the preferred content is between 80%. If the alumina content is less than 4%, the glass breakage will be easily susceptible to external moisture or chemical reagents. However, if it exceeds 18.0%, the melting temperature of the glass will be too high, and it will generally melt. Furnace manufacturing. Therefore, silicon oxide and aluminum oxide together constitute the main body of the glass network structure, and the preferred total thereof should exceed 71.0%. If the total of silicon oxide and aluminum oxide is less than 71.0%, the glass structure will be It is not stable enough, it is easy to devitrify, and it is easy to be eroded by external water vapor or chemical reagents. Boron oxide is used as a flux, which is mainly used to reduce the viscosity of glass paste when melting glass. The preferred content is 7.5% to 14.0%. If the boron oxide content is less than 7.5%, the flux effect cannot be fully exerted. However, if the boron oxide content is more than 14.0%, it is not easy to make a homogeneous glass due to the volatilization of boron oxide.

第15頁 200521099 Γ 五、發明說明（11) | 由於氧化紹和氧化哪對玻璃黏度和k解溫度都有極大 | 影響，因此其比例範圍應有限制。氧化鋁與氧化棚的較佳 | 比例介於ι·〇與2.1之間，若比例低於ι·〇，玻璃膏之黏度 I，太低’玻璃基板將不易成型。若比例高於2 · 1，玻璃膏之黏度太高，不利於以一般溶解爐製造。氧化鎮係用以降低炫製玻璃時玻璃膏之黏度，以減少其中之氣泡或不純物之含量，及調整玻璃成型性，其較佳，之含量係介於〇· 〇%至2· 0%間，若氧化鎂含量多於2· 〇%，則玻璃將容易失透。 ♦ 氧化部之作用係為促進玻璃之熔解，及調整玻璃成型囊I性’其較佳含量係介於3 · 〇 %至7 · 〇 %間。若氧化鈣含量少於 3·0%，將無法有效降低破璃之黏度，而若氧化鈣含量多於 7 · 〇 %，玻璃將容易失透’且熱膨脹係數會大幅提高，不利於後續製程之應用。由此，氧化鎂與氧化鈣之作用係作為助熔劑，及調整玻璃成型性。氧化鎂與氧化鈣之較佳之總含量係介於3^ 至7 · 0 %間，若總含量少於3 · 0 %，將無法發揮促進坡璃炼^ • 之效果，若總含量多於7 · 0 %，將導致玻璃失透和成型不，且熱膨脹係數會太高。艮氧化鋰之作用係作為助熔劑以及防止玻璃失透，苴丄佳含量係在1 · 0 %至6 · 0 %間。若氧化銷含量少於1 · 〇 %，〃車又，法發揮助熔劑之效果，且玻璃將容易失透，若氧化鈀f f • 多於6.0%，玻璃密度會太尚’不利於產品之應用各里氧化鋇之作用與氧化鳃相似，其較佳之ϋ為2 〇 %至Page 15 200521099 Γ V. Description of the invention (11) | Since both oxide and oxidation have a great effect on glass viscosity and k-solution temperature, the range of ratios should be limited. The preferred ratio of alumina and oxidation booth is between ι · 〇 and 2.1. If the ratio is lower than ι · 〇, the viscosity I of the glass paste is too low, and the glass substrate will not be easily formed. If the ratio is higher than 2.1, the viscosity of the glass paste is too high, which is not conducive to manufacturing in a general melting furnace. Oxidation ball is used to reduce the viscosity of glass paste when making glass, to reduce the content of bubbles or impurities in it, and to adjust the moldability of glass. The content is preferably between 0.00% and 2.0%. If the magnesium oxide content is more than 2.0%, the glass will be easily devitrified. ♦ The role of the oxidation part is to promote the melting of the glass and adjust the glass forming properties. The preferred content is between 3.0% and 7.0%. If the content of calcium oxide is less than 3.0%, the viscosity of broken glass cannot be effectively reduced, and if the content of calcium oxide is more than 7.0%, the glass will be easily devitrified and the thermal expansion coefficient will be greatly increased, which is not conducive to subsequent processes application. Therefore, the action of magnesium oxide and calcium oxide acts as a flux and adjusts the glass moldability. The preferred total content of magnesium oxide and calcium oxide is between 3 ^ and 7 · 0%. If the total content is less than 3.0%, the effect of promoting slope smelting cannot be exerted. If the total content is more than 7 · 0%, will cause devitrification and molding failure of the glass, and the thermal expansion coefficient will be too high. The role of lithium oxide is to act as a flux and prevent devitrification of the glass. The optimum content is between 1.0% and 6.0%. If the content of oxidized pin is less than 1.0%, and the effect of flux is exerted, and the glass will be easily devitrified, if the palladium oxide ff is more than 6.0%, the glass density will be too high, which is not conducive to the application of the product. The effect of barium oxide is similar to that of oxidized gills, and its preferred range is 20% to

200521099 五、發明說明（12) 0 ν/ΛΤΛ*/ ^2· °1 ^ #) - 玻，…，ί;變= 含量多於璃失透，其較佳之總^ i 2用/糸t為助炫劑’及防止玻量少於4 . 0 %，將盔法發二/ ;丨於.〇 %至1 3 . 0 %間，若總含容易失透，而若總、含』璃熔解之效果，且玻璃將高。置夕於13·0%，將導致玻璃密度會太氧化鋅亦係用以促谁诂至^，若氧化辞含量多於=為0.0% 乳：錯亦係用以降低玻璃璃。作用，其較佳之含量係介於0 0%又以玻璃之熔解於1.0%，玻璃將容易失透。 ·υ/°，右氧化錯含量多由於氧化砷、氧化銻、氧化鱼熔解時的澄清劑或除泡劑，1較佳=化錦的作用是玻璃。若總含量少於〇.3%，其澄&劑量為0.3%至2.0% 發揮，若總含量多於2.〇%，將導致：璃包無法充分透光度。敬項變頁或發黑，影響若氧化砷含量若氧化銻含量若氧化錫含量氧化石申較佳之含量係在0.0%至2. 多於2 · 0 %，則將導致玻璃發黑。 °曰氧化録較佳之含量係在〇. 0%至丨多於1 · 0 %，也將導致玻璃發黑。 · °曰’ 氧化錫較佳之含量係在〇· 0%至丨.〇多於1.0%，將導致玻璃失透。 · °曰第17頁 200521099_ 五、發明說明（13) 氧化鈽較佳之含量係在〇.〇%至1〇%間，若氧化鈽含量多於1.0% ’將使玻璃變黃，影響透光产。藉由本發明所揭露的玻璃組成，^ (P〇ly-Sl ) TFT-LCD等次世代製程或產品 τ — LCD玻璃基板特性時，其組成成份之重量百分比分別為6〇· 〇%至64·〇%之氧化石夕、15.0%至19.0%之氧化銘、9 5%至13· 0%之乳化硼、0· 0%，4· 〇%之氧化鎂、3· 〇%至1〇· 〇%之氧化鈣、0 · 0 %至3 · 0 %之氧化鋇、〇 · 〇 %至2 · 〇 %之氧化鋇、〇 · 〇 %至 1 · 0 %之氧化鋅、0 · 0%至1 · 〇 %之氧化鍅、〇 · 〇 %至2 · 〇 %之氧化石申、0·0%至1.0%之氧化銻、〇〇%至1〇%之氧化錫、〇〇%至 1 · 0 %之氧化鈽、其中氧化矽與氧化鋁的總和超過7 6 · 〇 %，氧化銘與氧化删的比例介於1 · 3與1 · 8之間，氧化鎂、氧化鈣之總和介於5 · 0 %至1 0 · 0 %之間，氧化鋰、氧化鋇之總和介於0 . 0%至4· 5%之間，氧化砷與氧化銻、氧化錫、氧化鈽之總和介於0 · 3 %至2 · 0 %之間。該等組成的玻璃，其熱膨脹係數低於34 X 1 0-7/ °C ( 30〜4 0 0 °C )，應變點溫度高於6 65 °C，密度低於2·4 (g/cm3)，液相溫度低於1 2 0 0 T：，每公斤基板玻璃中泡徑在0 · 5〜1 · 0 m m内的氣泡數目少於2 〇個，滿足如多晶石夕型（poly_Si ) TFT-LCD等次世代製程或產品所需求的TFT-LCD玻璃基板特性。以下將--說明上述該等組成限制的原因。 ) 由於氧化矽係玻璃網路形成之主體，其較佳之含旦、 6 0 · 0 %至6 4 · 0 %。若氧化矽含量少於6 0 · 0 %，所製作出3 ^為璃熱膨脹係數太高，且玻璃將容易失透。若氧化石夕含θ $200521099 V. Description of the invention (12) 0 ν / ΛΤΛ * / ^ 2 · ° 1 ^ #)-glass, ..., ί; change = content more than glass devitrification, its better total ^ i 2 use / 糸 t is "Hyun aid" and prevent glass content less than 4.0%, the helmet method is issued two /; 丨 between .0% to 13.0%, if the total content is easy to devitrify, and if the total, content "glass melting Effect, and the glass will be high. Setting it at 13.0% will cause the density of the glass to be too high. Zinc oxide is also used to promote who can reach ^, if the content of oxidation is more than = 0.0% Milk: Wrong is also used to reduce glass. Effect, its preferred content is between 0 0% and the melting of glass to 1.0%, the glass will easily devitrify. · Υ / °, the content of right oxidized oxide is high. As arsenic oxide, antimony oxide, and oxidized fish are clarifiers or defoamers when melting, 1 is better = the role of chemical bromide is glass. If the total content is less than 0.3%, its Cheng & dosage is 0.3% to 2.0%. If the total content is more than 2.0%, it will cause: the glass package cannot fully transmit light. The change of page or blackening will affect the content of arsenic oxide, antimony oxide, and tin oxide. The preferred content of stone oxide is 0.0% to 2. More than 2.0%, it will cause glass blackening. ° Said that the better content of oxidation is from 0.0% to more than 1.0%, which will also cause the glass to black. · ° Said that the preferred content of tin oxide is from 0.0% to more than 1.0%, which will cause devitrification of the glass. · ° Page 17 200521099_ V. Description of the invention (13) The preferred content of thorium oxide is between 0.00% and 10%. If the content of thorium oxide is more than 1.0%, it will make the glass yellow and affect the light transmission. . With the glass composition disclosed in the present invention, when the next-generation process such as (Poly-Sl) TFT-LCD or product τ — LCD glass substrate characteristics, the weight percentage of its composition is 60% to 64%, respectively. 〇% of oxidized stone, 15.0% to 19.0% of oxidized oxide, 9 5% to 13.0% of emulsified boron, 0.0%, 4.0% of magnesium oxide, 3.0% to 10.0. % Calcium oxide, 0.0% to 3.0% barium oxide, 0.00% to 2.0% barium oxide, 0.00% to 1.0% zinc oxide, 0% to 1% 0% hafnium oxide, 0.00% to 2.0% stone oxide, 0.0% to 1.0% antimony oxide, 0.00% to 10% tin oxide, 0.00% to 1.0 % Of hafnium oxide, where the sum of silica and alumina exceeds 76. 0%, the ratio of oxide to oxide is between 1.3, 1.8, and the sum of magnesium oxide and calcium oxide is between 5. Between 0% and 10 · 0%, the sum of lithium oxide and barium oxide is between 0.0% and 4. · 5%, and the total of arsenic oxide with antimony oxide, tin oxide, and thallium oxide is between 0 · 3 % To 2 · 0%. The glass of these compositions has a coefficient of thermal expansion lower than 34 X 1 0-7 / ° C (30 ~ 4 0 0 ° C), a strain point temperature higher than 6 65 ° C, and a density lower than 2 · 4 (g / cm3 ), The liquidus temperature is lower than 1 2 0 0 T: the number of bubbles within 0.5 mm to 1.0 mm per kilogram of substrate glass is less than 20, which satisfies polycrystalline silicon (poly_Si) TFT-LCD glass substrate characteristics required by next-generation processes or products such as TFT-LCD. The following will explain the reasons for these composition restrictions. ) Because of the main body formed by the silica-based glass network, its preferred content is from 60% to 64%. If the silicon oxide content is less than 60%, the thermal expansion coefficient of the glass produced is too high, and the glass will easily devitrify. If the oxide stone contains θ $

200521099200521099

五、發明說明（14) 於6 4 · 0 %，則將導致玻璃之熔解溫度太高，致其报難以一般熔解爐製造，且所製成之破璃也容易失透。、一氧化銘係用以提高玻璃結構之強度，較佳之含量係、 1 5· 0%至19· 0%間。若氧化銘含量少於15. 〇% ,玻璃^容、失透，也容易受到外界水氣或化學試劑之侵蝕，然，若# 化銘含量多於19.0%，亦將導致玻璃之溶解溫度太高，氧不利於以一般熔解爐製造。由於氧化矽和氧化鋁係為共同構成玻璃網路結構的主體，其較佳總和應超過7 6 · 0 %，若氧化矽與氧化鋁的纟/和少於7 6 · 0 %，玻璃結構將不夠安定，容易失透，也容Z : 到外界水氣或化學試劑之侵钱。父氧化硼之作用係作為助熔劑，主要係用以降低、溶製玻璃時玻璃膏之黏度，其較佳之含量為9 · 5 %至1 3 · 〇 %，若氧^ 化硼含量少於9 · 5 %，其助熔劑效果即無法充分發揮，若氧化硼含量多於1 3 · 0 %，由於氧化硼的揮發，不易製成均質的玻璃。 ' 而氧化鋁和氧化棚對玻璃黏度和溶解溫度都有極大影響，因此其比例範圍應有限制。、氧化鋁與氧化硼的較佳比例介於1 · 3與1 · 8之間，若比例低於1 · 3，玻璃膏之黏度太低，玻璃基板將不易成型。若比例高於1 · 8，玻璃膏之黏度太高，不利於以一般炫解爐製造。V. Description of the invention (14) At 64 · 0%, the melting temperature of the glass will be too high, making it difficult to manufacture in a general melting furnace, and the glass produced will also be easily devitrified. The oxide inscription is used to improve the strength of the glass structure. The preferred content is between 15.0% and 19.0%. If the content of oxidant is less than 15.0%, the glass volume and devitrification will also be easily eroded by external water vapor or chemical reagents. However, if the content of oxidant is more than 19.0%, the dissolution temperature of the glass will be too high. High, oxygen is not conducive to manufacturing in a general melting furnace. Since silicon oxide and aluminum oxide are the main body that together constitute the glass network structure, their preferred total should exceed 76. 0%. If the 纟 / sum of silicon oxide and aluminum oxide is less than 76. 0%, the glass structure will be Not stable enough, easy to devitrify, and also tolerate Z: money invasion to outside water vapor or chemical reagents. The role of the parent boron oxide is as a flux, which is mainly used to reduce and dissolve the viscosity of the glass paste when the glass is made. The preferred content is 9.5 to 13%. If the boron oxide content is less than 9 · 5%, its flux effect cannot be fully exerted. If the content of boron oxide is more than 13 · 0%, it is not easy to make homogeneous glass due to the volatilization of boron oxide. '' Since alumina and oxidation booths have a great influence on glass viscosity and melting temperature, the ratio range should be limited. The preferred ratio of aluminum oxide and boron oxide is between 1.3 and 1.8. If the ratio is lower than 1.3, the viscosity of the glass paste is too low, and the glass substrate will not be easily formed. If the ratio is higher than 1.8, the viscosity of the glass paste is too high, which is not conducive to the manufacture of ordinary decontamination furnaces.

氧化鎂係用以降低炼製玻璃時玻璃膏之黏度，以減少其中之氣泡或不純物之含量，及調整玻璃成型性。其較佳之含量係介於〇· 〇%至4· 〇%間，但若氧化鎂含量多於4· 〇%，Magnesium oxide is used to reduce the viscosity of glass paste when making glass, to reduce the content of bubbles or impurities in it, and to adjust the moldability of glass. Its preferred content is between 0.00% and 4.0%, but if the magnesium oxide content is more than 4.0%,

200521099 L、發明說明（15) 破螭將容易失透。性氧化鈣之作用亦係促進姑其較佳含量係介於3 之熔解，及調整玻璃成型於3.0%，將無法有效降低玻1〇.0%間，若氧化鈣含量少 W.O%，玻璃將容易失透\且\之黏度，若氧化鈣含量多於利於後續製程之應用。 …膨脹係數會大幅提高，不氧化鎭與氧化妈之作用传、型性。氧化鎂與氧化鈣之，#作為助溶劑，及調整玻璃成間，若總含量少於5 之總含量係介於5.0%至之效果，若總含量多於1〇\〇%°，’將無法發揮促進玻璃熔解良，且熱膨脹係數會太高。將導致玻璃失透和成型不氧化锶之作用在作為助炫佳含量係在〇· 0%至3· 0%間，—及防止玻璃失透，其較密度會太高，不利於產品之I用化锶含量多於3 · 0 %，玻璃氧化鋇之作用與氧化4田知/ 2. 〇 %，# ir ^ > 釔相似，其較佳之含量為ο · 〇 %至點會大幅降低。、2.0%，玻璃密度會太高，且應變透 5% 至1 氧化鳃與氧化鋇之作用係作為助熔劑，及防止玻璃失其較佳之總含量係介於〇%至4· 5%間，若總含量多於4· 將導致玻璃密度會太高。氧化鋅亦係用以促進玻璃之熔解，其較佳含量為〇 · 〇 % 0%，若氧化鋅含量多於丨· 0%，玻璃將容易失透。係、^降=璃之黏度，以促進玻璃U解作用 /、乂之含量係’丨；0 . 0 %至1 · 0 %，若氧化錯含量多於1 · 200521099 五、發明說明（16) 0 %，玻璃將容易失透。氧化珅、氧化銻、氧化錫與氧化錦的作用是玻璃熔解時的澄清劑或除泡劑，其較佳之總含量為0 . 3 %至2 . 0 %，若總含量少於0 . 3 %，其澄清劑或除泡劑效果即無法充分發揮，若總含量多於2. 0 %，將導致玻璃變黃或發黑，影響透光度。氧化砷較佳之含量係在〇 . 〇 %至2 . 0 %間，若氧化砷含量多於2 . 0 %，將導致玻璃發黑。氧化銻較佳之含量係在0. 0 %至1. 0 %間，若氧化銻含量多於1 . 0 %，也將導致玻璃發黑。200521099 L. Description of the invention (15) Breaking of the maggot will easily devitrify. The effect of the natural calcium oxide is to promote the melting of the better content of 3, and adjust the glass molding to 3.0%, it will not be able to effectively reduce the glass between 10.0%, if the calcium oxide content is less than WO%, the glass will It is easy to devitrify, and if the content of calcium oxide is more than that, it is beneficial to the application of subsequent processes. … The coefficient of expansion will be greatly increased, and the role and shape of the oxide and the oxide will not be transmitted. For magnesium oxide and calcium oxide, # as a co-solvent, and adjust the glass composition, if the total content is less than 5, the total content is between 5.0% and 500%, if the total content is more than 10%, 'will Can not play a role in promoting good glass melting, and the thermal expansion coefficient will be too high. It will cause the devitrification of glass and the formation of strontium oxide. The content of strontium is between 0.0% and 3.0%, and the prevention of devitrification of glass, its density will be too high, which is not good for product I. With more than 3.0% strontium content, the effect of glass barium oxide is similar to that of oxidized TiO 2 / 2.0%, # ir ^ > yttrium, and its preferred content is ο · 〇% will greatly reduce. , 2.0%, glass density will be too high, and strain through 5% to 1 the role of gills and barium oxide as a flux, and to prevent the loss of glass, the better total content is between 0% to 4.5%, If the total content is more than 4 ·, the glass density will be too high. Zinc oxide is also used to promote the melting of glass. Its preferred content is 0%. 0%. If the content of zinc oxide is more than 0%, the glass will easily devitrify. System, ^ drop = viscosity of glass to promote the U-decomposition of glass /, the content of tritium '丨; 0. 0% to 1 · 0%, if the content of oxidation errors is more than 1. 200521099 5. Description of the invention (16) 0%, the glass will easily devitrify. The function of thorium oxide, antimony oxide, tin oxide and oxide bromide is as a clarifier or defoamer when the glass is melted, and its preferred total content is 0.3% to 2.0%, if the total content is less than 0.3% , Its clarifying or defoaming agent effect cannot be fully exerted, if the total content is more than 2.0%, it will cause the glass to turn yellow or black, affecting the light transmittance. The preferred content of arsenic oxide is between 0.0% and 2.0%. If the content of arsenic oxide is more than 2.0%, the glass will become black. The preferred content of antimony oxide is between 0.0% and 1.0%. If the antimony oxide content is more than 1.0%, the glass will also become black.

氧化錫較佳之含量係在0 . 0 %至1. 0 %間，若氧化錫含量多於1 · 0 %，將導致玻璃失透。氧化鈽較佳之含量係在(K 0 %至1. 0 %間，若氧化鈽含量多於1 . 0 %，將使玻璃變黃，影響透光度。本發明係先將上述之組成物，均勻混合後，將混合原料導入一玻璃熔解槽，待此混合原料熔解成玻璃膏後，將其溫度降低至成型所需之溫度範圍，予以成型，製作出預定厚度之玻璃基板，再將玻璃基板徐緩冷卻，即可切割加工成液晶顯不裔用之玻璃基板成品。【實施方式】The preferable tin oxide content is between 0.0% and 1.0%. If the tin oxide content is more than 1.0%, it will cause devitrification of the glass. The preferred content of hafnium oxide is between (K 0% and 1.0%). If the hafnium oxide content is more than 1.0%, the glass will turn yellow and affect the light transmittance. The present invention is to first combine the above-mentioned composition, After uniform mixing, the mixed raw materials are introduced into a glass melting tank. After the mixed raw materials are melted into a glass paste, the temperature is lowered to a temperature range required for molding, and molding is performed to produce a glass substrate of a predetermined thickness. After slowly cooling, it can be cut and processed into a finished glass substrate for liquid crystal display. [Embodiment]

於下列之表一、表二（例1至例1 0 )中顯示出根據本發明所製成玻璃樣品的組成及特性，此亦即本發明的實施例。而表一係依據本發明所揭露的玻璃組成範圍，對應於The composition and characteristics of the glass samples made according to the present invention are shown in Tables 1 and 2 (Examples 1 to 10) below, which are also examples of the present invention. Table 1 is the composition range of the glass disclosed according to the present invention, which corresponds to

第21頁 200521099 五、發明說明（17) 的對僅具有T F T - L C D玻璃基板所需之基本物理特性。表一传、據本發明所揭露的玻璃組成範圍，對應於尚呈有如多〜曰依型（poly-Si ) TFT-LCD等次世代製程或產品/所需求 L C D玻璃基板特性。於在表三、表四（例1 1至例1 6 ) 甚示不同於本發明所製成玻璃樣品的組成及特性，亦即明的比較例。其中表三係表一的對照組，表四係表本發照組。Page 21 200521099 V. The pair of invention description (17) has only the basic physical characteristics required for T F T-L C D glass substrate. As shown in Table 1, the glass composition range disclosed according to the present invention corresponds to the characteristics of the next-generation process or products / required L C D glass substrates, such as poly-Si TFT-LCD. Tables 3 and 4 (Examples 11 to 16) show very different compositions and characteristics from the glass samples made according to the present invention, that is, comparative examples. Among them, Table 3 is the control group of Table 1, and Table 4 is the photographic group.

II 於表一至表四的玻璃樣品，均係以如下方法勢造· 用之各組成成份係取自常用原料，依所對應之重^ $八使加以均勻混合，再以1 6 0 0〜1 6 5 0 X：之溫度Λ並在：金掛刀比内熔解6至8小時，熔解過程中，利用白金攪拌棒授掉2尚時’以促進玻璃中各組成成份之均勾性，然後將玻瑪膏隹入金屬模板中冷卻成型為板狀。此時，針對各玻璃樣σ 行檢測，分別得到熱膨脹係數、應變點、密度、液相溫度、氣泡數目等特性值，並分別表列於下列之表一至表四= 對應棚位上。其中’檢測本發明各玻璃樣品之各特性值時，主要係依下列方法進行檢測： (1 )熱膨脹係數（單位：1 〇-?/ °C )之檢測：係參照美國材料試驗協會（American Society for Testing and Materials，以下簡稱ASTM)所訂定之編號E 2 2 8 - 9 5檢測 Φ 標準，以機械推桿式熱膨脹儀及氧化鋁為參考標準，加熱並量測玻璃樣品之伸長量，溫度範圍自室溢量到玻璃不再伸長，甚至因軟化而收縮為止之溫度，开溫速率為II The glass samples in Tables 1 to 4 are made according to the following methods. The components used are taken from common raw materials, and they are evenly mixed according to the corresponding weight ^ $ 八使, and then mixed with 1 6 0 0 ~ 1 6 5 0 X: the temperature Λ and melt in the gold hanging knife ratio for 6 to 8 hours. During the melting process, use a platinum stirrer to teach 2 time 'to promote the uniformity of each component in the glass, and then the glass The horse paste is poured into a metal template and cooled to form a plate. At this time, for each glass sample σ, the thermal expansion coefficient, strain point, density, liquid temperature, number of bubbles and other characteristic values are obtained, and listed in the following Tables 1 to 4 = corresponding booths. Among them, when testing each characteristic value of each glass sample of the present invention, it is mainly tested according to the following methods: (1) Test of thermal expansion coefficient (unit: 10-? / ° C): refer to the American Society for Testing Materials for Testing and Materials (hereinafter referred to as ASTM) No. E 2 2 8-9 5 Testing Φ standard, using mechanical push rod type thermal expansion meter and alumina as reference standards, heating and measuring the elongation and temperature range of glass samples The temperature from the room overflow to the time when the glass no longer elongates or even shrinks due to softening, the opening temperature rate is

第22頁 200521099_ 五、發明說明（18) 每分鐘3 °C。熱膨脹係數由3 0至4 0 0 °C之玻璃伸長量計算得到。 (2) 應變點（單位：°C )之檢測：係參照ASTM C 5 9 8 - 9 3，加熱並量測玻璃樣品之變形率與溫度之關係，以特定變形率所對應之溫度作為應變點。 (3) 密度（單位·· g/cm3 )之檢測：係參照ASTM C 7 2 9 - 7 5，取約2公克重不含氣泡之塊狀玻璃，以玻璃樣品在比重液中浮沉之情形量測其密度。Page 22 200521099_ V. Description of the invention (18) 3 ° C per minute. The coefficient of thermal expansion is calculated from the glass elongation at 30 to 400 ° C. (2) Detection of strain point (unit: ° C): refer to ASTM C 5 9 8-9 3, heat and measure the relationship between the deformation rate and temperature of the glass sample, and use the temperature corresponding to the specific deformation rate as the strain point . (3) Density (unit ·· g / cm3) test: refer to ASTM C 7 2 9-7 5, take about 2 grams of block glass without air bubbles, and use glass sample to float and sink in specific gravity Measure its density.

(4) 玻璃液相溫度（單位：°C )之檢測：係根據ASTM C829-81 ，將小於850 //m之玻璃屑放入白金皿中，置於梯度爐2 4小時後，以顯微鏡測量玻璃之結晶情形，判定其液相溫度而得。 (5 )氣泡產生數（單位：個/公斤）：將板狀玻璃樣品研磨、拋光後，在顯微鏡下觀察其内部氣泡數，計算泡徑在 0.5〜1.0mm内的氣泡數目，再以玻璃樣品重量換算為每公斤玻璃的氣泡數。而表一、表二、表三及表四之氣泡產生數對應攔位中，凡以0標記者，則表示該組成之樣品，其氣泡產生數在1 〇個/公斤以下，屬於良好的情況 ;凡以△標記者，表示該組成之樣品，其氣泡產生數在 1 0〜5 0個/公斤之間，屬於中等的情況：凡以X標記者，表示該組成之樣品，其氣泡產生數在5 0個/公斤以上，屬於不佳的情況。(4) Detection of glass liquid temperature (unit: ° C): According to ASTM C829-81, the glass shavings smaller than 850 // m are placed in a platinum dish, placed in a gradient furnace for 24 hours, and measured with a microscope The crystallization of glass is determined by its liquidus temperature. (5) Number of bubbles generated (unit: unit / kg): After grinding and polishing the plate-shaped glass sample, observe the number of bubbles inside the microscope, calculate the number of bubbles with a bubble diameter within 0.5 ~ 1.0mm, and then use the glass sample Weight is converted to bubbles per kilogram of glass. In the corresponding stoppages of the bubble generation numbers in Tables 1, 2, 3, and 4, where 0 is marked, it means that the sample of the composition has a bubble generation number of less than 10 / kg, which is a good situation. ; Where marked with △, the sample of the composition, the number of bubbles generated between 10 ~ 50 / kg, which is a medium situation: Where marked with X, the sample of the composition, the number of bubbles generated Above 50 / kg, it is a bad situation.

200521099 五、發明說明（19) 表一以下組成爲雷量百分比（wt%) 實施例例1 例2 例3 例4 例5 氧化矽(Si〇2) 58.3 56.9 58.7 57.5 59.1 氧化鋁(Α12〇3) 17.2 16.2 15.7 18.1 16.4 氧化硼(Β2〇3) 10.5 9.8 8.5 11.2 10.8 氧化鎂_〇） 0.4 0.7 1.1 0.6 0 氧化鈣(Ca〇） 4.5 3.6 4.1 5.9 6.1 氧化緦(SrO) 2.7 4.6 3.2 1.3 2.4 氧化鋇_) 5.1 6.6 7.1 4.2 3.4 氧化鋅(Zn〇） 0.3 0 0.6 0.2 0.4 氧化鍇(Zr〇2) 0.5 0.5 0.4 0 0.2 氧化砷(AS2〇3) 0.4 0.3 0.3 0.8 0.6 氯化銻(Sb2〇3) 0.1 0.3 0 0.2 0.3 氧化鍚(Sn〇2) 0 0.2 0 0 0.2 氧化飾（Ce〇2) 0 0.3 0.3 0 0.1 氧化矽+氧化鋁(Si〇2 +Α12〇3) 75.5 73.1 74.4 75.6 75.5 氧化絕/氧化硼（Ai2a/a〇3) 1.64 1.65 1.85 1.62 1.52 氧化鎂+氧化鈣 (MgO + CaO) 4.9 4.3 5.2 6.5 6.1 氧化總+氧化参貝 CSrO + BaO) 7.8 11.2 10.3 5.5 5.8 氧化砷+氧化銻+氧化鍚+氧化鈽 (As2〇3+Sb2〇3+Sn〇2+Ce〇2) 0.5 Π 0.6 1 1.2 熱膨脹係數（xlOYC ) (30〜400oC ) 37.9 37.1 38.5 39.6 39.2 應戀點rc) 659 653 660 664 662 密度（2/cm3) 2.54 2.57 2.58 2.53 2.53 玻璃液相溫度（°C) 1120 1100 1100 1180 1160 氣洵_生勳〇〇 0 〇〇200521099 V. Description of the invention (19) Table 1 The following composition is the percentage of lightning amount (wt%) Example 1 Example 2 Example 3 Example 4 Example 5 Silicon oxide (Si〇2) 58.3 56.9 58.7 57.5 59.1 Aluminum oxide (Α12〇3 ) 17.2 16.2 15.7 18.1 16.4 Boron oxide (B2〇3) 10.5 9.8 8.5 11.2 10.8 Magnesium oxide_〇) 0.4 0.7 1.1 0.6 0 Calcium oxide (Ca〇) 4.5 3.6 4.1 5.9 6.1 SmO (SrO) 2.7 4.6 3.2 1.3 2.4 Oxidation Barium _) 5.1 6.6 7.1 4.2 3.4 Zinc oxide (Zn〇) 0.3 0 0.6 0.2 0.4 Hafnium oxide (Zr〇2) 0.5 0.5 0.4 0 0.2 Arsenic oxide (AS2 03) 0.4 0.3 0.3 0.8 0.6 Antimony chloride (Sb203) ) 0.1 0.3 0 0.2 0.3 Hafnium oxide (Sn〇2) 0 0.2 0 0 0.2 Oxidation decoration (Ce〇2) 0 0.3 0.3 0 0.1 Silicon oxide + aluminum oxide (Si〇2 + A12〇3) 75.5 73.1 74.4 75.6 75.5 Oxidation Insulation / boron oxide (Ai2a / a〇3) 1.64 1.65 1.85 1.62 1.52 Magnesium oxide + calcium oxide (MgO + CaO) 4.9 4.3 5.2 6.5 6.1 Total oxidation + oxidation oxide CSrO + BaO) 7.8 11.2 10.3 5.5 5.8 Arsenic oxide + oxidation Antimony + Samarium oxide + Samarium oxide (As2〇3 + Sb2〇3 + Sn〇2 + Ce〇2) 0.5 Π 0.6 1 1.2 Thermal expansion coefficient (xlOYC) (30 ~ 400oC) 37.9 37.1 38.5 39 .6 39.2 Correspondence point rc) 659 653 660 664 662 Density (2 / cm3) 2.54 2.57 2.58 2.53 2.53 Glass liquidus temperature (° C) 1120 1100 1100 1180 1160 Gas_shengxun 〇〇 0 〇〇〇

ϋ·ι 第24頁 200521099 五、發明說明（20) 以下細成爲重量百分比（wt% ) 實施例例6 例7 例8 例9 例10 氧化矽(Si〇2) 62.5 60.8 63.1 62.9 61.6 氧化金呂(A1203) 17.1 16.3 15.4 15.9 18.1 氧化硼(B2〇3) 9.8 10.5 10.2 10.8 10.3 氧化鎂_〇) 1.2 0 0.2 2.2 0.6 氧化鈣(Ca〇） 4.2 9.1 8.2 6.5 5.1 氧化緦(Sr〇） 1.6 1.3 0.8 0.3 1.9 氧化鋇(Ba〇） Π 0.2 0.4 0.3 0.5 氧化鋅(ZnO) 0.6 0 0.3 0.1 0.4 氧化銷(Zr〇2) 0.5 0.5 0 0.2 0.3 氧化砷(AS2〇3) 0.7 0.5 0.3 0.6 0.2 氧化銻(Sb2Ch) 0.3 0.5 0.7 0.2 0.8 氧化鍚(Sn〇2) 0.2 0 0.4 0 0.1 氧化鋪（Ce〇2) 0.2 0.3 0 0 0.1 氧化矽+氧化鋁(Si〇2 +AI2O3) 79.6 77.1 78.5 78.8 79.7 氧化絕/氧化硼（Al2〇3/B2〇3) 1.74 1.55 1.51 1.47 1.76 氧化鎂+氧化鈣 (MgO + CaO) 5.4 9.1 8.4 8.7 5.7 氧化緦+氧化鋇 (SrO + BaO) 2.7 1.5 1.2 0.6 2.4 氧化砷+氧化銻+氧化鍚+氧化鈽 (AS2 Ch+Sb2 〇3+Sn 〇2+Ce 〇2) 1.4 1.3 1.4 0.8 1.2 熟膨脹係數（xl〇-7/0C ) (30〜400oC ) 32.7 33.8 33.4 33.8 32.9 應戀點rc) 675 671 673 671 676 密度（2/cm3) 2.38 2.36 2.35 2.32 2.38 玻璃液相辦rc) 1140 1160 1170 1180 1140 氣洵番生勳〇〇〇〇〇ϋ · ιPage 24 200521099 V. Description of the invention (20) The following is a percentage by weight (wt%) Example 6 Example 7 Example 8 Example 9 Example 10 Silicon oxide (Si〇2) 62.5 60.8 63.1 62.9 61.6 Gold oxide (A1203) 17.1 16.3 15.4 15.9 18.1 Boron oxide (B2O3) 9.8 10.5 10.2 10.8 10.3 Magnesium oxide_〇) 1.2 0 0.2 2.2 0.6 Calcium oxide (Ca〇) 4.2 9.1 8.2 6.5 5.1 Samarium oxide (Sr〇) 1.6 1.3 0.8 0.3 1.9 Barium oxide (Ba〇) Π 0.2 0.4 0.3 0.5 Zinc oxide (ZnO) 0.6 0 0.3 0.1 0.4 Oxidation pin (Zr〇2) 0.5 0.5 0 0.2 0.3 Arsenic oxide (AS2 03) 0.7 0.5 0.3 0.6 0.2 Antimony oxide ( Sb2Ch) 0.3 0.5 0.7 0.2 0.8 Hafnium oxide (Sn〇2) 0.2 0 0.4 0 0.1 CeO2 0.2 0.3 0 0 0.1 Silicon oxide + aluminum oxide (Si〇2 + AI2O3) 79.6 77.1 78.5 78.8 79.7 Oxidation / Boron oxide (Al2〇3 / B2〇3) 1.74 1.55 1.51 1.47 1.76 Magnesium oxide + calcium oxide (MgO + CaO) 5.4 9.1 8.4 8.7 5.7 Hafnium oxide + barium oxide (SrO + BaO) 2.7 1.5 1.2 0.6 2.4 Arsenic oxide + Antimony oxide + Hafnium oxide + Hafnium oxide (AS2 Ch + Sb2 〇3 + Sn 〇2 + Ce 〇2) 1.4 1.3 1.4 0.8 1.2 Cooked expansion coefficient (xl0-7 / 0C) (30 ~ 40 0oC) 32.7 33.8 33.4 33.8 32.9 The love point rc) 675 671 673 671 676 Density (2 / cm3) 2.38 2.36 2.35 2.32 2.38 Glass liquid phase office rc) 1140 1160 1170 1180 1140 Disturbed Fan Shengxun 〇〇〇〇〇〇〇

I·· 第25頁 200521099 五、發明說明（21) 表三I ·· Page 25 200521099 V. Description of Invention (21) Table III

第26頁Page 26

以下細.成爲重量百分th (wt%) 比鮫例例11 例12 例13 氧化矽(Si〇2) 57.4 59.2 58.5 氧化絕(AI2O3) 17.1 18.6 16.5 氧化硼(B2〇3) 10.6 11.5 9.5 氧化籍⑽〇） 0.6 1.4 1.2 氧化鈣⑽） 7.6 5.3 4 氧化緦(SrO) 1.8 0.6 3.1 氧化鋇(BaO) 3.8 1.7 6.6 氧化鋅(Zn〇） 0 0.3 0.2 氧化撕〇2) 0.2 0 0.3 氧化砷(AS2〇3) 0.3 0.6 0.1 氧化銻(Sb2〇3) 0.6 0.6 0 氧化—(Sn〇2) 0 0 0 氧化鋪（Ce〇2) 0 0.2 0 氧化砂+氧化絕(Si〇2 +AI2O3) 74.5 77.8 75 氧化纖化硼（Α12〇3·) 1.61 1.62 1.74 氧化鎂+氧化鈣 (MgO + CaO) 8.2 6.7 5.2 氧化緦+氧化鋇 (SrO + BaO) 5.6 2.3 9.7 氧化碑+氧化鍊+氧化鎭+氧化鋪 (As2Ch+Sb2〇3+Sn〇2+Ce〇2) 0.9 1.4 0.1 熟膨脹係數（xlOYC ) ( 30〜400oC ) 41.2 39.6 38.7 應繼點（〇C) 655 660 660 密度（2/cm3) 2.54 2.51 2.58 玻璃液相Μ度（°C) 1130 1220 1120 氣泡產生動〇 0 X 200521099 五、發明說明（22) 表四The following is the percentage of weight th (wt%). Example 11 Example 12 Example 13 Silicon oxide (Si〇2) 57.4 59.2 58.5 Oxidation insulation (AI2O3) 17.1 18.6 16.5 Boron oxide (B2 03) 10.6 11.5 9.5 Oxidation ⑽〇) 0.6 1.4 1.2 Calcium oxide ⑽) 7.6 5.3 4 SrO 1.8 0.6 0.6 Barium oxide (BaO) 3.8 1.7 6.6 Zinc oxide (Zn〇) 0 0.3 0.2 Oxidation tear 0.2) 0.2 0 0.3 Arsenic oxide ( AS2〇3) 0.3 0.6 0.1 Antimony oxide (Sb2〇3) 0.6 0.6 0 Oxidation— (Sn〇2) 0 0 0 Oxidation shop (Ce〇2) 0 0.2 0 Oxidation sand + oxidation insulation (Si〇2 + AI2O3) 74.5 77.8 75 Oxidized fibrillated boron (Α12〇3 ·) 1.61 1.62 1.74 Magnesium oxide + calcium oxide (MgO + CaO) 8.2 6.7 5.2 Hafnium oxide + barium oxide (SrO + BaO) 5.6 2.3 9.7 Oxide monument + oxide chain + hafnium oxide + Oxidation shop (As2Ch + Sb2〇3 + Sn〇2 + Ce〇2) 0.9 1.4 0.1 Cook expansion coefficient (xlOYC) (30 ~ 400oC) 41.2 39.6 38.7 Succession point (〇C) 655 660 660 Density (2 / cm3) 2.54 2.51 2.58 Glass liquid phase M (° C) 1130 1220 1120 Bubble generation movement 0 X 200521099 V. Description of the invention (22) Table 4

以下細.成爲重量百分比比較例例14 例15 例16 氧化矽(Si〇2) 61.2 61 61.9 氧化舍呂(AkCb) 15.5 15.7 16.7 ^ 化硼(B203) 10.1 9.8 11.5 氧化_(M2〇) 0.5 0.9 0.5 氧化鈣(CaO) 10.5 5.5 6.2 氧化齡0) 0.6 3.1 1.3 氧化鋇(Ba〇） 0.9 2.9 1.1 氧化鋅(ZnO) 0.3 0 0.4 氧化銷(Zr〇2) 0.2 0.1 0.4 氧化神(AS2〇3) 0 0.5 0 氧化銻(Sb2〇3) 0 0.5 0 氧化鍚(Sn〇2) 0 0 0 氧化鋪（Ce〇2) 0.2 0 0 氧化矽+氧化鋁(Si〇2 +Α12〇3) 76.1 76.7 78.6 氣化絕/氧化硼（Al2Ch/B2Ch) 1.53 1.60 1.45 氧化鎂+氧化鈣 (MgO + CaO) 11 6.4 6.7 氧化緦+氧化鋇 (SrO + BaO) 1.5 6 2.4 氧化碑+氧化鍊+氧化鎮+氧化鈽 (As2〇3+Sb2〇3+Sn〇2+Ce〇2) 0.2 1 0 熟膨脹係數（xl〇,〇C) (30~400oC) 36.1 33.5 33.4 應戀占rc) 669 670 667 密度（2/cm3) 2.36 2.49 2.38 玻璃液相溫度rc) 1180 1160 1180 氣泡盡生勳 Δ 〇 X 由表一所示實施例1至實施例5中之各檢測數據，可清楚觀察出，當僅需要具有TFT-LCD玻璃基板所需的基本物理特性時，依據本發明所揭露的玻璃組成範圍所製成之玻The following is the percentage by weight. Comparative Example 14 Example 15 Example 16 Silicon Oxide (Si〇2) 61.2 61 61.9 Oxelium (AkCb) 15.5 15.7 16.7 ^ Boron (B203) 10.1 9.8 11.5 Oxidation (M2〇) 0.5 0.9 0.5 Calcium Oxide (CaO) 10.5 5.5 6.2 Oxidation Age 0) 0.6 3.1 1.3 Barium Oxide (Ba〇) 0.9 2.9 1.1 Zinc Oxide (ZnO) 0.3 0 0.4 Oxidation Pin (Zr〇2) 0.2 0.1 0.4 God of Oxygen (AS2〇3) 0 0.5 0 Antimony oxide (Sb2〇3) 0 0.5 0 Rhenium oxide (Sn〇2) 0 0 0 Oxide shop (Ce〇2) 0.2 0 0 Silicon oxide + aluminum oxide (Si〇2 + A12〇3) 76.1 76.7 78.6 Gasification insulation / boron oxide (Al2Ch / B2Ch) 1.53 1.60 1.45 Magnesium oxide + calcium oxide (MgO + CaO) 11 6.4 6.7 Hafnium oxide + barium oxide (SrO + BaO) 1.5 6 2.4 Oxide monument + oxidation chain + oxidation ball + oxidation钸 (As2〇3 + Sb2〇3 + Sn〇2 + Ce〇2) 0.2 1 0 Ripe expansion coefficient (xl0, 0C) (30 ~ 400oC) 36.1 33.5 33.4 should account for rc) 669 670 667 density (2 / cm3) 2.36 2.49 2.38 Glass liquidus temperature rc) 1180 1160 1180 Bubble exhaustion Δ OX From the test data shown in Table 1 in Examples 1 to 5, it can be clearly observed that when only TFT is required -LCD When the glass substrate required for basic physical properties, glass made according to the present invention is disclosed a glass composition range

第27頁 I 200521099 i 1 丨·丨 _ 丨· ........... .... 广五、發明說明（23)Page 27 I 200521099 i 1 丨 · 丨 _ 丨 · ................. Guangzhou V. Description of the Invention (23)

I | 璃，其熱膨脹係數於界於溫度30〜400t：時均低於4 0x1 0_7/ i °C，應變點溫度均高於650°C，密度均低於2.6(g/cm3)， • 玻璃液相溫度均低於1 2 0 0 C，每公斤基板玻璃中泡徑在〇 . 5〜1 · 0 m m内的氣泡數目均少於2 0個，均滿足τ j? τ - L C D玻璃基板所需的基本物理特性。而表二所示實施例6至實施例1 〇中之各檢測數據，亦可清楚觀察出，當需要具有如多晶矽型（poly-Si )TFT-LCD等次世代製程或產品所需求wTF 丁一， L C D玻璃基板特性時，依據本發明所揭露的另一玻璃組成 w 範圍所製成之玻璃，其熱膨脹係數於界於溫度3 0〜4 0 0 °C時均低於34 X 10_7/ °C，應變點溫度均高於6 6 5它，密度均低於2· 4 (g/cm3 )，玻璃液相溫度均低於12〇〇艽，每公斤基板玻璃中泡徑在0 · 5〜1 · 0 m m内的氣泡數目均少於2 〇個，亦均滿足如多晶矽型（p〇 1 y -S i ) TFT-LCD等次世代製程或產品所需求的T F T - L C D玻璃基板特性。而表三、表四中，則列示了其它不同於本發明之組成成份所施作之比較例1 1至比較例丨6。表三之比較例丨丨至比較例1 3 ’係表一的對照組。表四之比較例丨4至比較例丨6，係表二的對照組。由表三所示之各檢測數據中，可清楚顯不’比較例1 1之熱膨脹係數偏高，比較例丨2之玻璃液相溫度偏高’比較例1 3之玻璃氣泡產生數過高，均不能滿足 T F T - L C D玻璃基板所需的基本物理特性。另，由表四所示 ❶之各檢測數據中’亦可清楚顯示，比較例丨4之熱膨脹係數偏高’ 士較例1 5，破螭密度偏高，比較例丨6之玻璃氣泡產生數過高’亦不能滿足如多晶矽型（p 〇丨y _ s i ) T F T - L C D等I | glass, whose coefficient of thermal expansion is within the temperature range of 30 ~ 400t: the average temperature is lower than 4 0x1 0_7 / i ° C, the strain point temperature is higher than 650 ° C, and the density is lower than 2.6 (g / cm3). • glass The liquidus temperature is lower than 1 2 0 0 C, and the number of bubbles in a glass substrate with a diameter of 0.5 to 1.0 mm per kg of substrate glass is less than 20, all satisfying τ j? Τ-LCD glass substrate Required basic physical characteristics. The test data in Examples 6 to 10 shown in Table 2 can also be clearly observed. When it is necessary to have the next-generation process or product such as poly-Si TFT-LCD, wTF Ding Yi When the characteristics of LCD glass substrates, the glass made according to another glass composition w range disclosed in the present invention has a thermal expansion coefficient lower than 34 X 10_7 / ° C at a temperature of 30 ~ 4 0 0 ° C. The strain point temperature is higher than 6 65, the density is lower than 2 · 4 (g / cm3), the glass liquidus temperature is lower than 1 200〇, and the bubble diameter per kilogram of substrate glass is 0 · 5 ~ 1. · The number of bubbles in 0 mm is less than 20, which also meets the characteristics of TFT-LCD glass substrates required for next-generation processes or products such as polycrystalline silicon (p〇1 y -S i) TFT-LCD. In Tables 3 and 4, Comparative Examples 11 to 6 which are applied to other components different from the present invention are listed. The comparative examples from Table 3 to Comparative Example 13 are the control group of Table 1. The comparative examples 4 to 6 in Table 4 are the control group in Table 2. From the test data shown in Table 3, it can be clearly shown that the thermal expansion coefficient of Comparative Example 1 1 is too high, and the glass liquid phase temperature of Comparative Example 2 is too high. The glass bubble generation number of Comparative Example 13 is too high. None of them can meet the basic physical characteristics required for a TFT-LCD glass substrate. In addition, according to the test data shown in Table 4, 'can also clearly show that the thermal expansion coefficient of Comparative Example 丨 4 is too high' 较 Comparative Example 15 has a high breaking density, and the number of glass bubbles generated in Comparative Example 丨 6 If it is too high, it cannot meet the requirements such as polycrystalline silicon (p 〇丨 y _ si) TFT-LCD

第28頁 200521099_ 五、發明說明（24) 次世代製程或產品所需求的TFT-LCD玻璃基板特性。承前所述，本發明較習用之玻璃基板創新，除可達到一般TFT-LCD玻璃基板所需要之基本特性外，更可達到前述之多晶矽型（poly-Si)TFT-LCD之玻璃基板所需要之諸多特性，極具新穎性與進步性，符合發明專利之法定要件，爰依法提出發明專利申請。雖本發明以一較佳實施例揭露如上，但並非用以限定本發明實施之範圍，任何熟習此項技藝者，在不脫離本發明之精神與範圍内，當可做些許的更動與潤飾，及凡依本發明所作的均等變化與修飾，應以本發明之申請專利範圍所涵蓋，其界定應已申請專利範圍為準。Page 28 200521099_ V. Description of the invention (24) Characteristics of TFT-LCD glass substrate required for next-generation processes or products. According to the foregoing, the present invention is more innovative than the conventional glass substrates. In addition to the basic characteristics required by general TFT-LCD glass substrates, it can also achieve the requirements of the aforementioned poly-Si TFT-LCD glass substrates. Many features are extremely novel and progressive, complying with the statutory requirements for invention patents, and file an invention patent application according to law. Although the present invention is disclosed as above with a preferred embodiment, it is not intended to limit the scope of implementation of the present invention. Any person skilled in the art can make some modifications and decorations without departing from the spirit and scope of the present invention. And all equal changes and modifications made in accordance with the present invention shall be covered by the scope of patent application of the present invention, and the definition shall be subject to the scope of patent application.

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Claims

200521099__ 六、申請專利範圍 1 . 一種硼鋁矽酸鹽玻璃，係包含重量百分比5 6 . 0 %至6 4 . 0 % 之氧化矽、1 4 · 0 %至1 9 · 0 %之氧化鋁、7 · 5 %至1 4 . 0 %之氧化硼、0 . 0 %至4 · 0 %之氧化鎂、3 . 0 %至1 0 . 0 %之氧化鈣、 0 · 0 %至6 · 0 %之氧化勰、0 · 0 %至1 0 · 0 %之氧化鋇、0 · 0%至 1 . 0 %之氧化鋅、0 · 0%至1 · 0 %之氧化鍅、0 · 0 %至2 · 0 %之氧化砷、0 . 0 %至1 . 0 %之氧化銻、0. 0 %至1 . 0 %之氧化錫、200521099__ VI. Patent application scope 1. A boroaluminosilicate glass containing 56.0% to 64.0% by weight of silicon oxide, 14.0% to 19.0% by weight of alumina, 7.5% to 14.0% boron oxide, 0.0% to 4.0% magnesium oxide, 3.0% to 1.0% calcium oxide, 0. 0% to 6.0% Hafnium oxide, 0 · 0% to 10 · 0% barium oxide, 0 · 0% to 1.0% zinc oxide, 0 · 0% to 1 · 0% hafnium oxide, 0 · 0% to 2 0% arsenic oxide, 0.0% to 1.0% antimony oxide, 0.0% to 1.0% tin oxide,

0 . 0 %至1 . 0 %之氧化鈽；其中氧化矽與氧化鋁的總和超過 7 1 . 0 %，氧化鋁與氧化硼的比例介於1 · 0與2. 1之間，氧化鎂、氧化鈣之總和介於3 · 0 %至1 0 . 0 %之間，氧化鋰、氧化鋇之總和介於0 · 0 %至1 3 · 0 %之間，氧化砷與氧化銻、氧化錫、氧化鈽之總和介於0· 3%至2. 0%之間。0.0% to 1.0% of hafnium oxide; where the sum of silica and alumina exceeds 71.0%, the ratio of alumina to boron oxide is between 1.0 · 2.1, magnesium oxide, The sum of calcium oxide is between 3.0% and 1.0%, the sum of lithium oxide and barium oxide is between 0.0% and 13.0%, arsenic oxide and antimony oxide, tin oxide, The sum of thorium oxide is between 0.3% and 2.0%.

2.如申請專利範圍第1項所述之硼鋁矽酸鹽玻璃，其組成成份之重量百分比分別為5 6 · 0 %至6 0 . 0 %之氧化矽、1 4 · 0 %至1 8 · 0 %之氧化鋁、7 · 5 %至1 4 · 0 %之氧化硼，0 . 0 %至2 · 0 °/〇之氧化鎂、3 . 0%至7 · 0 %之氧化鈣、1 · 0 %至6 · 0 %之氧化锶、2 · 0 %至1 (K 0 %之氧化鋇、0 · 0 %至1 . 0 %之氧化鋅、0· 0 %至1 · 0 %之氧化锆、0 · 0 %至2 · 0 %之氧化砷、0 · 0 %至1 · 0 % 之氧化銻、0 · 0 %至1 · 0 %之氧化錫、0 · 0 %至1 · 0 %之氧化鈽 •，其中氧化矽與氧化鋁的總和超過7 1 · 0 %，氧化鋁與氧化删的比例介於1 . 0與2. 1之間，氧化鎮、氧化#5之總和介於3 . 0 %至7 . 0 %之間，氧化勰、氧化鋇之總和介於4 . 0 °/〇至1 3 . 0 %之間，氧化砷與氧化銻、氧化錫、氧化鈽之總和介於0 . 3 %至2 . 0 %之間。 3 ·如申請專利範圍第2項所述之硼鋁矽酸鹽玻璃，其中該2. The boroaluminosilicate glass according to item 1 of the scope of patent application, the weight percentages of which are 5 6 · 0% to 60.0% of silicon oxide, 14.0% to 1 8 0% alumina, 7.5% to 14 · 0% boron oxide, 0.0% to 2.0 ° o / magnesium oxide, 3.0% to 7.0% calcium oxide, 1 0% to 6.0% strontium oxide, 2.0% to 1.0% (K 0% barium oxide, 0.0% to 1.0% zinc oxide, 0.0% to 1.0% oxidation Zirconium, 0. 0% to 2.0% arsenic oxide, 0. 0% to 1.0% antimony oxide, 0. 0% to 1.0% tin oxide, 0. 0% to 1.0% Of osmium oxide •, where the sum of silica and alumina exceeds 7 1 · 0%, the ratio of alumina to oxidized oxide is between 1.0 and 2.1, and the sum of oxidized town and oxidation # 5 is between 3 0% to 7.0%, the sum of hafnium oxide and barium oxide is between 4.0 ° / 0 and 13.0%, the sum of arsenic oxide and antimony oxide, tin oxide, hafnium oxide is between 0.3% to 2.0%. 3 · The boroaluminosilicate glass according to item 2 of the patent application scope, wherein

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κ __ 六、申請專利範圍玻璃之熱膨脹係數低於40 X 1 0_7/ °C ( 30〜4 0 0 t )、變點溫度高於6 5 0 °C、密度低於2· 6 (g/cm3 )、液相溫产於1 2 0 0 °C、每公斤基板玻璃中泡徑在〇· 5〜1. 〇mm内低 ' 泡數目少於2 0個。 ^ 4 ·如申請專利範圍第2項所述之硼鋁矽酸鹽玻璃，其中★女玻璃係可用於TFT-LCD之玻璃基板。 ~ 5 .如申請專利範圍第1項所述之硼鋁矽酸鹽玻璃，其組成成份之重量百分比分別為6 0 . 0 %至6 4 · 0 %之氧化秒、丨5 ^ , %至1 9 · 0 %之氧化鋁、9 · 5 %至1 3 · 0 °/。之氧化硼、〇 · 〇 %至4· 〇 %之氧化鎂、3 · 0 %至1 0 · 0 %之氧化鈣、0 · 0 %至3 · 〇 %之氧化 II 勰、〇 · 〇 %至2 · 0 %之氧化鋇、0 · 〇 %至1 · 0 %之氧化鋅、〇〇 % 至1 · 0 %之氧化锆、0 · 0 %至2 · 0 %之氧化砷、0 · 〇 %至i · 〇 % ° 之氧化銻、0 · 0 %至1 . 〇 %之氧化錫、〇 · 〇 %至1 · 〇 %之氧化飾，且其中氧化石夕與氧化銘的總和超過7 6 · 0 %，氧化銘與氧化硼的比例介於1 · 3與1 · 8之間，氧化鎂、氧化約之總和介於5 · 0 %至1 〇 · 〇 %之間，氧化鋰、氧化鋇之總和介於〇 · 〇 %至4 · 5 %之間，氧化砷與氧化銻、氧化錫、氧化鈽之總和介於0 · 3 %至2 · 0 %之間。 6·如申請專利範圍第5項所述之硼鋁矽酸鹽玻璃，其中該玻璃之熱膨脹係數低於34 X 1 0_V。(：（ 30〜4 0 0 °C )、應、變點溫度高於6 6 5 °C、密度低於2 · 4 ( g / c m3 )、液相溫度低於1 2 0 0 °C、每公斤基板玻璃令泡徑在〇· 5〜1· 0mm内的氣一、泡數目少於2 0個。 w 7 ·如申請專利範圍第5項所述之硼鋁矽酸鹽玻璃，其中該κ __ VI. Patent application glass The thermal expansion coefficient of glass is lower than 40 X 1 0_7 / ° C (30 ~ 4 0 0 t), the change point temperature is higher than 6 50 ° C, and the density is lower than 2 · 6 (g / cm3 ), The liquid phase is warmly produced at 1 200 ° C, the bubble diameter per kilogram of the substrate glass is within 0.5 ~ 1.0 mm, and the number of bubbles is less than 20. ^ 4 The boroaluminosilicate glass as described in item 2 of the scope of patent application, in which ★ female glass is used as a glass substrate for TFT-LCD. ~ 5. According to the boroaluminosilicate glass described in item 1 of the scope of the patent application, the weight percentage of its composition is 60. 0% to 64. 0% oxidation seconds, 5 ^,% to 1 9 · 0% alumina, 9 · 5% to 1 3 · 0 ° /. Boron oxide, 0.00% to 4.0% magnesium oxide, 3.0% to 100.0% calcium oxide, 0% to 3.0% oxide II 勰, 〇% to 2 · 0% barium oxide, 0 · 0% to 1 · 0% zinc oxide, 0% to 1 · 0% zirconia, 0 · 0% to 2 · 0% arsenic oxide, 0 · 0% Antimony oxide to i · 〇% °, tin oxide from 0 to 0% to 1.0%, oxide decoration from 〇% to 1.0%, and the sum of the oxide stone oxide and the oxide inscription exceeds 7 6 · 0%, the ratio of oxide oxide and boron oxide is between 1.3, 1.8, and the sum of magnesium oxide and oxide is between 5.0% and 1.0%, and lithium oxide and barium oxide are The total sum is between 0.0% and 4.5%, and the sum of arsenic oxide, antimony oxide, tin oxide, and thallium oxide is between 0.3% and 2.0%. 6. The boroaluminosilicate glass according to item 5 of the scope of patent application, wherein the thermal expansion coefficient of the glass is lower than 34 X 1 0_V. (：( 30 ~ 4 0 0 ° C), stress, change point temperature is higher than 6 6 5 ° C, density is lower than 2 · 4 (g / c m3), liquidus temperature is lower than 1 2 0 0 ° C, Each kilogram of substrate glass has a bubble diameter within 0.5 to 1.0 mm. The number of bubbles is less than 20. w 7 The boroaluminosilicate glass according to item 5 of the scope of patent application, wherein the

第32頁 200521099 六、申請專利範圍玻璃係可用於包括多晶石夕型（P〇ly-Si ) TFT-LCD等次世代製程或產品之TFT-LCD玻璃基板。Page 32 200521099 VI. Scope of patent application Glass series can be used for TFT-LCD glass substrates including polycrystalline silicon (Poly-Si) TFT-LCD and other next-generation processes or products.

Hi·! 第33頁 200521099 六、指定代表圖 (一）、本案代表圖為：第________圖 (二）、本案代表圖之元件代表符號簡單說明 IBiiHi ·! Page 33 200521099 VI. Designated Representative Map (1) The representative map in this case is: Figure ________ (II). The component representative symbols of the representative map in this case are simply explained IBii