TW200504138A - Curable resin composition, protective film, and the method of formation - Google Patents

Curable resin composition, protective film, and the method of formation

Info

Publication number
TW200504138A
TW200504138A TW093118171A TW93118171A TW200504138A TW 200504138 A TW200504138 A TW 200504138A TW 093118171 A TW093118171 A TW 093118171A TW 93118171 A TW93118171 A TW 93118171A TW 200504138 A TW200504138 A TW 200504138A
Authority
TW
Taiwan
Prior art keywords
protective film
resin composition
curable resin
formation
composition
Prior art date
Application number
TW093118171A
Other languages
Chinese (zh)
Inventor
Atsushi Baba
Michinori Nishikawa
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200504138A publication Critical patent/TW200504138A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/45—Heterocyclic compounds having sulfur in the ring
    • C08K5/46—Heterocyclic compounds having sulfur in the ring with oxygen or nitrogen in the ring
    • C08K5/47—Thiazoles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/39—Thiocarbamic acids; Derivatives thereof, e.g. dithiocarbamates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/39—Thiocarbamic acids; Derivatives thereof, e.g. dithiocarbamates
    • C08K5/40—Thiurams, i.e. compounds containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/43—Compounds containing sulfur bound to nitrogen
    • C08K5/44—Sulfenamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C09D201/02—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09D201/06—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Optical Filters (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

This invention provides a curable resin composition which meets the requirement of transparency, heat resistance, surface hardness, adhesion, and excellent loading resistance during heating. This curable composition can be used to form the protective film for photo device which is excellent in leveling the height difference of color filter formed on the bottom substrate. The protective film formed by the disclosed composition; and the method of formation are also provided. The curable resin composition comprises a polymer with more than 2 epoxy groups in each molecule, a cationic polymer, and compounds choosing from thiazole, thiazolin, sulfonyl amine, dithiocarbamate, and thiram.
TW093118171A 2003-06-23 2004-06-23 Curable resin composition, protective film, and the method of formation TW200504138A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003177752A JP4046023B2 (en) 2003-06-23 2003-06-23 Curable resin composition, protective film and method for forming protective film

Publications (1)

Publication Number Publication Date
TW200504138A true TW200504138A (en) 2005-02-01

Family

ID=34179581

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118171A TW200504138A (en) 2003-06-23 2004-06-23 Curable resin composition, protective film, and the method of formation

Country Status (3)

Country Link
JP (1) JP4046023B2 (en)
KR (1) KR100977962B1 (en)
TW (1) TW200504138A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI396715B (en) * 2005-08-12 2013-05-21 Jsr Corp Resin composition, protection film of color filter and producing thereof

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602004001096T2 (en) * 2003-06-30 2006-10-19 Mitsubishi Gas Chemical Co., Inc. A thermosetting resin composition and use thereof
JP4536437B2 (en) * 2003-06-30 2010-09-01 三菱瓦斯化学株式会社 Thermosetting resin composition and use thereof
JP2005338831A (en) * 2004-05-25 2005-12-08 Samsung Electronics Co Ltd Photoresist composition for organic film of liquid crystal display, spinless coating method thereof, fabrication method of organic film pattern using the same, and liquid crystal display fabricated by the same
JP2006228578A (en) * 2005-02-17 2006-08-31 Dainippon Printing Co Ltd Color filter base plate for organic electroluminescent element
JP2006257257A (en) * 2005-03-17 2006-09-28 Sumitomo Chemical Co Ltd Curable resin composition and protective film formed by the same
JP2007119720A (en) * 2005-09-29 2007-05-17 Dainippon Printing Co Ltd Curable resin composition
JP2007100020A (en) * 2005-10-07 2007-04-19 Jsr Corp Curable resin composition, over coat, and method for producing the same
WO2007094396A1 (en) 2006-02-16 2007-08-23 Tokyo Ohka Kogyo Co., Ltd. Photosensitive resin composition and pattern forming method using same
JP4851359B2 (en) * 2006-02-16 2012-01-11 東京応化工業株式会社 Photosensitive resin composition and pattern forming method using the same
JP4635935B2 (en) * 2006-03-29 2011-02-23 Ｊｓｒ株式会社 Radiation-sensitive composition for forming colored layer, color filter, and color liquid crystal display element
JP5524480B2 (en) * 2006-05-18 2014-06-18 日本化薬株式会社 Thermosetting resin composition and cured product thereof
JP2008144124A (en) * 2006-11-14 2008-06-26 Jsr Corp Thermosetting resin composition, method for forming color filter protective film and color filter protective film
JP4637221B2 (en) 2007-09-28 2011-02-23 富士フイルム株式会社 Positive photosensitive resin composition and cured film forming method using the same
JP4718623B2 (en) * 2008-03-28 2011-07-06 富士フイルム株式会社 Positive photosensitive resin composition and cured film forming method using the same
TWI461848B (en) * 2008-03-28 2014-11-21 Fujifilm Corp Positive type photosensitive resin composition and curing film forming method using it
JP2012185301A (en) * 2011-03-04 2012-09-27 Micro Process:Kk Photo mask protective film material
TWI585522B (en) 2012-08-31 2017-06-01 富士軟片股份有限公司 Photosensitive resin composition, cured product and method for manufacturing the same, method for manufacturing resin pattern, cured film, liquid crystal display apparatus, organic electroluminescent apparatus and touch panel apparatus
KR102233483B1 (en) * 2015-03-27 2021-03-26 동우 화인켐 주식회사 Colored photosensitive resin composition and color filter manufactured by the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08211610A (en) * 1995-02-02 1996-08-20 Nippon Kayaku Co Ltd Resin composition, resist ink composition and its cured body

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI396715B (en) * 2005-08-12 2013-05-21 Jsr Corp Resin composition, protection film of color filter and producing thereof

Also Published As

Publication number Publication date
JP4046023B2 (en) 2008-02-13
KR20050000331A (en) 2005-01-03
JP2005017321A (en) 2005-01-20
KR100977962B1 (en) 2010-08-24

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