玖、發明說明： 【發明所屬之技術領域】 發明領域 本I明概有關於電磁能量的消減，尤係關於附有電磁 能量衰減材料的多孔濾材。 3^0 «tr 發明背景 於此所述之ENI係概指電磁干擾及射頻干擾(RFI)， 而所謂“電磁”係概指電磁波和射頻。 在正常操作時，電子設備典型會產生不受歡迎的電磁 能量，其會由純射和傳導的職發射而干擾附近之電子 設備的操作。該電辦量會存在於涵蓋—域_波長和 頻率中。-般為儘量減少麵的問題m〈的電磁能量 源會被屏蔽及電接地，而來減少射入周遭環境中。可替代 或附加地，易遭受EMI的裝置亦可同樣地屏蔽及電接地， 而來保護它們免受周遭環境中的EMI干擾。因此，屏罩會 被設來阻止電磁能量相對於一障壁、殼體，或其他内部設 有電子設備之封罩的進出。 概言之，一理想的EMI屏罩應包含一完全封閉的殼 體，其係由無限導電性且沒有孔隙、接縫、間隙、氣孔的 材料構成。但，在實際的情況往往會形成一封罩，其係由 具有-些孔隙之有限導電性的材料所構成。該等孔隙可能是 無意造成的，例如因構建方法所致(譬如在相鄰的嵌板和周圍 的門之間，或在殼體構件與電路板之間的間隙或接縫）；或 :可:=有Γ成者’譬如為供空氣流通以便冷卻的氣孔 衣造方f可被用來改善非故意㈣㈣蔽效 ?…溶接或焊㈣縫，或可在屏㈣料的連接物中 磨銑一腔穴，而來消除非故意的孔隙。 如所遂，冷卻氣孔_般是有需要的，因為電子設備典 塑會產生熱能（即熱），其通常必須被由該設備消除，以確保 連續之長時間而且正確的操作。孔隙的屏蔽相對於冷卻氣 孔必然會有更多的挑戰，因為孔隙本身必需能供冷:氣空 流動通過來促進熱傳導，故並不能被去除。 習知技術可用的解決方法係提供某種程度的emi屏蔽 來罩覆一冷卻孔隙。例如，一冷卻孔隙可被一導電板所覆 蓋，該板具有小孔隙的場區（即，一個二維陣列）遍佈該冷卻 孔。其它的解決方法包括一導電屏幕，又再其它的方法包 括一波導孔隙的二維陣列（例如“蜂巢”）。該各方法皆會對具 有稍低於“截止，，(CUTOFF)頻率之頻率的較低頻EMI來提供 優先的衰減，該截止頻率一般係由各孔隙的最大尺寸來決 定。惟，該等方法較為複雜，因為它們有賴於該板或屏幕 確實地電連接於該設備的殼體，且必須被維持歷經該設備 的使用壽命。維持該等電連接在高振動及/或侵蝕性的環境 中將會特別的困難。 如前所述，該等習知方法和材料的屏蔽效果會隨著頻 率的長：1¾而減少。故，在許多今日的電子用具中有效地屏 蔽EMI會變得更為困難，因目前的趨勢仍不斷地提高操作 頻率。例如，現今使用的消費性電子產品譬如個人電腦中 所使用的微處理器的速度係以數千MHz來操作。而下一代 的裝置預期又會以更高的頻率來操作。 尚有其它的方法可遍佈冷卻孔來提供EMI屏蔽。例如 Ruffoni的No· 5151222美國專利，其揭露内容併此附送參 考。Ruffoni揭露使用一種蘊含導電墨汁之開放胞元組織的 聚胺酯發泡物。其所揭之方法係將該導電墨汁塗佈於該發 泡物表面上，並由該發泡物的塗覆表面至其内部來造成導 電性的變化或梯度。或許，該導電墨汁能在較高頻率提供 較佳的衰減性能，但不幸地，由於要產生梯度，故必須在 該發泡物表面塗佈較重的導電墨汁，方能提供一所需的整 體农減特性。惟該塗佈會因毛孔阻塞而造成壓力減降，此 等毛孔阻基係由於為了符合更高的衰減需求而塗佈厚重的 導電墨汁所致。因此，在Ruff〇ni之專利案中所亦的發泡物 並不適合用來作為空氣過濾器。 【日月内】 發明概要 概括而g，本發明係有關一種可吸收電磁干擾(EMI) 的空氣過_，譬如—被以-麵吸收材料來處理過的平 面狀夕孔基材(例如_聚胺酯發泡薄片該舰【吸收材料會 / F伤射入邊被處理過的空氣過濾器上的EMI，而得 ，少某-操作頻率範圍内的麵由之穿透。該吸收材料可 藉損耗機fj所產生的能量消耗來由該環境消除一部份的 EMI騎&耗機制包括在—介電材料中的極化損耗，及 〃 有限^r電性之導電材料中的導電性或電阻性損 200418560 耗0 緣是，在第一態樣中，本發明係關於θ ^ 種具有EMI吸 收特性的空氣過濾器。該過濾器包含一多？丨 基材(例如一開 放胞元組織的聚胺酯發泡物）及一EMI吸吹材料冷^ 、 孔基材上。在一實施列中，該EMI吸收性材料包括二二此 吸收物微粒，例如破，及一黏接劑，例如择备 长乳树脂，或彈 性物等。在另一實施例中，該EMI吸收式介今、風、各 、二瑕^過濾器在製 造時會接受多次ΕΜΙ吸收材料的塗佈。 在另一實施例中，該ΕΜΙ吸收式空氣過濾器亦包含一 10耐火劑。在又另一實施例中，該ΕΜΙ吸收式空氣過濾器係 包含一導電層。該導電層可例如被製成一屏幕或一低於截 止頻率的波導陣列（即一“蜂巢”）。 在另一態樣中，本發明係關於一種具有]£1^1吸收特性 之空氣過濾器的製造方法。該方法包含以下步驟：提供一 15多孔基材，其具有一第一面與一第二面；及塗佈一；ΕΜΙ吸 收材料於該多孔基材，而使吸電材料能夠一致或均勻地適 佈該多孔基材的深度。於一實施例中，塗佈該EMI吸收材 料的步驟更包含以下之次步驟：提供一£1^1吸收溶液，其 包含一吸電物及一黏接劑；將該多孔基材浸入該EMI吸收 20溶液中，而使該溶液滲入該多孔基材内；由該溶液中取出 該多孔基材；除去任何過多的溶液；及固化該]^^1吸收材 料。在另一實施例中，上述各程序步驟會被重複一或多次， 俾塗佈更多的EMI吸收材料，來達成一所需的衰減性能。 在另一貫施例中，塗佈該EMI吸收材料的步驟及包 8 200418560 括：提供一含有一吸電物及一黏接劑的吸電溶液；將該吸 電溶液喷洒於該多孔基材的第一面上；由該喷洒過的多孔 基材中除掉過多的吸電溶液，而使該EMI吸收材料均勻地 遍佈在該多孔基材中；及固化該吸電材料。 5 在另一實施例中，塗佈一層EMI吸收材料的製程更包 含一步驟，即強迫空氣穿過該多孔基材，以確使該等毛孔 保持暢通。在又另一實施例中，該製程更包含塗佈一耐火 劑層的步驟。 圖式簡單說明 10 本發明係以所附申請專利範圍中的特徵來界定。本發 明之優點等則可配合所附圖式參閱以下說明來進一步地瞭 解，其中： 第1圖為一 EMI吸收式空氣過濾器之製造方法實施例 的流程圖； 15 第2A及2B圖分別為一佇立之EMI吸收式空氣過濾器與 一框裝之EMI吸收式空氣過濾器的立體示意圖； 第3圖為一組合一導電層之EMI吸收式空氣過濾器的 變化實施例之立體示意圖；(Ii) Description of the invention: [Technical field to which the invention belongs] Field of the invention The present invention relates generally to the reduction of electromagnetic energy, and more particularly to a porous filter material with an electromagnetic energy attenuation material. 3 ^ 0 «tr Background of the Invention The ENI mentioned herein refers to electromagnetic interference and radio frequency interference (RFI), and the so-called" electromagnetic "refers to electromagnetic waves and radio frequency. During normal operation, electronic equipment typically generates undesired electromagnetic energy, which can interfere with the operation of nearby electronic equipment by pure and conductive emissions. This amount will be in coverage-domain_wavelength and frequency. -In order to minimize the problems of the surface, the electromagnetic energy source m <will be shielded and electrically grounded to reduce the incident into the surrounding environment. Alternatively or in addition, devices that are susceptible to EMI can be similarly shielded and electrically grounded to protect them from EMI interference in the surrounding environment. As a result, the screen is designed to prevent electromagnetic energy from entering or exiting a barrier, housing, or other enclosure with electronic equipment inside. In summary, an ideal EMI shield should include a completely closed enclosure made of a material with infinite conductivity and no voids, joints, gaps, or pores. However, in practice, a cover is often formed, which is composed of a material with limited conductivity of some pores. Such voids may be inadvertently caused, for example, by construction methods (such as between adjacent panels and surrounding doors, or gaps or seams between housing components and circuit boards); or: : = 有 Γ 成 者 'For example, the air-hole garment manufacturer f for air circulation can be used to improve the unintentional shielding effect? ... welding or welding quilting, or can be milled in the connection of the screen material A cavity to eliminate unintentional pores. As it is, cooling pores are often needed, because electronic equipment typically generates thermal energy (ie, heat), which must usually be eliminated by the equipment to ensure continuous and correct operation. The shielding of pores will inevitably have more challenges than cooling pores, because the pores themselves must be able to provide cooling: air and air flow through to promote heat conduction, so they cannot be removed. A solution that is available with conventional techniques is to provide some degree of EMI shielding to cover a cooling aperture. For example, a cooling aperture may be covered by a conductive plate having a field region (i.e., a two-dimensional array) of small apertures throughout the cooling aperture. Other solutions include a conductive screen, and yet other methods include a two-dimensional array of waveguide apertures (such as a "honeycomb"). Each of these methods provides preferential attenuation to lower frequency EMI with frequencies slightly below the "CUTOFF" frequency. The cutoff frequency is generally determined by the maximum size of each pore. However, these methods More complicated because they rely on the board or screen to be electrically connected to the device ’s housing and must be maintained over the life of the device. Maintaining these electrical connections in high vibration and / or aggressive environments will It will be particularly difficult. As mentioned earlier, the shielding effect of these conventional methods and materials decreases with the frequency: 1¾. Therefore, it is more difficult to effectively shield EMI in many electronic appliances today. Due to current trends, the operating frequency is still increasing. For example, the speed of microprocessors used in consumer electronics products such as personal computers today is operating at thousands of MHz. The next generation of devices is expected to operate at Higher frequency operation. There are other ways to provide EMI shielding throughout the cooling holes. For example, US Patent No. 5,151,222 to Ruffoni, the disclosure of which is hereby incorporated by reference. Ruf foni discloses the use of a polyurethane foam containing an open cell tissue containing conductive ink. The method disclosed is to coat the conductive ink on the surface of the foam, from the coated surface of the foam to its surface. Internally cause a change or gradient in conductivity. Perhaps, the conductive ink can provide better attenuation performance at higher frequencies, but unfortunately, because of the gradient, it is necessary to coat the surface of the foam with a heavy conductive Ink can provide a desired overall agricultural reduction characteristics. However, the coating will cause pressure reduction due to pore blockage. These pore resistance bases are used to coat thick conductive inks in order to meet higher attenuation requirements. Because of this, the foam in the Ruffoni patent case is not suitable for use as an air filter. [Day and month] Summary of the invention Summary and g, the present invention relates to an absorbable electromagnetic interference (EMI) The air is passed through, for example, a flat-shaped porous substrate that has been treated with a -side absorbent material (for example, polyurethane foam sheet. I, and, Shao-the surface in the operating frequency range is penetrated by this. The absorbing material can use the energy consumption generated by the loss machine fj to eliminate part of the EMI riding & consumption mechanism from the environment- Polarization loss in a dielectric material, and conductivity or resistive loss in a conductive material with limited ^ r electrical conductivity 200418560 0 loss is because, in a first aspect, the present invention relates to θ ^ species with EMI absorption Air filter with special characteristics. The filter includes a substrate (such as an open cell tissue polyurethane foam) and an EMI blowing material on a cold, porous substrate. In one embodiment, the EMI absorption The material includes two or two absorbent particles, such as broken, and an adhesive, such as a long-term resin, or an elastic material. In another embodiment, the EMI absorption type is air, wind, various, Defective filters are subjected to multiple coatings of EMI absorbent material during manufacture. In another embodiment, the EMI absorption air filter also contains 10 refractory agents. In yet another embodiment, the EMI absorption air filter system includes a conductive layer. The conductive layer can be made, for example, as a screen or a waveguide array (i.e., a "honeycomb") below the cutoff frequency. In another aspect, the present invention relates to a method for manufacturing an air filter having an absorption characteristic of £ 1 ^ 1. The method includes the following steps: providing a 15 porous substrate having a first side and a second side; and coating one; an EMI absorbing material on the porous substrate, so that the electric absorbing material can be uniformly or uniformly adapted. The depth of the porous substrate. In one embodiment, the step of applying the EMI absorbing material further includes the following steps: providing a £ 1 ^ 1 absorbing solution, which includes an electric attractor and an adhesive; and immersing the porous substrate in the EMI Absorb 20 solutions, so that the solution penetrates into the porous substrate; remove the porous substrate from the solution; remove any excess solution; and cure the] ^^ 1 absorbent material. In another embodiment, the above steps are repeated one or more times, and more EMI absorbing materials are coated to achieve a desired attenuation performance. In another embodiment, the step of coating the EMI absorbing material and the package 8 200418560 include: providing an electric absorbing solution containing an electric absorbing substance and an adhesive; spraying the electric absorbing solution on the porous substrate First side; removing too much electricity absorbing solution from the sprayed porous substrate so that the EMI absorbing material is evenly distributed in the porous substrate; and curing the electricity absorbing material. 5 In another embodiment, the process of applying a layer of EMI absorbing material further includes a step of forcing air through the porous substrate to ensure that the pores remain open. In yet another embodiment, the process further includes the step of applying a refractory layer. Brief description of the drawings 10 The present invention is defined by the features in the scope of the attached patent application. The advantages and the like of the present invention can be further understood with reference to the accompanying drawings with reference to the following description, wherein: FIG. 1 is a flowchart of an embodiment of a manufacturing method of an EMI absorption air filter; 15 FIGS. 2A and 2B are respectively A three-dimensional schematic diagram of a standing EMI absorption air filter and a framed EMI absorption air filter; FIG. 3 is a perspective view of a modified embodiment of a EMI absorption air filter combined with a conductive layer;
第4圖為一組合一低於截止頻率之波導濾波器的EMI 20 吸收式空氣過濾器之變化實施例的立體示意圖； 第5A與5B圖為形成非平面結構之EMI吸收式空氣過濾 器的變化實施例之立體示意圖； 第6圖為一能夠生產第1至5圖之Ε ΜI吸收式空氣過濾 器的製造方法之示意圖； 9 第7圖為另-能夠生產第⑴圖之職吸收式空氣過 濾器的製造方法之示意圖； 工 第8圖為-應吸收式空氣過滤器樣本進行衰減對頻 率之測試結果的圖表； ▲第9圖為—示意圖示出—種能夠測量穿過—材料例如 该EMI吸收式空氣過渡器的測試裝置；及 第10圖為使用第9圖之裝置來測量本發明之二丽吸 收式空氣過濾器樣本相較於一未受處理之空氣過濾哭，針 對壓力減降與空氣流量的測試結果之圖表。 〜π C實施方式3 較佳實施例之詳細說明 具有電磁能吸收特性的材料可被用來抑制_寬度頻率 範圍的ΕΜΙ傳輪。該等麵吸收材料可提供相當的電ς屏蔽 效果，例如在約100，_ΜΗΖ的_頻率中可高達地以上。 依據本發明，顧吸收材料可被製成—溶液而來塗佈 在-適當的多孔基材上。概言之，所形成的吸收性溶液包 3吸收材料及-黏接劑，而可被塗設於一新的客定空氣 濾器，或-般市售的非ΕΜΙ空氣濾器中。 工” 請參閱第1圖，所示為一塗佈ΕΜΙ吸收材料於一空氣濾 器之方法實施例的㈣步驟。簡言之，-多孔基材會被提 :(步驟100)，以及_可固化的_吸收溶液亦會被提供（步 驟11〇)。㈣’该EMI吸收溶液會被塗佈於該多孔基材上（步 驟120)然、後除掉任何過多的溶液(步驟⑽）。沈積在該多 L基材中的EMI吸收溶液兩會被固化(步驟_)。若需要較 200418560 大的EMI吸收性能，則步驟120至140可被重複一或多次（步 驟150)，而來施加更多的EMI吸收材料。在某些實施例中， 一耐火劑亦可被選擇來塗佈（步驟160如虛線所示）。 坪吕之，該等多孔基材概被選為具有 ___________ 5 10 的性質，即高阻塵性和低降壓性（或相反地具有高透氣性） 一指定樣本的多孔性測量值係為每線性吋的孔數。各 種多孔性基材可輕易地獲得，包括玻璃纖維墊、非織聚酯 網、及各種發泡物等。在一實施例中，步驟1〇〇所提供的多 孔基材係為一開放胞元發泡物，例如一網狀聚胺酯發泡物。 -般在電子設備巾絲過濾线制發泡基材之多孔性可 具有3PP1至2〇PPUx上。諸如人造歸發泡物亦能具有撓曲順 應及彈性的特質，而可提供“定形，，及回復其原㈣能力。但 一般而:，該多孔基材可為—市售的標準空氣渡材。 15 通㊉，在步驟110中所提供的EMI吸收溶液乃包含一或 夕種EMI吸收材料及_勒接劑。在某些實施例巾，該讀 20 吸收溶液亦包含高導電材料，譬如銅或|g。該_吸收材 =係被選成可抑制電磁能的傳輸者’其係例如可將電磁能 化成另—種能量’譬如熱能。該歷吸收材料可具有介 ^或磁性特質，或兩者的結合。某些腦吸收材料之例包 括碳、碳纖維、氧魅(Al2〇3)、藍寶石、二氧切陶、 -乳化鈦⑽2)、鐵氧體、鐵、♦化鐵、石墨、及 鎳、銅等不同成分的化合物。上述的鮮及料預 的操作溫度和壓力範圍内概呈固體。因 材料一般會被製成· ”料於射。 11 200418560 有不同的美國專利案曾揭露此等耗損材料及其用途。 例如Adkins的第4408255號，Moore等人的第5689275號，kim 等人的第5617095號，及Brown等人的第5428506號等美國專 利案，其内容併此提供參考。該等耗損材料的製造者係例 5 如R & F Prodncts of San Marcos，CA; A R C TechnicalFig. 4 is a perspective view of a modified embodiment of an EMI 20 absorption air filter combining a waveguide filter with a cut-off frequency; Figs. 5A and 5B are changes of an EMI absorption air filter forming a non-planar structure; The three-dimensional schematic diagram of the embodiment; FIG. 6 is a schematic diagram of a manufacturing method capable of producing the E MI absorption air filter of FIGS. 1 to 5; 9 FIG. 7 is another-absorptive air filtration capable of producing the second image Schematic diagram of the manufacturing method of the device; Figure 8 is a graph of the test results of the attenuation of the absorption air filter samples against frequency; ▲ Figure 9 is-a schematic diagram-a kind of measurement through-materials such as Test device for EMI absorption air transition device; and Fig. 10 shows the device of Fig. 9 used to measure the sample of the two-ray absorption air filter of the present invention compared with an untreated air filter. Graph with test results of air flow. ~ Π C Embodiment 3 Detailed Description of Preferred Embodiments Materials with electromagnetic energy absorption characteristics can be used to suppress the EMI transmission wheel in the _width frequency range. Such surface absorbing materials can provide considerable electrical shielding effects, such as up to above ground at frequencies of about 100, _MZZ. According to the present invention, the Gu-absorbing material can be made into a solution to be coated on a suitable porous substrate. In summary, the formed absorbent solution contains 3 absorbent material and an adhesive, and can be coated in a new custom air filter, or a commercially available non-EIM air filter. Please refer to FIG. 1, which shows the steps of an embodiment of a method for coating an EMI absorbent material on an air filter. In short, the porous substrate will be raised: (step 100), and _ curable _ Absorption solution will also be provided (step 11). ㈣ 'The EMI absorption solution will be coated on the porous substrate (step 120) and then any excess solution is removed (step ⑽). Deposited on The EMI absorption solution in the multi-L substrate will be cured in two steps (step _). If the EMI absorption performance greater than 200418560 is required, steps 120 to 140 may be repeated one or more times (step 150) to apply more EMI absorbing material. In some embodiments, a refractory can also be selected for coating (step 160 is shown as a dotted line). Ping Luzhi, these porous substrates are all selected to have ___________ 5 10 Properties, ie high dust resistance and low pressure drop (or conversely high air permeability)-The porosity measurement of a given sample is the number of pores per linear inch. Various porous substrates can be easily obtained, including glass Fiber mat, non-woven polyester mesh, and various foams, etc. One embodiment In step 100, the porous substrate provided is an open-cell foam, such as a reticulated polyurethane foam. Generally, the porosity of foamed substrates made of electronic equipment towel filter line may have 3PP1 to 20PPUx. Such as artificial return foam can also have the characteristics of flexibility and compliance, and can provide "setting, and restore its original ability. But generally, the porous substrate can be a commercially available standard air ferrule. 15 In general, the EMI absorbing solution provided in step 110 includes one or more EMI absorbing materials and a coupling agent. In some embodiments, the reading solution also contains a highly conductive material, such as copper or | g. The absorbing material = is selected as a transmitter capable of suppressing electromagnetic energy, which is, for example, capable of converting electromagnetic energy into another energy such as thermal energy. The calendar absorbing material may have a medium or magnetic property, or a combination of the two. Examples of certain brain-absorbent materials include carbon, carbon fiber, oxygen (Al203), sapphire, dioxycut ceramic, -emulsified titanium ⑽2), ferrite, iron, iron oxide, graphite, and nickel, copper, etc. Compounds of different composition. The freshness is expected to be solid within the expected operating temperature and pressure ranges. Because materials are generally made, they are expected to be shot. 11 200418560 Different US patents have disclosed such consumable materials and their uses. For example, Adkins No. 4408255, Moore et al. No. 5689275, kim et al. The contents of US Patent Nos. 5617095 and Brown et al. 5428506 are hereby incorporated by reference. Examples of manufacturers of such consumable materials are R & F Prodncts of San Marcos, CA; ARC Technical
Resource Inc. of San Jose, CA ； Tokin America, Inc. of Vnion City，CA; Intermark -USA· Inc· of Long Island，NY; TDK of Mount Prospect，IL ;及 Capcon of Inwood，NY·等。Resource Inc. of San Jose, CA; Tokin America, Inc. of Vnion City, CA; Intermark-USA. Inc. of Long Island, NY; TDK of Mount Prospect, IL; and Capcon of Inwood, NY.
該黏劑會將EMI吸收材料黏接於一基材，例如該多孔 10基材。在某些實施例中，該黏劑係被選成能以一致的彈性 來固化。在一實施例中，該黏劑係為一彈性物，例如樹脂 黏劑。在另一實施例中，該黏劑係為一橡膠，譬如天然膠 乳橡膠(例Stuart 1584)，一人造橡膠譬如苯乙烯丁二烯橡膠 (SBR) ’或—專賣性的黏劑。具有彈性—致性的黏劑會將該 U麵讀㈣歸於鮮孔歸，㈣許該乡孔基材保持 可撓性或柔軟。但在其它的實施例中，一黏劑係被選為會The adhesive will adhere the EMI absorbing material to a substrate, such as the porous substrate. In some embodiments, the adhesive is selected to cure with consistent elasticity. In one embodiment, the adhesive is an elastomer, such as a resin adhesive. In another embodiment, the adhesive is a rubber, such as a natural latex rubber (e.g., Stuart 1584), an elastomer such as styrene butadiene rubber (SBR), or a proprietary adhesive. The elastic-adhesive adhesive will read the U surface as fresh holes, allowing the pore hole substrate to remain flexible or soft. But in other embodiments, an adhesive system is selected as the
以較低的彈性或甚至剛性—致性來固化。一剛性固化黏二 之例係如環氧樹脂。 ^ 20 該塗佈步驟(120)會將該EMI吸收溶液施加於該多孔武 材。在-實施射，料絲材會被浸潰料_吸收^ 液的泡槽中。在另-實施例中，該_吸收溶液會如—、、炎 料而被明子、滾輪或噴佈^來㈣於該基材上。= 實施例中，該EMI吸收溶液會如墨 該溶液的配佈器來施加於該多孔基材上 汁而被一或多個裝有 通常，該EMI^ 12 收溶液可被任意地施加於該多孔基材，因為過多的溶液嗣 會被除掉。 除掉過多的刪吸收溶液（步助0)主要係為確使被施 加EMI吸收溶液之基材的毛孔能保持開放，以確保該基材 5仍有作為空氣濾$的功能。在_實施例中，該過多讀吸 收> 谷液的去除係藉軋榨或壓縮受處理過的基材而來完成。 例如，已處理的基材可被拉經一滾輪，例如一設在二相對 同狀滾輪之間者，或-相對於一剛性平面或平板的單一筒 狀滾輪。在另外的實施例中，除掉過多的麵吸收溶液係 W強迫或抽引空氣穿過所處理的多孔基材而來完成。該空氣 可藉在該基材的第一表面處施以一正壓而被強迫穿過該已 處理的基材。或者，亦可在該基材的一面上形成真空而使 空氣被抽過該基材。該等過多EMI吸收溶液之去除亦可組 合上述之方法來完成。 15 该固化步驟（140)係使被塗佈完成的EMI吸收材料和黏 劑能夠定形。在某些實施例中，處理完成的基材可在室溫 環境下被空氣固化。於其它實施例中，該基材則在較高溫 度例如爐中來被固化。 在某些實施例中，一耐火劑譬如磷酸鹽或三氧化二録 20等，亦可被選擇地塗佈於該基材（步驟160)來滿足嚴格的可 燃性標準。一種該等可燃性標準係詳述於保險業實驗室標 準94的UL 94 V0之垂直燃燒測試，其名稱為“供用於裝置與 用具之零件的塑膠材料之可燃性測試，，第5版，19%年，其 内容併此附送參考。在某些實施例中，一耐火劑會被以如 13 200418560 同前述塗佈EMI吸收溶液的方法（步驟1〇〇至14〇)來施加。在 其它的實施例中，附加的處理物例如殺黴菌劑亦會被同樣 地塗佈。 現請爹閱第2A圖，乃不出一自由仔立之扁平狀EM][吸 5收式空氣濾态200的立體圖。概言之，該平面濾器2〇〇會形 成一任意造型的截面21〇(例如一矩形），而具有一預定厚度 205。該厚度205沒有特別的限制，但一般之值係約由〇1吋 至0.5叶或更多。δ亥截面210的尺寸概由用途來決定，典型 會比其所固定之空氣通孔更大一些。第2]6圖示出一框裝構 10件的立體圖，其包含一扁平的£μι吸收式空氣濾器200 被裝在一框210中。該框210具有剛性並包含能將該框裝濾 窃208固δ又於一 δ又備之叙體（未示出）的結構。例如，該框21〇 可包含安裝孔212等能供固聚物***以將該濾器2〇8固裝於 該設備殼體上。 15 如上所述，該ΕΜΙ吸收材料一般在較高頻率（例高於 1GHz以上）會最有效。但在某些實施例中，尤其是該空氣濾 器的截面較大時(例如大於l〇cm)，則該EMI吸收濾器2〇〇能 有利地與一低頻EMI消減裝置來組合。第3圖即為一組合式 EMI二氣濾态的立體圖。該組合濾器3〇〇包含一如上所述的 20 收式空氣濾器2〇〇，以及一導電層31〇。該導電層31〇 係為一電導體，譬如鋁或銅，而具有孔陣可供空氣流過· 該導電層310可由一硬板或一屏幕來製成。在某些實施例 中，該導電層可包括一塗佈於該濾器2〇〇的導電塗層。這導 電塗層通常是由一高導電性材料來構成，例如鋼、鋁或金。 14 200418560 該導電塗料得被製成如漆料或墨汁，而藉浸潰、塗刷或噴 洒來施加於該濾器細。或者，該導電塗料亦能被製成微粒 而在一濺鍍製程中來塗佈於該濾器2〇〇上。 該組合式空氣濾器300亦可選擇性地安裝在一框21〇中 5 (該框係被示為有部份切除）。該框210可提供剛性，並有助 於由该導電層300形成確實的電接地於該設備的殼體。該框 210本身係可導電，而在該導電層31〇和一設備殼體之間形 成電連接。或者，該框亦可為非導電性，而可將該導電層 310壓抵於底盤來形成電連接。通常。該框21〇會包含固緊 10裝置320，例如機械固緊物(如螺絲、鉚釘等）。 請參閱第4圖，乃示出一組合式emI濾器400的變化實 施例。該濾器400的立體圖係示出一EMI吸收式空氣濾器 200組合一低於截止頻率的波導層405。該波導層405係由電 導體如鋁或銅所製成，並包含一陣列的孔隙41〇(即波導）等 15 遍佈该濾杰的表面區域。該各孔隙410可為任意形狀。譬如 矩形（如圖所示）、圖形、六角形等。各孔隙41〇會優先地衰 減一預定之“截止，，頻率以下的電磁輻射，該截止頻率可由 孔隙410的尺寸來控制。該波導層405的孔隙410可容空氣流 至該EMI吸收空氣過濾層200。因該EMI吸收層200會衰減較 2〇 高的頻率，故所形成的組合式EMI濾器400會比單獨的各層 200或405消減更大頻率範圍的EMI。 一般而言，該EMI吸收式空氣濾器能被製成任何所需 的形式。弟5A和5B圖係不出非爲平狀的實施例，其中被塗 佈EMI吸收溶液的多孔基材係呈板狀500及管狀510。 15 200418560 第6圖示出一用來製造該EMI吸收式空氣濾器之“浸潰，， 製法的實施例。一容器600，例如一槽，會容裝一EMI吸收 溶液610。嗣一多孔基材2〇〇會被浸入該溶液610中，而使該 溶液610能完全覆蓋並滲入該基材2〇〇内。該基材2〇〇嗣會被 5由該溶液610拉經一絞乾器620。該絞乾器620係被示出為雙 筒狀滾輪組，其會以預定量來壓縮該基材2〇〇，俾除掉過多 的溶液610，並確使溶液61〇能被迫入該基材2〇〇的内部。 第7圖係示出另一用來製造該emI吸收式空氣濾器2〇〇 之“噴洒”製法的實施例。一或多個喷佈器7〇〇,、700，，(概稱 10為7〇〇)會將該EMI吸收溶液71〇喷洒在該多孔基材2〇〇上。通 苇，δ亥領域中之專業人士所知的任何類型之噴佈器7⑽皆可 被使用（例如氣壓式、機械式、噴霧式等）。該等喷佈器7〇〇 會喷佈一充足的ΕΜΙ吸收溶液710塗層來完全地覆蓋並滲 入a亥多孔基材200。該基材200嗣會被拉經一絞乾裝置例如 15雙筒狀滾輪組730。該絞乾裝置730會以預定量來壓縮該基 材200,而除掉過多的溶液720,以及確使該溶液71〇能被迫 入該基材200内部。 第8圖係示出一 Ε ΜI吸收式空氣濾器樣本之Ε Μ〗性能的 測試結果。該空氣濾器測試樣本係將一彈性物黏劑中的碳 20基吸收物塗佈於一開放胞元網狀聚胺酯發泡物平面基材所 製成者。該樣本基材係被製成一〇·25吋厚的薄片，而具有 大約20ppi的孔隙率。該樣本會如前所述而以雙重碳塗層和 耐火劑來處理。在由約2.0〇^2至18.(^112頻率範圍内之電磁 傳輸損耗會遍及該慮器來測量。該樣本的測試結果證明在 16 200418560 約4GHz以上的頻率可測得大於20分貝（dB)的衰減。 由於該EMI吸收式空氣濾器亦必須有過濾空氣的功 能，故其在被以EMI吸收材料及選擇的其它塗層例如耐火 劑等來處理之後，仍可容許充分的空氣流過乃是很重要 5 的。該空氣濾器的空氣流通性能之一種測試法係壓力減降 相對於空氣流量的比值。一可供測量空氣流通性能之測試 裝置例，以及所測得結果等之說明，乃併此提供作為一附 件。整體而言，因塗佈一或多數覆層導致其空氣流量的減 少，會被控制於不大於一預定量之空氣流量減量（例如，相 10 同空氣流量的壓力減降差異不大於10%)。 藉由所示之各較佳實施例，專業人士將可瞭解本發明 之精神及請求範圍内的許多修正變化仍可被實施。因此本 發明僅以包含所有修正變化及等效實施的申請專利範圍來 界定。 15 附件 目的 本測試係在比較無屏蔽性空氣過濾材料與經吸收處理 之空氣過濾材料的空氣流動特性。 樣件說明 20 一“基準”空氣過濾材料係代表一舉例的電子設備之污 物及灰塵濾材。此基準濾材係由約20ppi的開放胞元組織聚 胺酯發泡物所構成，其厚度為0.25吋。 一第一樣本標示為“T-15”乃代表一EMI吸收式空氣濾 材，其具有雙重碳塗層及一耐火劑處理。該T-15樣本係使 17 200418560 用約15ppi的開放胞元聚胺酯發泡物所製成，其厚度為0·25 口寸。 一第二樣本標示為“Τ-20”係代表一ΕΜΙ吸收式空氣滤 材，其具有雙重碳塗層及一耐火劑處理。該Τ-20樣本係使 5 用約20ppi的開放胞元聚胺酯發泡物所製成，其厚度為0.25 口寸0 測試方法 氣流測試會依據 American Society for Testing andCured with lower elasticity or even rigidity. An example of a rigid curing adhesive is epoxy resin. ^ 20 The coating step (120) applies the EMI absorbing solution to the porous material. In the-implementation of the shot, the material wire will be immersed in the bubble tank. In another embodiment, the absorbing solution is scoured on the substrate by a lens, a roller, or a spray cloth such as-,-, or -flammable. = In the embodiment, the EMI absorbing solution will be applied to the porous substrate as a dispenser of the solution to be filled with juice or one or more. Generally, the EMI ^ 12 solution can be arbitrarily applied to the Porous substrate, because too much solution will be removed. The removal of the excess absorption solution (Step 0) is mainly to ensure that the pores of the substrate to which the EMI absorption solution is applied can be kept open to ensure that the substrate 5 still functions as an air filter. In the embodiment, the excessive reading absorption > removal of the grain liquid is accomplished by rolling or compressing the treated substrate. For example, the processed substrate may be drawn through a roller, such as one disposed between two oppositely shaped rollers, or a single cylindrical roller relative to a rigid flat or flat plate. In another embodiment, removing too much of the surface-absorbing solution is accomplished by forcing or drawing air through the porous substrate being treated. The air can be forced through the treated substrate by applying a positive pressure at the first surface of the substrate. Alternatively, a vacuum may be formed on one side of the substrate to allow air to be drawn through the substrate. The removal of these excessive EMI absorbing solutions can also be accomplished in combination with the methods described above. 15 This curing step (140) enables the coated EMI absorbing material and adhesive to be shaped. In some embodiments, the processed substrate may be air-cured at room temperature. In other embodiments, the substrate is cured at a higher temperature, such as in an oven. In some embodiments, a refractory such as phosphate or trioxide 20 can also be selectively applied to the substrate (step 160) to meet strict flammability standards. One such flammability standard is a vertical combustion test detailed in UL 94 V0 of the Insurance Industry Standard 94, entitled "Flammability Test of Plastic Materials for Parts Used in Devices and Appliances," 5th Edition, 19 % Year, its content is hereby incorporated by reference. In some embodiments, a refractory will be applied in the same manner as described in 13 200418560 (approximately steps 100 to 14). In the embodiment, additional treatments such as fungicides will also be coated in the same way. Now please read Figure 2A, but there is no free-standing flat EM] [Suck 5 retractable air filter 200 Three-dimensional view. In summary, the plane filter 200 will form a cross section 21 (such as a rectangle) of any shape, and has a predetermined thickness 205. The thickness 205 is not particularly limited, but the general value is about 0. 1 inch to 0.5 leaves or more. The size of the δH section 210 is determined by the application, and is typically larger than the air through hole it fixes. Section 2] 6 shows a perspective view of 10 pieces of frame structure , Which contains a flat £ μm absorption air filter 200 mounted in A frame 210. The frame 210 is rigid and includes a structure capable of fixing the frame 208 to a δ and a narrative (not shown). For example, the frame 21 may include a mounting hole 212 It is possible for solid polymer to be inserted to fix the filter 20 to the device housing. 15 As mentioned above, the EMI absorbing material is generally most effective at higher frequencies (for example, above 1 GHz). In some embodiments, especially when the cross section of the air filter is large (for example, greater than 10 cm), the EMI absorption filter 200 can be advantageously combined with a low-frequency EMI reduction device. Figure 3 is a A perspective view of the combined EMI two-air filter state. The combined filter 300 includes a 20-retractable air filter 2000 as described above, and a conductive layer 31. The conductive layer 31 is an electrical conductor, such as Aluminum or copper, but with a hole array for air to flow through. The conductive layer 310 may be made of a hard plate or a screen. In some embodiments, the conductive layer may include a coating on the filter 200. Conductive coating. This conductive coating is usually made of a highly conductive material, such as steel, aluminum or 14 200418560 The conductive paint must be made into paint or ink, which can be applied to the filter by dipping, brushing or spraying. Alternatively, the conductive paint can also be made into particulates in a sputtering process. Zhonglai is coated on the filter 200. The combined air filter 300 can also be optionally installed in a frame 21 and 5 (the frame is shown as partially cut off). The frame 210 can provide rigidity And helps to form a solid electrical ground to the device's casing from the conductive layer 300. The frame 210 itself is conductive and forms an electrical connection between the conductive layer 31 and a device casing. Or, The frame may also be non-conductive, and the conductive layer 310 may be pressed against the chassis to form an electrical connection. usually. The frame 21 may include a fastening device 320, such as a mechanical fastening (such as a screw, a rivet, etc.). Please refer to FIG. 4, which shows a modified embodiment of the combined emI filter 400. The perspective view of the filter 400 shows an EMI absorption air filter 200 combined with a waveguide layer 405 below the cutoff frequency. The waveguide layer 405 is made of an electrical conductor such as aluminum or copper, and contains an array of pores 41 (i.e., a waveguide) 15 throughout the surface area of the filter. Each of the pores 410 may have any shape. Such as rectangles (as shown), graphics, hexagons, etc. Each aperture 410 will preferentially attenuate a predetermined "cut-off, below the frequency of electromagnetic radiation, the cut-off frequency can be controlled by the size of the aperture 410. The aperture 410 of the waveguide layer 405 can allow air to flow to the EMI-absorbing air filter layer 200. Since the EMI absorption layer 200 will attenuate frequencies higher than 20, the combined EMI filter 400 will reduce EMI in a larger frequency range than the individual layers 200 or 405. Generally speaking, the EMI absorption The air filter can be made into any desired form. Figures 5A and 5B do not show a non-flat embodiment. The porous substrate coated with the EMI absorption solution has a plate shape 500 and a tube shape 510. 15 200418560 Fig. 6 shows an embodiment of a "impregnation" method for manufacturing the EMI absorption air filter. A container 600, such as a tank, will contain an EMI absorbing solution 610. A porous substrate 200 is immersed in the solution 610, so that the solution 610 can completely cover and penetrate into the substrate 200. The substrate 200 is pulled by the solution 610 through a twist dryer 620. The twister 620 is shown as a double-cylinder roller set, which will compress the substrate 200 by a predetermined amount, remove excess solution 610, and ensure that solution 61 can be forced into the substrate. The interior of the material 200. FIG. 7 shows another embodiment of a “spraying” method for manufacturing the emI absorption air filter 2000. One or more sprayers 700, 700, (collectively 10 is 700) will spray the EMI absorbing solution 710 on the porous substrate 2000. Through the reed, any type of sprayer 7⑽ known to those skilled in the field can be used (for example, pneumatic, mechanical, spray, etc.). The sprayers 700 will spray a sufficient coating of EMI absorbing solution 710 to completely cover and penetrate the porous substrate 200. The substrate 200 嗣 is drawn through a stranding device such as 15 double-cylinder roller sets 730. The wringing device 730 compresses the substrate 200 by a predetermined amount, removes an excessive amount of the solution 720, and ensures that the solution 710 can be forced into the substrate 200. Figure 8 shows the test results of the EM performance of an EM absorption air filter sample. The air filter test sample was made by coating a carbon 20-based absorbent in an elastomer adhesive on an open cell mesh polyurethane foam planar substrate. The sample substrate was made into a 0.25 inch thick sheet and had a porosity of about 20 ppi. The sample was treated with a dual carbon coating and refractory as previously described. The electromagnetic transmission loss in the frequency range from about 2.00 ^ 2 to 18. (^ 112 will be measured throughout the filter. The test results of this sample prove that at 16 200418560, frequencies above 4GHz can be measured greater than 20 decibels (dB Since the EMI absorption air filter must also have the function of filtering air, it can still allow sufficient air to flow through it after being treated with EMI absorbing materials and other selected coatings such as refractory. It is important5. A test method for the air flow performance of the air filter is the ratio of pressure drop to air flow rate. An example of a test device that can be used to measure air flow performance, and a description of the measured results, etc. It is provided as an accessory. In general, the decrease in air flow caused by applying one or more coatings will be controlled to an air flow reduction of not more than a predetermined amount (for example, a pressure reduction of 10 at the same air flow) The difference is not more than 10%.) With the preferred embodiments shown, professionals will understand that many modifications and changes within the spirit and scope of the present invention can still be implemented. Therefore The invention is only defined by the scope of the patent application that includes all amendments and equivalent implementations. 15 Attachment Purpose This test is to compare the air flow characteristics of the unshielded air filter material and the air filter material after absorption treatment. Sample description 20 a The "reference" air filter material represents an example of dirt and dust filter material for electronic equipment. This reference filter material is composed of about 20 ppi of open cell tissue polyurethane foam, and its thickness is 0.25 inches. A first sample Labeled "T-15" represents an EMI absorbing air filter material with a double carbon coating and a refractory treatment. The T-15 sample was made by using 2004 2004560 with an open cell polyurethane foam of about 15 ppi It has a thickness of 0 · 25 inches. A second sample labeled "T-20" represents an EMI absorption air filter material, which has a dual carbon coating and a refractory treatment. The T-20 sample is Made of 5 with an open cell polyurethane foam of about 20ppi, with a thickness of 0.25 inch. 0 Test method The airflow test will be based on the American Society for Testing and
Materials Annual Book of A S T M Standards 中所述的可透 l〇氣度標準ASTMD737來進行。該測試裝置係被示於第9圖， 其包含一“6x6”薄片金屬管900，兩端皆設有金屬凸緣(未示 出）。該管的第一端902係使用適當的固定物和密封劑封抵 一加壓腔室910的開口。受測試的EMI吸收式空氣濾材樣本 係被固接於該管900的第二端912，並被密封以防止由側邊 15 沒漏。一壓力帶920會距第二端912 18吋的距離來設在該管 900上。一加壓腔室出口 930會經由一系列的閥950及一氣流 計量裴置來連接於一離心式鼓風器（真空泵)940的抽吸側。 才父準操作會被用來測量該等測試參數。 測試結果 20 — 弟10圖示出該二吸收處理的發泡物（T*15、T-20)相較 :未處理之基準發泡濾材的性能測試數據圖表。該圖表的 縱轴代表“靜壓力，，（以吋水為單位），而橫軸代表“空氣流 置’’(以每平方吋孔板每分鐘立方呎來測計，即CFM/in2)。該 未處理的基準發泡物與二受處理發泡物樣本的測試結果乃 18 200418560 如圖所示。該測試結果證明全部三個樣本的靜壓力皆會隨 著空氣流量的增加而提高。此靜壓力的逐升係因測試料片 對氣流所產生之阻力所致。 結論 5 其結果顯示實際上在未受處理的基準濾材發泡和R-20 吸收濾材發泡物之間幾無差別。而如所預測，該T-15吸收 濾材發泡物會比該基準及R-20樣本呈現更大的空氣流量。 此係由於其胞元結構具有15ppi而相較於其它二測試樣本 的20ppi更為開放之故。該數據顯示R-20樣本的空氣流量特 10 性係類似於基準樣本，雖亦能提供EMI吸收性。 【圖式簡單說明3 第1圖為一 EMI吸收式空氣過濾器之製造方法實施例 的流程圖， 第2A及2B圖分別為一佇立之EMI吸收式空氣過濾器與 15 一框裝之EMI吸收式空氣過濾器的立體示意圖； 第3圖為一組合一導電層之EMI吸收式空氣過濾器的 變化實施例之立體示意圖； 第4圖為一組合一低於截止頻率之波導濾波器的EMI 吸收式空氣過濾器之變化實施例的立體示意圖； 20 第5A與5B圖為形成非平面結構之EMI吸收式空氣過濾 器的變化實施例之立體示意圖； 第6圖為一能夠生產第1至5圖之EMI吸收式空氣過濾 器的製造方法之示意圖； 第7圖為另一能夠生產第1至5圖之EMI吸收式空氣過 19 200418560 滤*裔的製造方法之不意圖， 第8圖為一EMI吸收式空氣過濾器樣本進行衰減對頻 率之測試結果的圖表， 第9圖為一示意圖示出一種能夠測量穿過一材料例如 5 該EMI吸收式空氣過濾器的測試裝置；及 第10圖為使用第9圖之裝置來測量本發明之二EMI吸 收式空氣過濾器樣本相較於一未受處理之空氣過濾器，針 對壓力減降與空氣流量的測試結果之圖表。 【圖式之主要元件代表符號表】 100〜160···各步驟 600…容器 200···ΕΜΙ吸收式空氣濾器 610,710···ΕΜΙ 吸收溶液 205…厚度 620/730···絞乾器 208···框裝構件 700…喷佈器 210…截面 720···過多的溶液 210···框 900…管 212…安裝孔 902…第一端 300,400…組合濾器 910···加壓腔室 310···導電層 912…第二端 320…固緊裝置 920…壓力帶 405···波導層 930···出口 410…孔隙 940…真空泵 500,510…多孔基材 950…閥Permeable 10-gas standard ASTM D737 described in Materials Annual Book of AS T M Standards. The test device is shown in Figure 9 and includes a "6x6" sheet metal tube 900 with metal flanges (not shown) at both ends. The first end 902 of the tube is sealed against the opening of a pressurized chamber 910 with a suitable fixture and sealant. The tested EMI absorption air filter sample was fixed to the second end 912 of the tube 900 and sealed to prevent leakage from the side 15. A pressure band 920 is placed on the tube 900 at a distance of 18 inches from the second end 912. A pressurized chamber outlet 930 is connected to the suction side of a centrifugal blower (vacuum pump) 940 via a series of valves 950 and an air flow metering device. The quasi-quasi operation will be used to measure these test parameters. Test result 20 — Figure 10 shows the performance test data chart of the double-absorbing foam (T * 15, T-20) compared to the untreated reference foam filter. The vertical axis of the graph represents "static pressure," (in inches of water), and the horizontal axis represents "air flow position" (measured in cubic feet per minute per square inch of orifice plate, CFM / in2). The test results of the untreated reference foam and two treated foam samples are shown in Figure 18 200418560. The test results demonstrate that the static pressure of all three samples increases with increasing air flow. This increase in static pressure is due to the resistance of the test piece to the air flow. Conclusion 5 The results show that there is virtually no difference between the untreated baseline filter foam and the R-20 absorbent filter foam. As predicted, the T-15 absorption filter foam will exhibit a greater air flow than the benchmark and R-20 samples. This line is more open than the 20 ppi of the other two test samples due to its cell structure of 15 ppi. This data shows that the air flow characteristics of the R-20 sample are similar to the reference sample, although they also provide EMI absorption. [Schematic description 3 Figure 1 is a flowchart of an embodiment of a manufacturing method of an EMI absorption air filter, and Figures 2A and 2B are a stand-alone EMI absorption air filter and 15 frame-mounted EMI absorption. 3 is a perspective view of a modified embodiment of an EMI absorption air filter combined with a conductive layer; FIG. 4 is a EMI absorption combined with a waveguide filter below the cutoff frequency 3D schematic diagram of a modified embodiment of an air filter; 20 Figures 5A and 5B are schematic diagrams of a modified embodiment of an EMI absorption air filter forming a non-planar structure; Figure 6 is a diagram capable of producing Figures 1 to 5 Schematic diagram of the manufacturing method of the EMI absorption air filter; Figure 7 is another intention to manufacture the EMI absorption air filter 19 200418560 of Figures 1 to 5, and Figure 8 is an EMI A graph of the test results of attenuation of an absorption air filter against frequency. Figure 9 is a schematic diagram showing a test device capable of measuring the penetration of a material such as 5 the EMI absorption air filter. And FIG. 10 is a graph showing the test results of pressure drop and air flow of the EMI absorption air filter sample of the present invention using the device of FIG. 9 compared to an untreated air filter. [Representative symbols for the main components of the diagram] 100 ~ 160 ... 600 in each step ... Vessel 200 ... EMI absorption air filter 610, 710 ... EMI absorption solution 205 ... Thickness 620/730 ... Strand dryer 208 ··· Framed member 700 ... Sprayer 210 ... Cross section 720 ... Excess solution 210 ... Frame 900 ... Tube 212 ... Mounting hole 902 ... First end 300, 400 ... Combined filter 910 ... Pressure chamber 310 ... conductive layer 912 ... second end 320 ... fastening device 920 ... pressure band 405 ... waveguide layer 930 ... outlet 410 ... void 940 ... vacuum pump 500, 510 ... porous substrate 950 ... valve