TW200914574A - Electrically conductive adhesive tape and method for preparing the same - Google Patents

Electrically conductive adhesive tape and method for preparing the same Download PDF

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Publication number
TW200914574A
TW200914574A TW097132028A TW97132028A TW200914574A TW 200914574 A TW200914574 A TW 200914574A TW 097132028 A TW097132028 A TW 097132028A TW 97132028 A TW97132028 A TW 97132028A TW 200914574 A TW200914574 A TW 200914574A
Authority
TW
Taiwan
Prior art keywords
electrically conductive
elastic support
mesh
layer
tape
Prior art date
Application number
TW097132028A
Other languages
Chinese (zh)
Inventor
Jin-Ho Song
Original Assignee
Nano Interface Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nano Interface Technology filed Critical Nano Interface Technology
Publication of TW200914574A publication Critical patent/TW200914574A/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
    • C09J2400/10Presence of inorganic materials
    • C09J2400/16Metal
    • C09J2400/163Metal in the substrate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
    • C09J2400/20Presence of organic materials
    • C09J2400/26Presence of textile or fabric
    • C09J2400/263Presence of textile or fabric in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Disclosed is an electrically conductive adhesive tape including: a mesh type elastic support layer having open spaces; an electrically conductive layer laminated one surface of the mesh type elastic support layer; and a conductive adhesive layer disposed on other surface of the mesh type elastic support layer, and a method of preparing the same. In the disclosed adhesive tape including the mesh type elastic support layer having an electrically conductive layer laminated on one surface thereof, and a conductive adhesive layer disposed on the other surface thereof can be used to shield or absorb an electromagnetic wave occurring from an electronic device because through open spaces of the mesh type elastic support layer, the electrically conductive layer comes in contact with the conductive adhesive layer, thereby electrically connecting one surface of the adhesive tape to the other surface.

Description

200914574 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種可用於吸收或屏蔽電 膠帶及其製備方法。 反之W式 5 10 15 【先前技術】 隨著科技發展,各種電子通信裝置快速地增加 現代設備提供人類生活極大的便利二 :電=各種產生自電子通信設備的傷害 落造:,如:發生故障、性能低 口诼刼知、哥命減損、品質劣化等。 磁、^1屏心成這些問題的電磁波,最近發展出各種電 磁波屏蔽物質。 叫分裡电 例如:塗佈電導麼敏膠至由金、銀、紹 成之今屬辣场4製 、* 片之%磁波屏蔽膠帶。然而,製備此+ 蔽膠帶或將電磁波屏蔽#*…“磁波屏 產生於① 電η置時,很難處理 張性導致之彈杻πσ 口生屬的低拉 復成其原來之狀Γ,經過壓縮之電磁波屏蔽勝帶無法恢 有所限制。〜因此’電磁波屏蔽膠帶在使用範圍上 係利等;=-:電磁波屏蔽膠帶,其 之金屬薄臈於—方式形成—金H、鎳、錫等 上,並塗佈—孰—布(conductive fabric)或不織布的表面 “、'融膠或壓敏膠來製備。 20 200914574 -磁::,上述包括一形成於導電布等表面之金屬薄膜之 电磁波屏蔽膠帶具有一表面電阻(平均h/ 、十叼马0.04 ohm/sq)尚 田4膜之電磁波屏蔽膠帶(平均為〇 〇i〇hm/叫), 因此導致電磁波屏蔽效能低下。 ίο 包括導電布等的電磁波屏蔽膠帶,有著因低電 U及在^、高濕Η速氧化導致1磁波屏蔽效 ==題。此外,更由於織品之紗線間的微小空間與 ΙΐΓ的微小空間會增加電阻,於是更減低了電磁波 雪::。2者’灰塵或濕氣吸附於微小空間亦成為-干擾 ”、皮并蔽之元素,致使無法有效屏蔽電磁波,導致 裝置發生故障。 薄 等 b外虽此電磁波屏蔽膠帶用作襯墊時,微導電纖維 ❷可能會於裁剪過程中自膠帶分離,可能會污染圯晶片 ’而減損電子裝置之性能。 15 【發明内容】 | 技術問題 為了解決上述問題,本發明試著發展一種可用於小尺 寸精、,田電子义置之向品質電磁波屏蔽材質,此材質具有較 薄之厚度卻具有兩電磁波屏蔽/吸收特性與高彈性。 因此,本發明之發明人發現,利用含有屏蔽篩網眼織 物(SCre=meshfabric)之膠帶可有效屏蔽或吸收電磁波,其 中該屏敝篩網眼織物係具有層壓於其一表面之電導材質 (可屏蔽或吸收電磁波),以及—黏著於另一表面之導電 200914574 膠,上述由於穿過屏蔽筛網眼織物之筛孔部分, 電黏著劑會愈雷導·;暫士Β & 導 材貝相接觸’因此可電性連接膠帶之— 表面至另一表面。 本發明係基於此發現。 5 技術解決辦法200914574 VI. Description of the Invention: [Technical Field] The present invention relates to an electrical tape which can be used for absorbing or shielding and a preparation method thereof. On the contrary, W type 5 10 15 [Prior Art] With the development of science and technology, various electronic communication devices rapidly increase the convenience of modern equipment to provide human life. Two: electricity = various damages generated from electronic communication equipment: such as: failure , low performance, knowing, loss of life, quality deterioration, etc. Magnetic waves, which are the electromagnetic waves of these problems, have recently developed various electromagnetic wave shielding materials. For example, the coating of the conductivity of the sensitizing glue to the gold, silver, and Shaocheng is now the hot field 4 system, * piece of magnetic wave shielding tape. However, when preparing this + masking tape or shielding the electromagnetic wave #*... "The magnetic wave screen is generated by 1 electric η, it is difficult to deal with the elastic 杻 σ σ 口 口 口 口 口 口 口 口 口 口 口 口Compressed electromagnetic wave shielding can not be limited. ~ So 'electromagnetic shielding tape is used in the scope of use; =-: electromagnetic shielding tape, the metal is thinner than - way to form - gold H, nickel, tin, etc. Top, and coated - conductive fabric or non-woven surface "," melt or pressure sensitive adhesive to prepare. 20 200914574 -Magnetic:: The electromagnetic wave shielding tape comprising a metal film formed on a surface of a conductive cloth or the like has an electromagnetic wave shielding tape of an average surface resistance (mean h/, 叼马0.04 ohm/sq) For 〇〇i〇hm/calling), the electromagnetic shielding effectiveness is low. Ίο Electromagnetic wave shielding tape including conductive cloth, etc., has a magnetic shielding effect due to low electric U and high humidity and idling oxidation. In addition, the tiny space between the yarns of the fabric and the tiny space of the enamel increase the resistance, thus reducing the electromagnetic wave::. In the case of two people, 'dust or moisture is adsorbed in a small space, and it becomes an interference, and the element of the skin is concealed, so that the electromagnetic wave cannot be effectively shielded, causing malfunction of the device. When the electromagnetic wave shielding tape is used as a gasket, Conductive fiber bundles may separate from the tape during the cutting process, which may contaminate the wafers' and detract from the performance of the electronic device. 15 [Invention] [Technical Problem] In order to solve the above problems, the present invention attempts to develop a small size fine , the electronic electronically placed to the quality electromagnetic wave shielding material, this material has a thin thickness but has two electromagnetic wave shielding / absorption characteristics and high elasticity. Therefore, the inventors of the present invention found that the use of shielding mesh fabric (SCre The tape of =meshfabric) can effectively shield or absorb electromagnetic waves. The screen mesh fabric has a conductive material laminated on one surface (which can shield or absorb electromagnetic waves), and a conductive 200914574 glue adhered to the other surface. The above-mentioned electro-adhesive agent will be more radiant due to the portion of the mesh passing through the screen of the screen mesh; The material is in contact with each other' so that the surface of the tape can be electrically connected to the other surface. The present invention is based on this finding.

10 根據本發明之一實施態樣,係提供一種電導式膠帶, 包括:具有開放空間之篩孔型彈性支撐層;電導声 厂堅於筛孔型彈性支撐狀—表面上;以及—導_著層: 係配置於篩孔型彈性支撐層之另一表面上。 &quot;根據本發明之另一實施態樣’係提供一種製備電導式 膠帶之方法,此方法包括步驟:形成具有開放空間之篩孔 型彈性支撐層;層壓一電導層於篩孔型彈性支撐層之一表 面,以及塗佈導電黏著劑於篩孔型彈性支樓層之另一表面 以形成導電黏著層。 15 【實施方式】 以下,將詳細論述本發明。 本發明中,「開放空間」一詞指的是往上/往下穿透 整個表面的未佔用空間,如篩孔型織品之篩孔、或彈性聚 20 合物薄片之通孔等。 圖1根據本發明之一實施例顯示電磁波屏蔽板之例 子。如圖1所示之電導式膠帶,其篩孔型彈性支撐層丨具有 電‘層2層壓於其一表面上,以及導電黏著層3配置於其另 —表面上。 200914574 *根據本發明之電導式膠帶,導電黏著層3與電導層⑽ =孔型彈性支撐層1之開放空間相接觸,因此可電性連接 膠可之纟面至另一表面。因此,本發明之電導式膠帶可 屏蔽或吸收電子裝置所產生之電磁波。 5 10 15 ★本發明之電導式膠帶’係包括一可自衝擊或震動中保 又電子裝置之篩孔型彈性支撐層i。如篩孔型織品,可用來 料此處之篩孔型彈性支。本發明所使狀篩孔型織 不又限制,、要s亥篩孔型織品是利用紗線,以類似一個 網狀’鬆散編織而成之織品皆可,也就是說,利用交錯經 緯紗線以-預定間隔形成篩孔之編織織品皆可。此紗線之 例子包括:由天_維,如棉、羊毛、麻等編成之纺紗; 由天然纖維,如絲’所製成之細線紗;以及由搓捻人造纖 ,准如·尼龍、聚乙烯、聚酯、聚氨醋等編成之單細線炒 或複細線紗。根據本發明之實施例’ 一利用於經緯方向將 «細紗線交錯編織而成之篩孔型織品,可用來做 型彈性支撐層。 如此篩孔型織品具有筛孔形成於其中’在此,筛孔之 比例無特殊之限制。然而,根據本發明之實施例 Η)〜酬孔W之比例形成筛孔。相應土也,相對於整個表 面積而吕’彈性支撐層阿包括約1〇〜8〇%之開放空間,且 通過此開放空間’導電黏著層3與電導層2相接觸,因此可 電性連接膠帶之一表面至另一表面。 除了篩孔型織品外,該篩孔型彈性支撐I亦可使用一 具有以一預定間隔形成通孔於其中之聚合物薄片。本發明 20 200914574 所使用之聚合物薄片無限制,只要此聚合物薄片是由可保 護電子裝置免於衝擊或震動之彈性材料所製成皆可。此聚 合物薄片之例子包括:聚乙稀基樹脂(polyethylene-based resin)、聚丙稀基樹脂(polypropylene-based resin)、聚氯乙 5 浠基樹脂(polyvinyl chloride-based resin)、聚偏二氯乙稀基 樹脂(polyvinylidene chloride-based resin)、聚苯乙稀基樹脂 (polystyrene-based resin)、聚酉旨基柏子月旨(polyester-based resin)、聚丙稀酸樹脂(polyacrylic resin)、苯乙婶-丙稀腈共 聚物(styrene-acrylonitrile (SAN) copolymer)、乙烯-乙烯醇 10 共聚物(ethylene-vinyl alcohol copolymer, EVA樹脂)、丙稀 腈-丁二稀-苯乙烯樹脂(acrylonitrile-butadiene-styrene (ABS) resin)、聚氨酷基樹脂(polyurethane-based resin)、氣 樹脂(fluoro resin)、石夕基樹脂(silicon-based resin),但本發 明並不僅限於此。 15 由上述聚合物樹脂所製成之聚合物薄片可包括以一預 定間隔形成通孔之開放空間。較佳以1〜1 〇〇孔/cm2之比例 丨形成通孔,以此方法,由聚合物樹脂製成之聚合物薄片包 括之開放空間,相對於整體表面積而言約為10〜80%。而 且,每一通孔之直徑亦無特殊限制,但較佳範圍約為0.1〜5 20 mm。每一通孔與其鄰近通孔形成約30〜90°之角度。通孔 通常具有圓形、三角形、或正方形等形狀,無特殊之限制。 篩孔型彈性支撐層之厚度可依膠帶所應用處做調整, 以保護電子裝置或電子元件免於衝擊或震動。例如:在大 尺寸電子裝置,如筆記型電腦中,較佳使用較厚之彈性支 200914574 樓層;以及在小尺寸電子裝置,如手機令,較佳使用 之弹性支撐層。根據本發明之實施例,_孔型彈性支撐声 之厚度可約為〇.〇5〜5 mm。 牙“ 5 10 15 在篩孔型彈性切層k —表面上,電導層2層遷於直 上。该電導層,可使用—由可屏蔽或吸收自電子聚 廣、 生之電磁波之金屬材質所製成之金屬薄膜,較佳為使用金 屬备。不似傳統電磁波屏蔽膠帶中所使用之導電布, 明之膠帶中使用作為電導層之金屬薄膜,即使膠帶受^ 剪’也不易$金屬粒子或纖維薄紗之污染。並且,此電導 層具有表面電阻約Ο.ίΠ ohm/sq,較傳統電磁波屏蔽膠帶所 用之習知導電布(約0.04 ohm/sq)純。,亦即,此電導層 具有高表面電子傳導性。因本發明之膠帶可具有高; 磁波屏蔽/吸收特性。 °屯 金屬材質實例包括’但不限於:金、鉑、銀、銅、鋁、 錫、鎳、與其合金◦根據本發明之實施例,可用鋁製之金 屬箔作為電導層。 衣 。 電導層之厚度可依熟習此領域技巧之人所需輕易地調 整。根據本發明之實施例,電導層之厚度範圍約在2〜3〇〇 内,較佳為3〜100 /zm,更佳為5〜5〇私爪。 如上所述包括電導層層壓於其上之筛孔型彈力支撐層 之另一表面,導電黏著層3配置於此。導電黏著層3可利用 塗佈導電黏著劑於篩孔型彈性支撐層1之另—表面所形成。 此導電黏著劑無特殊之限制,只要是該領域中習知之 導電黏著劑即可。-般而言’導電黏著劑包括:黏著聚合 20 200914574 5 10 15 脂?電填充物、以及其他填充物。導電填充物均勾 勿散於黏者聚合物樹脂中,於是導電填充物粒子相遠 接形成連續之通路。由於電子可穿越此連續通路,當= Μ層與f導層經由篩孔型彈性支撐層之開 時,本發明膠帶之—表面可電性連接至另-表面。觸 可用於導電黏著劑之黏著聚合物樹脂之實例可包括, 但不限於此·環氧樹脂、聚酯樹脂、丙烯酸樹脂、聚亞醯 胺樹脂、聚砜、酚醛樹脂、三聚氰胺樹脂等。 作為導電填充物’可用金、鉑、銀、銅、鋁、錫、鎳、 碳黑、碳纖維、石墨、聚乙块(p〇lyacety】ene)、聚苯胺 (polyaniline)、聚吼洛(p〇lypyrr〇ie)、聚噻吩 (polythiophene)、聚噻唑(p〇iysuifurnitride)、聚對笨 (P ypphenylene)、聚苯硫 _(p〇iyphenylenesumde)、聚對 苯乙炔(poly-P-phenyienevinylene)、以及其混合物,但本發 明不僅限於此。基於黏著聚合物樹脂為_ 言1導料充物可包括約1G〜細重量組成份。 導電黏著層3之厚度無特殊之限制,但較佳範圍約為$ 〜50 #m。若導電黏著層之厚度少於5#爪,膠帶之黏著強 度會減弱;若導電黏著層之厚度大於5〇#m,傳導性會減 弱,且將導電黏著層應用至密佈元件之電子裝置將會很困 難。 且,本發明之電導式膠帶之表面上,浮雕圖案部分4 可形成於篩孔型彈性支撐層1之各開放空間(見圖3與圖 4 )。相較於無洋雕圖案部分之電磁波屏蔽膠帶,具有浮雕 20 200914574 圖案部分4形成於苴矣品 增 痕,而具有改良之摔:。更進二黏著層因減少不規則頌 、乍更進步,即使當電子裝置具有 平坦之表面,也就是粗糙的表面, : 5 10 15 由於浮雕圖案部分,而可改 = a式“, π… 又冤子裝置之間之黏著特性。 需作個別=圖案°卩分4之形狀與深度可根據案例中膠帶所 作:別调整。洋雕圖案部分之形狀可包括:凹半球形、 之限制。根據本發明之實施例,當篩 狀=二1邊:孔:彈;雕支=:寺,浮雕圖索部分之形 ^ 子雕圖案部分之深度可盥篩?丨刑 ⑽層之厚度相符,例如:約少於一:: 制於此,只要可見浮雕圖案部分即可。 &lt; 同時’本發明提供—種製備電導式膠帶之方法。 «本發明之實施例,料式膠帶可以以 :層=孔型彈性支撐層;層壓電導層於筛孔型彈性支 ^上,m塗料電黏L篩孔型彈性支擇 層之另一表面以形成導電黏著層。 $如:篩孔型彈性支撐層係利用以該領域習知方法編 ,、、之師孔型織品形成’並接著在篩孔型彈性支撐層之—声 面上,層壓以金屬材質製成之電導層。在此,黏著 2電或料電熱融耀’或麼敏膠’可簡易地用於^電導 於師孔型彈性支撐層上。然後,導電黏著層利用塗 佈導電黏著劑於篩孔性彈性支撐層之另—表面來配置 此得到電導式膠帶。 田 20 200914574 5 10 15According to an embodiment of the present invention, there is provided an electrically conductive adhesive tape comprising: a mesh-type elastic support layer having an open space; the electrical conductivity sounding factory is fixed on a mesh-type elastic support-surface; and Layer: is disposed on the other surface of the mesh type elastic support layer. According to another embodiment of the present invention, a method for preparing an electrically conductive tape is provided, the method comprising the steps of: forming a mesh-type elastic support layer having an open space; laminating an electrically conductive layer on the mesh-type elastic support One surface of the layer, and a conductive adhesive applied to the other surface of the mesh-type elastic support floor to form a conductive adhesive layer. [Embodiment] Hereinafter, the present invention will be described in detail. In the present invention, the term "open space" refers to an unoccupied space that penetrates the entire surface upward/downward, such as a mesh of a mesh type fabric, or a through hole of an elastic polymer sheet. Fig. 1 shows an example of an electromagnetic wave shielding plate according to an embodiment of the present invention. The electrically conductive tape shown in Fig. 1 has a mesh-type elastic supporting layer 丨 having an electric layer 2 laminated on one surface thereof, and a conductive adhesive layer 3 disposed on the other surface. 200914574 * According to the electrically conductive tape of the present invention, the electrically conductive adhesive layer 3 is in contact with the electrically conductive layer (10) = the open space of the perforated elastic support layer 1, so that the adhesive can be electrically bonded to the other surface. Therefore, the electrically conductive tape of the present invention shields or absorbs electromagnetic waves generated by an electronic device. 5 10 15 ★ The electrically conductive tape of the present invention comprises a mesh-type elastic support layer i which is self-shocking or vibrating. For example, a mesh type fabric can be used for the mesh type elastic support here. The woven mesh pattern of the present invention is not limited, and the sifting mesh type fabric is made of a yarn, and is similar to a mesh-like loosely woven fabric, that is, using the interlaced warp yarn. A woven fabric in which mesh openings are formed at predetermined intervals may be used. Examples of the yarn include: a spun yarn made of a day-dimensional, such as cotton, wool, hemp, etc.; a fine yarn made of natural fibers such as silk; and a rayon, a nylon, Single fine wire fried or multi-filament yarn made of polyethylene, polyester, polyurethane, etc. According to an embodiment of the present invention, a mesh type fabric in which a fine yarn is interlaced in a warp and weft direction can be used to form an elastic support layer. Such a mesh type fabric has a mesh hole formed therein. Here, the ratio of the mesh holes is not particularly limited. However, according to an embodiment of the present invention, the ratio of the holes W forms a mesh opening. The corresponding soil also has an open space of about 1 〇 to 8 〇% with respect to the entire surface area, and the conductive adhesive layer 3 is in contact with the electrically conductive layer 2 through the open space, so that the adhesive tape can be electrically connected. One surface to the other. In addition to the mesh type fabric, the mesh type elastic support 1 may also use a polymer sheet having through holes formed therein at predetermined intervals. The polymer sheet used in the present invention 20 200914574 is not limited as long as the polymer sheet is made of an elastic material which protects the electronic device from impact or vibration. Examples of the polymer sheet include: a polyethylene-based resin, a polypropylene-based resin, a polyvinyl chloride-based resin, and a polyvinylidene chloride. Polyvinylidene chloride-based resin, polystyrene-based resin, polyester-based resin, polyacrylic resin, styrene Styrene-acrylonitrile (SAN) copolymer, ethylene-vinyl alcohol copolymer (EVA resin), acrylonitrile-butadiene resin -styrene (ABS) resin), polyurethane-based resin, fluoro resin, silicon-based resin, but the invention is not limited thereto. 15 A polymer sheet made of the above polymer resin may include an open space in which through holes are formed at a predetermined interval. Preferably, the through holes are formed in a ratio of 1 to 1 boring/cm 2 , and in this way, the polymer sheet made of the polymer resin includes an open space of about 10 to 80% with respect to the entire surface area. Further, the diameter of each of the through holes is not particularly limited, but a preferred range is about 0.1 to 5 20 mm. Each of the through holes forms an angle of about 30 to 90 with its adjacent through holes. The through hole usually has a shape such as a circle, a triangle, or a square, and is not particularly limited. The thickness of the mesh-type elastic support layer can be adjusted according to the application of the tape to protect the electronic device or electronic components from shock or vibration. For example, in large-sized electronic devices, such as notebook computers, it is preferable to use a thicker elastic support layer 200914574; and a small-sized electronic device such as a mobile phone, preferably a resilient support layer. According to an embodiment of the present invention, the thickness of the _ hole type elastic supporting sound may be about 〜. 5 5 5 mm. The tooth "5 10 15 on the surface of the mesh-type elastic layer k - the surface of the conductive layer 2 is moved straight up. The conductive layer can be used - made of metal material that can be shielded or absorbed from the electrons and the electromagnetic waves generated The metal film is preferably made of metal. Unlike the conductive cloth used in the conventional electromagnetic wave shielding tape, the metal film used as the conductive layer is used in the tape, and even if the tape is cut, it is not easy to be metal particles or thin fibers. The conductive layer has a surface resistance of about Ο.ίΠ ohm/sq, which is purer than the conventional conductive cloth (about 0.04 ohm/sq) used in the conventional electromagnetic wave shielding tape, that is, the conductive layer has a high surface. Electronic conductivity. The tape of the present invention can have high magnetic wave shielding/absorption characteristics. Examples of metal materials include, but are not limited to, gold, platinum, silver, copper, aluminum, tin, nickel, and alloys thereof. In an embodiment, a metal foil made of aluminum can be used as the electrically conductive layer. The thickness of the electrically conductive layer can be easily adjusted as desired by those skilled in the art. According to an embodiment of the invention, the thickness of the electrically conductive layer The circumference is about 2 to 3 inches, preferably 3 to 100 /zm, more preferably 5 to 5 inches. The above-mentioned another type of the mesh type elastic support layer on which the electrically conductive layer is laminated is included. The surface of the conductive adhesive layer 3 is disposed here. The conductive adhesive layer 3 can be formed by coating a conductive adhesive on the other surface of the mesh-type elastic support layer 1. The conductive adhesive is not particularly limited as long as it is in the field. Conventional conductive adhesives can be used. - Generally speaking, 'conductive adhesives include: adhesive polymerization 20 200914574 5 10 15 grease? Electrical fillers, and other fillers. Conductive fillers are not scattered in the adhesive polymer resin Therefore, the conductive filler particles are distantly connected to form a continuous path. Since electrons can pass through the continuous passage, when the = Μ layer and the f-guide layer are opened through the mesh-type elastic support layer, the surface electrical conductivity of the tape of the present invention Connecting to another surface. Examples of the adhesive polymer resin that can be used for the conductive adhesive may include, but are not limited to, epoxy resin, polyester resin, acrylic resin, polyamido resin, polysulfone, phenol resin, Melamine resin and the like. For conductive fillers, 'available gold, platinum, silver, copper, aluminum, tin, nickel, carbon black, carbon fiber, graphite, p〇lyacety ene, polyaniline, polypyrox (p〇 Lypyrr〇ie), polythiophene, polythiazole (p〇iysuifurnitride), polyphenylene (P ypphenylene), polyphenylene sulfonate (polypyridylene), poly-P-phenyienevinylene, and A mixture thereof, but the present invention is not limited thereto. The filler based on the adhesive polymer resin may include a composition of about 1 G to a fine weight. The thickness of the conductive adhesive layer 3 is not particularly limited, but is preferably in the range of about $50 to 50 #m. If the thickness of the conductive adhesive layer is less than 5#, the adhesive strength of the tape will be weakened; if the thickness of the conductive adhesive layer is greater than 5〇#m, the conductivity will be weakened, and the electronic device applying the conductive adhesive layer to the dense component will Very difficult. Further, on the surface of the electrically conductive tape of the present invention, the relief pattern portion 4 may be formed in each open space of the mesh type elastic support layer 1 (see Figs. 3 and 4). Compared with the electromagnetic wave shielding tape of the portion without the ocean carving pattern, there is a relief 20 200914574 The pattern portion 4 is formed in the product mark, and has an improved drop:. Further, the second adhesive layer is improved by reducing irregularities and enthalpy, even when the electronic device has a flat surface, that is, a rough surface, : 5 10 15 due to the embossed pattern portion, it can be changed to a type ", π... Adhesive characteristics between the tweezers. Need to be individual = pattern ° 卩 4 The shape and depth can be made according to the tape in the case: Do not adjust. The shape of the part of the eagle pattern can include: concave hemisphere, the limit. According to this Embodiments of the invention, when the sieve shape = two sides: hole: bomb; carving branch =: temple, the shape of the relief figure part ^ the depth of the part of the carving pattern can be sieved? The thickness of the layer (10) is consistent, for example: About less than one:: Thus, as long as the embossed pattern portion is visible. <At the same time, the present invention provides a method for preparing an electrically conductive tape. «In the embodiment of the present invention, the tape can be: layer = hole The elastic support layer; the piezoelectric layer of the layer is on the mesh-type elastic support, and the other surface of the electro-adhesive L-mesh elastic-retaining layer is formed to form a conductive adhesive layer. Using the well-known methods in the field, The fabric is formed 'and then laminated on a sound surface of the mesh-type elastic support layer, and an electrically conductive layer made of a metal material is laminated. Here, the adhesive 2 electric or electric heating radiant 'or sensible glue' can be easily used. The conductive adhesive layer is then coated with a conductive adhesive on the other surface of the mesh elastic support layer to obtain the electrically conductive tape. Field 20 200914574 5 10 15

L j 20 孰融J於b之二^ t型彈性支標層利用配置導電或非導電 備,且利用打孔器以-預定門^ “物薄片上來製 備之電導層層心製備::仏形成通孔。之後,將-預 該筛孔型彈性支撐:Γ;Γ型彈性支撐層上。當加熱 熱融膠因受熱而融二==型彈性支撐層表面之 層層壓。於是,導電為著^ 型彈性支撐層與電導 型彈性支撐層之另利用塗佈導電黏著劑於筛孔 傲t層之另—表面來形成,由此可得電導式膝帶。 中,:=更加具體的例子,如圖5所示,在捲繞_ 經緯方向一篩孔型織品以聚乙_紗在 二:二金屬薄膜被捲起。之後,當由捲繞滾筒⑻ 心⑽所知供之師孔型織品i與銘金屬薄膜 筒20丨與下熱壓滾筒2〇2之 …、越浪 型織品i之-表面上乂/ 則層壓於篩孔 融膠,配以導電或非導電熱 以Λ劫士4口1之表面上,則可將鋁金屬薄膜2 〇”、、方式間皁地層壓於篩孔型織品1之上。 •护罢曰壓私序後’篩孔型織品1之另-表面,以塗佈用噴 ^置3(Μ塗佈導電黏著劑,由此形成—導電黏著層3。在 在’既然導電黏著劑亦塗佈於篩孔型織品之篩孔中,導· 黏著層可能金屬薄膜接觸,因此可電性連接膠帶之 ^了表面。因此,可得到可屏蔽或吸收電磁波之電導 12 200914574 且’根據本發明之势借 著層步驟後,利用、 °匕括.於形成導電黏 ^ 起滾踌於篩孔型彈性支撐層之备μ # 工間开:成净雕圖案部分(見圖6)。 牙層之各開放 雕圖案部分4可以 5 4〇2,其表面形成 二。形成,包括凸起滾筒 筒4〇1。特別地是,膠帶:::’與具有平滑表面之橡膠滾 領域習知滾筒裝置來# 之子雕圓案部分4可利用該 起滾筒術。 料’如其表㈣成有凸料分之凸 10 例如.洋雕圖案部分4可簡單地利用 有平滑外周圍表面之橡膠滾筒4(HH有各㈣^括具 起部分形成於其外周円本二 、有各種凸面形狀凸 筒術與橡_接觸日凸形成’凸起滚 爾驅動時,此膠帶,筒401與凸起滚筒 务a β m +、眷 栝表面層壓有電導層2且另一 15 ㈣著層3之筛孔型彈性支撐層1,係通過橡 與凸起滾筒402之間所通過且介於其二者之間, 凸起部分與橡膠滾筒401之橡膠之部 使膠-表面卜已滾请之與橡膠滾筒之間所產生的壓力係 =二面上形成浮雕圖案部分4。依上述方法形成之浮雕 20 ^:可防止電導式膠帶上不規利痕之發生,以及改 善膠帶之黏性。 根據本發明之膠帶,其包括具有電導層層壓於其一表 面,導電黏著層配置於另一表面之筛孔型彈性支撐層,可 用來屏敝或吸收產生自電子裝置之電磁波,因通過筛孔型 13 200914574 彈性支撐層之開放空間,電導層與導電黏著層接觸,因此 可電性連接膠帶之一表面至另一表面。 雖然本發明之數個示範實施例為說明之目的而描述, 然熟習此領域技術之人將明瞭各種不偏離本發明於附屬項 中揭露之範圍與精神之修飾、增加、替代係為可能。 【圖式簡單說明】 〇 圖1係本發明—實施例之電導式膠帶之剖面圖。 圖2係本發明一實施例之電導式膠帶之透視圖。 10圖3係本發明另一實施例之電導式膠帶之剖面圖。 圖4係本發明另一實施例之電導式膠帶之透視圖。 圖5係本發明—實施例之製備電導式膠帶過程之示意圖。 圖6係本發明另一實施例之製備電導式膠帶過程之示意圖 15 20 【主要元件符號說明】 1篩孔型彈性支撐層 2電導層 3導電黏著層 4浮雕圖案部分 101用於4孔型彈性支撐層之捲繞滚筒 2〇2下熱壓滚筒 用於篩孔型彈性支撐層之捲繞滚筒 201上熱壓滾筒 4〇2凸起滾筒 3〇ι塗佈用之噴灑装置 401橡膠滾筒 14L j 20 孰 J J b 之 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ t t t 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性 弹性Through-hole. After that, the mesh-type elastic support is pre-formed on the Γ-type elastic support layer. When the heated hot melt is heated, the layer of the surface of the elastic support layer is laminated. Thus, the conductive is The ^-type elastic support layer and the electrically conductive elastic support layer are additionally formed by coating a conductive adhesive on the other surface of the mesh hole, thereby obtaining a conductive knee band. Medium::= More specific example As shown in Fig. 5, a mesh type fabric in the winding_latitude-longitude direction is rolled up by a poly-yarn yarn in a two-two metal film. After that, it is known by the winding drum (8) core (10). Fabric i and Ming metal film cylinder 20 丨 and lower hot pressing roller 2 〇 2 ..., the wave-type fabric i - surface 乂 / then laminated to the mesh hole melt, with conductive or non-conductive heat to rob On the surface of the 4th port 1, the aluminum metal film 2 can be laminated on the mesh fabric 1 in a manner of soap. • After the private order, the other surface of the mesh-type fabric 1 is coated with a spray coating (the conductive adhesive is applied, thereby forming a conductive adhesive layer 3. In the case of conductive bonding) The agent is also applied to the mesh hole of the mesh-type fabric, and the conductive/adhesive layer may be in contact with the metal film, so that the surface of the tape can be electrically connected. Therefore, the conductance capable of shielding or absorbing electromagnetic waves can be obtained 12 200914574 and The present invention has the potential to be formed by using a layer step, which is used to form a conductive adhesive layer, which is rolled into the mesh-type elastic support layer, and is formed into a net-engraved pattern portion (see Fig. 6). Each of the open engraved pattern portions 4 of the dental layer may be 5 4 〇 2, and its surface is formed into two. The formation includes a raised roller cylinder 4 〇 1. In particular, the tape:::' and the rubber roller having a smooth surface are known in the field. The roller device can be used for the roller-scraping portion 4 of the roller device. The material "as shown in the table (4) is convex with a convex portion. For example, the oceanic pattern portion 4 can simply utilize the rubber roller 4 having a smooth outer peripheral surface. (HH has each (four) ^ bracketed part formed in its outer circumference 円 2, there is The convex shape of the convex tube and the rubber _ contact with the convex shape to form a 'bull roller drive, the tape, the cylinder 401 and the convex roller service a β m +, the surface of the crucible is laminated with the electrically conductive layer 2 and the other 15 (four) The mesh-type elastic support layer 1 of the layer 3 is passed between the rubber and the convex roller 402 and is interposed therebetween, and the convex portion and the rubber portion of the rubber roller 401 make the glue-surface The pressure generated between the rolling and the rubber roller is the embossed pattern portion 4 formed on the two sides. The embossing 20 ^ formed by the above method can prevent the occurrence of irregular marks on the conductive tape and improve the adhesion of the tape. The adhesive tape according to the present invention comprises a mesh-type elastic support layer having an electrically conductive layer laminated on one surface thereof and a conductive adhesive layer disposed on the other surface, which can be used for screening or absorbing electromagnetic waves generated from the electronic device. Through the open space of the mesh-type 13 200914574 elastic support layer, the electrically conductive layer is in contact with the electrically conductive adhesive layer, thereby electrically connecting one surface of the tape to the other surface. Although several exemplary embodiments of the invention are described for illustrative purposes , of course It will be apparent to those skilled in the art that various modifications, additions, and substitutions may be made without departing from the scope and spirit of the invention disclosed in the appended claims. Brief Description of the Drawings FIG. 1 is a conductivity type of the present invention. Figure 2 is a perspective view of a conductive tape according to an embodiment of the present invention. Figure 3 is a cross-sectional view of a conductive tape according to another embodiment of the present invention. Figure 4 is a conductance of another embodiment of the present invention. Figure 5 is a schematic view showing the process of preparing an electrically conductive tape according to another embodiment of the present invention. Fig. 6 is a schematic view showing the process of preparing an electrically conductive tape according to another embodiment of the present invention. 15 20 [Main component symbol description] 1 sieve Hole type elastic support layer 2 Conductive layer 3 Conductive adhesive layer 4 Embossed pattern portion 101 for winding roller 2〇2 of 4-hole type elastic support layer The hot press roller is used for winding drum 201 of mesh type elastic support layer Hot press roller 4〇2 raised roller 3〇1 spraying device 401 rubber roller 14

Claims (1)

200914574 七、申請專利範圍: 1. 一種電導式膠帶,包括: 一篩孔型彈性支撐層,係具有一開放空間; 一電導㉟’係層壓於該篩孔型彈性支撐層之一表面 5 上;以及 一導電黏著層,係配置於該篩孔塑彈性支撐層之另一 表面上。 2 ·如申5月專利範圍第1項所述之電導式膠帶,其中, 該導電黏著層與該電導層係經由該筛孔型彈性支撐層之 ⑺放空間相接觸’由此電性連接該膠帶之一表面至另一表面。 ,3·如申請專利範圍第1項所述之電導式膠帶,其中, 子雕圖案部分係形成於該篩孔型彈性支撐層之各開放* 間。 二 15200914574 VII. Patent application scope: 1. A conductive tape comprising: a mesh type elastic support layer having an open space; a conductance 35' laminated on a surface 5 of the mesh type elastic support layer And a conductive adhesive layer disposed on the other surface of the mesh plastic elastic support layer. The electrically conductive adhesive tape according to the first aspect of the invention, wherein the conductive adhesive layer and the electrically conductive layer are in contact with each other via the (7) discharge space of the mesh-type elastic support layer, thereby electrically connecting the conductive adhesive layer One surface of the tape to the other surface. The conductive tape of claim 1, wherein the sub-embossed portion is formed between the openings* of the mesh-type elastic support layer. Two 15 20 ▲ 〃 4·如申請專利範圍第丨項所述之電導式膠帶,其中, 亥篩孔型彈性支撐層之開放空間之範圍約為整個表面之】 〜80%。 ιυ s *5.如申請專利範圍第1項所述之電導式膠帶,其中, ~ _孔型彈性支撐層之厚度範圍介於0·05〜5 mm間。 ▲〜6.如申請專利範圍第1項所述之電導式膠帶,其中, ^ ^ ^型彈性支撑層包括-篩孔型織品或-彈性聚合物薄 其具有以一預定間隔形成之通孔。 •如申請專利範圍第ό項所述之電導式膠帶,其中, 該篩孔型織。勺紅&amp; 土’。口包括師孔以1〇〜1〇〇篩孔/cm2之比例形成。 15 200914574 8. 如申請專利範圍第6項所述之電導式膠帶,其中, 該篩孔型織品係以棉紗、單細線紗、或複細線紗來編織。 9. 如申請專利範圍第6項所述之電導式膠帶,其中, 該彈性聚合物薄片係選自由以下材料所組成之群組所製 5 成:聚乙烯基樹脂(polyethylene-based resin)、聚丙稀基樹 脂(polypropylene-based resin)、聚氯乙稀基樹脂(polyvinyl chloride-based resin)、聚偏二氯乙稀基樹脂(polyvinylidene chloride-based resin)、聚苯乙稀基樹脂(polystyrene-based resin)、聚S旨基樹脂(polyester-based resin)、聚丙稀酸樹脂 10 (polyacrylic resin)、 苯乙浠-丙稀腈共聚物 (styrene-acrylonitrile (SAN) copolymer)、乙稀-乙浠醇共聚 物(ethylene-vinyl alcohol copolymer, EVA樹脂)、丙稀腈-丁二烯-苯乙浠樹脂(acrylonitrile-butadiene-styrene (ABS) resin)、聚氨S旨基樹脂(polyurethane-based resin)、氟樹脂 15 (fluoro resin)、石夕基樹脂(silicon-based resin)。 10. 如申請專利範圍第6項所述之電導式膠帶,其中, / 該通孔具有直徑範圍0.1〜5 mm。 11. 如申請專利範圍第6項所述之電導式膠帶,其中, 該通孔以約1〜100孔/cm2之比例形成。 20 12.如申請專利範圍第1項所述之電導式膠帶,其中, 該電導層具有厚度範圍2〜300 μ m。 13.如申請專利範圍第1項所述之電導式膠帶,其中, 該電導層係為一金屬薄膜,而該金屬薄膜係選自由:金、 16 200914574 14. 如申請專利範圍第1項所述之電導式膠帶,其中, 該導電黏著層包括一黏著聚合物樹脂與導電填充物。 15. 如申請專利範圍第14項所述之電導式膠帶,其 中,該黏著聚合物樹脂係選自由環氧樹脂、聚酯樹脂、丙 5烯酸樹脂、聚亞醯胺樹脂、聚砜、酚醛樹脂、與三聚氰胺 樹脂所組成之群組。 16.如申請專利範圍第14項所述之電導式膠帶,其 〇 10 1520 ▲ 〃 4· The conductive tape of the above-mentioned patent application, wherein the open space of the sift-type elastic support layer is about 80% of the entire surface. The conductive tape of the invention of claim 1, wherein the thickness of the ~_-type elastic support layer ranges from 0.05 to 5 mm. The conductive tape of the invention of claim 1, wherein the ^ ^ ^ type elastic support layer comprises a mesh type fabric or an elastic polymer film having through holes formed at a predetermined interval. The electrically conductive tape of the invention of claim 2, wherein the mesh is woven. Spoon red &amp; soil. The mouth includes a teacher hole formed at a ratio of 1 〇 to 1 〇〇 sieve hole/cm 2 . The conductive tape of the invention of claim 6, wherein the mesh type fabric is woven with cotton yarn, single fine thread yarn, or multi-filament yarn. 9. The electrically conductive tape of claim 6, wherein the elastic polymer sheet is selected from the group consisting of: polyethylene-based resin, polypropylene Polypropylene-based resin, polyvinyl chloride-based resin, polyvinylidene chloride-based resin, polystyrene-based resin Resin, polys-based resin, polyacrylic resin, styrene-acrylonitrile (SAN) copolymer, ethylene-acetol Copolymer (ethylene-vinyl alcohol copolymer, EVA resin), acrylonitrile-butadiene-styrene (ABS) resin, polyurethane-based resin, Fluororesin 15 (silicon resin), silicon-based resin. 10. The electrically conductive tape of claim 6, wherein the through hole has a diameter ranging from 0.1 to 5 mm. 11. The electrically conductive tape of claim 6, wherein the through hole is formed at a ratio of about 1 to 100 holes/cm2. The electrically conductive tape of claim 1, wherein the electrically conductive layer has a thickness ranging from 2 to 300 μm. 13. The electrically conductive tape of claim 1, wherein the electrically conductive layer is a metal film selected from the group consisting of: gold, 16 200914574 14. As described in claim 1 The electrically conductive adhesive tape, wherein the conductive adhesive layer comprises an adhesive polymer resin and a conductive filler. 15. The electrically conductive tape of claim 14, wherein the adhesive polymer resin is selected from the group consisting of epoxy resin, polyester resin, propylene 5-enoic acid resin, polyamido resin, polysulfone, phenolic acid. A group of resins and melamine resins. 16. The conductive tape of claim 14, wherein 〇 10 15 中,該導電填充物係選自由金、翻、銀、銅、在呂、錫、錄 碳黑、碳纖維、石墨、聚乙炔(p〇lyacetylene)、聚苯胺 (polyaniline)、聚。比 „各(p〇lypyrr〇le)、聚噻吩 (polythiophene)、聚噻唑(p〇iysuifurnitride)、聚對苯 (f〇iy-p-Phenyiene)、聚笨硫醚(polyphenyienesumde卜聚對 苯乙炔(P〇ly-P-phenylenevinyIene)、以及其混合物所组成之 群組。 、 ^ 扣申請專利範圍第1項所述之電導式膠帶,其中, 該導電黏著層具有厚度範圍5〜5〇 Wm。 ” 18. -種製備電導式膠帶之方法,該方法包括步驟: 形成一具有開放空間之篩孔型彈性支撐層; 層壓一電導層於該篩孔型彈性支撐層之一表面.、 形成一導電黏著劑於該篩孔型彈性支撐層 1 以形成一導電黏著層。 又面 請專利範圍第18項所述之方法,於形成該導 *者s之^驟後’ t包括步驟:利用—凸起 孔型彈性支撐層之各開放空間形成浮雕圖案部分。… 20The conductive filler is selected from the group consisting of gold, tumbling, silver, copper, ruthenium, tin, carbon black, carbon fiber, graphite, p〇lyacetylene, polyaniline, and poly. „ ( (p〇lypyrr〇le), polythiophene, polythiazole (p〇iysuifurnitride), polyparaphenylene (f〇iy-p-Phenyiene), polyphenyienesumde poly(p-phenylene acetylene) P 〇 - P P 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电18. A method of preparing an electrically conductive tape, the method comprising the steps of: forming a mesh-type elastic support layer having an open space; laminating an electrically conductive layer on a surface of the mesh-type elastic support layer; forming a conductive Adhesive agent is applied to the mesh-type elastic support layer 1 to form a conductive adhesive layer. The method described in claim 18 of the patent scope is further included in the step of forming the guide s. Each open space of the apertured elastic support layer forms a portion of the relief pattern.... 20
TW097132028A 2007-08-22 2008-08-22 Electrically conductive adhesive tape and method for preparing the same TW200914574A (en)

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