TR201620039A1 - Küçük boyutlu doku morfoloji̇si̇ne katki sağlayan bi̇r lazerli̇ isil i̇şlem adimi kullanilarak gerçekleşti̇ri̇len bi̇r yüzey dokulandirma yöntemi̇ - Google Patents

Küçük boyutlu doku morfoloji̇si̇ne katki sağlayan bi̇r lazerli̇ isil i̇şlem adimi kullanilarak gerçekleşti̇ri̇len bi̇r yüzey dokulandirma yöntemi̇ Download PDF

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Publication number
TR201620039A1
TR201620039A1 TR2016/20039A TR201620039A TR201620039A1 TR 201620039 A1 TR201620039 A1 TR 201620039A1 TR 2016/20039 A TR2016/20039 A TR 2016/20039A TR 201620039 A TR201620039 A TR 201620039A TR 201620039 A1 TR201620039 A1 TR 201620039A1
Authority
TR
Turkey
Prior art keywords
contributes
heat treatment
treatment step
method used
laser heat
Prior art date
Application number
TR2016/20039A
Other languages
English (en)
Inventor
Yerci̇ Selçuk
Hadibrata Wisnu
Original Assignee
Selcuk Yerci
Hadibrata Wisnu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Selcuk Yerci, Hadibrata Wisnu filed Critical Selcuk Yerci
Priority to TR2016/20039A priority Critical patent/TR201620039A1/tr
Priority to EP17203012.4A priority patent/EP3343640B1/en
Publication of TR201620039A1 publication Critical patent/TR201620039A1/tr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0236—Special surface textures
    • H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Silicon Compounds (AREA)

Abstract

Buluş, bir lazer ışını uygulama adımının kullanıldığı, bir silisyum pulnın yüzeyinin dokulandırılmasına yönelik bir yöntem ile ilgilidir.
TR2016/20039A 2016-12-29 2016-12-29 Küçük boyutlu doku morfoloji̇si̇ne katki sağlayan bi̇r lazerli̇ isil i̇şlem adimi kullanilarak gerçekleşti̇ri̇len bi̇r yüzey dokulandirma yöntemi̇ TR201620039A1 (tr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TR2016/20039A TR201620039A1 (tr) 2016-12-29 2016-12-29 Küçük boyutlu doku morfoloji̇si̇ne katki sağlayan bi̇r lazerli̇ isil i̇şlem adimi kullanilarak gerçekleşti̇ri̇len bi̇r yüzey dokulandirma yöntemi̇
EP17203012.4A EP3343640B1 (en) 2016-12-29 2017-11-22 Method of surface texturing using a laser heating step that contributes to small-sized texture morphology

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TR2016/20039A TR201620039A1 (tr) 2016-12-29 2016-12-29 Küçük boyutlu doku morfoloji̇si̇ne katki sağlayan bi̇r lazerli̇ isil i̇şlem adimi kullanilarak gerçekleşti̇ri̇len bi̇r yüzey dokulandirma yöntemi̇

Publications (1)

Publication Number Publication Date
TR201620039A1 true TR201620039A1 (tr) 2018-07-23

Family

ID=60450472

Family Applications (1)

Application Number Title Priority Date Filing Date
TR2016/20039A TR201620039A1 (tr) 2016-12-29 2016-12-29 Küçük boyutlu doku morfoloji̇si̇ne katki sağlayan bi̇r lazerli̇ isil i̇şlem adimi kullanilarak gerçekleşti̇ri̇len bi̇r yüzey dokulandirma yöntemi̇

Country Status (2)

Country Link
EP (1) EP3343640B1 (tr)
TR (1) TR201620039A1 (tr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018111874A1 (de) * 2018-05-17 2019-11-21 Hanwha Q Cells Gmbh Verfahren zur Behandlung eines gesägten Halbleiterwafers, Halbleiterwafer und Halbleiterwafer-Solarzelle
CN111554778B (zh) * 2020-05-13 2021-07-27 温州大学 一种利用激光旋切进行晶硅太阳能电池表面制绒的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4390392A (en) 1980-09-16 1983-06-28 Texas Instruments Incorporated Method for removal of minute physical damage to silicon wafers by employing laser annealing
DE19811878C2 (de) * 1998-03-18 2002-09-19 Siemens Solar Gmbh Verfahren und Ätzlösung zum naßchemischen pyramidalen Texturätzen von Siliziumoberflächen
US8247312B2 (en) * 2008-04-24 2012-08-21 Innovalight, Inc. Methods for printing an ink on a textured wafer surface
US8309389B1 (en) * 2009-09-10 2012-11-13 Sionyx, Inc. Photovoltaic semiconductor devices and associated methods
US20120295447A1 (en) * 2010-11-24 2012-11-22 Air Products And Chemicals, Inc. Compositions and Methods for Texturing of Silicon Wafers

Also Published As

Publication number Publication date
EP3343640B1 (en) 2020-01-01
EP3343640A1 (en) 2018-07-04

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