SU668632A3 - Printed circuit board manufacturing method - Google Patents

Printed circuit board manufacturing method

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Publication number
SU668632A3
SU668632A3 SU691324306A SU1324306A SU668632A3 SU 668632 A3 SU668632 A3 SU 668632A3 SU 691324306 A SU691324306 A SU 691324306A SU 1324306 A SU1324306 A SU 1324306A SU 668632 A3 SU668632 A3 SU 668632A3
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USSR - Soviet Union
Prior art keywords
salt
metal
ultraviolet light
ions
solution
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SU691324306A
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Russian (ru)
Inventor
Энтони Де Анжелло Майкл
Джекс Шарп Дональд
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Вестерн Электрик Компани Инкорпорейтед (Фирма)
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Publication of SU668632A3 publication Critical patent/SU668632A3/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • G03C5/58—Processes for obtaining metallic images by vapour deposition or physical development
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

(54) СПОСОБ ИЗГОТОВЛЕНИЯ ПЕЧАТНОЙ ПЛАТЫ(54) METHOD OF MANUFACTURING A PCB

1one

Изобретение относитс  к технологии изготовлени  печатных плат и может быть использовано при производстве малогабаритной аппаратуры.The invention relates to the manufacture of printed circuit boards and can be used in the manufacture of small-sized equipment.

Известен способ изготовлени  печатных плат, включающий в себ  формирование рисунка схемы на диэлектрической подложке путем нанесени  на ее поверхность сло  соли каталитического металла из ее раствора и последующей избирательной металлизации посредством химического восстановлени  каталитического металла 1.A known method of manufacturing printed circuit boards involves forming a circuit pattern on a dielectric substrate by depositing a layer of a catalytic metal salt on its surface and then selectively metallizing it by chemical reduction of the catalytic metal 1.

Однако этот способ дорог и дает неточные рисунки схемы.However, this method is expensive and gives inaccurate drawings of the scheme.

Цель изобретени  - повышение точности рисунка схемы и удешевление способа.The purpose of the invention is to improve the accuracy of the circuit pattern and the cheaper method.

Дл  этого в способе изготовлени  печатных плат перед нанесением на диэлектрическую подложку сло  соли каталитического металла из ее раствора на ее поверхность нанос т слой соли, содержащей ионы металла , степень окислени  которого зависит от облучени  ультрафиолетовым светом, и избирательно облучают его ультрафиолетовым светом.To do this, in the method of manufacturing printed circuit boards, before applying a layer of catalytic metal salt from its solution onto the dielectric substrate, a layer of salt containing metal ions is deposited on its surface, the degree of oxidation of which depends on the irradiation with ultraviolet light, and selectively irradiate it with ultraviolet light.

В качестве соли, содержащей ионы металла , степень окислени  которого зависит от облучени  ультрафиолетовым светом, используют соль металлов, способную восстановить ионы каталитического металла из раствора его соли после облучени  ее ультрафиОо1етовым светом.As a salt containing metal ions, the degree of oxidation of which depends on the irradiation with ultraviolet light, a metal salt is used that is able to reduce the ions of the catalytic metal from the solution of its salt after irradiating it with ultraviolet light.

В качестве соли, содержащей ионы металла , степень окислени  которого зависит от облучени  ультрафиолетовым светом, используют соль металла, ионы которого после облучени  ее ультрафиолетовым светом утрачивают способность восстанавливать ионы каталитического металла из раствора его соли.As a salt containing metal ions, the degree of oxidation of which depends on irradiation with ultraviolet light, a salt of the metal is used, whose ions, after irradiating it with ultraviolet light, lose the ability to regenerate the ions of the catalytic metal from a solution of its salt.

В качестве соли металла, способной восстанавливать ионы каталитического металла из раствора его соли после облучени  ее ультрафиолетовым светом, используют соль металла, способную после облучени  ультрафиолетовым светом восстанавливать ионы каталитического металла из раствора его соли.As a metal salt capable of reducing ions of a catalytic metal from a solution of its salt after irradiating it with ultraviolet light, a metal salt is used that can, after irradiating with ultraviolet light, restore ions of a catalytic metal from a solution of its salt.

Claims (7)

В качестве соли металла, ионы которого после облучени  ее ультрафиолетовым свето .м утрачивают способность восстанавливать ионы каталит11ческо1о мета,л.ла из раствора его соли, используют галоиды металлов , а именно хлорид олова или хлорид титана , или хлорид свинца. В качестве соли металла, способной после облучени  ультрафиолетовым светом восстанавливать ионы каталитического металла из раствора его соли, используют органическую соль трехвалентного железа, а имен но оксалат трехвалентного железа или цитра ,т трехвалентного железа, или тартрат трехвалентного железа. В качестве соли металла, способной после облучени  ультрафиолетовы.м светом восстанавливать ионы каталитического металла из раствора его соли, используют органическую соль двухвалентной ртути, а и.менно оксалат двухвалентной ртути или питрат двухвалентной ртути, или тартрат двухвалентной ртути. Существо предлагаемого способа заключаетс  в следующем. Поверхность подложки, выполненной из изол ционного матери....;а, очищают либо погружение. в раствор пделочи, либо в раствор азотной кислоты, либо обдувают песком на пескоструйном аппарате. Далее подложку промывают и погружают в раствор соли, содержащей ионы металла , степень окислени  которого зависит от облучени  ультрафиолетовым светом. В качестве таких солей берут хлорид олова, хлорид титана, хлорид свинца, органические соли трехвалентного железа (оксалат трехвалентного железа, цитрат трехвалетного железа или тартрат трехвалентного железа) или органические соли двухвале1ггной ртути (оксалат двухвалентной ртути, цитрат двухвалентной ртути или тартрат двухвале 1тной ртути). Дал.ее подложку сушат, закрывают маской , представл ющей собой топологию схемы , и освещают (экспонируют) ультрафиолетовым свето.м. После этого подложку погружают в рас вор соли драгоценного .металла или паллади . Проводники схемы, экспонированные ультрафиолетовым светом, состо щие из покрыти  соли металла, способной после облучени  ультрафиолетовым свето.м восстанавливать драгоценпый металл из его соли, при погружении в электролизную ванну восстанавливают драгоценный .металл. Неэксио1И1рованные участки не восстанавливают его, а после промывки удал ютс . Промытые подложки погружают в электролизную ванну, где на драгоценный металл электролитическим способом нанос т медь. Далее подложки сущат и подвергают обработке , усиливающей сцепление полученных проводЩ1ков с подложкой. Формула изобретени  1.Способ изготовлени  печатных плат, включающий в себ  формирование рисунка схемы на диэлектрической подложке путе.м нанесени  на ее поверхность сло  соли каталитического металла из его раствора и последующей избирательной .металлизации посредством химического восстановлени  каталитического .металла, отличающийс  тем, что, с целью повыщени  рисунка схемы и удещевлени  способа, перед нанесением на диэлектрическую подложку сло  соли каталитического .металла из ее раствора на ее поверхность нанос т слой соли, содержащей ионы металла, степень окислени  которого зависит от облучени  ультрафиолетовым светом , и избирательно облучают его ультрафиолетовым светом. As a metal salt, the ions of which, after irradiating it with ultraviolet light, lose the ability to regenerate catalysts meta, lla ions from a solution of its salt, metal halides are used, namely tin chloride or titanium chloride, or lead chloride. As a metal salt capable of recovering the catalytic metal ions from a solution of its salt after irradiation with ultraviolet light, an organic salt of ferric iron is used, namely ferric oxalate or zither, trivalent iron or ferric tartrate. As a metal salt capable of recovering the catalytic metal ions from a solution of its salt after ultraviolet irradiation with light, organic salt of divalent mercury is used, and mercury oxalate or divalent mercuric acid, or divalent mercury tartrate. The essence of the proposed method is as follows. The surface of the substrate, made of an insulating mother ...; a, is cleaned or immersed. in the solution of the work, either in the solution of nitric acid, or sandblasted on the sandblasting apparatus. The substrate is then washed and immersed in a solution of a salt containing metal ions, the degree of oxidation of which depends on the irradiation with ultraviolet light. Tin chloride, titanium chloride, lead chloride, organic salts of ferric iron (ferric oxalate, ferric citrate or ferric tartrate) or dvuhvalergngnoy organic mercury salts (divalent mercuric chloride, citrate divanely artdolor, art nougat, and tartaric acid) are taken as such salts. . The substrate is dried, covered with a mask representing the topology of the circuit, and illuminated (exposed) by ultraviolet light m. After that, the substrate is immersed in the salt solution of precious metal or palladium. The circuit conductors exposed to ultraviolet light, consisting of the coating of a metal salt, which, after irradiating with ultraviolet light, can recover precious metal from its salt, restore the precious metal when immersed in an electrolysis bath. The non-exo110 sites do not restore it, and after washing, they are removed. The washed substrates are immersed in an electrolysis bath, where copper is electrolytically applied to the precious metal. Next, the substrate is present and subjected to a treatment that enhances the adhesion of the obtained conductors to the substrate. Claim 1. A method of manufacturing printed circuit boards, comprising forming a circuit pattern on a dielectric substrate by depositing a layer of a catalytic metal salt on its surface and then selectively metallizing it by chemically reducing a catalytic metal, characterized in that In order to enhance the circuit pattern and the method, before applying a layer of catalytic metal salt on its dielectric substrate, a layer of salt, soda, is applied to its dielectric substrate. The neighing metal ions, the degree of oxidation of which depends on the irradiation with ultraviolet light, and selectively irradiate it with ultraviolet light. 2.Способ по п. 1, отличающийс  тем, что в качестве соли, содержащей ионы металла , степень окислени  которого зависит от облучени  ультрафиолетовым светом, используют соль металла, способную восстанавливать ионы каталитического металла из раствора его соли после облучени  ее ультрафиолетовым свето.м. 2. A method according to claim 1, characterized in that a salt containing metal ions, the oxidation state of which depends on irradiation with ultraviolet light, is used as a metal salt capable of reducing catalytic metal ions from a solution of its salt after irradiating it with ultraviolet light. 3.Способ по .п. 1, отличающийс  тем, что в качестве соли, содержащей ионы металла , степень окислени  которого зависит от облучени  ультрафио.летовым светом, используют соль металла, ионы которого после облучени  ее ультрафиолетовым светом утрачивают способность восстанавливать ионы каталитического металла из раствора его соли. 3. The method according to. 1, characterized in that as a salt containing metal ions, the degree of oxidation of which depends on irradiation with ultraviolet light, a salt of a metal is used, whose ions, after being irradiated with ultraviolet light, lose the ability to regenerate the ions of the catalytic metal from a solution of its salt. 4.Способ по п. 2, отличающийс  те.м, что в качестве соли металла, способной восстанавливатьионы каталитического металла из раствора его соли после облучени  ее ультрафиолетовым светом, используют соль металла, способную после облучени  ультрафиолетобым светом восстанавливать ионы каталитического металла из раствора его 4. A method according to claim 2, characterized in that as a metal salt capable of reducing ions of a catalytic metal from a solution of its salt after irradiating it with ultraviolet light, a metal salt is used that can, after irradiating with ultraviolet light, recover ions of a catalytic metal from its solution 5.Способ по п. 3, отличающийс  тем, что в качестве соли металла, ионы которого после облучени  ее ультрафиолетовым светом утрачивают способность восстанавливать ионы каталитического металла из раствора его соли, используют галоиды металлов , а именно хлорид олова, или .хлорид титана, или хлорид свинца. 5. A method according to claim 3, characterized in that as a metal salt, whose ions, after being irradiated with ultraviolet light, lose the ability to regenerate catalytic metal ions from a solution of its salt, metal halides are used, namely tin chloride, or titanium chloride, or lead chloride. 6.Способ по и. 4, отличающийс  тем, что в качестве соли .металла, способней после облучени  ультрафиолетовым светом восстанавливать ионы каталитического метал;ia из раствора его соли, используют органическую соль трехвалентного железа, а именно оксалат трехвалентного железа, или цитрат трехвалентного железа, или тартрат трехвалентного железа.6. Method for and. 4, characterized in that, as a metal salt, it is more capable, after irradiation with ultraviolet light, to recover catalytic metal ions; ia from a solution of its salt, organic ferric iron salt, namely ferric oxalate, or ferric citrate, or ferric tartrate is used. S6S6 7. Способ по п. 4, отличающийс  тем,двухвалентной ртути, или тартрат двухвачто в качестве соли металла, способной пос-лентной ртути, ле облучени  ультрафиолетовым светом восстанавливать ионы каталитического метал-Источники информации, прин тые во внила из раствора его соли, используют орга-мание при экспертизе7. The method according to claim 4, wherein bivalent mercury or tartrate is dvuhvarto as a metal salt capable of persistent mercury, by irradiating with ultraviolet light to reduce the ions of catalytic metal. Sources of information taken from the salt solution, use organization during examination ническую соль двухвалентной ртути, а имен- 1. Патент Японии № 8077, кл. 596415,nical salt of divalent mercury, and the name- 1. Japanese patent number 8077, cl. 596415, но оксалат двухвалентной ртути, или цитрат27.03.68.but bivalent mercury oxalate, or citrate 27.03.68. 668632668632
SU691324306A 1968-04-09 1969-04-08 Printed circuit board manufacturing method SU668632A3 (en)

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US71997668A 1968-04-09 1968-04-09

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US (1) US3562005A (en)
BE (1) BE729860A (en)
CH (1) CH531571A (en)
CS (1) CS158640B2 (en)
DE (1) DE1917474C3 (en)
FR (1) FR2005828A1 (en)
GB (1) GB1266193A (en)
NL (1) NL150519B (en)
SE (1) SE349668B (en)
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DE1917474C3 (en) 1980-08-21
CH531571A (en) 1972-12-15
GB1266193A (en) 1972-03-08
NL150519B (en) 1976-08-16
FR2005828A1 (en) 1969-12-19
BE729860A (en) 1969-08-18
DE1917474B2 (en) 1975-01-02
DE1917474A1 (en) 1970-01-08
SE349668B (en) 1972-10-02
NL6905460A (en) 1969-10-13
CS158640B2 (en) 1974-11-25
US3562005A (en) 1971-02-09

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