SU470249A1 - Микросхема - Google Patents

Микросхема

Info

Publication number
SU470249A1
SU470249A1 SU721855795A SU1855795A SU470249A1 SU 470249 A1 SU470249 A1 SU 470249A1 SU 721855795 A SU721855795 A SU 721855795A SU 1855795 A SU1855795 A SU 1855795A SU 470249 A1 SU470249 A1 SU 470249A1
Authority
SU
USSR - Soviet Union
Prior art keywords
resistors
metal substrate
anodic oxide
circuit
capacitors
Prior art date
Application number
SU721855795A
Other languages
English (en)
Inventor
Г.Г. Смолко
Н.М. Чиковани
Original Assignee
Предприятие П/Я Г-4515
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Предприятие П/Я Г-4515 filed Critical Предприятие П/Я Г-4515
Priority to SU721855795A priority Critical patent/SU470249A1/ru
Priority to DE2347649A priority patent/DE2347649C3/de
Priority to FR7340265A priority patent/FR2211835B1/fr
Priority to NL7316941A priority patent/NL7316941A/xx
Priority to GB5927373A priority patent/GB1410119A/en
Priority to US426464A priority patent/US3895272A/en
Application granted granted Critical
Publication of SU470249A1 publication Critical patent/SU470249A1/ru

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/016—Thin-film circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Bipolar Transistors (AREA)

Claims (1)

  1. Эта схема представл ет собой эмиттерный повторитель, в котором резисторы 6 играют роль нагрузки в цепи эмиттера и базы транзистора 8. Формула изобретени 
    Микросхема, содержаща  подложку из вентильного металла с анодной окисной плед-
    S.OK на ее поверхности, разводку, активные элементы, резисторы и конденсаторы, о т- пинающа с  тем, что, с целью повышени  плотности монтажа и .надежности, все элементы сформированы не5 посредственно на анодной окисной пленке, причем в качестве одной из обкладок конденсаторов использована металлическа  подложка .
SU721855795A 1972-12-20 1972-12-20 Микросхема SU470249A1 (ru)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SU721855795A SU470249A1 (ru) 1972-12-20 1972-12-20 Микросхема
DE2347649A DE2347649C3 (de) 1972-12-20 1973-09-21 Dünnfilmschaltung
FR7340265A FR2211835B1 (ru) 1972-12-20 1973-11-13
NL7316941A NL7316941A (ru) 1972-12-20 1973-12-11
GB5927373A GB1410119A (en) 1972-12-20 1973-12-20 Thin-film microcircuits
US426464A US3895272A (en) 1972-12-20 1973-12-20 Thin-film microcircuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU721855795A SU470249A1 (ru) 1972-12-20 1972-12-20 Микросхема

Publications (1)

Publication Number Publication Date
SU470249A1 true SU470249A1 (ru) 1976-08-05

Family

ID=20534692

Family Applications (1)

Application Number Title Priority Date Filing Date
SU721855795A SU470249A1 (ru) 1972-12-20 1972-12-20 Микросхема

Country Status (6)

Country Link
US (1) US3895272A (ru)
DE (1) DE2347649C3 (ru)
FR (1) FR2211835B1 (ru)
GB (1) GB1410119A (ru)
NL (1) NL7316941A (ru)
SU (1) SU470249A1 (ru)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU546240A1 (ru) * 1975-03-25 1978-09-25 Предприятие П/Я Г-4515 Микросхема
US4188652A (en) * 1978-01-17 1980-02-12 Smolko Gennady G Electronic device
DE3137708A1 (de) * 1981-09-22 1983-04-07 Siemens AG, 1000 Berlin und 8000 München Integratorschaltung mit einem differenzverstaerker
WO1989002095A1 (en) * 1987-08-27 1989-03-09 Hughes Aircraft Company Lcmos displays fabricated with implant treated silicon wafers
US4839707A (en) * 1987-08-27 1989-06-13 Hughes Aircraft Company LCMOS displays fabricated with implant treated silicon wafers
US4920329A (en) * 1989-09-13 1990-04-24 Motorola, Inc. Impedance-compensated thick-film resistor
US5859581A (en) 1997-06-20 1999-01-12 International Resistive Company, Inc. Thick film resistor assembly for fan controller
US6720577B2 (en) * 2000-09-06 2004-04-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
AU2001296281A1 (en) * 2000-09-21 2002-04-02 Michaeld. Casper Integrated thin film capacitor/inductor/interconnect system and method
US6890629B2 (en) * 2001-09-21 2005-05-10 Michael D. Casper Integrated thin film capacitor/inductor/interconnect system and method
JP2005286112A (ja) * 2004-03-30 2005-10-13 Airex Inc プリント配線板及びその製造方法
GB2446839A (en) * 2007-02-22 2008-08-27 Ruey-Feng Tai Semiconductor heat transfer method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2179566A (en) * 1935-08-19 1939-11-14 Globe Union Inc Resistor
US2566666A (en) * 1948-02-13 1951-09-04 Globe Union Inc Printed electronic circuit
US3187226A (en) * 1961-08-07 1965-06-01 Curtiss Wright Corp Miniaturized electrical apparatus with combined heat dissipating and insulating structure
US3353124A (en) * 1963-04-18 1967-11-14 Globe Union Inc Nickel oxide capacitors
CA924418A (en) * 1967-08-03 1973-04-10 Needham Victor Thin film circuits

Also Published As

Publication number Publication date
FR2211835B1 (ru) 1977-08-19
NL7316941A (ru) 1974-06-24
GB1410119A (en) 1975-10-15
DE2347649C3 (de) 1978-04-06
US3895272A (en) 1975-07-15
DE2347649A1 (de) 1974-06-27
FR2211835A1 (ru) 1974-07-19
DE2347649B2 (de) 1977-07-28

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