SU207685A1 - Solder for soldering metals and alloys - Google Patents
Solder for soldering metals and alloysInfo
- Publication number
- SU207685A1 SU207685A1 SU1101881A SU1101881A SU207685A1 SU 207685 A1 SU207685 A1 SU 207685A1 SU 1101881 A SU1101881 A SU 1101881A SU 1101881 A SU1101881 A SU 1101881A SU 207685 A1 SU207685 A1 SU 207685A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solder
- alloys
- soldering metals
- soldering
- metals
- Prior art date
Links
Landscapes
- Ceramic Products (AREA)
Description
Известен нрипой дл пайки различных металлов и сплавов следующего состава (в в/о): никель 0,5-17, бор 0,8-3,5, медь 80-99,5.Known for soldering various metals and alloys of the following composition (w / v): nickel 0.5-17, boron 0.8-3.5, copper 80-99.5.
Дл повышени прочности па ного соединени при пайке твердого сплава со сталью и увеличени эксплуатационной стойкости издели , работающего при повышенных температурах , состав припо вз т в другом соотношении (в о/о): никель 5-8, бор 0,3-0,5; медь 91,5-94,5.In order to increase the strength of a solder joint when brazing a hard alloy with steel and to increase the operational durability of the product operating at elevated temperatures, the composition is soldered in a different ratio (V / O): nickel 5-8, boron 0.3-0.5 ; copper 91.5-94.5.
Предложенный припой хорошо смачивает твердые сплавы и сталь. У припо отсутствует зона хрупкости при высоких темлературах , что позвол ет повысить пластичностьThe proposed solder wets well hard alloys and steel. The solder has no brittleness zone at high temperature, which allows to increase the plasticity
па ных соединении в холодном и гор чем состо ни х .steam connections in cold and hot conditions.
Предмет изобретени Subject invention
Припой дл пайки металлов и сплавов, содерлсащий никель, бор, медь, отличающийс тем, что, с целью повышени прочности па ного соединени при пайке твердого сплава со сталью и увеличени эксплуатационной стойкости издели , работающего При повышенных температурах, его состав вз т в следующем соотношении (в о/о): никель 5-8, бор 0,3-0,5, медь 91,5-94,5.Solder for soldering metals and alloys, containing nickel, boron, copper, characterized in that, in order to increase the strength of the solder joint when brazing a hard alloy with steel and to increase the operational durability of the product operating at elevated temperatures, its composition is taken in the following ratio (in o / o): nickel 5-8, boron 0.3-0.5, copper 91.5-94.5.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU1101881A SU207685A1 (en) | 1966-09-08 | 1966-09-08 | Solder for soldering metals and alloys |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU1101881A SU207685A1 (en) | 1966-09-08 | 1966-09-08 | Solder for soldering metals and alloys |
Publications (1)
Publication Number | Publication Date |
---|---|
SU207685A1 true SU207685A1 (en) | 1967-12-22 |
Family
ID=39967782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU1101881A SU207685A1 (en) | 1966-09-08 | 1966-09-08 | Solder for soldering metals and alloys |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU207685A1 (en) |
-
1966
- 1966-09-08 SU SU1101881A patent/SU207685A1/en active
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