SU186261A1 - PILES OF MOLIBDEN AND HIS ALLOYS - Google Patents
PILES OF MOLIBDEN AND HIS ALLOYSInfo
- Publication number
- SU186261A1 SU186261A1 SU915885A SU915885A SU186261A1 SU 186261 A1 SU186261 A1 SU 186261A1 SU 915885 A SU915885 A SU 915885A SU 915885 A SU915885 A SU 915885A SU 186261 A1 SU186261 A1 SU 186261A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- alloys
- molibden
- piles
- solder
- molybdenum
- Prior art date
Links
Landscapes
- Ceramic Products (AREA)
Description
Известен припой, используемый дл пайки молибдена и его сплавов, следующего состава: марганец 28-30%, никель 28-30%, медь - остальное.The solder used for soldering molybdenum and its alloys of the following composition is known: manganese 28-30%, nickel 28-30%, copper - the rest.
Дл по ышени жаропрочности и пластичности па ного соединени в состав припо введен молибден в количестве 0,5-3,0%, а остальные компоненты вз ты в следующем соотношении: марганец 38-42%, никель 18- 22%, медь 38-42%.In order to increase the heat resistance and plasticity of the brazed compound, molybdenum is introduced into the composition of the solder in an amount of 0.5-3.0%, and the remaining components are taken in the following ratio: manganese 38-42%, nickel 18-22%, copper 38-42 %
Соотношение компоиентов в предложенном припое позвол ет получить в па ном соединении структуру твердого раствора, котора обеспечивает высокую прочность и пластичность швов.The ratio of the components in the proposed solder makes it possible to obtain in the joint compound the structure of a solid solution, which provides high strength and ductility of joints.
Прочность соединений молибдена со сталью на срез, па ных предложенным припоем, при температуре 500°С составл ет 29,1 - 33,5 кг/льиа.The strength of molybdenum compounds with steel in shear, paired by the proposed solder, at a temperature of 500 ° C is 29.1 - 33.5 kg / lia.
Температура плавлени припо 920-950°С, температура пайки 1000°С.The melting point of solder is 920-950 ° C, the soldering temperature is 1000 ° C.
Предмет изобретени Subject invention
Припой дл пайки молибдена и его сплаВОВ , содержащий медь, марганец, никель, огличающийс тем, что, с целью повышени жаропрочности и пластичности па ного соединени , в его состав введен молибден в количестве 0,5-3,0%, а остальные компоненты вз ты в следующем соотношении: марганец 38- 42%, никель 18-22%, медь 38-42%.Solder for soldering molybdenum and its alloys, containing copper, manganese, and nickel, is confronted with the fact that, in order to increase the heat resistance and ductility of the solder compound, molybdenum is introduced into its composition in an amount of you are in the following ratio: manganese 38- 42%, nickel 18-22%, copper 38-42%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU915885A SU186261A1 (en) | 1964-08-10 | 1964-08-10 | PILES OF MOLIBDEN AND HIS ALLOYS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU915885A SU186261A1 (en) | 1964-08-10 | 1964-08-10 | PILES OF MOLIBDEN AND HIS ALLOYS |
Publications (1)
Publication Number | Publication Date |
---|---|
SU186261A1 true SU186261A1 (en) | 1966-09-12 |
Family
ID=39956135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU915885A SU186261A1 (en) | 1964-08-10 | 1964-08-10 | PILES OF MOLIBDEN AND HIS ALLOYS |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU186261A1 (en) |
-
1964
- 1964-08-10 SU SU915885A patent/SU186261A1/en active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SU186261A1 (en) | PILES OF MOLIBDEN AND HIS ALLOYS | |
ATE60812T1 (en) | PROCESS FOR THE PRODUCTION OF CRYSTALS OF INTERMETALLIC COMPOUNDS, IN PARTICULAR INDIVIDUAL SINGLE CRYSTALS, BY COOLING ALLOY MELTS. | |
SU679117A3 (en) | Solder for soldering aluminium alloys | |
SU406671A1 (en) | ALUMINUM SOLDER SOLUTION | |
SU553073A1 (en) | Solder for soldering molybdenum and its alloys | |
Kurguzov | Aluminum Solder Production--Strength of Aluminum-Germanium Solder for Soldering Aluminum Increased by Adding Copper | |
SU195845A1 (en) | ||
SU118690A1 (en) | Heat resistant solder | |
SU490606A1 (en) | Solder for soldering tungsten and its alloys | |
SU147896A1 (en) | Solder for soldering molybdenum with steel | |
SU409811A1 (en) | ||
SU194527A1 (en) | TITAIA PIKES | |
SU176784A1 (en) | TITANIAN PAIKI | |
SU241950A1 (en) | N.V. Kurguzov, I.K. Sklre and A.I. Golubev | |
SU450844A1 (en) | Nickel based alloy | |
SU172050A1 (en) | HIGH-STRENGTH MAGNETIC ALLOY | |
AT204291B (en) | Process for the grain refinement of aluminum and its alloys | |
SU177623A1 (en) | NICKEL-BASED ALLOY | |
SU423593A1 (en) | FLUSH FOR WELDING, PAIKES AND SURFACES | |
SU372045A1 (en) | FLUSHING FOR A METHOD BECKER \\\\\\\\\\\\\\\\\\\\\ h: ^ | |
SU411148A1 (en) | ||
SU219368A1 (en) | ||
SU629029A1 (en) | Soldering-welding flux | |
SU209953A1 (en) | Aluminum-Magnesium Alloy Soldering | |
SU186262A1 (en) | STAINLESS STEEL SHOES |