HK1041715A1 - Electroplating method using combination of vibrational flow of plating bath and plating current of pulse - Google Patents

Electroplating method using combination of vibrational flow of plating bath and plating current of pulse

Info

Publication number
HK1041715A1
HK1041715A1 HK02103418.6A HK02103418A HK1041715A1 HK 1041715 A1 HK1041715 A1 HK 1041715A1 HK 02103418 A HK02103418 A HK 02103418A HK 1041715 A1 HK1041715 A1 HK 1041715A1
Authority
HK
Hong Kong
Prior art keywords
plating
pulse
combination
electroplating method
plating bath
Prior art date
Application number
HK02103418.6A
Other languages
Chinese (zh)
Inventor
大政龍晋
Original Assignee
日本科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本科技股份有限公司 filed Critical 日本科技股份有限公司
Publication of HK1041715A1 publication Critical patent/HK1041715A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F31/00—Mixers with shaking, oscillating, or vibrating mechanisms
    • B01F31/44—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement
    • B01F31/441—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement performing a rectilinear reciprocating movement
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
HK02103418.6A 2000-05-25 2002-05-06 Electroplating method using combination of vibrational flow of plating bath and plating current of pulse HK1041715A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000155046 2000-05-25
JP2000243249 2000-08-10
JP2001129994A JP2002121699A (en) 2000-05-25 2001-04-26 Electroplating method using combination of vibrating flow and impulsive plating current of plating bath

Publications (1)

Publication Number Publication Date
HK1041715A1 true HK1041715A1 (en) 2002-07-19

Family

ID=27343513

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02103418.6A HK1041715A1 (en) 2000-05-25 2002-05-06 Electroplating method using combination of vibrational flow of plating bath and plating current of pulse

Country Status (9)

Country Link
US (1) US20010045360A1 (en)
EP (1) EP1164208A3 (en)
JP (1) JP2002121699A (en)
KR (1) KR100461908B1 (en)
CN (1) CN1335419A (en)
CA (1) CA2349156A1 (en)
HK (1) HK1041715A1 (en)
SG (1) SG94828A1 (en)
TW (1) TW526295B (en)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040019089A (en) 2001-07-31 2004-03-04 세키스이가가쿠 고교가부시키가이샤 Method for Producing Electroconductive Particles
JP3681670B2 (en) * 2001-09-25 2005-08-10 シャープ株式会社 Semiconductor integrated circuit manufacturing apparatus and manufacturing method
US6818115B2 (en) * 2001-10-19 2004-11-16 Viasystems Group, Inc. System and method for electrolytic plating
GB2386907B (en) 2002-03-27 2005-10-26 Isle Coat Ltd Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process
CN100503899C (en) * 2002-03-27 2009-06-24 岛屿涂层有限公司 Process for forming ceramic coatings on metals and alloys, and coatings produced by this process
JP3964263B2 (en) * 2002-05-17 2007-08-22 株式会社デンソー Blind via hole filling method and through electrode forming method
US7345868B2 (en) * 2002-10-07 2008-03-18 Presidio Components, Inc. Multilayer ceramic capacitor with terminal formed by electroless plating
US20050061660A1 (en) * 2002-10-18 2005-03-24 Kempen Hein Van System and method for electrolytic plating
US6884335B2 (en) * 2003-05-20 2005-04-26 Novellus Systems, Inc. Electroplating using DC current interruption and variable rotation rate
US7626179B2 (en) * 2005-09-30 2009-12-01 Virgin Island Microsystems, Inc. Electron beam induced resonance
US7791290B2 (en) 2005-09-30 2010-09-07 Virgin Islands Microsystems, Inc. Ultra-small resonating charged particle beam modulator
US7586097B2 (en) 2006-01-05 2009-09-08 Virgin Islands Microsystems, Inc. Switching micro-resonant structures using at least one director
JP2006131926A (en) * 2004-11-02 2006-05-25 Sharp Corp Plating method for micropore, method for forming gold bump using the same, method for producing semiconductor device, and semiconductor device
JP4856896B2 (en) * 2005-06-02 2012-01-18 新光電気工業株式会社 Lead frame plating method and lead frame
US20070012576A1 (en) * 2005-07-13 2007-01-18 Rohm And Haas Electronic Materials Llc Plating method
JP4458057B2 (en) * 2005-07-28 2010-04-28 Ｔｄｋ株式会社 Plating apparatus and plating method
US7876793B2 (en) 2006-04-26 2011-01-25 Virgin Islands Microsystems, Inc. Micro free electron laser (FEL)
US7728702B2 (en) 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Shielding of integrated circuit package with high-permeability magnetic material
US8188431B2 (en) 2006-05-05 2012-05-29 Jonathan Gorrell Integration of vacuum microelectronic device with integrated circuit
US7732786B2 (en) 2006-05-05 2010-06-08 Virgin Islands Microsystems, Inc. Coupling energy in a plasmon wave to an electron beam
US7728397B2 (en) 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Coupled nano-resonating energy emitting structures
US7986113B2 (en) 2006-05-05 2011-07-26 Virgin Islands Microsystems, Inc. Selectable frequency light emitter
US7990336B2 (en) 2007-06-19 2011-08-02 Virgin Islands Microsystems, Inc. Microwave coupled excitation of solid state resonant arrays
CN101815812A (en) 2008-09-01 2010-08-25 日本科技股份有限公司 Liquid material comprising hydrogen and oxygen, regasified gas comprising hydrogen and oxygen produced from the liquid material, process and apparatus for producing the liquid material and regasified gas, and fuel that does not evolve carbon dioxide
JP5504147B2 (en) * 2010-12-21 2014-05-28 株式会社荏原製作所 Electroplating method
US9666426B2 (en) * 2011-06-24 2017-05-30 Acm Research (Shanghai) Inc. Methods and apparatus for uniformly metallization on substrates
US20130248486A1 (en) * 2012-03-23 2013-09-26 Apple Inc. Electron beam polishing of aluminum
JP5980735B2 (en) * 2012-08-07 2016-08-31 株式会社荏原製作所 Through-hole electroplating method and electroplating apparatus
CN102899708B (en) * 2012-11-05 2015-02-25 无锡宏联电镀设备有限公司 Cathode moving device for electroplating bath
CN104060304A (en) * 2014-06-13 2014-09-24 安徽省宁国天成电工有限公司 Acid tinning electrolyte
JP6463622B2 (en) * 2014-11-27 2019-02-06 Ykk株式会社 Plating equipment, plating unit, and plating line
JP6222145B2 (en) * 2015-03-11 2017-11-01 トヨタ自動車株式会社 Metal film forming apparatus and film forming method
CN105862086B (en) * 2016-05-11 2017-09-22 吉首大学 Disk pulse, sine wave fluted disc, the pulsating of magnetic cylinder three electrolysis deblending slot
CN105908215B (en) * 2016-05-11 2017-11-07 吉首大学 The double pulsating electrolysis deblending slots of ultrasonic pulse, sine wave fluted disc
CN105714331B (en) * 2016-05-11 2017-11-17 盐城云林环保工程有限公司 The double pulsating electrolysis deblending slots of sine wave fluted disc, magnetic cylinder
CN105862085B (en) * 2016-05-11 2017-09-19 吉首大学 Disk stirring pulse, sine wave fluted disc, the pulsating of magnetic cylinder three electrolysis deblending slot
EP3574132A4 (en) 2017-01-26 2020-11-04 Curium US LLC Systems and methods for electroplating sources for alpha spectroscopy
JP6329681B1 (en) * 2017-10-31 2018-05-23 株式会社荏原製作所 Plating apparatus and plating method
CN107952395A (en) * 2017-11-27 2018-04-24 新乡市永振机械设备有限公司 Mix and stir vibrator
TWI690620B (en) * 2018-08-22 2020-04-11 華紹國際有限公司 Electroless plating device and manufacturing method of metallized substrate
CN109023494A (en) * 2018-10-12 2018-12-18 扬州市金杨电镀设备有限公司 The horizontal Tumble-plating device of oscillatory type
CN110359069B (en) * 2019-07-16 2021-01-29 吉林大学 Liquid-phase multi-metal mixed additive manufacturing device and method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4316786A (en) * 1980-09-19 1982-02-23 The United States Of America As Represented By The United States Department Of Energy Apparatus for electroplating particles of small dimension
GB2118973A (en) * 1982-04-27 1983-11-09 Corrintec Uk Ltd Electrical connector and manufacture thereof
JPS62235714A (en) * 1986-04-07 1987-10-15 Hitachi Ltd Formation of magnetic alloy thin film and device therefor
JPS63312996A (en) * 1987-06-15 1988-12-21 Seiko Instr & Electronics Ltd Method for electrodepositing amorphous alloy
US4720330A (en) * 1987-07-06 1988-01-19 The Dow Chemical Company Device and method for electroplating a workpiece having axial symmetry
JPH0230790A (en) * 1988-07-15 1990-02-01 Seiko Instr Inc Method for electrodepositing alloy
JP2992177B2 (en) * 1993-05-17 1999-12-20 日本テクノ株式会社 Chrome barrel plating equipment
DE4322378A1 (en) * 1993-07-06 1995-01-12 Hans Henig Method and device for the surface treatment, in the horizontal operating position, of workpieces which are primarily in the form of boards
US5684683A (en) * 1996-02-09 1997-11-04 Wisconsin Alumni Research Foundation DC-to-DC power conversion with high current output
US6261435B1 (en) * 1997-10-21 2001-07-17 Nihon Techno Kabushiki Kaisha Plating method
WO2000020662A1 (en) * 1998-10-05 2000-04-13 Semitool, Inc. Submicron metallization using electrochemical deposition
US6126808A (en) * 1998-03-23 2000-10-03 Pioneer Metal Finishing Method and apparatus for anodizing objects
JP3340669B2 (en) * 1998-03-24 2002-11-05 株式会社ジャパンエナジー Copper plating method and copper plating solution
KR100616198B1 (en) * 1998-04-21 2006-08-25 어플라이드 머티어리얼스, 인코포레이티드 Electro-chemical deposition system and method of electroplating on substrates
JP3641372B2 (en) * 1998-10-21 2005-04-20 株式会社荏原製作所 Electrolytic plating method and electrolytic plating apparatus

Also Published As

Publication number Publication date
TW526295B (en) 2003-04-01
KR20010107788A (en) 2001-12-07
KR100461908B1 (en) 2004-12-14
JP2002121699A (en) 2002-04-26
CN1335419A (en) 2002-02-13
SG94828A1 (en) 2003-03-18
EP1164208A2 (en) 2001-12-19
US20010045360A1 (en) 2001-11-29
CA2349156A1 (en) 2001-11-25
EP1164208A3 (en) 2003-10-08

Similar Documents

Publication Publication Date Title
HK1041715A1 (en) Electroplating method using combination of vibrational flow of plating bath and plating current of pulse
DE69924807D1 (en) Tin-copper alloy electroplating bath and plating process with this bath
EP1226426A4 (en) Method and apparatus for determination of additives in metal plating baths
AU2003226367A8 (en) Electropolishing and electroplating methods
HK1097008A1 (en) Iron-phosphorus electroplating bath and method
EP1558794A4 (en) Measurement of the concentration of a reducing agent in an electroless plating bath
HK1072446A1 (en) Device and method for regenerating an electroless metal plating bath
EP1048757A4 (en) Plating method and apparatus
EP1681372A4 (en) Electroless copper plating solution and method for electroless copper plating
EP1347075A4 (en) Method of salt bath nitriding for producing iron member having improved corrosion resistance and iron parts
GB9724284D0 (en) Electroplating baths and plating processes for nickel or nickel alloy
SG98017A1 (en) Method of forming selective electronics plating on polymer surfaces
GB2346620B (en) Sn-Bi alloy plating bath and method of plating using the same
AU2003265370A8 (en) Pulse reverse electrolysis of acidic copper electroplating solutions
SG83221A1 (en) Alloy composition and plating method
EP1146147A4 (en) Gold plating liquid and method of plating using the gold plating liquid
GB2351089B (en) Platinum electroforming/electroplating bath and method
AU2002365457A8 (en) Electrolysis bath for electrodepositing silver-tin alloys
AU2003291062A8 (en) Reduction of surface oxidation during electroplating
AU6057200A (en) Method and electroplating solution for plating antimony and antimony alloy coatings
AU2003242749A8 (en) Electrolytic bath for the electrodeposition of noble metals and their alloys
GB2387229B (en) Bath water-level sounder
GB0201441D0 (en) Method of electroless plating and ceramic capacitor
HK1038383A1 (en) Palladium electroplating bath and process for electroplating
GB0017741D0 (en) Zinc and zinc alloy electroplating additives and electroplating methods