SG93928A1 - Electroconductive resin composition - Google Patents
Electroconductive resin compositionInfo
- Publication number
- SG93928A1 SG93928A1 SG200201092A SG200201092A SG93928A1 SG 93928 A1 SG93928 A1 SG 93928A1 SG 200201092 A SG200201092 A SG 200201092A SG 200201092 A SG200201092 A SG 200201092A SG 93928 A1 SG93928 A1 SG 93928A1
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- electroconductive resin
- electroconductive
- composition
- resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0869—Acids or derivatives thereof
- C08L23/0884—Epoxide containing esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/22—Thermoplastic resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/04—Thermoplastic elastomer
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001054760A JP2002256125A (en) | 2001-02-28 | 2001-02-28 | Conductive resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
SG93928A1 true SG93928A1 (en) | 2003-01-21 |
Family
ID=18915045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200201092A SG93928A1 (en) | 2001-02-28 | 2002-02-20 | Electroconductive resin composition |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2002256125A (en) |
KR (1) | KR20020070825A (en) |
CN (1) | CN1373153A (en) |
HK (1) | HK1049348A1 (en) |
SG (1) | SG93928A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE346887T1 (en) | 2002-01-07 | 2006-12-15 | Denki Kagaku Kogyo Kk | ELECTRICALLY CONDUCTIVE RESIN COMPOSITION |
JP4939943B2 (en) * | 2004-09-07 | 2012-05-30 | 電気化学工業株式会社 | Conductive composite sheet |
JP5154081B2 (en) * | 2004-09-16 | 2013-02-27 | 電気化学工業株式会社 | Composite sheet |
JP5259131B2 (en) * | 2007-07-02 | 2013-08-07 | 電気化学工業株式会社 | Resin composition and sheet |
FR2924434B1 (en) * | 2007-12-04 | 2010-12-17 | Rhodia Operations | POLYAMIDE COMPOSITION STABILIZED FOR HEAT AND LIGHT |
KR100975331B1 (en) * | 2008-12-26 | 2010-08-12 | 권오건 | Ultrasonic Inspector Assemble |
JP5419078B2 (en) * | 2009-06-26 | 2014-02-19 | 太平化学製品株式会社 | Conductive resin composition, conductive sheet and molded article for countermeasure against static electricity |
KR101102312B1 (en) * | 2010-02-26 | 2012-01-03 | 주식회사 에네스코 | The water column wedge unit for the automated ultrasonic test on blade pins of turbine in the power plant |
JP2014009337A (en) * | 2012-07-02 | 2014-01-20 | Sumitomo Bakelite Co Ltd | Substrate sheet for electronic component packaging, multilayer sheet for electronic component packaging, carrier tape for electronic component packaging, and electronic component transportation body |
CN104031350B (en) * | 2014-06-17 | 2017-08-25 | 东莞市德诚塑化科技有限公司 | A kind of capacitance pen writing pencil materials, preparation method and its usage |
CN104861405A (en) * | 2015-05-11 | 2015-08-26 | 昆山恒光塑料制品有限公司 | Composite conductive master batch and production process thereof |
US9741677B1 (en) * | 2016-03-01 | 2017-08-22 | Infineon Technologies Ag | Semiconductor device including antistatic die attach material |
CN106947202A (en) * | 2017-05-05 | 2017-07-14 | 安徽彩晶光电有限公司 | The high-strength resistant plastics frame of LCD TV |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5707699A (en) * | 1995-01-26 | 1998-01-13 | Denki Kagaku Kogyo Kabushiki Kaisha | Electroconductive resin composition, sheet, molded product and container |
US5747164A (en) * | 1995-09-19 | 1998-05-05 | Denki Kagaku Kogyo Kabushiki Kaisha | Conductive composite plastic sheet and container |
WO2001009241A1 (en) * | 1999-07-29 | 2001-02-08 | Shanghai Genius Advanced Material Co. Ltd. | High fluidible, impact resistant conductive acrylonitrile-butadiene-styrene terpolymer material and preparing method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3202553B2 (en) * | 1995-09-19 | 2001-08-27 | 電気化学工業株式会社 | Conductive composite plastic sheet and container |
JPH101603A (en) * | 1996-06-17 | 1998-01-06 | Sumitomo Chem Co Ltd | Thermoplastic resin composition and ic tray |
JP3456416B2 (en) * | 1998-06-03 | 2003-10-14 | 住友化学工業株式会社 | Resin composition |
JP2000141554A (en) * | 1998-08-31 | 2000-05-23 | Dainippon Ink & Chem Inc | Conductive sheet, its production and molded product |
-
2001
- 2001-02-28 JP JP2001054760A patent/JP2002256125A/en active Pending
-
2002
- 2002-02-20 SG SG200201092A patent/SG93928A1/en unknown
- 2002-02-27 KR KR1020020010454A patent/KR20020070825A/en not_active Application Discontinuation
- 2002-02-28 CN CN02105392A patent/CN1373153A/en active Pending
-
2003
- 2003-03-03 HK HK03101554.3A patent/HK1049348A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5707699A (en) * | 1995-01-26 | 1998-01-13 | Denki Kagaku Kogyo Kabushiki Kaisha | Electroconductive resin composition, sheet, molded product and container |
US5747164A (en) * | 1995-09-19 | 1998-05-05 | Denki Kagaku Kogyo Kabushiki Kaisha | Conductive composite plastic sheet and container |
WO2001009241A1 (en) * | 1999-07-29 | 2001-02-08 | Shanghai Genius Advanced Material Co. Ltd. | High fluidible, impact resistant conductive acrylonitrile-butadiene-styrene terpolymer material and preparing method thereof |
Also Published As
Publication number | Publication date |
---|---|
CN1373153A (en) | 2002-10-09 |
HK1049348A1 (en) | 2003-05-09 |
JP2002256125A (en) | 2002-09-11 |
KR20020070825A (en) | 2002-09-11 |
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