SG93903A1 - Heat-peelable pressure-sensitive adhesive sheet - Google Patents

Heat-peelable pressure-sensitive adhesive sheet

Info

Publication number
SG93903A1
SG93903A1 SG200006284A SG200006284A SG93903A1 SG 93903 A1 SG93903 A1 SG 93903A1 SG 200006284 A SG200006284 A SG 200006284A SG 200006284 A SG200006284 A SG 200006284A SG 93903 A1 SG93903 A1 SG 93903A1
Authority
SG
Singapore
Prior art keywords
heat
sensitive adhesive
adhesive sheet
peelable pressure
pressure
Prior art date
Application number
SG200006284A
Other languages
English (en)
Inventor
Murata Akihisa
Oshima Toshiyuki
Arimitsu Yukio
Kiuchi Kazuyuki
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG93903A1 publication Critical patent/SG93903A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1142—Changing dimension during delaminating [e.g., crushing, expanding, warping, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
SG200006284A 1999-11-08 2000-11-01 Heat-peelable pressure-sensitive adhesive sheet SG93903A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31682099A JP3594853B2 (ja) 1999-11-08 1999-11-08 加熱剥離型粘着シート

Publications (1)

Publication Number Publication Date
SG93903A1 true SG93903A1 (en) 2003-01-21

Family

ID=18081289

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200006284A SG93903A1 (en) 1999-11-08 2000-11-01 Heat-peelable pressure-sensitive adhesive sheet

Country Status (10)

Country Link
US (1) US7163597B2 (de)
EP (1) EP1097977B1 (de)
JP (1) JP3594853B2 (de)
KR (2) KR100537255B1 (de)
CN (1) CN1227313C (de)
AT (1) ATE290578T1 (de)
DE (1) DE60018525T2 (de)
MY (1) MY123708A (de)
SG (1) SG93903A1 (de)
TW (1) TWI222991B (de)

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JP4651805B2 (ja) * 2000-11-08 2011-03-16 日東電工株式会社 加熱剥離型粘着シート
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JP2006030294A (ja) * 2004-07-12 2006-02-02 Nitto Denko Corp フレキシブル光導波路の製法
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JP4891659B2 (ja) * 2006-06-02 2012-03-07 日東電工株式会社 ダイシング用粘着シート
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JP5283838B2 (ja) 2006-11-04 2013-09-04 日東電工株式会社 熱剥離性粘着シート及び被着体回収方法
JP2008144116A (ja) * 2006-12-13 2008-06-26 Nitto Denko Corp 両面粘着シートおよび液晶表示装置
JP5068578B2 (ja) * 2007-05-02 2012-11-07 日東電工株式会社 両面粘着シートおよび液晶表示装置
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CN102676074A (zh) * 2012-01-08 2012-09-19 荆门市维益电子包装材料有限公司 感温剥离膜片生产工艺
JP2013147541A (ja) * 2012-01-17 2013-08-01 Nitto Denko Corp 粘着剤用ポリマー、粘着剤組成物及び熱剥離性粘着シート
WO2013114955A1 (ja) * 2012-01-30 2013-08-08 日東電工株式会社 加熱剥離型摺動用保護テープ
JP2013177549A (ja) * 2012-01-30 2013-09-09 Nitto Denko Corp 加熱剥離型摺動用保護テープ
JP5921927B2 (ja) * 2012-03-27 2016-05-24 日東電工株式会社 加熱剥離型粘着シート
JP6000595B2 (ja) * 2012-03-27 2016-09-28 日東電工株式会社 電子部品切断用加熱剥離型粘着シート及び電子部品加工方法
CN102703018B (zh) * 2012-05-30 2014-06-25 朱立超 一种粘合剂及其制备方法
JP2014040595A (ja) * 2013-09-26 2014-03-06 Nitto Denko Corp 熱剥離性感圧接着テープ又はシート
JP6407535B2 (ja) * 2014-02-28 2018-10-17 ソマール株式会社 粘着シート及び被着体積層物の製造方法
JP6407536B2 (ja) * 2014-02-28 2018-10-17 ソマール株式会社 粘着シート及び被着体積層物の製造方法
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CN110088182A (zh) * 2016-12-12 2019-08-02 3M创新有限公司 薄泡沫带材
JP6908395B2 (ja) 2017-02-28 2021-07-28 日東電工株式会社 粘着テープ
JP6792700B2 (ja) * 2017-08-09 2020-11-25 リンテック株式会社 加工検査対象物の加熱剥離方法
WO2019112033A1 (ja) 2017-12-07 2019-06-13 リンテック株式会社 粘着性積層体、粘着性積層体の使用方法、及び半導体装置の製造方法
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WO2020189568A1 (ja) 2019-03-15 2020-09-24 リンテック株式会社 粘着シート及び半導体装置の製造方法
JPWO2020196756A1 (de) 2019-03-28 2020-10-01
JPWO2020196757A1 (de) 2019-03-28 2020-10-01
WO2020196755A1 (ja) 2019-03-28 2020-10-01 リンテック株式会社 粘着シート、粘着シートの製造方法及び半導体装置の製造方法
CN110446143B (zh) * 2019-07-05 2021-03-09 歌尔股份有限公司 发声装置的振膜以及发声装置
KR20220025077A (ko) 2019-08-06 2022-03-03 닛토덴코 가부시키가이샤 점착 테이프
EP4011616A4 (de) 2019-08-06 2023-08-30 Nitto Denko Corporation Klebeband
KR20220117232A (ko) 2019-12-20 2022-08-23 닛토덴코 가부시키가이샤 점착 시트
CN114829525A (zh) 2019-12-20 2022-07-29 日东电工株式会社 粘合片
US20230026069A1 (en) 2019-12-20 2023-01-26 Nitto Denko Corporation Adhesive sheet
US20220372349A1 (en) 2019-12-27 2022-11-24 Nitto Denko Corporation Adhesive sheet
WO2021131517A1 (ja) 2019-12-27 2021-07-01 日東電工株式会社 粘着シート
JP2021113297A (ja) * 2020-01-21 2021-08-05 積水化学工業株式会社 粘着テープ、及びその製造方法
CN115023801A (zh) 2020-01-27 2022-09-06 琳得科株式会社 带保护膜的半导体芯片的剥离方法
JPWO2021153360A1 (de) 2020-01-27 2021-08-05
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JP7155210B2 (ja) * 2020-09-18 2022-10-18 日東電工株式会社 粘着シート
JP2022155610A (ja) 2021-03-31 2022-10-14 日東電工株式会社 粘着シート

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JP4010643B2 (ja) 1998-04-23 2007-11-21 日東電工株式会社 加熱剥離型粘着シート
US7214424B2 (en) 1999-03-01 2007-05-08 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10168401A (ja) * 1996-12-13 1998-06-23 Nitto Denko Corp 印刷用シート
JPH11166164A (ja) * 1997-12-01 1999-06-22 Nitto Denko Corp 加熱剥離型粘着シート

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EP1097977B1 (de) 2005-03-09
US7163597B2 (en) 2007-01-16
CN1295103A (zh) 2001-05-16
KR100602298B1 (ko) 2006-07-19
KR100537255B1 (ko) 2005-12-19
KR20010051480A (ko) 2001-06-25
EP1097977A3 (de) 2001-08-08
CN1227313C (zh) 2005-11-16
JP2001131507A (ja) 2001-05-15
TWI222991B (en) 2004-11-01
US20030203193A1 (en) 2003-10-30
DE60018525D1 (de) 2005-04-14
ATE290578T1 (de) 2005-03-15
KR20050097908A (ko) 2005-10-10
DE60018525T2 (de) 2005-07-28
JP3594853B2 (ja) 2004-12-02
MY123708A (en) 2006-05-31
EP1097977A2 (de) 2001-05-09

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