SG87885A1 - Method for manufacturing solid electrolytic capacitor and machine for manufacturing the same - Google Patents

Method for manufacturing solid electrolytic capacitor and machine for manufacturing the same

Info

Publication number
SG87885A1
SG87885A1 SG200000738A SG200000738A SG87885A1 SG 87885 A1 SG87885 A1 SG 87885A1 SG 200000738 A SG200000738 A SG 200000738A SG 200000738 A SG200000738 A SG 200000738A SG 87885 A1 SG87885 A1 SG 87885A1
Authority
SG
Singapore
Prior art keywords
manufacturing
machine
same
electrolytic capacitor
solid electrolytic
Prior art date
Application number
SG200000738A
Other languages
English (en)
Inventor
Masatoshi Tasei
Kenji Kuranuki
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG87885A1 publication Critical patent/SG87885A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
SG200000738A 1999-02-09 2000-02-08 Method for manufacturing solid electrolytic capacitor and machine for manufacturing the same SG87885A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03095099A JP3711776B2 (ja) 1999-02-09 1999-02-09 固体電解コンデンサの製造方法およびその製造装置

Publications (1)

Publication Number Publication Date
SG87885A1 true SG87885A1 (en) 2002-04-16

Family

ID=12317968

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200000738A SG87885A1 (en) 1999-02-09 2000-02-08 Method for manufacturing solid electrolytic capacitor and machine for manufacturing the same

Country Status (6)

Country Link
US (1) US6409775B1 (fr)
EP (1) EP1035555B1 (fr)
JP (1) JP3711776B2 (fr)
DE (1) DE60034902T2 (fr)
SG (1) SG87885A1 (fr)
TW (1) TW439077B (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1537980S (fr) * 2015-04-20 2015-11-16
JP1537979S (fr) * 2015-04-20 2015-11-16
JP1537981S (fr) * 2015-04-20 2015-11-16
CN112086288B (zh) * 2020-10-19 2022-07-29 湖南盛通电子科技有限公司 一种贴片式固态塑封电容器的制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0448712A (ja) * 1990-06-15 1992-02-18 Elna Co Ltd チップ部品のエージング方法
JPH0936006A (ja) * 1995-07-18 1997-02-07 Rohm Co Ltd 固体電解コンデンサの製造に使用するコンデンサ素子の供給装置
JPH1187175A (ja) * 1997-09-02 1999-03-30 Nec Toyama Ltd チップ型固体電解コンデンサの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5682218A (en) * 1979-12-10 1981-07-04 Fujitsu Ltd Continuous automatic mold molding apparatus
GB2141583A (en) * 1983-06-17 1984-12-19 Standard Telephones Cables Ltd Leadless capacitors
JPH02148820A (ja) * 1988-11-30 1990-06-07 Hitachi Condenser Co Ltd モールド型電子部品の製造方法
JP2973499B2 (ja) * 1990-09-13 1999-11-08 松下電器産業株式会社 チップ型固体電解コンデンサ
JP3160921B2 (ja) * 1991-03-06 2001-04-25 松下電器産業株式会社 固体電解コンデンサの製造方法
JP2827623B2 (ja) * 1991-10-03 1998-11-25 日立エーアイシー株式会社 モールド型電子部品の製造方法及びリードフレーム
JPH0621293A (ja) * 1992-06-29 1994-01-28 Rohm Co Ltd アキシャルリードフレーム
SG67384A1 (en) * 1997-04-10 1999-09-21 Texas Instr Singapore Pte Ltd Integrated circuit package and flat plate molding process for integrated circuit package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0448712A (ja) * 1990-06-15 1992-02-18 Elna Co Ltd チップ部品のエージング方法
JPH0936006A (ja) * 1995-07-18 1997-02-07 Rohm Co Ltd 固体電解コンデンサの製造に使用するコンデンサ素子の供給装置
JPH1187175A (ja) * 1997-09-02 1999-03-30 Nec Toyama Ltd チップ型固体電解コンデンサの製造方法

Also Published As

Publication number Publication date
EP1035555A2 (fr) 2000-09-13
TW439077B (en) 2001-06-07
US6409775B1 (en) 2002-06-25
JP3711776B2 (ja) 2005-11-02
DE60034902D1 (de) 2007-07-05
EP1035555B1 (fr) 2007-05-23
EP1035555A3 (fr) 2005-01-12
DE60034902T2 (de) 2007-09-20
JP2000228339A (ja) 2000-08-15

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