SG48189G - Method of punching a laminate for electrical use - Google Patents

Method of punching a laminate for electrical use

Info

Publication number
SG48189G
SG48189G SG48189A SG48189A SG48189G SG 48189 G SG48189 G SG 48189G SG 48189 A SG48189 A SG 48189A SG 48189 A SG48189 A SG 48189A SG 48189 G SG48189 G SG 48189G
Authority
SG
Singapore
Prior art keywords
punching
laminate
electrical use
electrical
Prior art date
Application number
SG48189A
Other languages
English (en)
Original Assignee
Hitachi Ltd
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Chemical Co Ltd filed Critical Hitachi Ltd
Publication of SG48189G publication Critical patent/SG48189G/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00—Shaping by press-cutting; Perforating
    • B21D28/24—Perforating, i.e. punching holes
    • B21D28/26—Perforating, i.e. punching holes in sheets or flat parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Manufacture Of Motors, Generators (AREA)
SG48189A 1985-08-07 1989-08-07 Method of punching a laminate for electrical use SG48189G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60172350A JPS6234798A (ja) 1985-08-07 1985-08-07 プリント基板打抜き方法

Publications (1)

Publication Number Publication Date
SG48189G true SG48189G (en) 1989-12-08

Family

ID=15940269

Family Applications (1)

Application Number Title Priority Date Filing Date
SG48189A SG48189G (en) 1985-08-07 1989-08-07 Method of punching a laminate for electrical use

Country Status (5)

Country Link
JP (1) JPS6234798A (ja)
KR (1) KR870002754A (ja)
CN (1) CN1011206B (ja)
GB (1) GB2179884B (ja)
SG (1) SG48189G (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2663807A1 (fr) * 1990-06-26 1991-12-27 Philips Composants Appareil et systeme de poinconnage de circuits imprimes.
DE4041507A1 (de) * 1990-12-22 1992-06-25 Bosch Gmbh Robert Verfahren zum fuegen einer leiterbahnfolie mit einem elektrischen bauteil, damit erzeugtes geraet sowie vorrichtung zum montieren einer leiterbahnfolie
DE19751238A1 (de) * 1997-11-19 1999-05-27 Feintool Int Holding Vorrichtung zum Herstellen eines Werkstückes durch Stanzen
JP3930300B2 (ja) * 2001-11-20 2007-06-13 日本碍子株式会社 打抜同時積層用打抜金型
JP4646908B2 (ja) * 2004-05-10 2011-03-09 株式会社 ベアック トリミング装置及びトリミング方法
CN101637926B (zh) * 2009-07-28 2013-06-19 珠海元盛电子科技股份有限公司 用于制作粘结层的钢刀模及制作粘结层的方法
CN102189565A (zh) * 2010-03-17 2011-09-21 车兆丰 包装薄片器件的盲孔纸带、其冲压方法和专用冲压模具
JP5197870B1 (ja) * 2012-02-11 2013-05-15 株式会社メイク・ア・ボックス 打抜機のバランス補正シートの作製方法、打抜機のバランス補正型、並びに打抜機のバランス補正方法、及び打抜機のバランス補正シート
CN102886425A (zh) * 2012-09-17 2013-01-23 芜湖市续元工贸有限公司 钣金件冲孔模
CN102990710A (zh) * 2012-10-29 2013-03-27 茅惠杰 一种改进的打孔机构
CN103753642B (zh) * 2013-11-08 2015-12-30 青岛盈科精密橡塑有限公司 一种用于高分子高黏胶产品的定位成型模具
CN106604556B (zh) * 2017-02-23 2018-01-19 江西联益电子科技有限公司 一种pcb电路板加工装置
CN106925812B (zh) * 2017-03-10 2018-09-18 长沙天恒测控技术有限公司 用于电工钢片表面绝缘电阻测量装置的无动力钻孔器
CN109721235A (zh) * 2019-01-22 2019-05-07 江苏先河激光技术有限公司 手机显示屏裂片装置及手机显示屏加工***
CN110014476B (zh) * 2019-04-12 2020-11-10 江苏神通阀门股份有限公司 一种橡胶膜片冲剪模具的使用方法
CN110154154B (zh) * 2019-05-29 2021-06-15 安徽大华半导体科技有限公司 一种切筋成型装置
CN110202638B (zh) * 2019-06-12 2021-06-04 惠州市盈帆实业有限公司 一种复合电路板的沉头孔的制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB465198A (en) * 1934-07-27 1937-04-27 Charles Hathaway Howland Shear Improvements relating to the mechanical working of substances
GB465197A (en) * 1934-07-27 1937-04-27 Charles Hathaway Howland Shear Improvements relating to the cold working of materials
GB465196A (en) * 1935-07-27 1937-04-27 Charles Hathaway Howland Shear Improvements relating to the production of cold flow in substances
JPS59169799A (ja) * 1983-03-15 1984-09-25 塩出　高睦 油圧精密パンチングプレス

Also Published As

Publication number Publication date
CN1011206B (zh) 1991-01-16
GB2179884B (en) 1989-04-05
GB8619051D0 (en) 1986-09-17
GB2179884A (en) 1987-03-18
CN86104935A (zh) 1987-02-04
JPS6234798A (ja) 1987-02-14
KR870002754A (ko) 1987-04-06

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