SG161133A1 - System and method for engaging singulated substrates - Google Patents

System and method for engaging singulated substrates

Info

Publication number
SG161133A1
SG161133A1 SG200808274-5A SG2008082745A SG161133A1 SG 161133 A1 SG161133 A1 SG 161133A1 SG 2008082745 A SG2008082745 A SG 2008082745A SG 161133 A1 SG161133 A1 SG 161133A1
Authority
SG
Singapore
Prior art keywords
unit
engagement
engaging
pickers
assembly
Prior art date
Application number
SG200808274-5A
Inventor
Seung Ho Baek
Jong Jae Jung
Hae Choon Yang
Original Assignee
Rokko Systems Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rokko Systems Pte Ltd filed Critical Rokko Systems Pte Ltd
Priority to SG200808274-5A priority Critical patent/SG161133A1/en
Priority to PCT/SG2009/000406 priority patent/WO2010053451A2/en
Priority to TW098137503A priority patent/TW201027658A/en
Publication of SG161133A1 publication Critical patent/SG161133A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

A unit picker assembly for engaging singulated IC units, the assembly comprising; a plurality of unit pickers, each unit picker having an engagement end for engagement of an IC unit; each of said unit pickers movably mounted to permit movement from a retracted position to a unit engagement position; an actuator assembly arranged to move to a plurality of actuating positions, each of said positions corresponding to one of said unit pickers from the retracted position to the unit engagement position; wherein whilst in any of said actuating positions the actuator assembly is arranged to move the corresponding unit picker from the retracted position to the engagement position. Figure IA
SG200808274-5A 2008-11-04 2008-11-04 System and method for engaging singulated substrates SG161133A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG200808274-5A SG161133A1 (en) 2008-11-04 2008-11-04 System and method for engaging singulated substrates
PCT/SG2009/000406 WO2010053451A2 (en) 2008-11-04 2009-11-04 System and method for engaging singulated subtrates
TW098137503A TW201027658A (en) 2008-11-04 2009-11-04 System and method for engaging singulated subtrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200808274-5A SG161133A1 (en) 2008-11-04 2008-11-04 System and method for engaging singulated substrates

Publications (1)

Publication Number Publication Date
SG161133A1 true SG161133A1 (en) 2010-05-27

Family

ID=42153440

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200808274-5A SG161133A1 (en) 2008-11-04 2008-11-04 System and method for engaging singulated substrates

Country Status (3)

Country Link
SG (1) SG161133A1 (en)
TW (1) TW201027658A (en)
WO (1) WO2010053451A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201404526A (en) * 2012-07-17 2014-02-01 Horng Terng Automation Co Ltd Equidistant openness adjustment mechanism
CN104003187A (en) * 2014-06-03 2014-08-27 苏州博众精工科技有限公司 Grabbing rotation mechanism

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100792485B1 (en) * 2006-07-01 2008-01-10 (주)테크윙 Pick-and-place apparatus
SG142198A1 (en) * 2006-11-03 2008-05-28 Rokko Systems Pte Ltd A unit lifter assembly
KR100908496B1 (en) * 2007-04-02 2009-08-04 이건소 Vacuum adsorption picker apparatus of handler
KR100822995B1 (en) * 2007-06-27 2008-04-16 윤점채 Pick and place unit in singulation handler

Also Published As

Publication number Publication date
TW201027658A (en) 2010-07-16
WO2010053451A2 (en) 2010-05-14
WO2010053451A3 (en) 2013-02-28

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