SG158041A1 - Polishing apparatus of substrate end face and polishing determining method - Google Patents

Polishing apparatus of substrate end face and polishing determining method

Info

Publication number
SG158041A1
SG158041A1 SG200904144-3A SG2009041443A SG158041A1 SG 158041 A1 SG158041 A1 SG 158041A1 SG 2009041443 A SG2009041443 A SG 2009041443A SG 158041 A1 SG158041 A1 SG 158041A1
Authority
SG
Singapore
Prior art keywords
polishing
substrate
face
polishing wheel
substrate end
Prior art date
Application number
SG200904144-3A
Inventor
Katsuhiko Tatsuda
Soushi Yamagishi
Osamu Ikai
Yutaka Matsuoka
Hironori Ise
Original Assignee
Nakamura Tome Prec Industry Co
Avanstrate Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nakamura Tome Prec Industry Co, Avanstrate Inc filed Critical Nakamura Tome Prec Industry Co
Publication of SG158041A1 publication Critical patent/SG158041A1/en

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

To provide a substrate end face polishing apparatus in accordance with an adaptive control incorporating a depth of an abrasion groove of a polishing wheel into a compensation element and having high reliability, together with a method of determining whether the polishing of the substrate is good or bad, the substrate end face polishing apparatus is provided with a polishing wheel for polishing an end face of the substrate, a rotational driving means of the polishing wheel, and a cutting edge feeding means of the polishing wheel, and the rotational driving means of the polishing wheel has a load current detecting means on the basis of end face contact of the substrate, and a compensating means of a load current generated by contact of groove side faces of an abrasion groove formed in the polishing wheel with the substrate.
SG200904144-3A 2008-06-17 2009-06-17 Polishing apparatus of substrate end face and polishing determining method SG158041A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008157301A JP5270974B2 (en) 2008-06-17 2008-06-17 Substrate end face polishing apparatus and polishing determination method

Publications (1)

Publication Number Publication Date
SG158041A1 true SG158041A1 (en) 2010-01-29

Family

ID=41481370

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200904144-3A SG158041A1 (en) 2008-06-17 2009-06-17 Polishing apparatus of substrate end face and polishing determining method

Country Status (5)

Country Link
JP (1) JP5270974B2 (en)
KR (1) KR101605484B1 (en)
CN (1) CN101607376B (en)
SG (1) SG158041A1 (en)
TW (1) TWI458593B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102069451A (en) * 2010-11-03 2011-05-25 广州遂联自动化设备有限公司 Current-based intelligent compensation control method used on polishing and grinding equipment
JP5842830B2 (en) * 2011-01-21 2016-01-13 株式会社ジェイテクト Grinding abnormality monitoring method and grinding abnormality monitoring apparatus
JP5454513B2 (en) * 2011-05-27 2014-03-26 信越半導体株式会社 Method for adjusting position of polishing head in height direction and method for polishing workpiece
CN105619243B (en) * 2016-01-05 2017-08-29 京东方科技集团股份有限公司 Grind cutter head and lapping device
JP2017148931A (en) 2016-02-19 2017-08-31 株式会社荏原製作所 Polishing device and polishing method
CN106041667A (en) * 2016-05-20 2016-10-26 京东方科技集团股份有限公司 Base plate and edging detection method, alignment method and device thereof
CN106378679A (en) * 2016-09-12 2017-02-08 成都中光电科技有限公司 Judgment method for grinding edge burning of TFT glass substrate
CN107331230A (en) * 2016-10-28 2017-11-07 湖南机电职业技术学院 A kind of intelligence manufacture production, teaching & research platform processed towards Metal Flake handicraft
TWI811249B (en) * 2017-11-09 2023-08-11 瑞士商格勞斯頓瑞士有限公司 Method for machining a glass pane
KR102308602B1 (en) * 2017-11-21 2021-10-05 (주) 세명유리 A plate glass polishing apparatus with automatic adjustment of polishing wheel pressure
CN109470906A (en) * 2018-09-28 2019-03-15 彩虹(合肥)液晶玻璃有限公司 A kind of operating current acquisition device and method
CN113344308B (en) * 2020-02-17 2024-01-05 华晨宝马汽车有限公司 Quality monitoring method, system, equipment and medium based on polishing operation data

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3362952B2 (en) * 1993-11-01 2003-01-07 トーヨーエイテック株式会社 Adaptive control grinding method and apparatus
JPH08197400A (en) * 1995-01-25 1996-08-06 Sumitomo Sitix Corp Chamfered part polishing method for semiconductor wafer
AU3042297A (en) * 1996-06-15 1998-01-07 Unova U.K. Limited Workpiece inspection and handling
JPH11320364A (en) * 1998-05-19 1999-11-24 Shin Etsu Handotai Co Ltd Soft grinding processing management method of chamfering part for wafer and chamfering device
JP2000176832A (en) * 1998-12-18 2000-06-27 Honda Motor Co Ltd Grinding method
JP2003048164A (en) * 2001-08-07 2003-02-18 Disco Abrasive Syst Ltd Polishing wheel
JP3874643B2 (en) * 2001-10-16 2007-01-31 セントラル硝子株式会社 Detection method for abnormal polishing on the periphery of glass plate
JP2003300155A (en) * 2002-04-10 2003-10-21 Disco Abrasive Syst Ltd Grinding method and grinding device
JP2004122259A (en) * 2002-09-30 2004-04-22 Nachi Fujikoshi Corp Adaptive control device for grinder
JP2006095604A (en) * 2004-09-28 2006-04-13 Hitachi Zosen Corp Polishing device
CN2892373Y (en) * 2006-04-24 2007-04-25 南京数控机床有限公司 Automatic setting tool and tool setting depth control device for grinding machine

Also Published As

Publication number Publication date
CN101607376A (en) 2009-12-23
JP2009297865A (en) 2009-12-24
KR20090131268A (en) 2009-12-28
CN101607376B (en) 2014-07-16
TWI458593B (en) 2014-11-01
JP5270974B2 (en) 2013-08-21
TW201008704A (en) 2010-03-01
KR101605484B1 (en) 2016-03-23

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