SG121124A1 - Methods for enhancing die saw and packaging reliability - Google Patents

Methods for enhancing die saw and packaging reliability

Info

Publication number
SG121124A1
SG121124A1 SG200505843A SG200505843A SG121124A1 SG 121124 A1 SG121124 A1 SG 121124A1 SG 200505843 A SG200505843 A SG 200505843A SG 200505843 A SG200505843 A SG 200505843A SG 121124 A1 SG121124 A1 SG 121124A1
Authority
SG
Singapore
Prior art keywords
methods
packaging reliability
die saw
enhancing die
enhancing
Prior art date
Application number
SG200505843A
Inventor
Chih-Hsiang Yao
Wen-Kai Wan
Kuan-Shou Chi
Tai-Chun Huang
Chin-Chiu Hsia
Ming-Song Liang
Original Assignee
Taiwan Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/940,504 external-priority patent/US7777338B2/en
Application filed by Taiwan Semiconductor Mfg filed Critical Taiwan Semiconductor Mfg
Publication of SG121124A1 publication Critical patent/SG121124A1/en

Links

SG200505843A 2004-09-13 2005-09-12 Methods for enhancing die saw and packaging reliability SG121124A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/940,504 US7777338B2 (en) 2004-09-13 2004-09-13 Seal ring structure for integrated circuit chips
US11/196,184 US20060055002A1 (en) 2004-09-13 2005-08-03 Methods for enhancing die saw and packaging reliability

Publications (1)

Publication Number Publication Date
SG121124A1 true SG121124A1 (en) 2006-04-26

Family

ID=37111168

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200505843A SG121124A1 (en) 2004-09-13 2005-09-12 Methods for enhancing die saw and packaging reliability

Country Status (2)

Country Link
SG (1) SG121124A1 (en)
TW (1) TWI287266B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7443097B2 (en) * 2020-03-09 2024-03-05 キオクシア株式会社 Semiconductor wafers and semiconductor chips
US11676958B2 (en) * 2021-03-26 2023-06-13 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device including cumulative sealing structures and method and system for making of same
US20230187294A1 (en) * 2021-12-13 2023-06-15 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor wafer seal ring

Also Published As

Publication number Publication date
TWI287266B (en) 2007-09-21
TW200625505A (en) 2006-07-16

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