SG11202102956TA - Sputtering target and method for producing same - Google Patents
Sputtering target and method for producing sameInfo
- Publication number
- SG11202102956TA SG11202102956TA SG11202102956TA SG11202102956TA SG11202102956TA SG 11202102956T A SG11202102956T A SG 11202102956TA SG 11202102956T A SG11202102956T A SG 11202102956TA SG 11202102956T A SG11202102956T A SG 11202102956TA SG 11202102956T A SG11202102956T A SG 11202102956TA
- Authority
- SG
- Singapore
- Prior art keywords
- sputtering target
- producing same
- producing
- same
- sputtering
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3491—Manufacturing of targets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D3/00—Straightening or restoring form of metal rods, metal tubes, metal profiles, or specific articles made therefrom, whether or not in combination with sheet metal parts
- B21D3/10—Straightening or restoring form of metal rods, metal tubes, metal profiles, or specific articles made therefrom, whether or not in combination with sheet metal parts between rams and anvils or abutments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J1/00—Preparing metal stock or similar ancillary operations prior, during or post forging, e.g. heating or cooling
- B21J1/02—Preliminary treatment of metal stock without particular shaping, e.g. salvaging segregated zones, forging or pressing in the rough
- B21J1/025—Preliminary treatment of metal stock without particular shaping, e.g. salvaging segregated zones, forging or pressing in the rough affecting grain orientation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J1/00—Preparing metal stock or similar ancillary operations prior, during or post forging, e.g. heating or cooling
- B21J1/06—Heating or cooling methods or arrangements specially adapted for performing forging or pressing operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
- B21J5/008—Incremental forging
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
- C22F1/18—High-melting or refractory metals or alloys based thereon
- C22F1/183—High-melting or refractory metals or alloys based thereon of titanium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thermal Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Forging (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018180535 | 2018-09-26 | ||
PCT/JP2019/037136 WO2020066957A1 (ja) | 2018-09-26 | 2019-09-20 | スパッタリングターゲット及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202102956TA true SG11202102956TA (en) | 2021-04-29 |
Family
ID=69952126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202102956TA SG11202102956TA (en) | 2018-09-26 | 2019-09-20 | Sputtering target and method for producing same |
Country Status (8)
Country | Link |
---|---|
US (1) | US20220033960A1 (zh) |
EP (1) | EP3859048A4 (zh) |
JP (1) | JP7145963B2 (zh) |
KR (1) | KR102623865B1 (zh) |
CN (1) | CN112771199B (zh) |
SG (1) | SG11202102956TA (zh) |
TW (1) | TWI787546B (zh) |
WO (1) | WO2020066957A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112404461A (zh) * | 2020-10-26 | 2021-02-26 | 宁波江丰电子材料股份有限公司 | 一种钛靶材组件的车削方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5993621A (en) * | 1997-07-11 | 1999-11-30 | Johnson Matthey Electronics, Inc. | Titanium sputtering target |
JP3659921B2 (ja) * | 2002-01-15 | 2005-06-15 | 東邦チタニウム株式会社 | ターゲット用チタン材の製造方法 |
JP5428741B2 (ja) * | 2009-10-19 | 2014-02-26 | 東ソー株式会社 | 円筒形スパッタリングターゲットの製造方法 |
JP5472353B2 (ja) * | 2012-03-27 | 2014-04-16 | 三菱マテリアル株式会社 | 銀系円筒ターゲット及びその製造方法 |
US10431438B2 (en) * | 2013-03-06 | 2019-10-01 | Jx Nippon Mining & Metals Corporation | Titanium target for sputtering and manufacturing method thereof |
JP5855319B2 (ja) * | 2013-07-08 | 2016-02-09 | Jx日鉱日石金属株式会社 | スパッタリングターゲット及び、それの製造方法 |
AT14157U1 (de) | 2013-12-20 | 2015-05-15 | Plansee Se | W-Ni-Sputtertarget |
WO2015151498A1 (ja) * | 2014-03-31 | 2015-10-08 | 株式会社 東芝 | スパッタリングターゲットの製造方法およびスパッタリングターゲット |
JP5783293B1 (ja) * | 2014-04-22 | 2015-09-24 | 三菱マテリアル株式会社 | 円筒型スパッタリングターゲット用素材 |
JP6600214B2 (ja) * | 2015-09-28 | 2019-10-30 | 株式会社Screenホールディングス | 成膜装置 |
WO2018163861A1 (ja) * | 2017-03-06 | 2018-09-13 | 三菱マテリアル株式会社 | Cu-Ni合金スパッタリングターゲット及びその製造方法 |
JP7174476B2 (ja) * | 2017-03-31 | 2022-11-17 | Jx金属株式会社 | タングステンターゲット |
JP2018053366A (ja) | 2017-10-24 | 2018-04-05 | 住友化学株式会社 | 円筒型ターゲット |
-
2019
- 2019-09-20 WO PCT/JP2019/037136 patent/WO2020066957A1/ja unknown
- 2019-09-20 KR KR1020217009533A patent/KR102623865B1/ko active IP Right Grant
- 2019-09-20 SG SG11202102956TA patent/SG11202102956TA/en unknown
- 2019-09-20 US US17/279,092 patent/US20220033960A1/en active Pending
- 2019-09-20 JP JP2020549175A patent/JP7145963B2/ja active Active
- 2019-09-20 TW TW108134009A patent/TWI787546B/zh active
- 2019-09-20 CN CN201980061601.4A patent/CN112771199B/zh active Active
- 2019-09-20 EP EP19867644.7A patent/EP3859048A4/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP3859048A4 (en) | 2022-07-27 |
CN112771199A (zh) | 2021-05-07 |
EP3859048A1 (en) | 2021-08-04 |
CN112771199B (zh) | 2024-01-16 |
JP7145963B2 (ja) | 2022-10-03 |
JPWO2020066957A1 (ja) | 2021-09-24 |
US20220033960A1 (en) | 2022-02-03 |
TWI787546B (zh) | 2022-12-21 |
KR102623865B1 (ko) | 2024-01-11 |
WO2020066957A1 (ja) | 2020-04-02 |
KR20210053940A (ko) | 2021-05-12 |
TW202018098A (zh) | 2020-05-16 |
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