SG11202009058SA - Substrate lifting apparatus and substrate transferring method - Google Patents

Substrate lifting apparatus and substrate transferring method

Info

Publication number
SG11202009058SA
SG11202009058SA SG11202009058SA SG11202009058SA SG11202009058SA SG 11202009058S A SG11202009058S A SG 11202009058SA SG 11202009058S A SG11202009058S A SG 11202009058SA SG 11202009058S A SG11202009058S A SG 11202009058SA SG 11202009058S A SG11202009058S A SG 11202009058SA
Authority
SG
Singapore
Prior art keywords
substrate
lifting apparatus
transferring method
substrate transferring
substrate lifting
Prior art date
Application number
SG11202009058SA
Inventor
Katsunori Fujii
Masanori Ito
Original Assignee
Ulvac Techno Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Techno Ltd filed Critical Ulvac Techno Ltd
Publication of SG11202009058SA publication Critical patent/SG11202009058SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11202009058SA 2018-07-30 2019-05-08 Substrate lifting apparatus and substrate transferring method SG11202009058SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018142815 2018-07-30
PCT/JP2019/018355 WO2020026549A1 (en) 2018-07-30 2019-05-08 Substrate lift device and substrate transfer method

Publications (1)

Publication Number Publication Date
SG11202009058SA true SG11202009058SA (en) 2020-10-29

Family

ID=69231192

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202009058SA SG11202009058SA (en) 2018-07-30 2019-05-08 Substrate lifting apparatus and substrate transferring method

Country Status (6)

Country Link
US (1) US12020967B2 (en)
JP (1) JP7111816B2 (en)
KR (1) KR102451031B1 (en)
CN (1) CN112514047B (en)
SG (1) SG11202009058SA (en)
WO (1) WO2020026549A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022165477A (en) * 2021-04-20 2022-11-01 日新イオン機器株式会社 Wafer support device

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3245369B2 (en) * 1996-11-20 2002-01-15 東京エレクトロン株式会社 Method for separating workpiece from electrostatic chuck and plasma processing apparatus
JP3725967B2 (en) * 1997-06-20 2005-12-14 株式会社日立製作所 Method for removing electrostatically adsorbed sample
JPH11243137A (en) * 1998-10-14 1999-09-07 Nec Corp Electrostatic chuck
US20050045618A1 (en) * 2001-07-09 2005-03-03 Ibiden Co., Ltd. Ceramic heater and ceramic joined article
JP2004040047A (en) * 2002-07-08 2004-02-05 Tokyo Electron Ltd Treatment apparatus and method for releasing material to be released from electrostatic chuck
TW594297B (en) * 2002-07-19 2004-06-21 Hitachi Ind Co Ltd Substrate assembling device
US7243003B2 (en) * 2002-08-31 2007-07-10 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
JP2004228488A (en) 2003-01-27 2004-08-12 Matsushita Electric Ind Co Ltd Substrate conveyance method
JP2006303138A (en) * 2005-04-20 2006-11-02 Seiko Epson Corp Apparatus and method for manufacturing semiconductor device
KR100566324B1 (en) * 2005-05-09 2006-03-31 주식회사 에이디피엔지니어링 Lift pin module of fpd manufacturing machine
JP4836512B2 (en) * 2005-07-29 2011-12-14 東京エレクトロン株式会社 Substrate lifting apparatus and substrate processing apparatus
JP2008041896A (en) * 2006-08-04 2008-02-21 Tokyo Electron Ltd Substrate sensing mechanism, and substrate processor using same
JP2008041969A (en) 2006-08-08 2008-02-21 Matsushita Electric Ind Co Ltd Removal method of substrate
JP4795899B2 (en) * 2006-08-31 2011-10-19 東京エレクトロン株式会社 Substrate mounting mechanism and substrate delivery method
US8652260B2 (en) * 2008-08-08 2014-02-18 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus for holding semiconductor wafers
MY155371A (en) * 2008-11-12 2015-10-15 Esec Ag Method for detaching and removing a semiconductor chip from a foil
US8270142B2 (en) 2008-12-10 2012-09-18 Axcelis Technologies, Inc. De-clamping wafers from an electrostatic chuck
US8363378B2 (en) * 2009-02-17 2013-01-29 Intevac, Inc. Method for optimized removal of wafer from electrostatic chuck
JP2010199239A (en) 2009-02-24 2010-09-09 Tokyo Electron Ltd Discharging method of substrate to be treated and substrate treatment apparatus
US8313612B2 (en) 2009-03-24 2012-11-20 Lam Research Corporation Method and apparatus for reduction of voltage potential spike during dechucking
US8797705B2 (en) * 2009-09-10 2014-08-05 Lam Research Corporation Methods and arrangement for plasma dechuck optimization based on coupling of plasma signaling to substrate position and potential
JP5770575B2 (en) * 2011-09-12 2015-08-26 株式会社アルバック Formation method of oxide film
JP6342299B2 (en) 2014-11-04 2018-06-13 株式会社アルバック Substrate crack judgment method
KR20170024215A (en) * 2015-08-24 2017-03-07 세메스 주식회사 Unit for supporting substrate, Apparatus for treating substrate, and Method for treating substrate

Also Published As

Publication number Publication date
JP7111816B2 (en) 2022-08-02
KR102451031B1 (en) 2022-10-06
JPWO2020026549A1 (en) 2021-02-25
US20230163010A1 (en) 2023-05-25
KR20210021558A (en) 2021-02-26
WO2020026549A1 (en) 2020-02-06
CN112514047A (en) 2021-03-16
US12020967B2 (en) 2024-06-25
CN112514047B (en) 2024-05-03

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