SG11202007193SA - Negative-working ultra thick film photoresist - Google Patents
Negative-working ultra thick film photoresistInfo
- Publication number
- SG11202007193SA SG11202007193SA SG11202007193SA SG11202007193SA SG11202007193SA SG 11202007193S A SG11202007193S A SG 11202007193SA SG 11202007193S A SG11202007193S A SG 11202007193SA SG 11202007193S A SG11202007193S A SG 11202007193SA SG 11202007193S A SG11202007193S A SG 11202007193SA
- Authority
- SG
- Singapore
- Prior art keywords
- negative
- thick film
- film photoresist
- ultra thick
- working
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0384—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the main chain of the photopolymer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F216/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an alcohol radical
- C08F216/04—Acyclic compounds
- C08F216/06—Polyvinyl alcohol ; Vinyl alcohol
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/281—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing only one oxygen, e.g. furfuryl (meth)acrylate or 2-methoxyethyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/282—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing two or more oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
- C08F220/301—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and one oxygen in the alcohol moiety
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polymerisation Methods In General (AREA)
- Materials For Photolithography (AREA)
- Optical Filters (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Graft Or Block Polymers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862646946P | 2018-03-23 | 2018-03-23 | |
PCT/EP2019/056911 WO2019180058A1 (en) | 2018-03-23 | 2019-03-20 | Negative-working ultra thick film photoresist |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202007193SA true SG11202007193SA (en) | 2020-08-28 |
Family
ID=65904411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202007193SA SG11202007193SA (en) | 2018-03-23 | 2019-03-20 | Negative-working ultra thick film photoresist |
Country Status (9)
Country | Link |
---|---|
US (1) | US11698586B2 (en) |
EP (1) | EP3769156B1 (en) |
JP (1) | JP7274496B2 (en) |
KR (1) | KR102660770B1 (en) |
CN (1) | CN111837075B (en) |
PT (1) | PT3769156T (en) |
SG (1) | SG11202007193SA (en) |
TW (1) | TWI818965B (en) |
WO (1) | WO2019180058A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111837075B (en) | 2018-03-23 | 2024-07-05 | 默克专利股份有限公司 | Negative super thick film photoresist |
KR20240095519A (en) | 2021-11-17 | 2024-06-25 | 메르크 파텐트 게엠베하 | Compositions and methods for improving metal structure fabrication by wet chemical etching |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6090204A (en) * | 1983-10-24 | 1985-05-21 | Hitachi Chem Co Ltd | Production of polymer |
JPH064689B2 (en) * | 1983-11-01 | 1994-01-19 | 日立化成工業株式会社 | Polymer |
EP0141610B1 (en) * | 1983-10-24 | 1991-01-30 | Hitachi Chemical Co., Ltd. | Optical elements comprising polymers of (meth)acrylate esters |
JPH0615579B2 (en) * | 1984-09-20 | 1994-03-02 | 日立化成工業株式会社 | Optical equipment made of polymer |
DE3751745T2 (en) | 1986-10-23 | 1996-09-26 | Ibm | Highly sensitive resists with self-decomposition temperature greater than about 160 degrees Celsius |
US5456995A (en) * | 1988-07-07 | 1995-10-10 | Sumitomo Chemical Company, Limited | Radiation-sensitive positive resist composition |
JPH063544B2 (en) | 1988-07-07 | 1994-01-12 | 住友化学工業株式会社 | Positive type radiation sensitive resist composition |
JP2719799B2 (en) * | 1988-10-14 | 1998-02-25 | 日本合成化学工業株式会社 | Photosensitive resin composition |
JP2711590B2 (en) * | 1990-09-13 | 1998-02-10 | 富士写真フイルム株式会社 | Positive photoresist composition |
KR100256392B1 (en) | 1996-09-30 | 2000-05-15 | 겐지 아이다 | Photosensitive resin coloring composition for color filter, color filter formed therefrom, new anthraquinone compound and preparing method thereof |
US6296984B1 (en) | 1999-03-12 | 2001-10-02 | Agere Systems Guardian Corp. | Energy-sensitive resist material and a process for device fabrication using an energy-sensitive resist material |
JP4384570B2 (en) | 2003-12-01 | 2009-12-16 | 東京応化工業株式会社 | Photoresist composition for thick film and method for forming resist pattern |
JP4376706B2 (en) * | 2004-06-30 | 2009-12-02 | 東京応化工業株式会社 | Method for forming plated product using negative photoresist composition |
JP4590431B2 (en) | 2007-06-12 | 2010-12-01 | 富士フイルム株式会社 | Pattern formation method |
US8617794B2 (en) * | 2007-06-12 | 2013-12-31 | Fujifilm Corporation | Method of forming patterns |
JP2009003366A (en) | 2007-06-25 | 2009-01-08 | Jsr Corp | Radiation-sensitive resin composition used for microlens formation |
KR101430533B1 (en) * | 2008-01-04 | 2014-08-22 | 솔브레인 주식회사 | Negative photoresist composition and method of manufacturing array substrate using the same |
JP4964862B2 (en) | 2008-12-18 | 2012-07-04 | 凸版印刷株式会社 | Photosensitive resin composition and color filter using the photosensitive resin composition |
JP2010286796A (en) | 2009-06-15 | 2010-12-24 | Asahi Kasei E-Materials Corp | Photosensitive resin composition |
WO2012029734A1 (en) * | 2010-09-02 | 2012-03-08 | 東レ株式会社 | Photosensitive composition, cured film formed from same, and element having cured film |
JP5997431B2 (en) | 2011-11-02 | 2016-09-28 | 旭化成株式会社 | Photosensitive resin composition |
CN104602573B (en) | 2012-05-15 | 2018-05-22 | Geigtech东湾公司 | For installing the component of curtain |
US8906594B2 (en) | 2012-06-15 | 2014-12-09 | Az Electronic Materials (Luxembourg) S.A.R.L. | Negative-working thick film photoresist |
JP6013150B2 (en) * | 2012-11-22 | 2016-10-25 | メルクパフォーマンスマテリアルズマニュファクチャリング合同会社 | Method for producing positive photosensitive siloxane composition |
KR20150118582A (en) | 2013-02-12 | 2015-10-22 | 도레이 카부시키가이샤 | Photosensitive resin composition, protective film or insulation film obtained by heat curing said composition, touch panel using said film, and production method for said touch panel |
KR102082722B1 (en) | 2013-07-25 | 2020-02-28 | 도레이 카부시키가이샤 | Negative-type photosensitive white composition for touch panel, touch panel, and production method for touch panel |
TWI483075B (en) | 2013-08-08 | 2015-05-01 | Chi Mei Corp | Negative photosensitive resin composition and application thereof |
WO2015060240A1 (en) * | 2013-10-21 | 2015-04-30 | 日産化学工業株式会社 | Negative photosensitive resin composition |
KR20150112560A (en) | 2014-03-28 | 2015-10-07 | 동우 화인켐 주식회사 | Application and removal type composition for modifying surface of a passivation layer and image sensor manufactured by using the same |
JP2015193758A (en) | 2014-03-31 | 2015-11-05 | 東洋インキScホールディングス株式会社 | Photosensitive resin composition for overcoat and coating film using the same |
KR101767082B1 (en) | 2014-11-17 | 2017-08-10 | 삼성에스디아이 주식회사 | Photosensitive resin composition, photosensitive resin film using the same and color filter |
CN107001629B (en) | 2014-11-27 | 2019-09-24 | 东丽株式会社 | Resin and photosensitive polymer combination |
JP6518436B2 (en) | 2014-12-19 | 2019-05-22 | 東友ファインケム株式会社Dongwoo Fine−Chem Co., Ltd. | Colored curable resin composition |
KR20160091646A (en) | 2015-01-26 | 2016-08-03 | 동우 화인켐 주식회사 | Photosensitive resin comopsition, photocurable pattern formed from the same and image display comprising the pattern |
KR20160118865A (en) * | 2015-04-03 | 2016-10-12 | 삼성에스디아이 주식회사 | Photosensitive resin composition and color filter using the same |
US20180259850A1 (en) * | 2017-03-10 | 2018-09-13 | Tokyo Ohka Kogyo Co., Ltd. | Method for forming patterned cured film, photosensitive composition, dry film, and method for producing plated shaped article |
JP6813398B2 (en) | 2017-03-10 | 2021-01-13 | 東京応化工業株式会社 | Methods for Forming Photosensitive Compositions, Dry Films, and Patterned Hardened Films |
CN111837075B (en) | 2018-03-23 | 2024-07-05 | 默克专利股份有限公司 | Negative super thick film photoresist |
-
2019
- 2019-03-20 CN CN201980017900.8A patent/CN111837075B/en active Active
- 2019-03-20 EP EP19712966.1A patent/EP3769156B1/en active Active
- 2019-03-20 KR KR1020207030643A patent/KR102660770B1/en active IP Right Grant
- 2019-03-20 US US16/966,998 patent/US11698586B2/en active Active
- 2019-03-20 PT PT197129661T patent/PT3769156T/en unknown
- 2019-03-20 SG SG11202007193SA patent/SG11202007193SA/en unknown
- 2019-03-20 WO PCT/EP2019/056911 patent/WO2019180058A1/en active Application Filing
- 2019-03-20 JP JP2020550871A patent/JP7274496B2/en active Active
- 2019-03-22 TW TW108109926A patent/TWI818965B/en active
Also Published As
Publication number | Publication date |
---|---|
CN111837075B (en) | 2024-07-05 |
TWI818965B (en) | 2023-10-21 |
EP3769156B1 (en) | 2024-03-20 |
JP7274496B2 (en) | 2023-05-16 |
US11698586B2 (en) | 2023-07-11 |
KR20200136009A (en) | 2020-12-04 |
PT3769156T (en) | 2024-06-25 |
JP2021518584A (en) | 2021-08-02 |
TW201940978A (en) | 2019-10-16 |
EP3769156A1 (en) | 2021-01-27 |
WO2019180058A1 (en) | 2019-09-26 |
KR102660770B1 (en) | 2024-04-24 |
CN111837075A (en) | 2020-10-27 |
US20200393758A1 (en) | 2020-12-17 |
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