SG11202004727UA - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- SG11202004727UA SG11202004727UA SG11202004727UA SG11202004727UA SG11202004727UA SG 11202004727U A SG11202004727U A SG 11202004727UA SG 11202004727U A SG11202004727U A SG 11202004727UA SG 11202004727U A SG11202004727U A SG 11202004727UA SG 11202004727U A SG11202004727U A SG 11202004727UA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- polishing
- composition
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017252270A JP6978933B2 (ja) | 2017-12-27 | 2017-12-27 | 研磨用組成物 |
PCT/JP2018/047025 WO2019131448A1 (ja) | 2017-12-27 | 2018-12-20 | 研磨用組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202004727UA true SG11202004727UA (en) | 2020-06-29 |
Family
ID=67067301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202004727UA SG11202004727UA (en) | 2017-12-27 | 2018-12-20 | Polishing composition |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6978933B2 (ja) |
KR (1) | KR20200098547A (ja) |
CN (1) | CN111527589A (ja) |
DE (1) | DE112018006626T5 (ja) |
SG (1) | SG11202004727UA (ja) |
TW (1) | TWI798325B (ja) |
WO (1) | WO2019131448A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7349309B2 (ja) * | 2019-09-30 | 2023-09-22 | 株式会社フジミインコーポレーテッド | シリコンウェーハ用研磨用組成物 |
JP7433042B2 (ja) * | 2019-12-24 | 2024-02-19 | ニッタ・デュポン株式会社 | 研磨用組成物 |
JP2021105145A (ja) * | 2019-12-27 | 2021-07-26 | ニッタ・デュポン株式会社 | 研磨用組成物及びシリコンウェーハの研磨方法 |
EP4103662A4 (en) * | 2020-02-13 | 2023-08-16 | FUJIFILM Electronic Materials U.S.A, Inc. | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF |
EP4103663A4 (en) | 2020-02-13 | 2023-08-23 | Fujifilm Electronic Materials U.S.A., Inc. | POLISHING COMPOSITIONS AND METHODS OF USE THEREOF |
JP7450439B2 (ja) | 2020-03-31 | 2024-03-15 | 株式会社フジミインコーポレーテッド | 研磨用組成物および磁気ディスク基板の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5721505B2 (ja) * | 2011-04-01 | 2015-05-20 | ニッタ・ハース株式会社 | 研磨用組成物 |
WO2012165578A1 (ja) * | 2011-06-02 | 2012-12-06 | 協立化学産業株式会社 | 電池電極又はセパレーター用コート剤組成物 |
CN104245829B (zh) * | 2012-04-27 | 2017-03-01 | 日本合成化学工业株式会社 | 树脂组合物及其用途 |
CN104798181B (zh) * | 2012-11-30 | 2016-08-24 | 霓达哈斯股份有限公司 | 研磨组合物 |
JP2016124943A (ja) * | 2014-12-26 | 2016-07-11 | ニッタ・ハース株式会社 | 研磨用組成物 |
SG11201803362VA (en) * | 2015-10-23 | 2018-05-30 | Nitta Haas Inc | Polishing composition |
-
2017
- 2017-12-27 JP JP2017252270A patent/JP6978933B2/ja active Active
-
2018
- 2018-12-20 SG SG11202004727UA patent/SG11202004727UA/en unknown
- 2018-12-20 CN CN201880084023.1A patent/CN111527589A/zh active Pending
- 2018-12-20 DE DE112018006626.6T patent/DE112018006626T5/de active Pending
- 2018-12-20 WO PCT/JP2018/047025 patent/WO2019131448A1/ja active Application Filing
- 2018-12-20 KR KR1020207018293A patent/KR20200098547A/ko not_active Application Discontinuation
- 2018-12-26 TW TW107147152A patent/TWI798325B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP2019117904A (ja) | 2019-07-18 |
TWI798325B (zh) | 2023-04-11 |
TW201930540A (zh) | 2019-08-01 |
JP6978933B2 (ja) | 2021-12-08 |
CN111527589A (zh) | 2020-08-11 |
KR20200098547A (ko) | 2020-08-20 |
DE112018006626T5 (de) | 2020-09-10 |
WO2019131448A1 (ja) | 2019-07-04 |
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