SG11202000305YA - Laser irradiation device - Google Patents

Laser irradiation device

Info

Publication number
SG11202000305YA
SG11202000305YA SG11202000305YA SG11202000305YA SG11202000305YA SG 11202000305Y A SG11202000305Y A SG 11202000305YA SG 11202000305Y A SG11202000305Y A SG 11202000305YA SG 11202000305Y A SG11202000305Y A SG 11202000305YA SG 11202000305Y A SG11202000305Y A SG 11202000305YA
Authority
SG
Singapore
Prior art keywords
laser irradiation
irradiation device
laser
irradiation
Prior art date
Application number
SG11202000305YA
Inventor
Atsushi Yamamoto
Hirotaka Sazuka
Daisuke Ito
Original Assignee
Japan Steel Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Steel Works Ltd filed Critical Japan Steel Works Ltd
Publication of SG11202000305YA publication Critical patent/SG11202000305YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laser Beam Processing (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)
  • Dicing (AREA)

Abstract

T o r e a l i z e a l a s e r i r r a d i a t i o n a p p a r a t u s b y u s i n g w h i c h a c c u r a c y i n p r o c e s s i n g a s u b s t r a t e c a n b e i m p r o v e d . A l a s e r i r r a d i a t i o n a p p a r a t u s ( 1 ) a c c o r d i n g t o a n e m b o d i m e n t i n c l u d e s a l a s e r i r r a d i a t i o n 5 u n i t ( 3 ) c o n f i g u r e d t o a p p l y l a s e r l i g h t ( L 1 ) t o a s u b s t r a t e ( S ) , a b a s e p a r t ( 4 ) , a n d a c o n v e y a n c e s t a g e ( 5 ) c o n f i g u r e d t o c o n v e y t h e s u b s t r a t e ( S ) . T h e c o n v e y a n c e s t a g e ( 5 ) i n c l u d e s a s t a g e ( 1 0 ) c o n f i g u r e d t o b e m o v a b l e o v e r t h e b a s e p a r t ( 4 ) , a b a s e f l a n g e ( 1 1 ) f i x e d o v e r t h e s t a g e ( 1 0 ) , a s u b s t r a t e s t a g e ( 1 2 ) f i x e d t o a n u p p e r e n d p a r t o f t h e b a s e 1 0 f l a n g e ( 1 1 ) a n d c o n f i g u r e d s o t h a t t h e s u b s t r a t e ( S ) i s p l a c e d t h e r e o v e r , a n d a p u s h e r p i n ( 1 3 ) f o r s u p p o r t i n g t h e s u b s t r a t e , t h e p u s h e r p i n b e i n g c o n f i g u r e d t o p e n e t r a t e t h e s u b s t r a t e s t a g e ( 1 2 ) a n d t o b e m o v a b l e u p a n d d o w n . 1 5 [ F i g . 1 ]
SG11202000305YA 2017-08-25 2017-08-25 Laser irradiation device SG11202000305YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/030472 WO2019038902A1 (en) 2017-08-25 2017-08-25 Laser irradiation device

Publications (1)

Publication Number Publication Date
SG11202000305YA true SG11202000305YA (en) 2020-02-27

Family

ID=65438488

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202000305YA SG11202000305YA (en) 2017-08-25 2017-08-25 Laser irradiation device

Country Status (5)

Country Link
US (1) US11684999B2 (en)
JP (1) JP6955013B2 (en)
CN (1) CN111033715A (en)
SG (1) SG11202000305YA (en)
WO (1) WO2019038902A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111430279B (en) * 2020-04-30 2023-09-01 瑞安市荣海机电有限公司 Substrate supporting device for excimer laser annealing equipment

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3554534B2 (en) * 1995-12-12 2004-08-18 東京エレクトロン株式会社 Substrate support mechanism and substrate exchange method for semiconductor processing apparatus, and semiconductor processing apparatus and substrate transfer apparatus
TW318258B (en) 1995-12-12 1997-10-21 Tokyo Electron Co Ltd
JPH1050716A (en) * 1996-07-30 1998-02-20 Dainippon Screen Mfg Co Ltd Single wafer type substrate heat treating apparatus
US6485248B1 (en) * 2000-10-10 2002-11-26 Applied Materials, Inc. Multiple wafer lift apparatus and associated method
JP4084293B2 (en) * 2002-12-05 2008-04-30 株式会社アドヴァンスド・ディスプレイ・プロセス・エンジニアリング FPD manufacturing equipment
JP3611568B2 (en) * 2003-12-11 2005-01-19 美岳 伊藤 Substrate processing apparatus, substrate processing method, and substrate manufacturing method
JP2005310989A (en) * 2004-04-20 2005-11-04 Hitachi High-Tech Electronics Engineering Co Ltd Method and device for delivering substrate and photomask
JP2006005032A (en) * 2004-06-16 2006-01-05 Japan Steel Works Ltd:The Substrate stage device
JP2006196862A (en) * 2004-12-16 2006-07-27 Tokyo Ohka Kogyo Co Ltd Supporting pin for substrate
JP5843161B2 (en) * 2011-05-13 2016-01-13 株式会社ニコン Exposure apparatus, flat panel display manufacturing method, and device manufacturing method
KR101740220B1 (en) * 2012-10-18 2017-05-25 디앤에이 주식회사 Apparatus for loading a substrate applicable to laser lift off device
CN103915318A (en) * 2014-03-17 2014-07-09 京东方科技集团股份有限公司 Laser annealing device, polycrystalline silicon thin film and manufacturing method thereof
JP2016021524A (en) * 2014-07-15 2016-02-04 東京エレクトロン株式会社 Plasma processing apparatus
JP6712411B2 (en) * 2015-03-30 2020-06-24 株式会社ニコン Object transport apparatus, exposure apparatus, flat panel display manufacturing method, device manufacturing method, object transportation method, and exposure method
CN106154607B (en) * 2016-08-26 2019-03-29 京东方科技集团股份有限公司 A kind of elevating mechanism

Also Published As

Publication number Publication date
US20200180071A1 (en) 2020-06-11
US11684999B2 (en) 2023-06-27
CN111033715A (en) 2020-04-17
JP6955013B2 (en) 2021-10-27
WO2019038902A1 (en) 2019-02-28
JPWO2019038902A1 (en) 2020-11-05

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