SG11201908356WA - Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device - Google Patents
Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor deviceInfo
- Publication number
- SG11201908356WA SG11201908356WA SG11201908356WA SG11201908356WA SG 11201908356W A SG11201908356W A SG 11201908356WA SG 11201908356W A SG11201908356W A SG 11201908356WA SG 11201908356W A SG11201908356W A SG 11201908356WA
- Authority
- SG
- Singapore
- Prior art keywords
- assembly
- semiconductor device
- production method
- joints
- metal paste
- Prior art date
Links
- 239000002184 metal Substances 0.000 title abstract 2
- 229910052751 metal Inorganic materials 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 2
- 239000004065 semiconductor Substances 0.000 title 2
- 239000002923 metal particle Substances 0.000 abstract 3
- 125000004432 carbon atom Chemical group C* 0.000 abstract 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/068—Flake-like particles
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
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- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
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- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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- B23K35/302—Cu as the principal constituent
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- B23K35/3618—Carboxylic acids or salts
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Powder Metallurgy (AREA)
- Die Bonding (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
FP0636-00 Provided is A metal paste for joints, containing: metal particles; and monovalent carboxylic acid having 1 to 9 carbon atoms, in which the metal particles include sub-micro copper particles having a volume 5 average particle diameter of 0.12 µm to 0.8 1..tm, and a content of the monovalent carboxylic acid having 1 to 9 carbon atoms is 0.015 part by mass to 0.2 part by mass with respect to 100 parts by mass of the metal particles. 84
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017050091 | 2017-03-15 | ||
PCT/JP2018/001442 WO2018168187A1 (en) | 2017-03-15 | 2018-01-18 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201908356WA true SG11201908356WA (en) | 2019-10-30 |
Family
ID=63522923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201908356W SG11201908356WA (en) | 2017-03-15 | 2018-01-18 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device |
Country Status (8)
Country | Link |
---|---|
US (1) | US11370066B2 (en) |
EP (1) | EP3597330A4 (en) |
JP (1) | JP7222346B2 (en) |
KR (1) | KR102499022B1 (en) |
CN (1) | CN110461504B (en) |
SG (1) | SG11201908356WA (en) |
TW (1) | TWI756359B (en) |
WO (1) | WO2018168187A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3889317A4 (en) * | 2018-11-29 | 2021-11-24 | Showa Denko Materials Co., Ltd. | Method for producing bonded object and semiconductor device and copper bonding paste |
JPWO2021060525A1 (en) * | 2019-09-27 | 2021-04-01 | ||
JP7392728B2 (en) * | 2019-09-30 | 2023-12-06 | 株式会社レゾナック | Copper paste for bonding, method for manufacturing bonded body, and bonded body |
JPWO2021066026A1 (en) * | 2019-09-30 | 2021-04-08 | ||
JP7391678B2 (en) * | 2020-01-24 | 2023-12-05 | 大陽日酸株式会社 | Bonding material |
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JPS4928639B1 (en) | 1969-06-17 | 1974-07-27 | ||
JPS506081B1 (en) | 1970-12-09 | 1975-03-11 | ||
JP3736797B2 (en) | 2001-11-20 | 2006-01-18 | Tdk株式会社 | High temperature cream solder composition and inductor |
CN1737072B (en) * | 2004-08-18 | 2011-06-08 | 播磨化成株式会社 | Conductive adhesive agent and process for manufacturing article using the conductive adhesive agent |
JP5006081B2 (en) | 2007-03-28 | 2012-08-22 | 株式会社日立製作所 | Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof |
JP5060199B2 (en) | 2007-08-08 | 2012-10-31 | 株式会社今仙電機製作所 | Reclining device |
JP4928639B2 (en) | 2010-03-15 | 2012-05-09 | Dowaエレクトロニクス株式会社 | Bonding material and bonding method using the same |
WO2011155055A1 (en) * | 2010-06-11 | 2011-12-15 | Dowaエレクトロニクス株式会社 | Low-temperature-sintering bonding material and bonding method using the bonding material |
JP5811314B2 (en) * | 2010-06-16 | 2015-11-11 | 国立研究開発法人物質・材料研究機構 | METAL NANOPARTICLE PASTE, ELECTRONIC COMPONENT BODY USING METAL NANOPARTICLE PASTE, LED MODULE, AND METHOD FOR FORMING CIRCUIT FOR PRINTED WIRING BOARD |
JP4832615B1 (en) * | 2010-11-01 | 2011-12-07 | Dowaエレクトロニクス株式会社 | Low-temperature sinterable conductive paste, conductive film using the same, and method for forming conductive film |
JP5848552B2 (en) * | 2011-08-29 | 2016-01-27 | 日立金属株式会社 | Method for producing copper fine particle dispersion, method for producing copper fine particle, copper fine particle dispersion and copper fine particle |
WO2013090570A1 (en) | 2011-12-13 | 2013-06-20 | Dow Corning Corporation | Composition and conductor formed therefrom |
CN104081468B (en) | 2012-01-31 | 2016-09-21 | 株式会社村田制作所 | Metal terminal joint conductive paste, with the electronic unit of metal terminal and manufacture method thereof |
JP5980574B2 (en) * | 2012-05-29 | 2016-08-31 | ハリマ化成株式会社 | Material for forming conductive metal thick film and method for forming conductive metal thick film |
JP5880300B2 (en) * | 2012-06-14 | 2016-03-08 | 日立化成株式会社 | Adhesive composition and semiconductor device using the same |
JP6089175B2 (en) * | 2012-06-29 | 2017-03-08 | 荒川化学工業株式会社 | Method for producing conductive paste |
EP2827341A4 (en) * | 2012-10-30 | 2016-03-30 | Kaken Tech Co Ltd | Conductive paste and die bonding method |
JP6199048B2 (en) * | 2013-02-28 | 2017-09-20 | 国立大学法人大阪大学 | Bonding material |
US20150136301A1 (en) * | 2013-11-13 | 2015-05-21 | R.R. Donnelley & Sons Company | Adhesive material composition and method |
JP2015142059A (en) * | 2014-01-30 | 2015-08-03 | 株式会社日立製作所 | power semiconductor module |
JP5926322B2 (en) * | 2014-05-30 | 2016-05-25 | 協立化学産業株式会社 | Coated copper particles and method for producing the same |
KR20170020861A (en) | 2014-06-23 | 2017-02-24 | 알파 어셈블리 솔루션스 인크. | Multilayered metal nano and micron particles |
WO2016031619A1 (en) * | 2014-08-29 | 2016-03-03 | 三井金属鉱業株式会社 | Conductor connection structure, method for producing same, conductive composition, and electronic component module |
EP3189914B1 (en) * | 2014-09-01 | 2022-06-08 | DOWA Electronics Materials Co., Ltd. | Bonding material and bonding method using same |
JP6091019B2 (en) * | 2015-02-02 | 2017-03-08 | 田中貴金属工業株式会社 | Thermally conductive conductive adhesive composition |
WO2016140351A1 (en) | 2015-03-05 | 2016-09-09 | 国立大学法人大阪大学 | Method for producing copper particles, copper particles and copper paste |
JP6060199B2 (en) | 2015-03-24 | 2017-01-11 | ハリマ化成株式会社 | Solder alloy, solder paste and electronic circuit board |
CN107210084A (en) * | 2015-05-25 | 2017-09-26 | 积水化学工业株式会社 | Conductive material and connection structural bodies |
EP3009211B1 (en) * | 2015-09-04 | 2017-06-14 | Heraeus Deutschland GmbH & Co. KG | Metal paste and its use for joining components |
US11590569B2 (en) * | 2017-11-29 | 2023-02-28 | National University Corporation Hokkaido University | Low-temperature sinterable copper particle and method for producing sintered body by using the same |
-
2018
- 2018-01-18 JP JP2019505730A patent/JP7222346B2/en active Active
- 2018-01-18 KR KR1020197022623A patent/KR102499022B1/en active IP Right Grant
- 2018-01-18 SG SG11201908356W patent/SG11201908356WA/en unknown
- 2018-01-18 EP EP18767237.3A patent/EP3597330A4/en active Pending
- 2018-01-18 US US16/493,427 patent/US11370066B2/en active Active
- 2018-01-18 CN CN201880017472.4A patent/CN110461504B/en active Active
- 2018-01-18 WO PCT/JP2018/001442 patent/WO2018168187A1/en unknown
- 2018-02-06 TW TW107104190A patent/TWI756359B/en active
Also Published As
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EP3597330A1 (en) | 2020-01-22 |
EP3597330A4 (en) | 2020-11-25 |
TW201835264A (en) | 2018-10-01 |
JP7222346B2 (en) | 2023-02-15 |
JPWO2018168187A1 (en) | 2020-01-16 |
TWI756359B (en) | 2022-03-01 |
KR20190126299A (en) | 2019-11-11 |
US11370066B2 (en) | 2022-06-28 |
US20200130109A1 (en) | 2020-04-30 |
KR102499022B1 (en) | 2023-02-13 |
CN110461504B (en) | 2022-07-01 |
WO2018168187A1 (en) | 2018-09-20 |
CN110461504A (en) | 2019-11-15 |
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