SG11201907532VA - Active boundary quilt architecture memory - Google Patents

Active boundary quilt architecture memory

Info

Publication number
SG11201907532VA
SG11201907532VA SG11201907532VA SG11201907532VA SG11201907532VA SG 11201907532V A SG11201907532V A SG 11201907532VA SG 11201907532V A SG11201907532V A SG 11201907532VA SG 11201907532V A SG11201907532V A SG 11201907532VA SG 11201907532V A SG11201907532V A SG 11201907532VA
Authority
SG
Singapore
Prior art keywords
memory
international
active boundary
portions
memory array
Prior art date
Application number
SG11201907532VA
Inventor
Christophe Vincent Antoine Laurent
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Publication of SG11201907532VA publication Critical patent/SG11201907532VA/en

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/025Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • G11C11/225Auxiliary circuits
    • G11C11/2253Address circuits or decoders
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • G11C11/225Auxiliary circuits
    • G11C11/2259Cell access
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0023Address circuits or decoders
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/10Decoders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0207Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/20Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
    • H10B63/24Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes of the Ovonic threshold switching type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/231Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/06Sense amplifiers; Associated circuits, e.g. timing or triggering circuits
    • G11C7/062Differential amplifiers of non-latching type, e.g. comparators, long-tailed pairs

Abstract

WO 18/ 15 175 6 Al (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 23 August 2018 (23.08.2018) WIP0 I PCT O V SID o OH H How iflo VII IE (10) International Publication Number WO 2018/151756 Al (51) International Patent Classification: Gl1C 11/22 (2006.01) (21) International Application Number: PCT/US2017/049441 (22) International Filing Date: 30 August 2017 (30.08.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 15/434,401 16 February 2017 (16.02.2017) US (71) Applicant: MICRON TECHNOLOGY, INC. [US/US]; 8000 S. Federal Way, Boise, Idaho 83716-9632 (US). (72) Inventor: LAURENT, Christophe Vincent Antoine; 8000 S. Federal Way, Boise, Idaho 83716-9632 (US). (74) Agent: HARRIS, Philip W.; Holland & Hart LLP, P.O. Box 11583, Salt Lake City, Utah 84147 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: as to applicant's entitlement to apply for and be granted a patent (Rule 4.17(ii)) as to the applicant's entitlement to claim the priority of the earlier application (Rule 4.17(iii)) Published: — with international search report (Art. 21(3)) (54) Title: ACTIVE BOUNDARY QUILT ARCHITECTURE MEMORY (57) : Methods, systems, and apparatus that increase avail- 415_a able memory or storage using active boundary areas in quilt architec- ture are described. A memory array may include memory cells overly- ing each portion of a substrate layer that includes certain types of sup- port circuitry, such as decoders and sense amplifiers. Active boundary portions, which may be elements of the memory array having a differ- ent configuration from other portions of the memory array, may be po- sitioned on two sides of the memory array and may increase available data in a quilt architecture memory. The active boundary portions may include support components to access both memory cells of neighbor- ing memory portions and memory cells overlying the active boundary portions. Address scrambling may produce a uniform increase in num- ber of available data in conjunction with the active boundary portions. El Core portion Boundary portion Control circuit portion FIG. 9 900
SG11201907532VA 2017-02-16 2017-08-30 Active boundary quilt architecture memory SG11201907532VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/434,401 US9792958B1 (en) 2017-02-16 2017-02-16 Active boundary quilt architecture memory
PCT/US2017/049441 WO2018151756A1 (en) 2017-02-16 2017-08-30 Active boundary quilt architecture memory

Publications (1)

Publication Number Publication Date
SG11201907532VA true SG11201907532VA (en) 2019-09-27

Family

ID=60021644

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201907532VA SG11201907532VA (en) 2017-02-16 2017-08-30 Active boundary quilt architecture memory

Country Status (8)

Country Link
US (4) US9792958B1 (en)
EP (1) EP3583600A4 (en)
JP (1) JP6982089B2 (en)
KR (3) KR102338201B1 (en)
CN (1) CN110291584B (en)
SG (1) SG11201907532VA (en)
TW (1) TWI635504B (en)
WO (1) WO2018151756A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9792958B1 (en) 2017-02-16 2017-10-17 Micron Technology, Inc. Active boundary quilt architecture memory
US10347333B2 (en) 2017-02-16 2019-07-09 Micron Technology, Inc. Efficient utilization of memory die area
US10658427B2 (en) * 2018-10-18 2020-05-19 Micron Technology, Inc. Memory for embedded applications
US10777245B2 (en) * 2019-01-22 2020-09-15 Micron Technology, Inc. Vertical decoders
US10943952B2 (en) * 2019-06-10 2021-03-09 Sandisk Technologies Llc Threshold switch for memory
US11144228B2 (en) * 2019-07-11 2021-10-12 Micron Technology, Inc. Circuit partitioning for a memory device
US10957681B1 (en) * 2019-08-28 2021-03-23 Micron Technology, Inc. Integrated assemblies comprising sense-amplifier-circuitry and wordline-driver-circuitry under memory cells of a memory array
KR102659033B1 (en) * 2019-10-14 2024-04-22 양쯔 메모리 테크놀로지스 씨오., 엘티디. 3D phase change memory devices
KR20210111004A (en) * 2020-03-02 2021-09-10 삼성전자주식회사 Non-volatile memory device, storage device having the same, and reading method thereof
JP2021153080A (en) 2020-03-24 2021-09-30 キオクシア株式会社 Semiconductor storage device
WO2022013590A1 (en) 2020-07-14 2022-01-20 Micron Technology , Inc. 3D QUILT MEMORY ARRAY FOR FeRAM AND DRAM
US11424250B2 (en) * 2020-08-27 2022-08-23 Qualcomm Incorporated Memory
WO2022077318A1 (en) * 2020-10-15 2022-04-21 Yangtze Advanced Memory Industrial Innovation Center Co., Ltd Array and contact architecture for four stack three dimensional cross point memory
US11587606B2 (en) 2021-04-15 2023-02-21 Micron Technology, Inc. Decoding architecture for memory devices
US11894103B2 (en) 2021-04-15 2024-02-06 Micron Technology, Inc. Decoding architecture for word line tiles
US11475947B1 (en) 2021-04-15 2022-10-18 Micron Technology, Inc. Decoding architecture for memory tiles
US11393822B1 (en) * 2021-05-21 2022-07-19 Micron Technology, Inc. Thin film transistor deck selection in a memory device
US11482266B1 (en) 2021-07-26 2022-10-25 Micron Technology, Inc. Edgeless memory clusters

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2827675B2 (en) * 1992-03-26 1998-11-25 日本電気株式会社 Semiconductor storage device
KR100311035B1 (en) * 1997-11-21 2002-02-28 윤종용 Semiconductor memory device with efficiently disposed pads
JP3575988B2 (en) * 1998-05-28 2004-10-13 沖電気工業株式会社 Semiconductor storage device
US7157314B2 (en) 1998-11-16 2007-01-02 Sandisk Corporation Vertically stacked field programmable nonvolatile memory and method of fabrication
US6034882A (en) * 1998-11-16 2000-03-07 Matrix Semiconductor, Inc. Vertically stacked field programmable nonvolatile memory and method of fabrication
US6567287B2 (en) 2001-03-21 2003-05-20 Matrix Semiconductor, Inc. Memory device with row and column decoder circuits arranged in a checkerboard pattern under a plurality of memory arrays
US6765813B2 (en) 2000-08-14 2004-07-20 Matrix Semiconductor, Inc. Integrated systems using vertically-stacked three-dimensional memory cells
JP2002299575A (en) * 2001-03-29 2002-10-11 Toshiba Corp Semiconductor memory
JP3659205B2 (en) * 2001-08-30 2005-06-15 セイコーエプソン株式会社 Nonvolatile semiconductor memory device and driving method thereof
US7112994B2 (en) * 2002-07-08 2006-09-26 Viciciv Technology Three dimensional integrated circuits
JP4026753B2 (en) * 2002-07-25 2007-12-26 株式会社日立製作所 Semiconductor integrated circuit
US7057914B2 (en) 2002-08-02 2006-06-06 Unity Semiconductor Corporation Cross point memory array with fast access time
DE10248723A1 (en) * 2002-10-18 2004-05-06 Infineon Technologies Ag Integrated circuit arrangement with capacitors and preferably planar transistors and manufacturing processes
CN100394603C (en) * 2003-04-03 2008-06-11 株式会社东芝 Phase change memory device
DE10319271A1 (en) * 2003-04-29 2004-11-25 Infineon Technologies Ag Memory circuitry and manufacturing method
CN1977337A (en) 2004-05-03 2007-06-06 统一半导体公司 Non-volatile programmable memory
US7272070B2 (en) 2004-12-21 2007-09-18 Infineon Technologies Ag Memory access using multiple activated memory cell rows
US7872892B2 (en) * 2005-07-05 2011-01-18 Intel Corporation Identifying and accessing individual memory devices in a memory channel
US20070132049A1 (en) 2005-12-12 2007-06-14 Stipe Barry C Unipolar resistance random access memory (RRAM) device and vertically stacked architecture
US7515501B2 (en) * 2007-05-24 2009-04-07 Micron Technology, Inc. Memory architecture having local column select lines
US8253124B2 (en) * 2007-09-07 2012-08-28 Nec Corporation Semiconductor element
KR100935936B1 (en) * 2007-09-12 2010-01-11 삼성전자주식회사 Multi-Layered Memory Apparatus
US7551477B2 (en) * 2007-09-26 2009-06-23 Sandisk Corporation Multiple bit line voltages based on distance
US7750430B2 (en) * 2007-10-31 2010-07-06 Hynix Semiconductor Inc. Semiconductor device and method for fabricating the same
JP5085446B2 (en) * 2008-07-14 2012-11-28 株式会社東芝 3D memory device
JP5322533B2 (en) * 2008-08-13 2013-10-23 株式会社東芝 Nonvolatile semiconductor memory device and manufacturing method thereof
US20100157647A1 (en) * 2008-12-19 2010-06-24 Unity Semiconductor Corporation Memory access circuits and layout of the same for cross-point memory arrays
US8364901B2 (en) * 2009-02-13 2013-01-29 Micron Technology, Inc. Memory prefetch systems and methods
US20180122686A1 (en) 2009-04-14 2018-05-03 Monolithic 3D Inc. 3d semiconductor device and structure
JP5180913B2 (en) * 2009-06-02 2013-04-10 シャープ株式会社 Nonvolatile semiconductor memory device
US8320181B2 (en) * 2009-08-25 2012-11-27 Micron Technology, Inc. 3D memory devices decoding and routing systems and methods
JP4987927B2 (en) * 2009-09-24 2012-08-01 株式会社東芝 Semiconductor memory device
US8638584B2 (en) * 2010-02-02 2014-01-28 Unity Semiconductor Corporation Memory architectures and techniques to enhance throughput for cross-point arrays
WO2012029638A1 (en) 2010-09-03 2012-03-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TWI539453B (en) * 2010-09-14 2016-06-21 半導體能源研究所股份有限公司 Memory device and semiconductor device
WO2013018281A1 (en) * 2011-08-02 2013-02-07 パナソニック株式会社 Resistance variable nonvolatile memory device, and driving method therefor
US8873271B2 (en) 2011-08-14 2014-10-28 International Business Machines Corporation 3D architecture for bipolar memory using bipolar access device
JP6081171B2 (en) * 2011-12-09 2017-02-15 株式会社半導体エネルギー研究所 Storage device
US9117503B2 (en) * 2012-08-29 2015-08-25 Micron Technology, Inc. Memory array plane select and methods
US9190144B2 (en) 2012-10-12 2015-11-17 Micron Technology, Inc. Memory device architecture
US9025398B2 (en) 2012-10-12 2015-05-05 Micron Technology, Inc. Metallization scheme for integrated circuit
US8891280B2 (en) 2012-10-12 2014-11-18 Micron Technology, Inc. Interconnection for memory electrodes
US9224635B2 (en) 2013-02-26 2015-12-29 Micron Technology, Inc. Connections for memory electrode lines
US9406362B2 (en) * 2013-06-17 2016-08-02 Micron Technology, Inc. Memory tile access and selection patterns
US9153305B2 (en) * 2013-08-30 2015-10-06 Micron Technology, Inc. Independently addressable memory array address spaces
US9812196B2 (en) * 2013-10-28 2017-11-07 Hewlett Packard Enterprise Development Lp Geometry dependent voltage biases for asymmetric resistive memories
WO2015065443A1 (en) * 2013-10-31 2015-05-07 Hewlett-Packard Development Company, L.P. Three dimensional resistive memory architectures
US9543515B2 (en) * 2013-11-07 2017-01-10 Intel Corporation Electrode materials and interface layers to minimize chalcogenide interface resistance
WO2016047254A1 (en) 2014-09-22 2016-03-31 ソニー株式会社 Memory cell unit array
US9748337B2 (en) * 2015-03-12 2017-08-29 Kabushiki Kaisha Toshiba Semiconductor memory device
US9711224B2 (en) * 2015-03-13 2017-07-18 Micron Technology, Inc. Devices including memory arrays, row decoder circuitries and column decoder circuitries
US9589611B2 (en) 2015-04-01 2017-03-07 Semiconductor Energy Laboratory Co., Ltd. Memory device, semiconductor device, and electronic device
US10210915B2 (en) 2016-06-10 2019-02-19 Semiconductor Energy Laboratory Co., Ltd. Memory device and semiconductor device including the same
WO2018004715A1 (en) 2016-06-28 2018-01-04 Schlumberger Technology Corporation Well testing systems and methods with mobile monitoring
US9792958B1 (en) 2017-02-16 2017-10-17 Micron Technology, Inc. Active boundary quilt architecture memory
US10347333B2 (en) 2017-02-16 2019-07-09 Micron Technology, Inc. Efficient utilization of memory die area

Also Published As

Publication number Publication date
KR20190104642A (en) 2019-09-10
TWI635504B (en) 2018-09-11
CN110291584A (en) 2019-09-27
US9792958B1 (en) 2017-10-17
US20190103139A1 (en) 2019-04-04
TW201832229A (en) 2018-09-01
JP2020511778A (en) 2020-04-16
JP6982089B2 (en) 2021-12-17
US20180233177A1 (en) 2018-08-16
WO2018151756A1 (en) 2018-08-23
EP3583600A4 (en) 2020-12-02
US10157643B2 (en) 2018-12-18
EP3583600A1 (en) 2019-12-25
KR20220162815A (en) 2022-12-08
US11355162B2 (en) 2022-06-07
CN110291584B (en) 2023-07-18
US10818323B2 (en) 2020-10-27
KR102338201B1 (en) 2021-12-13
US20200395050A1 (en) 2020-12-17
KR20210152016A (en) 2021-12-14

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