SG11201810641UA - Chuck, substrate-holding apparatus, pattern-forming apparatus, and method of manufacturing article - Google Patents

Chuck, substrate-holding apparatus, pattern-forming apparatus, and method of manufacturing article

Info

Publication number
SG11201810641UA
SG11201810641UA SG11201810641UA SG11201810641UA SG11201810641UA SG 11201810641U A SG11201810641U A SG 11201810641UA SG 11201810641U A SG11201810641U A SG 11201810641UA SG 11201810641U A SG11201810641U A SG 11201810641UA SG 11201810641U A SG11201810641U A SG 11201810641UA
Authority
SG
Singapore
Prior art keywords
substrate
chuck
pattern
forming apparatus
support portion
Prior art date
Application number
SG11201810641UA
Other languages
English (en)
Inventor
Toru Matsumoto
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of SG11201810641UA publication Critical patent/SG11201810641UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
SG11201810641UA 2016-06-01 2017-05-29 Chuck, substrate-holding apparatus, pattern-forming apparatus, and method of manufacturing article SG11201810641UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016109651A JP6758920B2 (ja) 2016-06-01 2016-06-01 チャック、基板保持装置、パターン形成装置、及び物品の製造方法
PCT/JP2017/019917 WO2017209051A1 (fr) 2016-06-01 2017-05-29 Mandrin, dispositif de support de substrat, dispositif de formation de motif et procédé de fabrication d'article

Publications (1)

Publication Number Publication Date
SG11201810641UA true SG11201810641UA (en) 2018-12-28

Family

ID=60477425

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201810641UA SG11201810641UA (en) 2016-06-01 2017-05-29 Chuck, substrate-holding apparatus, pattern-forming apparatus, and method of manufacturing article

Country Status (8)

Country Link
US (1) US10754262B2 (fr)
EP (1) EP3467870B1 (fr)
JP (1) JP6758920B2 (fr)
KR (1) KR102169894B1 (fr)
CN (1) CN109314077B (fr)
SG (1) SG11201810641UA (fr)
TW (1) TWI648815B (fr)
WO (1) WO2017209051A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107604309B (zh) * 2017-11-06 2023-09-15 京东方科技集团股份有限公司 掩膜板贴合装置以及其贴合方法
KR102628919B1 (ko) * 2019-05-29 2024-01-24 주식회사 원익아이피에스 기판처리장치 및 이를 이용한 기판처리방법
US11776840B2 (en) * 2019-10-29 2023-10-03 Canon Kabushiki Kaisha Superstrate chuck, method of use, and method of manufacturing an article
US11728204B2 (en) * 2020-10-23 2023-08-15 Kla Corporation High flow vacuum chuck
US11794314B2 (en) * 2021-08-30 2023-10-24 Kla Corporation Quick swap chuck with vacuum holding interchangeable top plate
KR102413824B1 (ko) * 2022-01-04 2022-06-28 주식회사 메이코리아 진공압을 이용해 피가공물을 회전 가능하게 고정하는 고정용 지그

Family Cites Families (28)

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JPH045646U (fr) * 1990-04-27 1992-01-20
EP0456426B1 (fr) * 1990-05-07 2004-09-15 Canon Kabushiki Kaisha Porte substrat du type à dépression
JPH0521584A (ja) * 1991-07-16 1993-01-29 Nikon Corp 保持装置
JPH05235151A (ja) * 1992-02-20 1993-09-10 Canon Inc 基板保持盤
JPH0851143A (ja) 1992-07-20 1996-02-20 Nikon Corp 基板保持装置
JPH06196381A (ja) 1992-12-22 1994-07-15 Canon Inc 基板保持装置
JPH0831719A (ja) * 1994-07-13 1996-02-02 Nikon Corp 半導体基板用吸着ホルダー及び投影露光装置
JP3487368B2 (ja) * 1994-09-30 2004-01-19 株式会社ニコン 走査型露光装置
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
JP2821678B2 (ja) * 1997-04-07 1998-11-05 株式会社ニコン 基板の吸着装置
JP2000100895A (ja) * 1998-09-18 2000-04-07 Nikon Corp 基板の搬送装置、基板の保持装置、及び基板処理装置
WO2001056074A1 (fr) * 2000-01-28 2001-08-02 Hitachi Tokyo Electronics Co., Ltd. Support de tranche, systeme d'exposition et procede de fabrication de dispositif a semiconducteur
JP3859937B2 (ja) * 2000-06-02 2006-12-20 住友大阪セメント株式会社 静電チャック
EP1458019A3 (fr) * 2003-03-13 2005-12-28 VenTec Gesellschaft für Venturekapital und Unternehmensberatung Porte-substrats mobiles électrostatiques et transportables
EP1491953A1 (fr) * 2003-06-23 2004-12-29 ASML Netherlands B.V. Appareil lithographique, procédé pour la production d'un dispositif et dispositif produit par ce procédé
JP4229380B2 (ja) * 2003-09-30 2009-02-25 コバレントマテリアル株式会社 基板保持用真空チャック
EP1699073B1 (fr) * 2003-12-15 2010-12-08 Nikon Corporation Systeme de platine, appareil d'exposition et procede d'exposition
WO2005122219A1 (fr) * 2004-06-09 2005-12-22 Nikon Corporation Dispositif de maintien de substrat, appareil d’exposition ayant ledit dispositif, procede d’exposition, procede de fabrication du dispositif et plaque hydrophobe
SG10201801998TA (en) * 2004-09-17 2018-04-27 Nikon Corp Substrate holding device, exposure apparatus, and device manufacturing method
KR100689843B1 (ko) * 2006-01-03 2007-03-08 삼성전자주식회사 웨이퍼 스테이지 및 이를 이용한 웨이퍼 안착방법
JPWO2007083592A1 (ja) * 2006-01-17 2009-06-11 株式会社ニコン 基板保持装置及び露光装置、並びにデバイス製造方法
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JP6340693B2 (ja) * 2013-07-18 2018-06-13 株式会社ブイ・テクノロジー 基板の保持装置及び密着露光装置並びに近接露光装置
JP6706182B2 (ja) * 2016-09-16 2020-06-03 キオクシア株式会社 基板保持装置

Also Published As

Publication number Publication date
CN109314077A (zh) 2019-02-05
EP3467870A4 (fr) 2020-02-26
US20190094700A1 (en) 2019-03-28
WO2017209051A1 (fr) 2017-12-07
KR20190015414A (ko) 2019-02-13
CN109314077B (zh) 2023-06-02
TWI648815B (zh) 2019-01-21
EP3467870A1 (fr) 2019-04-10
TW201743405A (zh) 2017-12-16
JP2017216375A (ja) 2017-12-07
EP3467870B1 (fr) 2022-07-27
US10754262B2 (en) 2020-08-25
KR102169894B1 (ko) 2020-10-26
JP6758920B2 (ja) 2020-09-23

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