SG11201810119PA - Composition for post chemical-mechanical-polishing cleaning - Google Patents
Composition for post chemical-mechanical-polishing cleaningInfo
- Publication number
- SG11201810119PA SG11201810119PA SG11201810119PA SG11201810119PA SG11201810119PA SG 11201810119P A SG11201810119P A SG 11201810119PA SG 11201810119P A SG11201810119P A SG 11201810119PA SG 11201810119P A SG11201810119P A SG 11201810119PA SG 11201810119P A SG11201810119P A SG 11201810119PA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- ludwigshafen
- composition
- strasse
- chd
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 5
- 238000004140 cleaning Methods 0.000 title abstract 3
- 238000005498 polishing Methods 0.000 title abstract 3
- 101000764817 Chromohalobacter salexigens (strain ATCC BAA-138 / DSM 3043 / CIP 106854 / NCIMB 13768 / 1H11) Oxygen-dependent choline dehydrogenase 1 Proteins 0.000 abstract 2
- 229920002125 Sokalan® Polymers 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 229920001577 copolymer Polymers 0.000 abstract 2
- 235000013350 formula milk Nutrition 0.000 abstract 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 2
- -1 poly(acrylic acid) Polymers 0.000 abstract 2
- 101100220553 Caenorhabditis elegans chd-3 gene Proteins 0.000 abstract 1
- 240000000233 Melia azedarach Species 0.000 abstract 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 abstract 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 abstract 1
- 239000011976 maleic acid Substances 0.000 abstract 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 abstract 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 abstract 1
- 230000008520 organization Effects 0.000 abstract 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
- C11D1/721—End blocked ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/722—Ethers of polyoxyalkylene glycols having mixed oxyalkylene groups; Polyalkoxylated fatty alcohols or polyalkoxylated alkylaryl alcohols with mixed oxyalkylele groups
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
- C11D3/3765—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions in liquid compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16173998 | 2016-06-10 | ||
PCT/EP2017/063215 WO2017211653A1 (en) | 2016-06-10 | 2017-05-31 | Composition for post chemical-mechanical-polishing cleaning |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201810119PA true SG11201810119PA (en) | 2018-12-28 |
Family
ID=56117643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201810119PA SG11201810119PA (en) | 2016-06-10 | 2017-05-31 | Composition for post chemical-mechanical-polishing cleaning |
Country Status (9)
Country | Link |
---|---|
US (1) | US10865361B2 (ja) |
EP (1) | EP3469049B1 (ja) |
JP (1) | JP6932147B2 (ja) |
KR (1) | KR102377573B1 (ja) |
CN (1) | CN109312263B (ja) |
IL (1) | IL263453B (ja) |
SG (1) | SG11201810119PA (ja) |
TW (1) | TWI730115B (ja) |
WO (1) | WO2017211653A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10844333B2 (en) * | 2015-12-22 | 2020-11-24 | Basf Se | Composition for post chemical-mechanical-polishing cleaning |
CN109576090A (zh) * | 2018-12-13 | 2019-04-05 | 中国科学院上海光学精密机械研究所 | 氧化物光学元件化学机械抛光后残留物清洗剂及其制备方法 |
US11659838B2 (en) | 2021-04-01 | 2023-05-30 | Sterilex, Llc | Quat-free powdered disinfectant/sanitizer |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE602005000732T2 (de) | 2004-06-25 | 2007-12-06 | Jsr Corp. | Reinigungszusammensetzung für Halbleiterkomponente und Verfahren zur Herstellung eines Halbleitergeräts |
US7311856B2 (en) * | 2005-03-30 | 2007-12-25 | Cabot Microelectronics Corporation | Polymeric inhibitors for enhanced planarization |
WO2006125462A1 (en) * | 2005-05-25 | 2006-11-30 | Freescale Semiconductor, Inc | Cleaning solution for a semiconductor wafer |
JP3803360B2 (ja) * | 2005-08-31 | 2006-08-02 | 花王株式会社 | 洗浄剤組成物 |
US20100273330A1 (en) * | 2006-08-23 | 2010-10-28 | Citibank N.A. As Collateral Agent | Rinse formulation for use in the manufacture of an integrated circuit |
JP4777197B2 (ja) | 2006-09-11 | 2011-09-21 | 富士フイルム株式会社 | 洗浄液及びそれを用いた洗浄方法 |
US20090056744A1 (en) | 2007-08-29 | 2009-03-05 | Micron Technology, Inc. | Wafer cleaning compositions and methods |
JP2009069505A (ja) | 2007-09-13 | 2009-04-02 | Tosoh Corp | レジスト除去用洗浄液及び洗浄方法 |
JP2012072267A (ja) * | 2010-09-28 | 2012-04-12 | Sanyo Chem Ind Ltd | 電子材料用洗浄剤 |
WO2013123317A1 (en) | 2012-02-15 | 2013-08-22 | Advanced Technology Materials, Inc. | Post-cmp removal using compositions and method of use |
US20160122696A1 (en) * | 2013-05-17 | 2016-05-05 | Advanced Technology Materials, Inc. | Compositions and methods for removing ceria particles from a surface |
US10844333B2 (en) * | 2015-12-22 | 2020-11-24 | Basf Se | Composition for post chemical-mechanical-polishing cleaning |
-
2017
- 2017-05-31 KR KR1020197000645A patent/KR102377573B1/ko active IP Right Grant
- 2017-05-31 IL IL263453A patent/IL263453B/en unknown
- 2017-05-31 JP JP2018564814A patent/JP6932147B2/ja active Active
- 2017-05-31 CN CN201780034922.6A patent/CN109312263B/zh active Active
- 2017-05-31 WO PCT/EP2017/063215 patent/WO2017211653A1/en unknown
- 2017-05-31 US US16/307,191 patent/US10865361B2/en active Active
- 2017-05-31 EP EP17726645.9A patent/EP3469049B1/en active Active
- 2017-05-31 SG SG11201810119PA patent/SG11201810119PA/en unknown
- 2017-06-08 TW TW106118993A patent/TWI730115B/zh active
Also Published As
Publication number | Publication date |
---|---|
US10865361B2 (en) | 2020-12-15 |
JP2019518849A (ja) | 2019-07-04 |
EP3469049A1 (en) | 2019-04-17 |
US20190144781A1 (en) | 2019-05-16 |
CN109312263B (zh) | 2022-04-15 |
TW201809251A (zh) | 2018-03-16 |
IL263453A (en) | 2019-01-31 |
WO2017211653A1 (en) | 2017-12-14 |
KR20190016093A (ko) | 2019-02-15 |
TWI730115B (zh) | 2021-06-11 |
CN109312263A (zh) | 2019-02-05 |
KR102377573B1 (ko) | 2022-03-22 |
EP3469049B1 (en) | 2020-07-22 |
JP6932147B2 (ja) | 2021-09-08 |
IL263453B (en) | 2022-08-01 |
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