SG11201809285YA - Polymer, composition, molded article, cured product, and laminate - Google Patents
Polymer, composition, molded article, cured product, and laminateInfo
- Publication number
- SG11201809285YA SG11201809285YA SG11201809285YA SG11201809285YA SG11201809285YA SG 11201809285Y A SG11201809285Y A SG 11201809285YA SG 11201809285Y A SG11201809285Y A SG 11201809285YA SG 11201809285Y A SG11201809285Y A SG 11201809285YA SG 11201809285Y A SG11201809285Y A SG 11201809285YA
- Authority
- SG
- Singapore
- Prior art keywords
- polymer
- composition
- molded article
- laminate
- cured product
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
- C08G73/0273—Polyamines containing heterocyclic moieties in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
- C08G65/4006—(I) or (II) containing elements other than carbon, oxygen, hydrogen or halogen as leaving group (X)
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
- C08G65/4012—Other compound (II) containing a ketone group, e.g. X-Ar-C(=O)-Ar-X for polyetherketones
- C08G65/4031—(I) or (II) containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
- C08G65/4012—Other compound (II) containing a ketone group, e.g. X-Ar-C(=O)-Ar-X for polyetherketones
- C08G65/4031—(I) or (II) containing nitrogen
- C08G65/4037—(I) or (II) containing nitrogen in ring structure, e.g. pyridine group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
- C08G65/4012—Other compound (II) containing a ketone group, e.g. X-Ar-C(=O)-Ar-X for polyetherketones
- C08G65/4043—(I) or (II) containing oxygen other than as phenol or carbonyl group
- C08G65/405—(I) or (II) containing oxygen other than as phenol or carbonyl group in ring structure, e.g. phenolphtalein
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
- C08G65/4081—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group forming cyclic polymers or oligomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0633—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
FSG_JR-00959SG01 130 A novel polymer having high glass transition temperature and an excellent balance between heat resistance, high refractive index and mechanical properties, and a composition and molded article containing the polymer are provided. The polymer 5 according to the invention has a first structural unit represented by at least one of formulae (1-1), (1-2) and (1-3) below and a second structural unit having either a secondary amino structure or a tertiary amino structure at two or more terminals. POLYMER, COMPOSITION, MOLDED ARTICLE, CURED PRODUCT AND LAMINATE [No Suitable Figure]
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016084840 | 2016-04-20 | ||
JP2016089870 | 2016-04-27 | ||
JP2016148944 | 2016-07-28 | ||
PCT/JP2017/014282 WO2017183461A1 (en) | 2016-04-20 | 2017-04-05 | Polymer, composition, molded article, cured product, and laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201809285YA true SG11201809285YA (en) | 2018-11-29 |
Family
ID=60115952
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201809285YA SG11201809285YA (en) | 2016-04-20 | 2017-04-05 | Polymer, composition, molded article, cured product, and laminate |
SG10202006580TA SG10202006580TA (en) | 2016-04-20 | 2017-04-05 | Polymer, composition, molded article, cured product, and laminate |
SG10202006578WA SG10202006578WA (en) | 2016-04-20 | 2017-04-05 | Polymer, composition, molded article, cured product, and laminate |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202006580TA SG10202006580TA (en) | 2016-04-20 | 2017-04-05 | Polymer, composition, molded article, cured product, and laminate |
SG10202006578WA SG10202006578WA (en) | 2016-04-20 | 2017-04-05 | Polymer, composition, molded article, cured product, and laminate |
Country Status (7)
Country | Link |
---|---|
US (1) | US11505651B2 (en) |
EP (3) | EP3770202B1 (en) |
KR (1) | KR102267304B1 (en) |
CN (2) | CN109071804B (en) |
SG (3) | SG11201809285YA (en) |
TW (2) | TWI738763B (en) |
WO (1) | WO2017183461A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6866737B2 (en) * | 2016-04-20 | 2021-04-28 | Jsr株式会社 | Polymers, compositions and moldings |
JP6922364B2 (en) * | 2016-07-28 | 2021-08-18 | Jsr株式会社 | Polymers, compositions and moldings |
CN111108816A (en) * | 2017-09-15 | 2020-05-05 | Jsr株式会社 | Circuit board |
KR102643004B1 (en) * | 2017-11-08 | 2024-03-05 | 닛산 가가쿠 가부시키가이샤 | Triazine ring-containing polymer and composition containing the same |
WO2020179443A1 (en) * | 2019-03-01 | 2020-09-10 | Jsr株式会社 | Laminate for high-frequency circuit, method for producing same, flexible printed board, b stage sheet, and wound laminate |
JP7409374B2 (en) * | 2019-04-25 | 2024-01-09 | Jsr株式会社 | Photosensitive resin composition |
JP2021172756A (en) * | 2020-04-27 | 2021-11-01 | 味の素株式会社 | Resin composition |
CN114561011B (en) * | 2022-03-10 | 2023-11-03 | 哈尔滨工业大学 | Self-emulsifying ionic aqueous polyamide imide and preparation method thereof, carbon fiber sizing agent and preparation method and application thereof |
WO2024053282A1 (en) * | 2022-09-09 | 2024-03-14 | Jsr株式会社 | Polymer, composition, cured product, laminate, and electronic component |
Family Cites Families (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3166521A (en) * | 1962-03-06 | 1965-01-19 | Du Pont | Polymers of aminopyrimidines and process therefor |
FR2019511A1 (en) * | 1968-09-30 | 1970-07-03 | Procter & Gamble | |
US3644285A (en) * | 1970-10-12 | 1972-02-22 | Research Corp | Polyaromatic pyrazines |
US3814757A (en) * | 1971-04-13 | 1974-06-04 | Du Pont | Diamino substituted dicyano pyrazines and process |
JPS5638617B2 (en) * | 1972-06-12 | 1981-09-08 | ||
JPS5630182B2 (en) | 1973-02-02 | 1981-07-13 | ||
JPS5122904A (en) | 1974-08-20 | 1976-02-24 | Mitsubishi Heavy Ind Ltd | DATSUKIKI SUKURABAA |
CH606253A5 (en) * | 1977-01-07 | 1978-10-31 | Ciba Geigy Ag | |
SU858316A1 (en) | 1979-12-17 | 1985-11-30 | Новосибирский институт органической химии СО АН СССР | 2,5-di-(n-aminophenyl)pyramidine as monomer for synthesis of polymides,method of producing same and polyimides on its base as heat resistant material |
JPS6185439A (en) * | 1984-10-03 | 1986-05-01 | Showa Denko Kk | Poly-2-aminopyrimidine |
US4931487A (en) * | 1988-03-04 | 1990-06-05 | Dow Chemical Company | Chain extenders for polyurethanes |
US5089571A (en) * | 1990-12-04 | 1992-02-18 | The Dow Chemical Company | Regenerated, high molecular weight, thermoplastic resins and process for regenerating thermoplastic resins |
JPH0565352A (en) | 1991-09-09 | 1993-03-19 | Mitsubishi Gas Chem Co Inc | Production of thermosetting film of cyanate-modified polyphenylene ether resin |
DE4237768A1 (en) | 1991-11-12 | 1993-05-13 | Ciba Geigy Ag | New polyarylene ether derivs. with reduced viscosity - used to prepare moulded bodies, foils, fibres and membranes, as matrix resins, adhesives or coating agents or as polymer additives |
US5464923A (en) * | 1994-10-19 | 1995-11-07 | Hoechst Celanese Corporation | Polymer compositions containing substituted biphenyl pyrazines |
JP4153060B2 (en) * | 1997-09-25 | 2008-09-17 | 日本曹達株式会社 | Polyester compound having pyrazine ring in main chain, process for producing the same, and polymer dye |
JP2001301088A (en) | 2000-04-24 | 2001-10-30 | Jsr Corp | Laminated film and printed board using the same |
JP4467816B2 (en) | 2001-02-27 | 2010-05-26 | 株式会社日立製作所 | Low dielectric loss tangent resin composition, curable film, cured product, electrical component using the same, and production method thereof |
US6869715B2 (en) | 2002-11-23 | 2005-03-22 | Gkss-Forschungszentrum Geesthacht, Gmbh | Ion conductive membrane for electrochemical application |
JP4211378B2 (en) | 2002-12-13 | 2009-01-21 | ソニー株式会社 | Capacitor element |
CN1835946B (en) | 2003-06-19 | 2010-06-16 | 住友化学株式会社 | Epoxy compound and cured epoxy resin product |
EP1652259A2 (en) * | 2003-07-27 | 2006-05-03 | Pemeas GmbH | Proton-conducting membrane and use thereof |
JP2005290317A (en) * | 2004-04-05 | 2005-10-20 | Teijin Ltd | Rigid-type heterocyclic polymer composition |
JP4999285B2 (en) | 2005-05-24 | 2012-08-15 | 上野製薬株式会社 | Liquid crystalline polyester resin composition |
JP2007262191A (en) | 2006-03-28 | 2007-10-11 | Nippon Steel Chem Co Ltd | Flame-retardant curable resin composition |
JP2008039703A (en) | 2006-08-09 | 2008-02-21 | Sumitomo Bakelite Co Ltd | Electromagnetic characteristic measuring tool and measuring method |
JP4963628B2 (en) | 2007-05-15 | 2012-06-27 | 住友化学株式会社 | Polymer film laminate, method for producing the same, and flexible wiring board using polymer film laminate. |
JP5198105B2 (en) | 2008-03-25 | 2013-05-15 | 日本メクトロン株式会社 | Manufacturing method of multilayer flexible printed wiring board |
JP4613977B2 (en) | 2008-04-28 | 2011-01-19 | 日立化成工業株式会社 | Prepreg including thin-layer quartz glass cloth and wiring board using the same |
JP2010031231A (en) * | 2008-06-30 | 2010-02-12 | Jsr Corp | New aromatic compound and polyarylene-based copolymer having nitrogen-containing aromatic ring |
EP2428529B1 (en) * | 2009-05-07 | 2019-03-06 | Nissan Chemical Corporation | Triazine ring-containing polymer and film-forming composition comprising same |
JP5625566B2 (en) | 2009-07-14 | 2014-11-19 | 味の素株式会社 | Adhesive film with copper foil |
US8222403B2 (en) * | 2009-11-12 | 2012-07-17 | The United States Of America, As Represented By The Secretary Of The Navy | Heteroaromatic phthalonitriles |
CN102753604B (en) * | 2010-01-04 | 2015-01-21 | 罗地亚经营管理公司 | Polyamine and method for producing the same |
WO2012014339A1 (en) | 2010-07-26 | 2012-02-02 | 日本メクトロン株式会社 | Flexible printed circuit board and method of manufacturing thereof |
JP5630182B2 (en) | 2010-09-27 | 2014-11-26 | 株式会社デンソー | Epoxy resin composition and epoxy resin / polyethersulfone composite |
JP5598258B2 (en) | 2010-10-28 | 2014-10-01 | 日産化学工業株式会社 | Electronic device comprising a triazine ring-containing polymer-containing high refractive index film |
TWI393495B (en) | 2010-12-03 | 2013-04-11 | Adv Flexible Circuits Co Ltd | Electrical impedance precision control of signal transmission line for circuit board |
KR102045172B1 (en) | 2010-12-27 | 2019-11-14 | 주식회사 쿠라레 | Circuit board |
US9006339B2 (en) * | 2011-05-10 | 2015-04-14 | Basf Se | Mechanically stabilized polyazoles comprising at least one polyvinyl alcohol |
JP5590245B2 (en) | 2011-08-23 | 2014-09-17 | 日本ゼオン株式会社 | Curable resin composition, film, prepreg, laminate, cured product, and composite |
TWI544843B (en) | 2011-11-22 | 2016-08-01 | 松下知識產權經營股份有限公司 | Flexible metal clad substrate, method for manufacturing flexible metal clad substrate, printed wiring board, multilayer flexible printed wiring board, and flex-rigid printed wiring board |
KR20140104420A (en) | 2011-12-01 | 2014-08-28 | 제이에스알 가부시끼가이샤 | Resist-underlayer-film-forming composition used in multilayer resist process, resist underlayer film, method for forming same, and pattern-formation method |
WO2013094606A1 (en) | 2011-12-22 | 2013-06-27 | 太陽インキ製造株式会社 | Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate |
US8981036B2 (en) * | 2012-08-02 | 2015-03-17 | The United States Of America, As Represented By The Secretary Of The Navy | Synthesis of and curing additives for phthalonitriles |
JP2014070111A (en) | 2012-09-28 | 2014-04-21 | Nippon Zeon Co Ltd | Insulator, insulating film, laminate, and method for manufacturing laminate |
CN103102488B (en) * | 2013-02-07 | 2014-10-15 | 江西师范大学 | High dielectric constant polyimide containing bipyrimidine structure and preparation method |
JP2014185309A (en) * | 2013-02-21 | 2014-10-02 | Jsr Corp | Polymer production method and polymer |
JP6188788B2 (en) | 2013-03-22 | 2017-08-30 | ナミックス株式会社 | Resin composition, and adhesive film, coverlay film, and interlayer adhesive formed thereby |
JP6235787B2 (en) | 2013-03-29 | 2017-11-22 | 東レ・デュポン株式会社 | Coverlay for high frequency circuit boards |
JP6515811B2 (en) | 2013-12-24 | 2019-05-22 | 日産化学株式会社 | Triazine polymer-containing composition |
CN103801501B (en) | 2014-01-20 | 2016-04-20 | 中国科学院长春应用化学研究所 | Flexible glue-free copper coated plate and preparation method thereof |
JP6388483B2 (en) | 2014-03-13 | 2018-09-12 | 東レ・デュポン株式会社 | High frequency circuit board coverlay and flexible flat cable base material |
JP6429267B2 (en) * | 2014-04-28 | 2018-11-28 | Jsr株式会社 | Polymer |
JP6432156B2 (en) | 2014-04-28 | 2018-12-05 | Jsr株式会社 | POLYMER COMPOSITION, POLYMER PELLET, MOLDED BODY, AND FILM |
JP6206445B2 (en) | 2014-07-25 | 2017-10-04 | Jsr株式会社 | Circuit board resin substrate, circuit board resin composition, and circuit board |
JP2016087799A (en) | 2014-10-29 | 2016-05-23 | 東レ・デュポン株式会社 | Long-sized laminate for high frequency circuit board, and method for manufacturing the same |
TW201929618A (en) | 2015-01-13 | 2019-07-16 | 日商日立化成股份有限公司 | Resin film for flexible printed circuit board, metal foil provided with resin, coverlay film, bonding sheet, and flexible printed circuit board |
KR102438427B1 (en) * | 2015-03-11 | 2022-09-01 | 제이에스알 가부시끼가이샤 | Polymers, resin compositions and resin molded articles |
WO2017007928A1 (en) * | 2015-07-07 | 2017-01-12 | Katz Jeffrey Louis | Polymeric ion conductor with improved thermal characteristics |
JP6590568B2 (en) | 2015-07-22 | 2019-10-16 | 株式会社カネカ | Insulating film, method for producing insulating film, and method for producing metal-clad laminate |
JP6927665B2 (en) | 2015-12-25 | 2021-09-01 | 日東電工株式会社 | Wiring circuit board |
JP6888308B2 (en) | 2016-02-04 | 2021-06-16 | Jsr株式会社 | Resin composition, polymer production method and molded product |
JP6971580B2 (en) | 2016-02-12 | 2021-11-24 | 株式会社カネカ | Multilayer polyimide film and flexible metal-clad laminate |
JPWO2017209208A1 (en) | 2016-06-02 | 2019-03-28 | 日立化成株式会社 | Manufacturing method of laminate |
-
2017
- 2017-04-05 SG SG11201809285YA patent/SG11201809285YA/en unknown
- 2017-04-05 SG SG10202006580TA patent/SG10202006580TA/en unknown
- 2017-04-05 WO PCT/JP2017/014282 patent/WO2017183461A1/en active Application Filing
- 2017-04-05 EP EP20193296.9A patent/EP3770202B1/en active Active
- 2017-04-05 EP EP20193294.4A patent/EP3766919B1/en active Active
- 2017-04-05 KR KR1020187029962A patent/KR102267304B1/en active IP Right Grant
- 2017-04-05 SG SG10202006578WA patent/SG10202006578WA/en unknown
- 2017-04-05 CN CN201780023932.XA patent/CN109071804B/en active Active
- 2017-04-05 CN CN202111199328.7A patent/CN113861407B/en active Active
- 2017-04-05 EP EP17785803.2A patent/EP3447081B1/en active Active
- 2017-04-14 TW TW106112616A patent/TWI738763B/en active
- 2017-04-14 TW TW110124227A patent/TWI768995B/en active
-
2018
- 2018-10-19 US US16/165,526 patent/US11505651B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR102267304B1 (en) | 2021-06-21 |
EP3766919A1 (en) | 2021-01-20 |
SG10202006578WA (en) | 2020-08-28 |
EP3447081A4 (en) | 2020-03-18 |
US11505651B2 (en) | 2022-11-22 |
US20190055357A1 (en) | 2019-02-21 |
EP3766919B1 (en) | 2024-02-21 |
EP3770202B1 (en) | 2024-02-21 |
US20220235179A1 (en) | 2022-07-28 |
SG10202006580TA (en) | 2020-08-28 |
KR20180136950A (en) | 2018-12-26 |
EP3770202A1 (en) | 2021-01-27 |
EP3447081A1 (en) | 2019-02-27 |
CN113861407A (en) | 2021-12-31 |
TW202140616A (en) | 2021-11-01 |
TW201807017A (en) | 2018-03-01 |
CN109071804B (en) | 2022-01-11 |
CN109071804A (en) | 2018-12-21 |
WO2017183461A1 (en) | 2017-10-26 |
TWI738763B (en) | 2021-09-11 |
EP3447081B1 (en) | 2021-03-31 |
CN113861407B (en) | 2024-02-20 |
TWI768995B (en) | 2022-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201809285YA (en) | Polymer, composition, molded article, cured product, and laminate | |
BR112017008494A2 (en) | "laminate, integrated molded articles and methods for producing integrated molded article and laminate production" | |
BR112014031920A2 (en) | ethylene copolymers, film and polymerization process | |
MX2015009243A (en) | Glass-fibers-reinforced thermoplastic resin molded article and method for producing same. | |
WO2014098269A3 (en) | Toughening agent for polycarbonate resin, polycarbonate resin composition, and molded article | |
WO2014104390A3 (en) | Curable silicone composition, cured product thereof, and optical semiconductor device | |
MX2016012449A (en) | Olefin resin and method for producing same. | |
MX350820B (en) | Polymer composition with heat-absorbing properties. | |
MY181194A (en) | Thermoplastic resin composition and molded product thereof | |
WO2017119793A3 (en) | Phthalonitrile resin | |
WO2014152686A3 (en) | High refractive index siloxanes | |
MX2019009890A (en) | Acid-functionalized copolymers of methyl methacrylate and acrylic resin compositions based thereon. | |
MY172180A (en) | Impact-resistant pmma with improved optical properties | |
AR107794A1 (en) | ARTIFICIAL GRASSES AND THE METHOD OF PREPARATION OF THEM | |
MX2017005577A (en) | Poly(vinyl acetal) resin compositions, layers, and interlayers having enhanced optical properties. | |
SG11201906470WA (en) | Conjugated diene polymer, conjugated diene polymer composition, and tire | |
WO2016085222A8 (en) | Thermoplastic resin composition and molded product obtained by applying same | |
WO2016094203A8 (en) | Poly(vinyl acetal) resin compositions, layers, and interlayers having enhanced optical properties | |
TW200714620A (en) | Cycloolefin addition polymer, its composite and molding, and optical material | |
MY171762A (en) | Ethylene-vinylalcohol resin composition, molded product, and multilayer structure | |
MY197693A (en) | Polyarylene sulfide copolymer and method of producing the same | |
MX2022006041A (en) | Matrix resin for laminates with high transparency, low yellowing and high glass transition temperatures. | |
TW201613997A (en) | Thermoplastic resin composition, manufacturing method thereof and molded body | |
SG11201810722PA (en) | Polymerizable silane compound | |
SA519401443B1 (en) | Multi-modal polyisoolefin compositions and processes therefor |