SG11201808372XA - Method for manufacturing semiconductor device - Google Patents

Method for manufacturing semiconductor device

Info

Publication number
SG11201808372XA
SG11201808372XA SG11201808372XA SG11201808372XA SG11201808372XA SG 11201808372X A SG11201808372X A SG 11201808372XA SG 11201808372X A SG11201808372X A SG 11201808372XA SG 11201808372X A SG11201808372X A SG 11201808372XA SG 11201808372X A SG11201808372X A SG 11201808372XA
Authority
SG
Singapore
Prior art keywords
resin layer
adhesive
semiconductor device
manufacturing semiconductor
adhered
Prior art date
Application number
SG11201808372XA
Inventor
Eiji Hayashishita
Original Assignee
Mitsui Chemicals Tohcello Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Tohcello Inc filed Critical Mitsui Chemicals Tohcello Inc
Publication of SG11201808372XA publication Critical patent/SG11201808372XA/en

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    • H—ELECTRICITY
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H01L2224/81815—Reflow soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A method for manufacturing a semiconductor device according to the present invention includes at least the following three steps: (A) a step of preparing a first structure (100) including an adhesive 5 laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and a first semiconductor component (60) adhered to the adhesive resin layer (30) and having a first terminal (65); (B) a step of performing solder reflow processing on the first structure 10 (100) in a state where the first semiconductor component (60) is adhered to the adhesive resin layer (30); and (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50). Fig. 1
SG11201808372XA 2016-03-30 2017-03-27 Method for manufacturing semiconductor device SG11201808372XA (en)

Applications Claiming Priority (2)

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JP2016068859 2016-03-30
PCT/JP2017/012478 WO2017170451A1 (en) 2016-03-30 2017-03-27 Semiconductor device manufacturing method

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JP (1) JP6204640B1 (en)
KR (1) KR102074607B1 (en)
CN (1) CN109075085B (en)
SG (1) SG11201808372XA (en)
TW (1) TWI705496B (en)
WO (1) WO2017170451A1 (en)

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WO2018097036A1 (en) 2016-11-25 2018-05-31 三井化学東セロ株式会社 Adhesive laminated film and method for producing electronic device
JP6875865B2 (en) * 2017-01-12 2021-05-26 リンテック株式会社 Manufacturing method for semiconductor processing sheets and semiconductor devices
CN109686854B (en) * 2017-10-19 2024-07-02 京东方科技集团股份有限公司 Packaging structure and packaging method, electronic device and packaging film recycling method
JP7133355B2 (en) * 2018-05-17 2022-09-08 日東電工株式会社 Adhesive sheet
CN109599357B (en) * 2018-11-26 2020-12-18 合肥彩虹蓝光科技有限公司 Cutting method and manufacturing method of semiconductor element
JP7479336B2 (en) 2021-08-06 2024-05-08 古河電気工業株式会社 Semiconductor manufacturing process transport tape

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JP2002226796A (en) * 2001-01-29 2002-08-14 Hitachi Chem Co Ltd Pressure-sensitive adhesive sheet for sticking wafer and semiconductor device
JP4745073B2 (en) * 2006-02-03 2011-08-10 シチズン電子株式会社 Manufacturing method of surface mounted light emitting device
JP2012033637A (en) * 2010-07-29 2012-02-16 Nitto Denko Corp Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device
JP5689269B2 (en) * 2010-09-16 2015-03-25 日東電工株式会社 Adhesive tape
TW201241941A (en) * 2010-10-21 2012-10-16 Sumitomo Bakelite Co A method for manufacturing an electronic equipment, and the electronic equipment obtained by using the method, as well as a method for manufacturing electronics and electronic parts, and the electronics and the electronic parts obtained using the method
JP5963395B2 (en) * 2011-03-04 2016-08-03 タツタ電線株式会社 Protective tape
US8816404B2 (en) 2011-09-16 2014-08-26 Stats Chippac, Ltd. Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant
JP2013227435A (en) 2012-04-26 2013-11-07 Toray Ind Inc Adhesive sheet for producing semiconductor device and method for producing semiconductor device
KR102007259B1 (en) * 2012-09-27 2019-08-06 삼성전자주식회사 Semiconductor package and method for manufacturing the same
KR20150099769A (en) * 2012-12-28 2015-09-01 린텍 가부시키가이샤 Dicing-sheet substrate film and dicing sheet
JP5894092B2 (en) 2013-01-24 2016-03-23 日本電信電話株式会社 Semiconductor device mounting structure and semiconductor device manufacturing method
JP2015137299A (en) * 2014-01-21 2015-07-30 住友ベークライト株式会社 Resin composition, adhesive sheet, adhesive sheet integrated with dicing tape, adhesive sheet integrated with back grind tape, adhesive sheet integrated with back grind tape also functioning as dicing tape, and electronic device
JP6280400B2 (en) * 2014-03-07 2018-02-14 日東電工株式会社 Underfill material, laminated sheet, and method of manufacturing semiconductor device

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EP3442012B1 (en) 2024-05-08
CN109075085B (en) 2022-04-05
CN109075085A (en) 2018-12-21
EP3442012A1 (en) 2019-02-13
TWI705496B (en) 2020-09-21
EP3442012A4 (en) 2020-01-29
JPWO2017170451A1 (en) 2018-04-05
KR102074607B1 (en) 2020-02-06
US20200312810A1 (en) 2020-10-01
TW201737341A (en) 2017-10-16
JP6204640B1 (en) 2017-09-27
KR20180119645A (en) 2018-11-02
WO2017170451A1 (en) 2017-10-05
US11107789B2 (en) 2021-08-31

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