SG11201807452UA - Protective film-forming composite sheet - Google Patents

Protective film-forming composite sheet

Info

Publication number
SG11201807452UA
SG11201807452UA SG11201807452UA SG11201807452UA SG11201807452UA SG 11201807452U A SG11201807452U A SG 11201807452UA SG 11201807452U A SG11201807452U A SG 11201807452UA SG 11201807452U A SG11201807452U A SG 11201807452UA SG 11201807452U A SG11201807452U A SG 11201807452UA
Authority
SG
Singapore
Prior art keywords
protective film
composite sheet
forming composite
support sheet
coating layer
Prior art date
Application number
SG11201807452UA
Inventor
Naoya Saiki
Haruka Sasaki
Hiroyuki Yoneyama
Daisuke Yamamoto
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG11201807452UA publication Critical patent/SG11201807452UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/406—Bright, glossy, shiny surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)

Abstract

Provided is a protective film-forming composite sheet including: a support sheet; a protective film-forming film provided on one surface of the support sheet; and a coating layer provided on a surface of the support sheet on a side opposite to a side where 5 the protective film-forming film is provided, in which a gloss value of a surface of the coating layer on a side opposite to a side where the coating layer and the support sheet are in contact with each other is in a range of 32 to 95.
SG11201807452UA 2016-03-04 2017-02-10 Protective film-forming composite sheet SG11201807452UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016042690 2016-03-04
PCT/JP2017/004927 WO2017150145A1 (en) 2016-03-04 2017-02-10 Protective film-forming composite sheet

Publications (1)

Publication Number Publication Date
SG11201807452UA true SG11201807452UA (en) 2018-09-27

Family

ID=59742786

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807452UA SG11201807452UA (en) 2016-03-04 2017-02-10 Protective film-forming composite sheet

Country Status (6)

Country Link
JP (1) JP6818009B2 (en)
KR (1) KR20180120173A (en)
CN (2) CN117656639A (en)
SG (1) SG11201807452UA (en)
TW (1) TWI764885B (en)
WO (1) WO2017150145A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2020116284A1 (en) * 2018-12-05 2021-10-21 リンテック株式会社 Manufacturing method of composite sheet for forming protective film and semiconductor chip
CN116323836A (en) * 2021-03-31 2023-06-23 积水保力马科技株式会社 Film-forming composition, film, circuit sheet, and sensor sheet

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002068192A1 (en) * 2001-02-26 2002-09-06 Trespaphan Gmbh Laser-markable laminate
JP4762671B2 (en) * 2005-10-26 2011-08-31 古河電気工業株式会社 Dicing tape and semiconductor wafer dicing method
KR101035297B1 (en) * 2006-09-27 2011-05-19 후지쯔 세미컨덕터 가부시키가이샤 Method for manufacturing semiconductor device
JP5391158B2 (en) * 2010-06-30 2014-01-15 古河電気工業株式会社 Wafer sticking adhesive sheet and wafer processing method using the same
JP5432853B2 (en) * 2010-07-30 2014-03-05 日東電工株式会社 Dicing tape-integrated film for semiconductor back surface, manufacturing method thereof, and manufacturing method of semiconductor device
JP5583724B2 (en) * 2012-09-20 2014-09-03 リンテック株式会社 Laser dicing sheet-peeling sheet laminate, laser dicing sheet and chip body manufacturing method
JP6059499B2 (en) * 2012-10-05 2017-01-11 リンテック株式会社 Surface protection sheet
JP6104925B2 (en) * 2012-10-05 2017-03-29 リンテック株式会社 Dicing sheet with protective film forming layer and chip manufacturing method
CN105009277B (en) * 2013-03-19 2017-10-27 琳得科株式会社 Diaphragm formation film
WO2014155756A1 (en) * 2013-03-26 2014-10-02 リンテック株式会社 Adhesive sheet, composite sheet for forming protective film, and method for manufacturing chip with protective film
JP6405556B2 (en) * 2013-07-31 2018-10-17 リンテック株式会社 Protective film forming film, protective film forming sheet and inspection method
US10106700B2 (en) * 2014-03-24 2018-10-23 Lintec Corporation Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product
JP6334223B2 (en) * 2014-03-26 2018-05-30 リンテック株式会社 Adhesive sheet
JP5823591B1 (en) * 2014-10-01 2015-11-25 古河電気工業株式会社 Adhesive tape for protecting semiconductor wafer surface and method for processing semiconductor wafer

Also Published As

Publication number Publication date
TW201801916A (en) 2018-01-16
TWI764885B (en) 2022-05-21
WO2017150145A1 (en) 2017-09-08
CN117656639A (en) 2024-03-08
JPWO2017150145A1 (en) 2018-12-27
KR20180120173A (en) 2018-11-05
JP6818009B2 (en) 2021-01-20
CN108778722A (en) 2018-11-09

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