SG11201706686YA - Methods for determining resist deformation - Google Patents

Methods for determining resist deformation

Info

Publication number
SG11201706686YA
SG11201706686YA SG11201706686YA SG11201706686YA SG11201706686YA SG 11201706686Y A SG11201706686Y A SG 11201706686YA SG 11201706686Y A SG11201706686Y A SG 11201706686YA SG 11201706686Y A SG11201706686Y A SG 11201706686YA SG 11201706686Y A SG11201706686Y A SG 11201706686YA
Authority
SG
Singapore
Prior art keywords
methods
resist deformation
determining resist
determining
deformation
Prior art date
Application number
SG11201706686YA
Other languages
English (en)
Inventor
Peng Liu
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG11201706686YA publication Critical patent/SG11201706686YA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • G03F7/70441—Optical proximity correction [OPC]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70608—Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
SG11201706686YA 2015-03-16 2016-02-24 Methods for determining resist deformation SG11201706686YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562133782P 2015-03-16 2015-03-16
PCT/EP2016/053877 WO2016146355A1 (en) 2015-03-16 2016-02-24 Methods for determining resist deformation

Publications (1)

Publication Number Publication Date
SG11201706686YA true SG11201706686YA (en) 2017-09-28

Family

ID=55409854

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201706686YA SG11201706686YA (en) 2015-03-16 2016-02-24 Methods for determining resist deformation

Country Status (8)

Country Link
US (1) US10423076B2 (ko)
EP (1) EP3271783B1 (ko)
JP (1) JP6640236B2 (ko)
KR (2) KR102182005B1 (ko)
CN (1) CN107430351B (ko)
SG (1) SG11201706686YA (ko)
TW (1) TWI620033B (ko)
WO (1) WO2016146355A1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10437157B2 (en) 2014-12-09 2019-10-08 Asml Netherlands B.V. Method and apparatus for image analysis
WO2016091536A1 (en) * 2014-12-09 2016-06-16 Asml Netherlands B.V. Method and apparatus for image analysis
WO2017172158A1 (en) * 2016-03-29 2017-10-05 Applied Materials, Inc. Integrated metrology and process system for semiconductor substrate local stress and overlay correction
US11625520B2 (en) 2017-12-04 2023-04-11 Asml Netherlands B.V. Systems and methods for predicting layer deformation
EP3492983A1 (en) * 2017-12-04 2019-06-05 ASML Netherlands B.V. Systems and methods for predicting layer deformation
EP3531206A1 (en) * 2018-02-23 2019-08-28 ASML Netherlands B.V. Systems and methods for improving resist model predictions
US11709988B2 (en) * 2018-12-31 2023-07-25 Asml Netherlands B.V. Method for predicting resist deformation
CN109708590B (zh) * 2019-01-23 2020-04-10 中国科学院长春光学精密机械与物理研究所 一种反射镜绝对加工面形的计算方法及***
KR20220093915A (ko) * 2020-12-28 2022-07-05 삼성전자주식회사 반도체 집적회로 레이아웃의 확률적 취약점 검출 방법 및 이를 수행하는 컴퓨터 시스템

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5523193A (en) 1988-05-31 1996-06-04 Texas Instruments Incorporated Method and apparatus for patterning and imaging member
DE59105735D1 (de) 1990-05-02 1995-07-20 Fraunhofer Ges Forschung Belichtungsvorrichtung.
US5229872A (en) 1992-01-21 1993-07-20 Hughes Aircraft Company Exposure device including an electrically aligned electronic mask for micropatterning
WO1997033205A1 (en) 1996-03-06 1997-09-12 Philips Electronics N.V. Differential interferometer system and lithographic step-and-scan apparatus provided with such a system
US6594012B2 (en) 1996-07-05 2003-07-15 Canon Kabushiki Kaisha Exposure apparatus
DE69735016T2 (de) 1996-12-24 2006-08-17 Asml Netherlands B.V. Lithographisches Gerät mit zwei Objekthaltern
US6433878B1 (en) * 2001-01-29 2002-08-13 Timbre Technology, Inc. Method and apparatus for the determination of mask rules using scatterometry
US7617477B2 (en) 2005-09-09 2009-11-10 Brion Technologies, Inc. Method for selecting and optimizing exposure tool using an individual mask error model
JP2008250139A (ja) 2007-03-30 2008-10-16 Fujifilm Corp 露光装置における露光方法及び露光装置
US20080304034A1 (en) 2007-06-07 2008-12-11 Asml Netherlands B.V. Dose control for optical maskless lithography
NL1036189A1 (nl) 2007-12-05 2009-06-08 Brion Tech Inc Methods and System for Lithography Process Window Simulation.
CN102057330B (zh) * 2008-06-03 2013-07-17 Asml荷兰有限公司 基于模型的扫描器调节方法
NL2007577A (en) 2010-11-10 2012-05-14 Asml Netherlands Bv Optimization of source, mask and projection optics.
NL2008924A (en) 2011-06-22 2013-01-02 Asml Netherlands Bv System and method to ensure source and image stability.
US8473878B2 (en) * 2011-11-28 2013-06-25 Synopsys, Inc. Lithographically enhanced edge determination
NL2009982A (en) * 2012-01-10 2013-07-15 Asml Netherlands Bv Source mask optimization to reduce stochastic effects.
JP5789275B2 (ja) 2012-02-03 2015-10-07 エーエスエムエル ネザーランズ ビー．ブイ． ３ｄレジストプロファイルのシミュレーション用のリソグラフィモデル
KR101821666B1 (ko) 2013-07-19 2018-01-24 에이에스엠엘 네델란즈 비.브이. 비­단조적 도즈 감도의 결정 및 적용

Also Published As

Publication number Publication date
US10423076B2 (en) 2019-09-24
CN107430351A (zh) 2017-12-01
TW201702747A (zh) 2017-01-16
TWI620033B (zh) 2018-04-01
EP3271783B1 (en) 2021-04-07
KR102182005B1 (ko) 2020-11-24
JP2018509651A (ja) 2018-04-05
US20180246419A1 (en) 2018-08-30
WO2016146355A1 (en) 2016-09-22
EP3271783A1 (en) 2018-01-24
JP6640236B2 (ja) 2020-02-05
KR102077173B1 (ko) 2020-02-13
KR20170141667A (ko) 2017-12-26
KR20200015843A (ko) 2020-02-12
CN107430351B (zh) 2019-06-11

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