SG11201703409QA - Short-chain fluorosurfactants with iodide additives for forming silver nanowire-based transparent conductive films - Google Patents

Short-chain fluorosurfactants with iodide additives for forming silver nanowire-based transparent conductive films

Info

Publication number
SG11201703409QA
SG11201703409QA SG11201703409QA SG11201703409QA SG11201703409QA SG 11201703409Q A SG11201703409Q A SG 11201703409QA SG 11201703409Q A SG11201703409Q A SG 11201703409QA SG 11201703409Q A SG11201703409Q A SG 11201703409QA SG 11201703409Q A SG11201703409Q A SG 11201703409QA
Authority
SG
Singapore
Prior art keywords
short
transparent conductive
conductive films
silver nanowire
based transparent
Prior art date
Application number
SG11201703409QA
Inventor
Teresa Ramos
Lin Zhang
Lily Pay
Original Assignee
Cam Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cam Holding Corp filed Critical Cam Holding Corp
Publication of SG11201703409QA publication Critical patent/SG11201703409QA/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/43—Thickening agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/45—Anti-settling agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K23/00—Use of substances as emulsifying, wetting, dispersing, or foam-producing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
  • Paints Or Removers (AREA)
SG11201703409QA 2014-11-05 2015-11-05 Short-chain fluorosurfactants with iodide additives for forming silver nanowire-based transparent conductive films SG11201703409QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462075733P 2014-11-05 2014-11-05
PCT/US2015/059240 WO2016073717A1 (en) 2014-11-05 2015-11-05 Short-chain fluorosurfactants with iodide additives for forming silver nanowire-based transparent conductive films

Publications (1)

Publication Number Publication Date
SG11201703409QA true SG11201703409QA (en) 2017-05-30

Family

ID=54542602

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201703409QA SG11201703409QA (en) 2014-11-05 2015-11-05 Short-chain fluorosurfactants with iodide additives for forming silver nanowire-based transparent conductive films

Country Status (6)

Country Link
US (4) US10040956B2 (en)
EP (1) EP3215576B1 (en)
JP (2) JP6473814B2 (en)
KR (2) KR101930385B1 (en)
SG (1) SG11201703409QA (en)
WO (1) WO2016073717A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6473814B2 (en) * 2014-11-05 2019-02-20 カンブリオス フィルム ソリューションズ コーポレーション Short chain fluorosurfactant with iodide additive for forming silver nanowire based transparent conductive film

Family Cites Families (23)

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US4609497A (en) * 1985-03-14 1986-09-02 E. I. Du Pont De Nemours And Company Process for separating surfactants used in the manufacture of concentrated fluoropolymer dispersions
JP2000062336A (en) * 1998-08-17 2000-02-29 Fuji Photo Film Co Ltd Original plate for lithographic printing plate
JP4403476B2 (en) * 2000-01-27 2010-01-27 Ｄｉｃ株式会社 Method for purifying fluorosurfactant copolymer
JP3747167B2 (en) * 2001-09-20 2006-02-22 三菱レイヨン株式会社 Conductive composition, conductor and method for forming the same
US20030148232A1 (en) * 2001-09-21 2003-08-07 Orem Michael W. Fluorinated surfactants in overcoat compositions and elements containing same
US6975067B2 (en) 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US7776983B2 (en) * 2004-12-30 2010-08-17 3M Innovative Properties Company Fluorochemical polymeric surfactants
US8454721B2 (en) 2006-06-21 2013-06-04 Cambrios Technologies Corporation Methods of controlling nanostructure formations and shapes
SG10201502808UA (en) * 2006-10-12 2015-05-28 Cambrios Technologies Corp Nanowire-Based Transparent Conductors And Applications Thereof
SG188158A1 (en) 2008-02-26 2013-03-28 Cambrios Technologies Corp Method and composition for screen printing of conductive features
CL2010000073A1 (en) 2009-01-29 2011-01-07 Midwest Ind Supply Inc Composition for chemical improvement of the soil comprising a synthetic fluid and a pour point reducer; composition comprising synthetic fluid, biodegradable material and synthetic fibers; composition comprising a base oil and polyisobutylene; composition comprising synthetic fluid and a binder; Application Method.
US20110024159A1 (en) 2009-05-05 2011-02-03 Cambrios Technologies Corporation Reliable and durable conductive films comprising metal nanostructures
EP2430639A1 (en) * 2009-05-05 2012-03-21 Cambrios Technologies Corporation Reliable and durable conductive films comprising metal nanostructures
CN102834923B (en) * 2009-12-04 2017-05-10 凯姆控股有限公司 Nanostructure-based transparent conductors having increased haze and devices comprising the same
EP3533811B1 (en) * 2010-11-09 2021-08-11 The Chemours Company FC, LLC Nucleation in aqueous polymerization of fluoromonomer
US20140054515A1 (en) * 2011-02-28 2014-02-27 Nthdegree Technologies Worldwide Inc. Metallic Nanowire Ink Composition for a Substantially Transparent Conductor
SG193253A1 (en) * 2011-03-04 2013-10-30 Cambrios Technologies Corp Method of tuning work function of metal nanostructure-based transparent conductor
JP2013107952A (en) 2011-11-18 2013-06-06 Toyo Ink Sc Holdings Co Ltd Water-based pigment ink for inkjet
TWI628674B (en) * 2013-01-22 2018-07-01 凱姆控股有限公司 Double-sided transparent conductive films and method for double-sided patterning
EP3129177B1 (en) * 2014-04-11 2019-12-18 Cambrios Film Solutions Corporation Methods of controlling nanowire morphology
EP2977993A1 (en) * 2014-07-25 2016-01-27 Heraeus Deutschland GmbH & Co. KG Formulations comprising metal nanowires and pedot
JP6473814B2 (en) * 2014-11-05 2019-02-20 カンブリオス フィルム ソリューションズ コーポレーション Short chain fluorosurfactant with iodide additive for forming silver nanowire based transparent conductive film
US10147512B2 (en) * 2015-12-09 2018-12-04 C3Nano Inc. Methods for synthesizing silver nanoplates and noble metal coated silver nanoplates and their use in transparent films for control of light hue

Also Published As

Publication number Publication date
WO2016073717A1 (en) 2016-05-12
JP2018501328A (en) 2018-01-18
JP6473814B2 (en) 2019-02-20
JP6750798B2 (en) 2020-09-02
US20180312703A1 (en) 2018-11-01
KR101930385B1 (en) 2018-12-18
US20210079236A1 (en) 2021-03-18
EP3215576B1 (en) 2019-07-17
KR20180135112A (en) 2018-12-19
US10793730B2 (en) 2020-10-06
US20200017695A1 (en) 2020-01-16
US20170342280A1 (en) 2017-11-30
KR20170085530A (en) 2017-07-24
EP3215576A1 (en) 2017-09-13
KR102212159B1 (en) 2021-02-05
JP2019112636A (en) 2019-07-11
US10040956B2 (en) 2018-08-07
US10465081B2 (en) 2019-11-05

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