SG11201600906YA - Resin sheet for electronic device encapsulation and method for manufacturing electronic device package - Google Patents
Resin sheet for electronic device encapsulation and method for manufacturing electronic device packageInfo
- Publication number
- SG11201600906YA SG11201600906YA SG11201600906YA SG11201600906YA SG11201600906YA SG 11201600906Y A SG11201600906Y A SG 11201600906YA SG 11201600906Y A SG11201600906Y A SG 11201600906YA SG 11201600906Y A SG11201600906Y A SG 11201600906YA SG 11201600906Y A SG11201600906Y A SG 11201600906YA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic device
- resin sheet
- encapsulation
- device package
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013167055A JP6259608B2 (en) | 2013-08-09 | 2013-08-09 | Resin sheet for sealing electronic device and method for manufacturing electronic device package |
PCT/JP2014/067921 WO2015019769A1 (en) | 2013-08-09 | 2014-07-04 | Resin sheet for electronic device encapsulation and method for manufacturing electronic device package |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201600906YA true SG11201600906YA (en) | 2016-03-30 |
Family
ID=52461108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201600906YA SG11201600906YA (en) | 2013-08-09 | 2014-07-04 | Resin sheet for electronic device encapsulation and method for manufacturing electronic device package |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6259608B2 (en) |
CN (1) | CN105453252B (en) |
SG (1) | SG11201600906YA (en) |
TW (1) | TW201513278A (en) |
WO (1) | WO2015019769A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9761540B2 (en) | 2015-06-24 | 2017-09-12 | Micron Technology, Inc. | Wafer level package and fabrication method thereof |
JP6788344B2 (en) * | 2015-12-21 | 2020-11-25 | 京セラ株式会社 | Electronic components and manufacturing methods for electronic components |
JP6461031B2 (en) * | 2016-03-16 | 2019-01-30 | 東芝メモリ株式会社 | Manufacturing method of semiconductor device |
JP2018051892A (en) * | 2016-09-28 | 2018-04-05 | 京セラ株式会社 | Thermosetting resin sheet, production method of the same, and sealing method of electronic component |
CN106684057B (en) | 2016-12-30 | 2019-10-22 | 华为技术有限公司 | Chip-packaging structure and its manufacturing method |
JP6894076B2 (en) * | 2017-03-31 | 2021-06-23 | ナガセケムテックス株式会社 | Manufacturing method of mounting structure and laminated sheet used for this |
JP6975547B2 (en) * | 2017-03-31 | 2021-12-01 | ナガセケムテックス株式会社 | Manufacturing method of mounting structure and laminated sheet used for it |
TWI645523B (en) * | 2017-07-14 | 2018-12-21 | 矽品精密工業股份有限公司 | Package structure and the manufacture thereof |
WO2019017283A1 (en) | 2017-07-21 | 2019-01-24 | 株式会社村田製作所 | Electronic component |
CN111108595A (en) * | 2017-09-29 | 2020-05-05 | 长濑化成株式会社 | Method for manufacturing mounting structure and laminated sheet used therein |
CN111108596B (en) * | 2017-09-29 | 2023-07-18 | 长濑化成株式会社 | Method for manufacturing mounting structure and sheet used therein |
JP7119817B2 (en) * | 2018-09-18 | 2022-08-17 | 昭和電工マテリアルズ株式会社 | semiconductor equipment |
WO2020241505A1 (en) * | 2019-05-31 | 2020-12-03 | パナソニックIpマネジメント株式会社 | Sheet-like sealing material, sheet for sealing and semiconductor device |
WO2022024369A1 (en) * | 2020-07-31 | 2022-02-03 | 国立大学法人東北大学 | Method for manufacturing semiconductor device, method for manufacturing apparatus comprising semiconductor device, semiconductor device, and apparatus comprising semiconductor device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11310766A (en) * | 1998-04-28 | 1999-11-09 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing and electronic part device |
JP2008288433A (en) * | 2007-05-18 | 2008-11-27 | Yaskawa Electric Corp | Resin molding method of mounting board, equipment therefor, and resin molded mounting board |
JP2010109246A (en) * | 2008-10-31 | 2010-05-13 | Yaskawa Electric Corp | Semiconductor device, and method of manufacturing the same |
TW201032300A (en) * | 2009-02-27 | 2010-09-01 | Advanced Semiconductor Eng | Chip scale package and method of fabricating the same |
JP2011054806A (en) * | 2009-09-02 | 2011-03-17 | Renesas Electronics Corp | Semiconductor device and method of manufacturing the same |
JP2011216849A (en) * | 2010-03-17 | 2011-10-27 | Tdk Corp | Electronic circuit module component, and method of manufacturing the same |
JP2013004848A (en) * | 2011-06-20 | 2013-01-07 | Semiconductor Components Industries Llc | Semiconductor device and manufacturing method of the same |
-
2013
- 2013-08-09 JP JP2013167055A patent/JP6259608B2/en active Active
-
2014
- 2014-07-04 CN CN201480043548.2A patent/CN105453252B/en not_active Expired - Fee Related
- 2014-07-04 WO PCT/JP2014/067921 patent/WO2015019769A1/en active Application Filing
- 2014-07-04 SG SG11201600906YA patent/SG11201600906YA/en unknown
- 2014-07-09 TW TW103123613A patent/TW201513278A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2015035567A (en) | 2015-02-19 |
CN105453252B (en) | 2018-10-26 |
TW201513278A (en) | 2015-04-01 |
WO2015019769A1 (en) | 2015-02-12 |
JP6259608B2 (en) | 2018-01-10 |
CN105453252A (en) | 2016-03-30 |
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