SG11201508847WA - Electroformed component and method for manufacturing same - Google Patents

Electroformed component and method for manufacturing same

Info

Publication number
SG11201508847WA
SG11201508847WA SG11201508847WA SG11201508847WA SG11201508847WA SG 11201508847W A SG11201508847W A SG 11201508847WA SG 11201508847W A SG11201508847W A SG 11201508847WA SG 11201508847W A SG11201508847W A SG 11201508847WA SG 11201508847W A SG11201508847W A SG 11201508847WA
Authority
SG
Singapore
Prior art keywords
manufacturing same
electroformed component
electroformed
component
manufacturing
Prior art date
Application number
SG11201508847WA
Inventor
Yoshinobu Hemmi
Takahiro Sakai
Hideaki Ozaki
Hirotada Teranishi
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Publication of SG11201508847WA publication Critical patent/SG11201508847WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Geometry (AREA)
  • Connecting Device With Holders (AREA)
  • Micromachines (AREA)
  • Manufacturing Optical Record Carriers (AREA)
SG11201508847WA 2013-08-02 2014-07-22 Electroformed component and method for manufacturing same SG11201508847WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013161824A JP5786906B2 (en) 2013-08-02 2013-08-02 Manufacturing method of electroformed parts
PCT/JP2014/069339 WO2015016099A1 (en) 2013-08-02 2014-07-22 Electroformed component and method for manufacturing same

Publications (1)

Publication Number Publication Date
SG11201508847WA true SG11201508847WA (en) 2015-11-27

Family

ID=52431635

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201508847WA SG11201508847WA (en) 2013-08-02 2014-07-22 Electroformed component and method for manufacturing same

Country Status (9)

Country Link
US (1) US9598784B2 (en)
EP (1) EP2980278B1 (en)
JP (1) JP5786906B2 (en)
KR (1) KR101572788B1 (en)
CN (1) CN105164320B (en)
MY (1) MY193636A (en)
SG (1) SG11201508847WA (en)
TW (1) TWI518211B (en)
WO (1) WO2015016099A1 (en)

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EP2916335A1 (en) * 2012-10-30 2015-09-09 Leap Co. Ltd. Coil element production method
JP2018197714A (en) * 2017-05-24 2018-12-13 山一電機株式会社 Mems type probe, and electric inspection device using the same
CN111721980B (en) * 2019-03-22 2022-11-04 台湾中华精测科技股份有限公司 Vertical probe card and rectangular probe thereof
TWI695985B (en) * 2019-03-22 2020-06-11 中華精測科技股份有限公司 Vertical probe card and rectangular probe thereof
TWI709750B (en) * 2019-03-22 2020-11-11 中華精測科技股份有限公司 Vertical probe card and rectangular probe thereof
KR20220022668A (en) * 2020-08-19 2022-02-28 (주)포인트엔지니어링 Mold using anodized oxide layer, Mold apparatus including thereof, Product and Method for manufacturing the product using thereof
KR20230049214A (en) * 2021-10-06 2023-04-13 (주)포인트엔지니어링 The Electro-conductive Contact Pin and Testing Device Having The Same
KR20230049217A (en) * 2021-10-06 2023-04-13 (주)포인트엔지니어링 The Electro-conductive Contact Pin and Test Device Having The Same
KR20230050060A (en) * 2021-10-07 2023-04-14 (주)포인트엔지니어링 The Electro-conductive Contact Pin Array
KR20230140921A (en) * 2022-03-30 2023-10-10 (주)포인트엔지니어링 The Electro-conductive Contact Pin And Test Device Having The Same

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TWI429789B (en) * 2010-03-11 2014-03-11 Omron Tateisi Electronics Co Composition for making contact, contact made therewith, connector, and method for producing the composition for making contact
JP2011226786A (en) * 2010-04-15 2011-11-10 Tokyo Electron Ltd Contact structure and method of manufacturing the same
CN102316677B (en) * 2010-06-30 2013-05-08 比亚迪股份有限公司 Electroplating method for double-side and multilayer flexible printed circuit board
JP5839798B2 (en) * 2010-12-17 2016-01-06 株式会社オプトニクス精密 Probe card
WO2013072964A1 (en) * 2011-11-17 2013-05-23 株式会社Ｌｅａｐ Production method for transfer mold, and said transfer mold
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Also Published As

Publication number Publication date
EP2980278A1 (en) 2016-02-03
TW201516187A (en) 2015-05-01
US9598784B2 (en) 2017-03-21
US20160115610A1 (en) 2016-04-28
CN105164320A (en) 2015-12-16
TWI518211B (en) 2016-01-21
CN105164320B (en) 2016-08-31
KR20150123974A (en) 2015-11-04
WO2015016099A1 (en) 2015-02-05
KR101572788B1 (en) 2015-11-27
EP2980278A4 (en) 2016-04-13
JP5786906B2 (en) 2015-09-30
EP2980278B1 (en) 2017-04-12
JP2015030887A (en) 2015-02-16
MY193636A (en) 2022-10-20

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