SG11201504456YA - Fabrication of optical elements and modules incorporating the same - Google Patents
Fabrication of optical elements and modules incorporating the sameInfo
- Publication number
- SG11201504456YA SG11201504456YA SG11201504456YA SG11201504456YA SG11201504456YA SG 11201504456Y A SG11201504456Y A SG 11201504456YA SG 11201504456Y A SG11201504456Y A SG 11201504456YA SG 11201504456Y A SG11201504456Y A SG 11201504456YA SG 11201504456Y A SG11201504456Y A SG 11201504456YA
- Authority
- SG
- Singapore
- Prior art keywords
- fabrication
- same
- optical elements
- modules incorporating
- incorporating
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00278—Lenticular sheets
- B29D11/00307—Producing lens wafers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/005—Diaphragms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1847—Manufacturing methods
- G02B5/1852—Manufacturing methods using mechanical means, e.g. ruling with diamond tool, moulding
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Ophthalmology & Optometry (AREA)
- Health & Medical Sciences (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lens Barrels (AREA)
- General Engineering & Computer Science (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261746347P | 2012-12-27 | 2012-12-27 | |
PCT/SG2013/000525 WO2014104972A1 (en) | 2012-12-27 | 2013-12-10 | Fabrication of optical elements and modules incorporating the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201504456YA true SG11201504456YA (en) | 2015-07-30 |
Family
ID=51016160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201504456YA SG11201504456YA (en) | 2012-12-27 | 2013-12-10 | Fabrication of optical elements and modules incorporating the same |
Country Status (8)
Country | Link |
---|---|
US (2) | US9478681B2 (en) |
EP (1) | EP2939053B1 (en) |
JP (1) | JP6253666B2 (en) |
KR (1) | KR102135492B1 (en) |
CN (1) | CN104937445B (en) |
SG (1) | SG11201504456YA (en) |
TW (2) | TWI622177B (en) |
WO (1) | WO2014104972A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9094593B2 (en) | 2013-07-30 | 2015-07-28 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules |
US9543354B2 (en) | 2013-07-30 | 2017-01-10 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules |
WO2017034483A1 (en) | 2015-08-27 | 2017-03-02 | Heptagon Micro Optics Pte. Ltd. | Optical assemblies including a spacer adhering directly to a substrate |
US10551596B2 (en) | 2016-06-29 | 2020-02-04 | Ams Sensors Singapore Pte. Ltd. | Optical and optoelectronic assemblies including micro-spacers, and methods of manufacturing the same |
WO2018101889A1 (en) | 2016-12-01 | 2018-06-07 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules and optoelectronic molding tools and processes for manufacturing the same |
DE112019006131T5 (en) | 2018-12-10 | 2021-08-26 | Ams Sensors Singapore Pte. Ltd. | VACUUM INJECTION MOLDING FOR OPTOELECTRONIC MODULES |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5655189A (en) * | 1994-05-27 | 1997-08-05 | Kyocera Corporation | Image device having thermally stable light emitting/receiving arrays and opposing lenses |
EP1443344A1 (en) * | 2003-01-29 | 2004-08-04 | Heptagon Oy | Manufacturing micro-structured elements |
CN1950724A (en) * | 2004-05-12 | 2007-04-18 | 松下电器产业株式会社 | Optical element and manufacturing method thereof |
KR100636349B1 (en) * | 2004-09-24 | 2006-10-19 | 엘지전자 주식회사 | Microlens Array Sheet and Manufacturing Method thereof |
DE102006010729A1 (en) * | 2005-12-09 | 2007-06-14 | Osram Opto Semiconductors Gmbh | Optical component, e.g. for miniature opto-electronic semi-conductor chips, comprises a composite unit of lens and mounting part in different materials |
JP5580207B2 (en) * | 2007-11-27 | 2014-08-27 | ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッド | Wafer scale package and manufacturing method thereof, and optical device and manufacturing method thereof |
TW200937642A (en) * | 2007-12-19 | 2009-09-01 | Heptagon Oy | Wafer stack, integrated optical device and method for fabricating the same |
TWI505703B (en) * | 2007-12-19 | 2015-10-21 | Heptagon Micro Optics Pte Ltd | Optical module, wafer scale package, and method for manufacturing those |
WO2009076787A1 (en) * | 2007-12-19 | 2009-06-25 | Heptagon Oy | Optical module for a camera device, baffle substrate, wafer scale package, and manufacturing methods therefor |
EP2273289B1 (en) * | 2008-04-28 | 2015-01-21 | Konica Minolta Opto, Inc. | Method for producing wafer lens assembly |
WO2010050290A1 (en) * | 2008-10-31 | 2010-05-06 | コニカミノルタオプト株式会社 | Wafer lens manufacturing method and wafer lens |
JP5352392B2 (en) * | 2009-09-14 | 2013-11-27 | 富士フイルム株式会社 | Wafer level lens array manufacturing method, wafer level lens array, lens module, and imaging unit |
JP5401227B2 (en) | 2009-09-16 | 2014-01-29 | 富士フイルム株式会社 | Wafer level lens array manufacturing method, wafer level lens array, lens module, and imaging unit |
JP2011062879A (en) * | 2009-09-16 | 2011-03-31 | Fujifilm Corp | Method for molding wafer level lens array, wafer level lens array, lens module, and imaging unit |
WO2011049635A1 (en) * | 2009-10-20 | 2011-04-28 | Tessera North America, Inc. | Focus compensation for optical elements and applications thereof |
JP2011128355A (en) * | 2009-12-17 | 2011-06-30 | Sony Corp | Imaging lens, camera module using imaging lens, manufacturing method of imaging lens, and manufacturing method of camera module |
KR101847658B1 (en) | 2010-02-01 | 2018-05-24 | 디비엠 리플렉스 엔터프라이즈스 인크. | Thick lens molded with embedded layers of the same resin using a two step injection molding process |
US20140002902A1 (en) * | 2011-01-25 | 2014-01-02 | Heptagon Micro Optics Pte. Ltd. | Manufacturing a Plurality of Optical Elements |
JP5401628B2 (en) * | 2011-03-01 | 2014-01-29 | 富士フイルム株式会社 | Lens module manufacturing method and lens module |
TW201241482A (en) * | 2011-04-08 | 2012-10-16 | E Pin Optical Industry Co Ltd | Optical lens with insert soma and optical lens module thereof |
TWI480615B (en) * | 2011-06-30 | 2015-04-11 | Lg Innotek Co Ltd | Lens unit, manufacturing method of the same, and camera module including the same |
US8848286B2 (en) * | 2012-04-11 | 2014-09-30 | Omni Version Technology, Inc. | Lens plate for wafer-level camera and method of manufacturing same |
US9634051B2 (en) * | 2012-07-17 | 2017-04-25 | Heptagon Micro Optics Pte. Ltd. | Optical devices, in particular computational cameras, and methods for manufacturing the same |
-
2013
- 2013-12-10 JP JP2015550362A patent/JP6253666B2/en active Active
- 2013-12-10 SG SG11201504456YA patent/SG11201504456YA/en unknown
- 2013-12-10 EP EP13868663.9A patent/EP2939053B1/en active Active
- 2013-12-10 WO PCT/SG2013/000525 patent/WO2014104972A1/en active Application Filing
- 2013-12-10 KR KR1020157020011A patent/KR102135492B1/en active IP Right Grant
- 2013-12-10 CN CN201380067470.3A patent/CN104937445B/en active Active
- 2013-12-17 TW TW102146751A patent/TWI622177B/en active
- 2013-12-17 TW TW107108311A patent/TWI655783B/en active
- 2013-12-26 US US14/140,712 patent/US9478681B2/en active Active
-
2016
- 2016-09-21 US US15/271,288 patent/US10126530B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP6253666B2 (en) | 2017-12-27 |
CN104937445B (en) | 2017-10-24 |
US10126530B2 (en) | 2018-11-13 |
TWI622177B (en) | 2018-04-21 |
US9478681B2 (en) | 2016-10-25 |
US20140183585A1 (en) | 2014-07-03 |
TW201432918A (en) | 2014-08-16 |
KR20150103090A (en) | 2015-09-09 |
JP2016506326A (en) | 2016-03-03 |
TW201820643A (en) | 2018-06-01 |
CN104937445A (en) | 2015-09-23 |
US20170010450A1 (en) | 2017-01-12 |
EP2939053A1 (en) | 2015-11-04 |
KR102135492B1 (en) | 2020-07-20 |
TWI655783B (en) | 2019-04-01 |
WO2014104972A1 (en) | 2014-07-03 |
EP2939053B1 (en) | 2019-03-20 |
EP2939053A4 (en) | 2016-08-31 |
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