SG11201403033YA - Monitoring leveler concentrations in electroplating solutions - Google Patents
Monitoring leveler concentrations in electroplating solutionsInfo
- Publication number
- SG11201403033YA SG11201403033YA SG11201403033YA SG11201403033YA SG11201403033YA SG 11201403033Y A SG11201403033Y A SG 11201403033YA SG 11201403033Y A SG11201403033Y A SG 11201403033YA SG 11201403033Y A SG11201403033Y A SG 11201403033YA SG 11201403033Y A SG11201403033Y A SG 11201403033YA
- Authority
- SG
- Singapore
- Prior art keywords
- electroplating solutions
- leveler concentrations
- monitoring
- monitoring leveler
- concentrations
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/413—Concentration cells using liquid electrolytes measuring currents or voltages in voltaic cells
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161569741P | 2011-12-12 | 2011-12-12 | |
| PCT/US2012/069016 WO2013090295A1 (en) | 2011-12-12 | 2012-12-11 | Monitoring leveler concentrations in electroplating solutions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201403033YA true SG11201403033YA (en) | 2014-09-26 |
Family
ID=48613119
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201605902RA SG10201605902RA (en) | 2011-12-12 | 2012-12-11 | Monitoring leveler concentrations in electroplating solutions |
| SG11201403033YA SG11201403033YA (en) | 2011-12-12 | 2012-12-11 | Monitoring leveler concentrations in electroplating solutions |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201605902RA SG10201605902RA (en) | 2011-12-12 | 2012-12-11 | Monitoring leveler concentrations in electroplating solutions |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9309605B2 (en) |
| JP (2) | JP6170938B2 (en) |
| KR (1) | KR102147003B1 (en) |
| MY (1) | MY167318A (en) |
| SG (2) | SG10201605902RA (en) |
| WO (1) | WO2013090295A1 (en) |
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| US9076843B2 (en) | 2001-05-22 | 2015-07-07 | Novellus Systems, Inc. | Method for producing ultra-thin tungsten layers with improved step coverage |
| US20100267230A1 (en) | 2009-04-16 | 2010-10-21 | Anand Chandrashekar | Method for forming tungsten contacts and interconnects with small critical dimensions |
| US9159571B2 (en) | 2009-04-16 | 2015-10-13 | Lam Research Corporation | Tungsten deposition process using germanium-containing reducing agent |
| US8709948B2 (en) * | 2010-03-12 | 2014-04-29 | Novellus Systems, Inc. | Tungsten barrier and seed for copper filled TSV |
| SG10201605902RA (en) | 2011-12-12 | 2016-09-29 | Novellus Systems Inc | Monitoring leveler concentrations in electroplating solutions |
| US8853080B2 (en) | 2012-09-09 | 2014-10-07 | Novellus Systems, Inc. | Method for depositing tungsten film with low roughness and low resistivity |
| US9783908B2 (en) * | 2012-10-23 | 2017-10-10 | Moses Lake Industries, Inc. | Plating bath metrology |
| US9689083B2 (en) | 2013-06-14 | 2017-06-27 | Lam Research Corporation | TSV bath evaluation using field versus feature contrast |
| DK2821780T3 (en) * | 2013-07-02 | 2018-07-30 | Ancosys Gmbh | In-situ fingerprints for electrochemical deposition and / or electrochemical etching |
| US9988735B2 (en) * | 2013-07-03 | 2018-06-05 | Tel Nexx, Inc. | Electrochemical deposition apparatus and methods for controlling the chemistry therein |
| US9589808B2 (en) | 2013-12-19 | 2017-03-07 | Lam Research Corporation | Method for depositing extremely low resistivity tungsten |
| US9575032B2 (en) * | 2014-08-07 | 2017-02-21 | Hong Kong Applied Science and Technology Research Institute Company Limited | Method of analyzing at least two inhibitors simultaneously in a plating bath |
| US9953984B2 (en) | 2015-02-11 | 2018-04-24 | Lam Research Corporation | Tungsten for wordline applications |
| US10094038B2 (en) | 2015-04-13 | 2018-10-09 | Lam Research Corporation | Monitoring electrolytes during electroplating |
| TWI711724B (en) * | 2018-11-30 | 2020-12-01 | 台灣積體電路製造股份有限公司 | Electrochemical plating system, method for performing electrochemical plating process, and method of forming semiconductor substrate |
| US11230784B2 (en) | 2018-11-30 | 2022-01-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electrochemical plating system and method of using |
| WO2021022292A1 (en) * | 2019-07-26 | 2021-02-04 | Lam Research Corporation | Differential contrast plating for advanced packaging applications |
| KR102445229B1 (en) * | 2019-09-30 | 2022-09-21 | 한국재료연구원 | Measuring cell for concentration of additive breakdown product in plating solution |
| CN114460146B (en) * | 2022-01-24 | 2023-09-26 | 常州大学 | Method for detecting copper ions in copper-dissolving solution of electrolytic copper foil |
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| US5196096A (en) | 1992-03-24 | 1993-03-23 | International Business Machines Corporation | Method for analyzing the addition agents in solutions for electroplating of PbSn alloys |
| US7531079B1 (en) | 1998-10-26 | 2009-05-12 | Novellus Systems, Inc. | Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation |
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| JP2001073200A (en) * | 1999-08-30 | 2001-03-21 | Ebara Corp | Plating liquid management method and management apparatus therefor |
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| JP2013077619A (en) | 2011-09-29 | 2013-04-25 | Renesas Electronics Corp | Manufacturing method of semiconductor device |
| SG10201605902RA (en) | 2011-12-12 | 2016-09-29 | Novellus Systems Inc | Monitoring leveler concentrations in electroplating solutions |
| CN103014823B (en) | 2013-01-05 | 2015-05-13 | 华进半导体封装先导技术研发中心有限公司 | Method for quickly determining effect of additive for improving copper electrodeposition |
| US9689083B2 (en) | 2013-06-14 | 2017-06-27 | Lam Research Corporation | TSV bath evaluation using field versus feature contrast |
-
2012
- 2012-12-11 SG SG10201605902RA patent/SG10201605902RA/en unknown
- 2012-12-11 SG SG11201403033YA patent/SG11201403033YA/en unknown
- 2012-12-11 US US13/711,254 patent/US9309605B2/en active Active
- 2012-12-11 MY MYPI2014001731A patent/MY167318A/en unknown
- 2012-12-11 WO PCT/US2012/069016 patent/WO2013090295A1/en active Application Filing
- 2012-12-11 KR KR1020147019507A patent/KR102147003B1/en active IP Right Grant
- 2012-12-11 JP JP2014547352A patent/JP6170938B2/en active Active
-
2016
- 2016-03-04 US US15/061,833 patent/US9856574B2/en active Active
-
2017
- 2017-07-03 JP JP2017130053A patent/JP6491700B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018009984A (en) | 2018-01-18 |
| JP2015501941A (en) | 2015-01-19 |
| US20160186356A1 (en) | 2016-06-30 |
| SG10201605902RA (en) | 2016-09-29 |
| KR102147003B1 (en) | 2020-08-24 |
| JP6491700B2 (en) | 2019-03-27 |
| MY167318A (en) | 2018-08-16 |
| KR20140113947A (en) | 2014-09-25 |
| US9856574B2 (en) | 2018-01-02 |
| US20130161203A1 (en) | 2013-06-27 |
| US9309605B2 (en) | 2016-04-12 |
| JP6170938B2 (en) | 2017-07-26 |
| WO2013090295A1 (en) | 2013-06-20 |
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