SG10202103036XA - Cutting apparatus, cutting blade replacement method, and board replacement method - Google Patents
Cutting apparatus, cutting blade replacement method, and board replacement methodInfo
- Publication number
- SG10202103036XA SG10202103036XA SG10202103036XA SG10202103036XA SG10202103036XA SG 10202103036X A SG10202103036X A SG 10202103036XA SG 10202103036X A SG10202103036X A SG 10202103036XA SG 10202103036X A SG10202103036X A SG 10202103036XA SG 10202103036X A SG10202103036X A SG 10202103036XA
- Authority
- SG
- Singapore
- Prior art keywords
- replacement method
- cutting
- board
- cutting blade
- cutting apparatus
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/155—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling
- B23Q3/1552—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling parts of devices for automatically inserting or removing tools
- B23Q3/1554—Transfer mechanisms, e.g. tool gripping arms; Drive mechanisms therefore
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
- B24B45/006—Quick mount and release means for disc-like wheels, e.g. on power tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
- B26D2001/0046—Cutting members therefor rotating continuously about an axis perpendicular to the edge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
- B26D7/2614—Means for mounting the cutting member
- B26D7/2621—Means for mounting the cutting member for circular cutters
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T483/00—Tool changing
- Y10T483/17—Tool changing including machine tool or component
- Y10T483/1733—Rotary spindle machine tool [e.g., milling machine, boring, machine, grinding machine, etc.]
- Y10T483/1736—Tool having specific mounting or work treating feature
- Y10T483/174—Abrading wheel
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020070792A JP7430452B2 (ja) | 2020-04-10 | 2020-04-10 | 切削装置、切削ブレードの交換方法及びボードの交換方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202103036XA true SG10202103036XA (en) | 2021-11-29 |
Family
ID=77851779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202103036XA SG10202103036XA (en) | 2020-04-10 | 2021-03-24 | Cutting apparatus, cutting blade replacement method, and board replacement method |
Country Status (7)
Country | Link |
---|---|
US (1) | US11491669B2 (ja) |
JP (1) | JP7430452B2 (ja) |
KR (1) | KR20210126495A (ja) |
CN (1) | CN113510868A (ja) |
DE (1) | DE102021203471A1 (ja) |
SG (1) | SG10202103036XA (ja) |
TW (1) | TW202138116A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022125669A (ja) * | 2021-02-17 | 2022-08-29 | 株式会社ディスコ | 切削装置 |
CN114770636A (zh) * | 2022-04-14 | 2022-07-22 | 淮安鼎卫医学检验所有限公司 | 一种医用软管切割设备 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3519706A1 (de) * | 1985-06-01 | 1986-12-04 | Gebrüder Honsberg GmbH, 5630 Remscheid | Werkzeugmaschine |
JPH10340867A (ja) * | 1997-06-05 | 1998-12-22 | Tokyo Seimitsu Co Ltd | ブレード自動交換システム |
US6030326A (en) * | 1997-06-05 | 2000-02-29 | Tokyo Seimitsu Co., Ltd. | Automatic blade changing system |
JP4837970B2 (ja) * | 2005-10-06 | 2011-12-14 | 株式会社ディスコ | 切削ブレードの交換装置 |
JP2007208114A (ja) * | 2006-02-03 | 2007-08-16 | Disco Abrasive Syst Ltd | 切削装置 |
JP6851688B2 (ja) * | 2017-04-21 | 2021-03-31 | 株式会社ディスコ | 加工工具の管理方法 |
JP6966883B2 (ja) * | 2017-07-04 | 2021-11-17 | 株式会社ディスコ | ブレード脱着治具、ブレード脱着方法、ブレード取り出し方法、及び切削装置 |
JP6612372B2 (ja) * | 2018-01-30 | 2019-11-27 | Towa株式会社 | フランジ交換機構、切断装置、フランジ交換方法および切断品の製造方法 |
JP7126749B2 (ja) * | 2018-03-19 | 2022-08-29 | 株式会社ディスコ | 切削装置 |
JP7165510B2 (ja) * | 2018-05-25 | 2022-11-04 | 株式会社ディスコ | 搬送用治具及び交換方法 |
JP7313202B2 (ja) * | 2019-06-18 | 2023-07-24 | 株式会社ディスコ | 切削装置及び交換方法 |
-
2020
- 2020-04-10 JP JP2020070792A patent/JP7430452B2/ja active Active
-
2021
- 2021-03-17 KR KR1020210034345A patent/KR20210126495A/ko active Search and Examination
- 2021-03-23 US US17/209,415 patent/US11491669B2/en active Active
- 2021-03-24 SG SG10202103036XA patent/SG10202103036XA/en unknown
- 2021-04-06 TW TW110112333A patent/TW202138116A/zh unknown
- 2021-04-08 DE DE102021203471.3A patent/DE102021203471A1/de active Pending
- 2021-04-09 CN CN202110381424.7A patent/CN113510868A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2021167033A (ja) | 2021-10-21 |
DE102021203471A1 (de) | 2021-10-14 |
TW202138116A (zh) | 2021-10-16 |
JP7430452B2 (ja) | 2024-02-13 |
KR20210126495A (ko) | 2021-10-20 |
US20210316468A1 (en) | 2021-10-14 |
CN113510868A (zh) | 2021-10-19 |
US11491669B2 (en) | 2022-11-08 |
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