SG10202100910UA - Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control m - Google Patents
Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control mInfo
- Publication number
- SG10202100910UA SG10202100910UA SG10202100910UA SG10202100910UA SG10202100910UA SG 10202100910U A SG10202100910U A SG 10202100910UA SG 10202100910U A SG10202100910U A SG 10202100910UA SG 10202100910U A SG10202100910U A SG 10202100910UA SG 10202100910U A SG10202100910U A SG 10202100910UA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- holding apparatus
- adsorption
- substrate holding
- pressure control
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 5
- 238000000034 method Methods 0.000 title 2
- 238000001179 sorption measurement Methods 0.000 title 2
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015161187A JP6353418B2 (en) | 2015-08-18 | 2015-08-18 | Substrate adsorption method, top ring and substrate polishing apparatus |
JP2016097291 | 2016-05-13 | ||
JP2016134881A JP6463303B2 (en) | 2016-05-13 | 2016-07-07 | Elastic film, substrate holding device, substrate polishing device, substrate adsorption determination method and pressure control method in substrate holding device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202100910UA true SG10202100910UA (en) | 2021-03-30 |
Family
ID=71832129
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202002713PA SG10202002713PA (en) | 2015-08-18 | 2016-07-27 | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
SG10202100910UA SG10202100910UA (en) | 2015-08-18 | 2016-07-27 | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control m |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202002713PA SG10202002713PA (en) | 2015-08-18 | 2016-07-27 | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR102178517B1 (en) |
SG (2) | SG10202002713PA (en) |
TW (1) | TWI785525B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116387419B (en) * | 2023-05-29 | 2023-08-11 | 惠科股份有限公司 | Huge transfer method of LED lamp beads |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3705670B2 (en) * | 1997-02-19 | 2005-10-12 | 株式会社荏原製作所 | Polishing apparatus and method |
US5961169A (en) | 1998-07-27 | 1999-10-05 | Strasbaugh | Apparatus for sensing the presence of a wafer |
US6506105B1 (en) * | 2000-05-12 | 2003-01-14 | Multi-Planar Technologies, Inc. | System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control |
US6857945B1 (en) | 2000-07-25 | 2005-02-22 | Applied Materials, Inc. | Multi-chamber carrier head with a flexible membrane |
WO2005073692A1 (en) * | 2004-01-29 | 2005-08-11 | Nas Giken Inc. | Substrate inspection device, substrate inspection method, and recovery tool |
JP2005332982A (en) * | 2004-05-20 | 2005-12-02 | Renesas Technology Corp | Method for manufacturing semiconductor apparatus |
JP5327427B2 (en) * | 2007-06-19 | 2013-10-30 | Jsr株式会社 | Chemical mechanical polishing aqueous dispersion preparation set, chemical mechanical polishing aqueous dispersion preparation method, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method |
WO2010023829A1 (en) * | 2008-08-29 | 2010-03-04 | 信越半導体株式会社 | Polishing head and polishing apparatus |
JP5597033B2 (en) | 2010-06-07 | 2014-10-01 | 株式会社荏原製作所 | Polishing apparatus and method |
JP5964064B2 (en) * | 2012-01-31 | 2016-08-03 | 株式会社荏原製作所 | Substrate holding apparatus, polishing apparatus, and polishing method |
JP5875950B2 (en) | 2012-06-29 | 2016-03-02 | 株式会社荏原製作所 | Substrate holding device and polishing device |
JP5856546B2 (en) | 2012-07-11 | 2016-02-09 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
JP6158637B2 (en) | 2012-08-28 | 2017-07-05 | 株式会社荏原製作所 | Elastic film and substrate holding device |
-
2016
- 2016-07-27 SG SG10202002713PA patent/SG10202002713PA/en unknown
- 2016-07-27 SG SG10202100910UA patent/SG10202100910UA/en unknown
- 2016-08-02 TW TW110108232A patent/TWI785525B/en active
-
2020
- 2020-07-09 KR KR1020200084573A patent/KR102178517B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR102178517B1 (en) | 2020-11-13 |
SG10202002713PA (en) | 2020-05-28 |
KR20200087110A (en) | 2020-07-20 |
TW202127532A (en) | 2021-07-16 |
TWI785525B (en) | 2022-12-01 |
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