SG10202002980WA - Processing method and thermocompression bonding method for workpiece - Google Patents
Processing method and thermocompression bonding method for workpieceInfo
- Publication number
- SG10202002980WA SG10202002980WA SG10202002980WA SG10202002980WA SG10202002980WA SG 10202002980W A SG10202002980W A SG 10202002980WA SG 10202002980W A SG10202002980W A SG 10202002980WA SG 10202002980W A SG10202002980W A SG 10202002980WA SG 10202002980W A SG10202002980W A SG 10202002980WA
- Authority
- SG
- Singapore
- Prior art keywords
- workpiece
- thermocompression bonding
- processing method
- bonding method
- processing
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000003672 processing method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
- H01L2223/5446—Located in scribe lines
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019078622A JP7301468B2 (en) | 2019-04-17 | 2019-04-17 | Workpiece processing method, thermocompression bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202002980WA true SG10202002980WA (en) | 2020-11-27 |
Family
ID=72660581
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202002980WA SG10202002980WA (en) | 2019-04-17 | 2020-03-30 | Processing method and thermocompression bonding method for workpiece |
Country Status (8)
Country | Link |
---|---|
US (2) | US11222807B2 (en) |
JP (1) | JP7301468B2 (en) |
KR (1) | KR20200122234A (en) |
CN (1) | CN111834275A (en) |
DE (1) | DE102020204897A1 (en) |
PH (1) | PH12020050062A1 (en) |
SG (1) | SG10202002980WA (en) |
TW (1) | TWI830900B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7301468B2 (en) * | 2019-04-17 | 2023-07-03 | 株式会社ディスコ | Workpiece processing method, thermocompression bonding method |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4607779A (en) * | 1983-08-11 | 1986-08-26 | National Semiconductor Corporation | Non-impact thermocompression gang bonding method |
JP2839215B2 (en) * | 1991-09-04 | 1998-12-16 | 株式会社カイジョー | Bonding equipment |
JP3842362B2 (en) * | 1996-02-28 | 2006-11-08 | 株式会社東芝 | Thermocompression bonding method and thermocompression bonding apparatus |
FR2805067B1 (en) * | 2000-02-15 | 2003-09-12 | Bourgogne Grasset | ELECTRONIC CHIP TOKEN AND METHODS OF MANUFACTURING SUCH A TOKEN |
US20020127821A1 (en) | 2000-12-28 | 2002-09-12 | Kazuyuki Ohya | Process for the production of thinned wafer |
JP2002203821A (en) * | 2000-12-28 | 2002-07-19 | Mitsubishi Gas Chem Co Inc | Adhering and peeling method |
JP4841431B2 (en) * | 2005-02-02 | 2011-12-21 | ソニーケミカル&インフォメーションデバイス株式会社 | Electrical component mounting equipment |
CN101473425B (en) * | 2006-06-23 | 2011-02-09 | 日立化成工业株式会社 | Production method of semiconductor device and bonding film |
JP2009141267A (en) * | 2007-12-10 | 2009-06-25 | Sony Chemical & Information Device Corp | Packaging method and apparatus of electrical component |
JP5198203B2 (en) | 2008-09-30 | 2013-05-15 | 株式会社ディスコ | Processing equipment |
JP5274966B2 (en) * | 2008-09-30 | 2013-08-28 | 株式会社ディスコ | Processing equipment |
JP5199010B2 (en) * | 2008-10-01 | 2013-05-15 | 富士通株式会社 | RFID tag manufacturing method and RFID tag |
CN103165474A (en) | 2011-12-16 | 2013-06-19 | 日东电工株式会社 | Method for producing semiconductor device |
JP2013243311A (en) | 2012-05-22 | 2013-12-05 | Disco Abrasive Syst Ltd | Surface protective tape |
CN104603922B (en) * | 2012-08-31 | 2018-01-26 | 松下知识产权经营株式会社 | Component mounting structure body |
JP6645730B2 (en) * | 2014-01-28 | 2020-02-14 | デクセリアルズ株式会社 | Connection body and method for manufacturing connection body |
JP2015149451A (en) * | 2014-02-07 | 2015-08-20 | デクセリアルズ株式会社 | Alignment method, connection method for electronic part, manufacturing method for connection body, connection body and anisotropic conductive film |
JP6597056B2 (en) * | 2015-08-26 | 2019-10-30 | 富士通株式会社 | Heating header for semiconductor mounting apparatus and semiconductor bonding method |
DE112015006857B4 (en) * | 2015-08-31 | 2023-10-05 | Disco Corporation | Method for processing a wafer and protective cover for use in this method |
JP6671797B2 (en) | 2016-05-30 | 2020-03-25 | 株式会社ディスコ | Tape application method |
KR101880053B1 (en) * | 2017-04-26 | 2018-07-20 | (주)노피온 | Method of manufacturing anisotropic conductive adhesive comprising gaper and method of mounting components using the gaper |
US11043685B2 (en) * | 2017-04-28 | 2021-06-22 | Honda Motor Co., Ltd. | Method and apparatus for producing resin frame equipped membrane electrode assembly |
KR102345923B1 (en) | 2017-05-18 | 2022-01-03 | 가부시기가이샤 디스코 | Protective sheeting for use in processing wafers, handling systems for wafers, and combinations of wafers and protective sheeting |
US11024595B2 (en) * | 2017-06-16 | 2021-06-01 | Micron Technology, Inc. | Thermocompression bond tips and related apparatus and methods |
US10403598B2 (en) * | 2017-08-11 | 2019-09-03 | Micron Technology, Inc. | Methods and system for processing semiconductor device structures |
JP7201342B2 (en) | 2018-06-06 | 2023-01-10 | 株式会社ディスコ | Wafer processing method |
JP7301468B2 (en) * | 2019-04-17 | 2023-07-03 | 株式会社ディスコ | Workpiece processing method, thermocompression bonding method |
-
2019
- 2019-04-17 JP JP2019078622A patent/JP7301468B2/en active Active
-
2020
- 2020-03-30 SG SG10202002980WA patent/SG10202002980WA/en unknown
- 2020-04-02 KR KR1020200040204A patent/KR20200122234A/en unknown
- 2020-04-03 US US16/839,388 patent/US11222807B2/en active Active
- 2020-04-07 PH PH12020050062A patent/PH12020050062A1/en unknown
- 2020-04-13 CN CN202010284072.9A patent/CN111834275A/en active Pending
- 2020-04-16 TW TW109112774A patent/TWI830900B/en active
- 2020-04-17 DE DE102020204897.5A patent/DE102020204897A1/en active Granted
-
2021
- 2021-11-03 US US17/453,365 patent/US11823942B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW202109759A (en) | 2021-03-01 |
PH12020050062A1 (en) | 2020-12-02 |
US20220059392A1 (en) | 2022-02-24 |
US20200335382A1 (en) | 2020-10-22 |
US11823942B2 (en) | 2023-11-21 |
CN111834275A (en) | 2020-10-27 |
TWI830900B (en) | 2024-02-01 |
DE102020204897A1 (en) | 2020-10-22 |
US11222807B2 (en) | 2022-01-11 |
JP7301468B2 (en) | 2023-07-03 |
KR20200122234A (en) | 2020-10-27 |
JP2020178008A (en) | 2020-10-29 |
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