SG10202002980WA - Processing method and thermocompression bonding method for workpiece - Google Patents

Processing method and thermocompression bonding method for workpiece

Info

Publication number
SG10202002980WA
SG10202002980WA SG10202002980WA SG10202002980WA SG10202002980WA SG 10202002980W A SG10202002980W A SG 10202002980WA SG 10202002980W A SG10202002980W A SG 10202002980WA SG 10202002980W A SG10202002980W A SG 10202002980WA SG 10202002980W A SG10202002980W A SG 10202002980WA
Authority
SG
Singapore
Prior art keywords
workpiece
thermocompression bonding
processing method
bonding method
processing
Prior art date
Application number
SG10202002980WA
Inventor
Yamamoto Naoko
Yodo Yoshiaki
Kubo Atsushi
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10202002980WA publication Critical patent/SG10202002980WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H01L2223/5446—Located in scribe lines

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
SG10202002980WA 2019-04-17 2020-03-30 Processing method and thermocompression bonding method for workpiece SG10202002980WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019078622A JP7301468B2 (en) 2019-04-17 2019-04-17 Workpiece processing method, thermocompression bonding method

Publications (1)

Publication Number Publication Date
SG10202002980WA true SG10202002980WA (en) 2020-11-27

Family

ID=72660581

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202002980WA SG10202002980WA (en) 2019-04-17 2020-03-30 Processing method and thermocompression bonding method for workpiece

Country Status (8)

Country Link
US (2) US11222807B2 (en)
JP (1) JP7301468B2 (en)
KR (1) KR20200122234A (en)
CN (1) CN111834275A (en)
DE (1) DE102020204897A1 (en)
PH (1) PH12020050062A1 (en)
SG (1) SG10202002980WA (en)
TW (1) TWI830900B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7301468B2 (en) * 2019-04-17 2023-07-03 株式会社ディスコ Workpiece processing method, thermocompression bonding method

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4607779A (en) * 1983-08-11 1986-08-26 National Semiconductor Corporation Non-impact thermocompression gang bonding method
JP2839215B2 (en) * 1991-09-04 1998-12-16 株式会社カイジョー Bonding equipment
JP3842362B2 (en) * 1996-02-28 2006-11-08 株式会社東芝 Thermocompression bonding method and thermocompression bonding apparatus
FR2805067B1 (en) * 2000-02-15 2003-09-12 Bourgogne Grasset ELECTRONIC CHIP TOKEN AND METHODS OF MANUFACTURING SUCH A TOKEN
US20020127821A1 (en) 2000-12-28 2002-09-12 Kazuyuki Ohya Process for the production of thinned wafer
JP2002203821A (en) * 2000-12-28 2002-07-19 Mitsubishi Gas Chem Co Inc Adhering and peeling method
JP4841431B2 (en) * 2005-02-02 2011-12-21 ソニーケミカル＆インフォメーションデバイス株式会社 Electrical component mounting equipment
CN101473425B (en) * 2006-06-23 2011-02-09 日立化成工业株式会社 Production method of semiconductor device and bonding film
JP2009141267A (en) * 2007-12-10 2009-06-25 Sony Chemical & Information Device Corp Packaging method and apparatus of electrical component
JP5198203B2 (en) 2008-09-30 2013-05-15 株式会社ディスコ Processing equipment
JP5274966B2 (en) * 2008-09-30 2013-08-28 株式会社ディスコ Processing equipment
JP5199010B2 (en) * 2008-10-01 2013-05-15 富士通株式会社 RFID tag manufacturing method and RFID tag
CN103165474A (en) 2011-12-16 2013-06-19 日东电工株式会社 Method for producing semiconductor device
JP2013243311A (en) 2012-05-22 2013-12-05 Disco Abrasive Syst Ltd Surface protective tape
CN104603922B (en) * 2012-08-31 2018-01-26 松下知识产权经营株式会社 Component mounting structure body
JP6645730B2 (en) * 2014-01-28 2020-02-14 デクセリアルズ株式会社 Connection body and method for manufacturing connection body
JP2015149451A (en) * 2014-02-07 2015-08-20 デクセリアルズ株式会社 Alignment method, connection method for electronic part, manufacturing method for connection body, connection body and anisotropic conductive film
JP6597056B2 (en) * 2015-08-26 2019-10-30 富士通株式会社 Heating header for semiconductor mounting apparatus and semiconductor bonding method
DE112015006857B4 (en) * 2015-08-31 2023-10-05 Disco Corporation Method for processing a wafer and protective cover for use in this method
JP6671797B2 (en) 2016-05-30 2020-03-25 株式会社ディスコ Tape application method
KR101880053B1 (en) * 2017-04-26 2018-07-20 (주)노피온 Method of manufacturing anisotropic conductive adhesive comprising gaper and method of mounting components using the gaper
US11043685B2 (en) * 2017-04-28 2021-06-22 Honda Motor Co., Ltd. Method and apparatus for producing resin frame equipped membrane electrode assembly
KR102345923B1 (en) 2017-05-18 2022-01-03 가부시기가이샤 디스코 Protective sheeting for use in processing wafers, handling systems for wafers, and combinations of wafers and protective sheeting
US11024595B2 (en) * 2017-06-16 2021-06-01 Micron Technology, Inc. Thermocompression bond tips and related apparatus and methods
US10403598B2 (en) * 2017-08-11 2019-09-03 Micron Technology, Inc. Methods and system for processing semiconductor device structures
JP7201342B2 (en) 2018-06-06 2023-01-10 株式会社ディスコ Wafer processing method
JP7301468B2 (en) * 2019-04-17 2023-07-03 株式会社ディスコ Workpiece processing method, thermocompression bonding method

Also Published As

Publication number Publication date
TW202109759A (en) 2021-03-01
PH12020050062A1 (en) 2020-12-02
US20220059392A1 (en) 2022-02-24
US20200335382A1 (en) 2020-10-22
US11823942B2 (en) 2023-11-21
CN111834275A (en) 2020-10-27
TWI830900B (en) 2024-02-01
DE102020204897A1 (en) 2020-10-22
US11222807B2 (en) 2022-01-11
JP7301468B2 (en) 2023-07-03
KR20200122234A (en) 2020-10-27
JP2020178008A (en) 2020-10-29

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