JP6645730B2 - Connection body and method for manufacturing connection body - Google Patents
Connection body and method for manufacturing connection body Download PDFInfo
- Publication number
- JP6645730B2 JP6645730B2 JP2014219705A JP2014219705A JP6645730B2 JP 6645730 B2 JP6645730 B2 JP 6645730B2 JP 2014219705 A JP2014219705 A JP 2014219705A JP 2014219705 A JP2014219705 A JP 2014219705A JP 6645730 B2 JP6645730 B2 JP 6645730B2
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- Prior art keywords
- conductive particles
- circuit board
- distance
- particles
- connection
- Prior art date
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0269—Non-uniform distribution or concentration of particles
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Description
本発明は、電子部品と回路基板とが接続された接続体及び接続体の製造方法に関し、特に導電性粒子を含有する接着剤を介して電子部品が回路基板に接続された接続体及び接続体の製造方法に関する。 The present invention relates to a connection body in which an electronic component is connected to a circuit board and a method of manufacturing the connection body, and more particularly to a connection body and a connection body in which an electronic component is connected to a circuit board via an adhesive containing conductive particles. And a method for producing the same.
従来から、テレビやPCモニタ、携帯電話やスマートホン、携帯型ゲーム機、タブレット端末やウェアラブル端末、あるいは車載用モニタ等の各種表示手段として、液晶表示装置や有機ELパネルが用いられている。近年、このような表示装置においては、ファインピッチ化、軽量薄型化等の観点から、駆動用ICを直接表示パネルのガラス基板上に実装するいわゆるCOG(chip on glass)が採用されている。 2. Description of the Related Art Conventionally, liquid crystal display devices and organic EL panels have been used as various display means such as televisions and PC monitors, mobile phones and smartphones, portable game machines, tablet terminals and wearable terminals, and in-vehicle monitors. In recent years, in such a display device, so-called COG (chip on glass) in which a driving IC is directly mounted on a glass substrate of a display panel has been adopted from the viewpoints of fine pitch, light weight and thinness.
例えばCOG実装方式が採用された液晶表示パネルにおいては、図12(A)(B)に示すように、ガラス基板等からなる透明基板101に、ITO(酸化インジウムスズ)等からなる透明電極102が複数形成され、これら透明電極102上に液晶駆動用IC103等の電子部品が接続される。液晶駆動用IC103は、実装面に、透明電極102に対応して複数の電極端子104が形成され、異方性導電フィルム105を介して透明基板101上に熱圧着されることにより、電極端子104と透明電極102とが接続される。
For example, in a liquid crystal display panel employing a COG mounting method, as shown in FIGS. 12A and 12B, a
異方性導電フィルム105は、バインダー樹脂に導電性粒子を混ぜ込んでフィルム状としたもので、2つの導体間で加熱圧着されることにより導電性粒子で導体間の電気的導通がとられ、バインダー樹脂にて導体間の機械的接続が保持される。異方性導電フィルム105を構成する接着剤としては、通常、信頼性の高い熱硬化性のバインダー樹脂が用いられるが、光硬化性のバインダー樹脂又は光熱併用型のバインダー樹脂であってもよい。
The anisotropic
このような異方性導電フィルム105を介して液晶駆動用IC103を透明電極102へ接続する場合は、先ず、透明基板101の透明電極102上に異方性導電フィルム105を図示しない仮圧着手段によって仮貼りする。続いて、異方性導電フィルム105を介して透明基板101上に液晶駆動用IC103を搭載し仮接続体を形成した後、熱圧着ヘッド106等の熱圧着手段によって液晶駆動用IC103を異方性導電フィルム105とともに透明電極102側へ加熱押圧する。この熱圧着ヘッド106による加熱によって、異方性導電フィルム105は熱硬化反応を起こし、これにより液晶駆動用IC103が透明電極102上に接着される。
When the liquid crystal driving IC 103 is connected to the
近年の液晶表示装置その他の電子機器の小型化、高精細化に伴い、回路基板の配線ピッチや電子部品の電極端子のファインピッチ化も進み、異方性導電フィルムを用いて、電極端子がファインピッチ化された回路基板上にICチップ等の電子部品をCOG接続する場合、狭小化された電極端子間においても確実に導電性粒子が挟持され導通を確保するために、導電性粒子を高密度に充填する必要がある。 With the recent miniaturization and high definition of liquid crystal display devices and other electronic devices, the finer pitch of the wiring pitch of the circuit board and the finer pitch of the electrode terminals of electronic components has been advanced. When an electronic component such as an IC chip is connected by COG to a pitched circuit board, the conductive particles are reliably sandwiched between the narrowed electrode terminals, and the conductive particles are densely packed to ensure conduction. Need to be filled.
しかし、図13に示すように、回路基板の配線ピッチや電子部品の電極端子のファインピッチ化が進むなかで導電性粒子107を高密度に充填すると、電極端子104間に分散された導電性粒子107が連続することによる端子間ショートの発生率が高まる。
However, as shown in FIG. 13, when the
なお、一般に回路基板に形成される電極は印刷等により数十nm〜数μmオーダーの薄さで形成されるため、回路基板側の電極間におけるショートは問題にならない。 In general, electrodes formed on a circuit board are formed with a thickness of the order of several tens of nm to several μm by printing or the like, so that a short circuit between electrodes on the circuit board side does not matter.
そこで、本発明は、回路基板の配線ピッチや電子部品の電極端子がファインピッチ化されても、電子部品と回路基板との導通性を確保するとともに、電子部品の電極端子間におけるショートを防止することができる接続体及び接続体の製造方法を提供することを目的とする。 Therefore, the present invention ensures the conductivity between the electronic component and the circuit board and prevents a short circuit between the electrode terminals of the electronic component even if the wiring pitch of the circuit board or the electrode terminal of the electronic component is made finer. It is an object of the present invention to provide a connection body and a method for manufacturing the connection body that can be used.
上述した課題を解決するために、本発明に係る接続体は、回路基板上に異方性導電接着剤を介して電子部品が接続された接続体において、上記異方性導電接着剤は、バインダー樹脂に導電性粒子が配列され、上記電子部品に形成された接続電極間のスペースにおける導電性粒子同士の粒子間距離は、上記回路基板に形成された基板電極と上記接続電極との間に捕捉された上記導電性粒子同士の粒子間距離よりも長く、上記基板電極及び上記接続電極の配列方向において、上記導電性粒子が、上記配列方向にわたって疎、上記配列方向と直交する方向に亘って密に配列されているものである。
また、本発明に係る接続体は、回路基板上に異方性導電接着剤を介して電子部品が接続された接続体において、上記異方性導電接着剤は、バインダー樹脂に導電性粒子が配列され、上記電子部品に形成された接続電極間のスペースにおける導電性粒子同士の粒子間距離は、上記回路基板に形成された基板電極と上記接続電極との間に捕捉された上記導電性粒子同士の粒子間距離よりも長く、上記基板電極及び上記接続電極の配列方向において、上記導電性粒子が、上記配列方向にわたって密、上記配列方向と直交する方向に亘って疎に配列されているものである。
また、本発明に係る接続体は、回路基板上に異方性導電接着剤を介して電子部品が接続された接続体において、上記異方性導電接着剤は、バインダー樹脂に導電性粒子が配列され、上記電子部品に形成された接続電極間のスペースにおける導電性粒子同士の粒子間距離は、上記回路基板に形成された基板電極と上記接続電極との間に捕捉された上記導電性粒子同士の粒子間距離よりも長く、上記回路基板に形成された基板電極と上記接続電極との間に捕捉された上記導電性粒子の上記基板電極の長手方向の外接線が、該長手方向に隣接して捕捉された導電性粒子を貫くものである。
In order to solve the above-described problems, a connector according to the present invention is a connector in which electronic components are connected via an anisotropic conductive adhesive on a circuit board, wherein the anisotropic conductive adhesive has a binder. The conductive particles are arranged in the resin, and the distance between the conductive particles in the space between the connection electrodes formed on the electronic component is captured between the substrate electrode formed on the circuit board and the connection electrode. The conductive particles are longer than the distance between the conductive particles and the conductive particles are sparse in the arrangement direction and dense in the direction orthogonal to the arrangement direction in the arrangement direction of the substrate electrode and the connection electrode. Are arranged.
Further, the connection body according to the present invention is a connection body in which electronic components are connected via an anisotropic conductive adhesive on a circuit board, wherein the anisotropic conductive adhesive has conductive particles arranged in a binder resin. The distance between the conductive particles in the space between the connection electrodes formed on the electronic component is the distance between the conductive particles captured between the substrate electrode formed on the circuit board and the connection electrode. Longer than the inter-particle distance, in the arrangement direction of the substrate electrode and the connection electrode, the conductive particles are densely arranged in the arrangement direction and sparsely arranged in a direction orthogonal to the arrangement direction. is there.
Further, the connection body according to the present invention is a connection body in which electronic components are connected via an anisotropic conductive adhesive on a circuit board, wherein the anisotropic conductive adhesive has conductive particles arranged in a binder resin. The distance between the conductive particles in the space between the connection electrodes formed on the electronic component is the distance between the conductive particles captured between the substrate electrode formed on the circuit board and the connection electrode. Longer than the distance between the particles, the external tangent of the conductive particles captured between the substrate electrode formed on the circuit board and the connection electrode in the longitudinal direction of the substrate electrode is adjacent to the longitudinal direction. It penetrates the conductive particles captured.
また、本発明に係る接続体の製造方法は、回路基板上に、導電性粒子を含有した接着剤を介して電子部品を搭載し、上記電子部品を上記回路基板に対して押圧するとともに、上記接着剤を硬化させることにより、上記電子部品を上記回路基板上に接続する接続体の製造方法において、上記接着剤は、バインダー樹脂に導電性粒子が配列され、上記接続電極間のスペースにおける導電性粒子同士の粒子間距離は、上記回路基板に形成された基板電極と上記電子部品に形成された接続電極との間に捕捉された上記導電性粒子同士の粒子間距離よりも長く、上記基板電極及び上記接続電極の配列方向において、上記導電性粒子が、上記配列方向にわたって疎、上記配列方向と直交する方向に亘って密に配列されるものである。
また、本発明に係る接続体の製造方法は、回路基板上に、導電性粒子を含有した接着剤を介して電子部品を搭載し、上記電子部品を上記回路基板に対して押圧するとともに、上記接着剤を硬化させることにより、上記電子部品を上記回路基板上に接続する接続体の製造方法において、上記接着剤は、バインダー樹脂に導電性粒子が配列され、上記接続電極間のスペースにおける導電性粒子同士の粒子間距離は、上記回路基板に形成された基板電極と上記電子部品に形成された接続電極との間に捕捉された上記導電性粒子同士の粒子間距離よりも長く、上記基板電極及び上記接続電極の配列方向において、上記導電性粒子が、上記配列方向にわたって密、上記配列方向と直交する方向に亘って疎に配列されるものである。
また、本発明に係る接続体の製造方法は、回路基板上に、導電性粒子を含有した接着剤を介して電子部品を搭載し、上記電子部品を上記回路基板に対して押圧するとともに、上記接着剤を硬化させることにより、上記電子部品を上記回路基板上に接続する接続体の製造方法において、上記接着剤は、バインダー樹脂に導電性粒子が配列され、上記接続電極間のスペースにおける導電性粒子同士の粒子間距離は、上記回路基板に形成された基板電極と上記電子部品に形成された接続電極との間に捕捉された上記導電性粒子同士の粒子間距離よりも長く、上記回路基板に形成された基板電極と上記接続電極との間に捕捉された上記導電性粒子の上記基板電極の長手方向の外接線が、該長手方向に隣接して捕捉された導電性粒子を貫くものである。
In addition, the method for manufacturing a connector according to the present invention includes mounting an electronic component on a circuit board via an adhesive containing conductive particles, pressing the electronic component against the circuit board, In the method of manufacturing a connector for connecting the electronic component on the circuit board by curing the adhesive , the adhesive has conductive particles arranged in a binder resin, and has a conductive property in a space between the connection electrodes. The interparticle distance between the particles is longer than the interparticle distance between the conductive particles captured between the substrate electrode formed on the circuit board and the connection electrode formed on the electronic component, and the substrate electrode In the arrangement direction of the connection electrodes, the conductive particles are sparsely arranged in the arrangement direction and densely arranged in a direction orthogonal to the arrangement direction.
In addition, the method for manufacturing a connector according to the present invention includes mounting an electronic component on a circuit board via an adhesive containing conductive particles, pressing the electronic component against the circuit board, In the method of manufacturing a connector for connecting the electronic component on the circuit board by curing the adhesive , the adhesive has conductive particles arranged in a binder resin, and has a conductive property in a space between the connection electrodes. The interparticle distance between the particles is longer than the interparticle distance between the conductive particles captured between the substrate electrode formed on the circuit board and the connection electrode formed on the electronic component, and the substrate electrode In the arrangement direction of the connection electrodes, the conductive particles are densely arranged in the arrangement direction and sparsely arranged in a direction orthogonal to the arrangement direction.
In addition, the method for manufacturing a connector according to the present invention includes mounting an electronic component on a circuit board via an adhesive containing conductive particles, pressing the electronic component against the circuit board, In the method of manufacturing a connector for connecting the electronic component on the circuit board by curing the adhesive , the adhesive has conductive particles arranged in a binder resin, and has a conductive property in a space between the connection electrodes. The inter-particle distance between the particles is longer than the inter-particle distance between the conductive particles captured between the substrate electrode formed on the circuit board and the connection electrode formed on the electronic component, and The outer tangent of the conductive particles captured between the substrate electrode and the connection electrode in the longitudinal direction of the substrate electrode penetrates the conductive particles captured adjacent in the longitudinal direction. is there.
本発明によれば、隣接する電極端子間の端子間スペースにおける導電性粒子同士の粒子間距離は、接続電極と基板電極との間に捕捉された導電性粒子同士の粒子間距離よりも長い。したがって、ファインピッチ化された接続電極の端子間スペースにおいて導電性粒子が連なることによる端子間ショートを防止することができる。 According to the present invention, the distance between the conductive particles in the inter-terminal space between adjacent electrode terminals is longer than the distance between the conductive particles captured between the connection electrode and the substrate electrode. Therefore, it is possible to prevent short-circuit between terminals due to continuous conductive particles in the space between terminals of the fine-pitched connection electrode.
以下、本発明が適用された接続体及び接続体の製造方法について、図面を参照しながら詳細に説明する。なお、本発明は、以下の実施形態のみに限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々の変更が可能であることは勿論である。また、図面は模式的なものであり、各寸法の比率等は現実のものとは異なることがある。具体的な寸法等は以下の説明を参酌して判断すべきものである。また、図面相互間においても互いの寸法の関係や比率が異なる部分が含まれていることは勿論である。 Hereinafter, a connector and a method of manufacturing the connector to which the present invention is applied will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to only the following embodiments, and it is needless to say that various modifications can be made without departing from the gist of the present invention. Further, the drawings are schematic, and the ratios of the respective dimensions may be different from actual ones. Specific dimensions and the like should be determined in consideration of the following description. In addition, it is needless to say that dimensional relationships and ratios are different between drawings.
[液晶表示パネル]
以下では、本発明が適用された接続体として、ガラス基板に、電子部品として液晶駆動用のICチップが実装された液晶表示パネルを例に説明する。この液晶表示パネル10は、図1に示すように、ガラス基板等からなる二枚の透明基板11,12が対向配置され、これら透明基板11,12が枠状のシール13によって互いに貼り合わされている。そして、液晶表示パネル10は、透明基板11,12によって囲繞された空間内に液晶14が封入されることによりパネル表示部15が形成されている。
[LCD panel]
Hereinafter, a liquid crystal display panel in which a liquid crystal driving IC chip is mounted as an electronic component on a glass substrate will be described as an example of a connection body to which the present invention is applied. In this liquid
透明基板11,12は、互いに対向する両内側表面に、ITO(酸化インジウムスズ)等からなる縞状の一対の透明電極16,17が、互いに交差するように形成されている。そして、両透明電極16,17は、これら両透明電極16,17の当該交差部位によって液晶表示の最小単位としての画素が構成されるようになっている。
The
両透明基板11,12のうち、一方の透明基板12は、他方の透明基板11よりも平面寸法が大きく形成されており、この大きく形成された透明基板12の縁部12aには、電子部品として液晶駆動用IC18が実装されるCOG実装部20が設けられている。なお、COG実装部20には、透明電極17の端子部17a、及び液晶駆動用IC18に設けられたIC側アライメントマーク22と重畳させる基板側アライメントマーク21が形成されている。
One of the
液晶駆動用IC18は、画素に対して液晶駆動電圧を選択的に印加することにより、液晶の配向を部分的に変化させて所定の液晶表示を行うことができるようになっている。また、図2に示すように、液晶駆動用IC18は、透明基板12への実装面18aに、透明電極17の端子部17aと導通接続される複数の電極端子19(バンプ)が形成されている。電極端子19は、例えば銅バンプや金バンプ、あるいは銅バンプに金メッキを施したもの等が好適に用いられる。
The liquid
[電極端子]
液晶駆動用IC18は、例えば、図3に示すように、実装面18aの一方の側縁に沿って電極端子19(入力バンプ)が一列で配列され、一方の側縁と対向する他方の側縁に沿って電極端子19(出力バンプ)が複数列で千鳥状に配列されている。電極端子19と、透明基板12のCOG実装部20に設けられている端子部17aとは、それぞれ同数かつ同ピッチで形成され、透明基板12と液晶駆動用IC18とが位置合わせされて接続されることにより、接続される。
[Electrode terminal]
In the liquid
なお、近年の液晶表示装置その他の電子機器の小型化、高機能化に伴い、液晶駆動用IC18等の電子部品も小型化、低背化が求められ、電極端子19もその高さが低くなっている(例えば6〜15μm)。
With the recent miniaturization and high performance of liquid crystal display devices and other electronic devices, electronic components such as a liquid
また、上述したように、近年の液晶表示装置その他の電子機器の小型化、高精細化に伴い、回路基板の配線ピッチや電子部品の電極端子のファインピッチ化も進んでいる。例えば、液晶駆動用IC18は、電極端子19の端子部17aと接続される接続面の大きさが、幅8〜60μm、長さ400μm以下で下限が幅と同距離(8〜60μm)又は導電性粒子径の7倍未満とされている。また、電極端子19間の最小距離も、電極端子19の幅に準じ、例えば8〜30μmとされる。また、例えば、図4に示す電極端子19及び端子部17aの配列方向における最小距離D(この距離は、異方性接続が可能な範囲で配列方向にずれていてもよい。)が導電性粒子径の4倍未満とすることができる。
Further, as described above, with the recent miniaturization and higher definition of liquid crystal display devices and other electronic devices, finer pitches of wiring pitches of circuit boards and finer pitches of electrode terminals of electronic components have been developed. For example, in the liquid
また、後述するように、液晶駆動用IC18は、透明基板12のCOG実装部20に実装されることにより、異方性導電フィルム1のバインダー樹脂の流動性が電極端子19上と、隣接する電極端子19間のスペース23とで異なり、この端子間スペース23におけるバインダー樹脂の流動性の方が高く、流動しやすい。この流動性に起因して、液晶表示パネル10は、端子部17aと接続される電極端子19上における導電性粒子4の最も近接する粒子との距離(以下、「粒子間距離」とも言う。)よりも、端子間スペース23における導電性粒子4の粒子間距離が長くなる。
As will be described later, the liquid
また、液晶駆動用IC18は、実装面18aに、基板側アライメントマーク21と重畳させることにより、透明基板12に対するアライメントを行うIC側アライメントマーク22が形成されている。なお、透明基板12の透明電極17の配線ピッチや液晶駆動用IC18の電極端子19のファインピッチ化が進んでいることから、液晶駆動用IC18と透明基板12とは、高精度のアライメント調整が求められている。
The
基板側アライメントマーク21及びIC側アライメントマーク22は、組み合わされることにより透明基板12と液晶駆動用IC18とのアライメントが取れる種々のマークを用いることができる。
As the substrate-
COG実装部20に形成されている透明電極17の端子部17a上には、回路接続用接着剤として異方性導電フィルム1を用いて液晶駆動用IC18が接続される。異方性導電フィルム1は、導電性粒子4を含有しており、液晶駆動用IC18の電極端子19と透明基板12の縁部12aに形成された透明電極17の端子部17aとを、導電性粒子4を介して電気的に接続させるものである。この異方性導電フィルム1は、熱圧着ヘッド33により熱圧着されることによりバインダー樹脂が流動化して導電性粒子4が端子部17aと液晶駆動用IC18の電極端子19との間で押し潰され、この状態でバインダー樹脂が硬化する。これにより、異方性導電フィルム1は、透明基板12と液晶駆動用IC18とを電気的、機械的に接続する。
A liquid
また、両透明電極16,17上には、所定のラビング処理が施された配向膜24が形成されており、この配向膜24によって液晶分子の初期配向が規制されるようになっている。さらに、両透明基板11,12の外側には、一対の偏光板25,26が配設されており、これら両偏光板25,26によってバックライト等の光源(図示せず)からの透過光の振動方向が規制されるようになっている。
An
[異方性導電フィルム]
次いで、異方性導電フィルム1について説明する。異方性導電フィルム(ACF:Anisotropic Conductive Film)1は、図5に示すように、通常、基材となる剥離フィルム2上に導電性粒子4を含有するバインダー樹脂層(接着剤層)3が形成されたものである。異方性導電フィルム1は、熱硬化型あるいは紫外線等の光硬化型の接着剤であり、液晶表示パネル10の透明基板12に形成された透明電極17上に貼着されるとともに液晶駆動用IC18が搭載され、熱圧着ヘッド33により熱加圧されることにより流動化して導電性粒子4が相対向する透明電極17の端子部17aと液晶駆動用IC18の電極端子19との間で押し潰され、加熱あるいは紫外線照射により、導電性粒子が押し潰された状態で硬化する。これにより、異方性導電フィルム1は、透明基板12と液晶駆動用IC18とを接続し、導通させることができる。
[Anisotropic conductive film]
Next, the anisotropic
また、異方性導電フィルム1は、膜形成樹脂、熱硬化性樹脂、潜在性硬化剤、シランカップリング剤等を含有する通常のバインダー樹脂層3に導電性粒子4が所定のパターンで規則的に配列されている。
The anisotropic
バインダー樹脂層3を支持する剥離フィルム2は、例えば、PET(Poly Ethylene Terephthalate)、OPP(Oriented Polypropylene)、PMP(Poly-4-methylpentene-1)、PTFE(Polytetrafluoroethylene)等にシリコーン等の剥離剤を塗布してなり、異方性導電フィルム1の乾燥を防ぐとともに、異方性導電フィルム1の形状を維持する。
The
バインダー樹脂層3に含有される膜形成樹脂としては、平均分子量が10000〜80000程度の樹脂が好ましい。膜形成樹脂としては、エポキシ樹脂、変形エポキシ樹脂、ウレタン樹脂、フェノキシ樹脂等の各種の樹脂が挙げられる。中でも、膜形成状態、接続信頼性等の観点からフェノキシ樹脂が特に好ましい。
As the film-forming resin contained in the
熱硬化性樹脂としては、特に限定されず、例えば、市販のエポキシ樹脂、アクリル樹脂等が挙げられる。 The thermosetting resin is not particularly limited, and examples thereof include commercially available epoxy resins and acrylic resins.
エポキシ樹脂としては、特に限定されないが、例えば、ナフタレン型エポキシ樹脂、ビフェニル型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、ビスフェノール型エポキシ樹脂、スチルベン型エポキシ樹脂、トリフェノールメタン型エポキシ樹脂、フェノールアラルキル型エポキシ樹脂、ナフトール型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、トリフェニルメタン型エポキシ樹脂等が挙げられる。これらは単独でも、2種以上の組み合わせであってもよい。 The epoxy resin is not particularly limited, for example, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolak type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenol methane type epoxy resin, phenol aralkyl type epoxy resin , Naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like. These may be used alone or in combination of two or more.
アクリル樹脂としては、特に制限はなく、目的に応じてアクリル化合物、液状アクリレート等を適宜選択することができる。例えば、メチルアクリレート、エチルアクリレート、イソプロピルアクリレート、イソブチルアクリレート、エポキシアクリレート、エチレングリコールジアクリレート、ジエチレングリコールジアクリレート、トリメチロールプロパントリアクリレート、ジメチロールトリシクロデカンジアクリレート、テトラメチレングリコールテトラアクリレート、2−ヒドロキシ−1,3−ジアクリロキシプロパン、2,2−ビス[4−(アクリロキシメトキシ)フェニル]プロパン、2,2−ビス[4−(アクリロキシエトキシ)フェニル]プロパン、ジシクロペンテニルアクリレート、トリシクロデカニルアクリレート、トリス(アクリロキシエチル)イソシアヌレート、ウレタンアクリレート、エポキシアクリレート等を挙げることができる。なお、アクリレートをメタクリレートにしたものを用いることもできる。これらは、1種単独で使用してもよいし、2種以上を併用してもよい。 The acrylic resin is not particularly limited, and an acrylic compound, a liquid acrylate, or the like can be appropriately selected depending on the purpose. For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy- 1,3-diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclo Examples thereof include decanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, and epoxy acrylate. In addition, what converted acrylate into methacrylate can also be used. These may be used alone or in combination of two or more.
潜在性硬化剤としては、特に限定されないが、例えば、加熱硬化型、UV硬化型等の各種硬化剤が挙げられる。潜在性硬化剤は、通常では反応せず、熱、光、加圧等の用途に応じて選択される各種のトリガにより活性化し、反応を開始する。熱活性型潜在性硬化剤の活性化方法には、加熱による解離反応などで活性種(カチオンやアニオン、ラジカル)を生成する方法、室温付近ではエポキシ樹脂中に安定に分散しており高温でエポキシ樹脂と相溶・溶解し、硬化反応を開始する方法、モレキュラーシーブ封入タイプの硬化剤を高温で溶出して硬化反応を開始する方法、マイクロカプセルによる溶出・硬化方法等が存在する。熱活性型潜在性硬化剤としては、イミダゾール系、ヒドラジド系、三フッ化ホウ素−アミン錯体、スルホニウム塩、アミンイミド、ポリアミン塩、ジシアンジアミド等や、これらの変性物があり、これらは単独でも、2種以上の混合体であってもよい。中でも、マイクロカプセル型イミダゾール系潜在性硬化剤が好適である。 The latent curing agent is not particularly limited, but includes, for example, various curing agents such as a heat curing type and a UV curing type. The latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction. The method of activating the heat-active latent curing agent is to generate active species (cations, anions, radicals) by a dissociation reaction by heating or the like. There are a method of starting a curing reaction by dissolving and dissolving with a resin, a method of starting a curing reaction by eluting a molecular sieve-encapsulated curing agent at a high temperature, and a method of dissolving and curing by microcapsules. Examples of the heat-active latent curing agent include imidazole-based, hydrazide-based, boron trifluoride-amine complex, sulfonium salt, amine imide, polyamine salt, dicyandiamide, and the like, and modified products thereof. A mixture of the above may be used. Among them, a microcapsule-type imidazole-based latent curing agent is preferable.
シランカップリング剤としては、特に限定されないが、例えば、エポキシ系、アミノ系、メルカプト・スルフィド系、ウレイド系等を挙げることができる。シランカップリング剤を添加することにより、有機材料と無機材料との界面における接着性が向上される。 Although it does not specifically limit as a silane coupling agent, For example, an epoxy type, an amino type, a mercapto sulfide type, a ureide type, etc. can be mentioned. By adding the silane coupling agent, the adhesiveness at the interface between the organic material and the inorganic material is improved.
[導電性粒子]
導電性粒子4としては、異方性導電フィルム1において使用されている公知の何れの導電性粒子を挙げることができる。導電性粒子4としては、例えば、ニッケル、鉄、銅、アルミニウム、錫、鉛、クロム、コバルト、銀、金等の各種金属や金属合金の粒子、金属酸化物、カーボン、グラファイト、ガラス、セラミック、プラスチック等の粒子の表面に金属をコートしたもの、或いは、これらの粒子の表面に更に絶縁薄膜をコートしたもの等が挙げられる。樹脂粒子の表面に金属をコートしたものである場合、樹脂粒子としては、例えば、エポキシ樹脂、フェノール樹脂、アクリル樹脂、アクリロニトリル・スチレン(AS)樹脂、ベンゾグアナミン樹脂、ジビニルベンゼン系樹脂、スチレン系樹脂等の粒子を挙げることができる。導電性粒子4の大きさは1〜10μmが好ましいが、本発明はこれに限定されるものではない。
[Conductive particles]
As the
[導電性粒子の規則配列]
異方性導電フィルム1は、導電性粒子4が平面視において所定の配列パターンで規則的に配列され、例えば図6に示すように、格子状かつ均等に配列されるものがある。平面視において規則的に配列されることにより、異方性導電フィルム1は、導電性粒子4がランダムに分散されている場合に比して、液晶駆動用IC18の隣接する電極端子19間がファインピッチ化し端子間面積が狭小化するとともに、導電性粒子4が高密度に充填されていても、液晶駆動用IC18の接続工程において、導電性粒子4の凝集体による電極端子19間のショートを防止することができる。
[Regular arrangement of conductive particles]
In the anisotropic
また、異方性導電フィルム1は、導電性粒子4が規則的に配列されることにより、バインダー樹脂層3に高密度に充填した場合にも、導電性粒子4の凝集による疎密の発生が防止されている。したがって、異方性導電フィルム1によれば、ファインピッチ化された端子部17aや電極端子19においても導電性粒子4を捕捉することができる。導電性粒子4の均等配列パターンは、任意に設定することができる。液晶駆動用IC18の接続工程については後に詳述する。
Moreover, the anisotropic
このような異方性導電フィルム1は、例えば、延伸可能なシート上に粘着剤を塗布し、その上に導電性粒子4を単層配列した後、当該シートを、所望の延伸倍率で延伸させる方法、導電性粒子4を基板上に所定の配列パターンに整列させた後、剥離フィルム2に支持されたバインダー樹脂層3に導電性粒子4を転写する方法、あるいは剥離フィルム2に支持されたバインダー樹脂層3上に、配列パターンに応じた開口部が設けられた配列板を介して導電性粒子4を供給する方法等により製造することができる。
Such an anisotropic
[粒子個数密度]
ここで、透明基板12の透明電極17の配線ピッチや液晶駆動用IC18の電極端子19のファインピッチ化が進んでいることから、透明基板12上に液晶駆動用IC18をCOG接続する場合、ファインピッチ化された電極端子19及び端子部17aとの間においても確実に導電性粒子が挟持され導通を確保するために、異方性導電フィルム1は、導電性粒子4が高密度で配列されている。
[Particle number density]
Here, the fine pitch of the wiring pitch of the
具体的に、異方性導電フィルム1は、導電性粒子4が5000〜60000個/mm2の個数密度で配列されている。粒子個数密度が5000個/mm2よりも少ないとファインピッチ化された電極端子19及び端子部17aとの間における粒子捕捉数が減少し、導通抵抗が上がってしまう。また、粒子個数密度が60000個/mm2よりも多いと狭小化された電極端子19間の端子間スペース23にある導電性粒子4が連なってしまい、隣接する電極端子19間をショートさせるおそれがある。なお、これらは一例であり、粒子個数密度は導電性粒子4の大きさから任意に調整するものであり、本発明はこれに限定されるものではない。
Specifically, the anisotropic
なお、異方性導電フィルム1の形状は、特に限定されないが、例えば、図5に示すように、巻取リール6に巻回可能な長尺テープ形状とし、所定の長さだけカットして使用することができる。
The shape of the anisotropic
また、上述の実施の形態では、異方性導電フィルム1として、バインダー樹脂層3に導電性粒子4を規則配列した熱硬化性樹脂組成物をフィルム状に成形した接着フィルムを例に説明したが、本発明に係る接着剤は、これに限定されず、例えばバインダー樹脂3のみからなる絶縁性接着剤層と導電性粒子4を規則配列したバインダー樹脂3からなる導電性粒子含有層とを積層した構成とすることができる。また、異方性導電フィルム1は、導電性粒子4が平面視で規則配列されていれば、図5に示すように単層配列されている他、複数のバインダー樹脂層3にわたって導電性粒子4が配列されるとともに平面視において規則配列されるものでもよい。また、異方性導電フィルム1は、多層構成の少なくとも一つの層内で、所定距離で単一に分散されたものでもよい。
Further, in the above-described embodiment, the anisotropic
[接続工程]
次いで、透明基板12に液晶駆動用IC18を接続する接続工程について説明する。先ず、透明基板12の端子部17aが形成されたCOG実装部20上に異方性導電フィルム1を仮貼りする。次いで、この透明基板12を接続装置のステージ上に載置し、透明基板12の実装部上に異方性導電フィルム1を介して液晶駆動用IC18を配置する。
[Connection process]
Next, a connection step of connecting the liquid
次いで、バインダー樹脂層3を硬化させる所定の温度に加熱された熱圧着ヘッド33によって、所定の圧力、時間で液晶駆動用IC18上から熱加圧する。これにより、異方性導電フィルム1のバインダー樹脂層3は流動性を示し、液晶駆動用IC18の実装面18aと透明基板12のCOG実装部20の間から流出するとともに、バインダー樹脂層3中の導電性粒子4は、液晶駆動用IC18の電極端子19と透明基板12の端子部17aとの間に挟持されて押し潰される。
Next, the
その結果、電極端子19と端子部17aとの間で導電性粒子4を挟持することにより電気的に接続され、この状態で熱圧着ヘッド33によって加熱されたバインダー樹脂が硬化する。これにより、液晶駆動用IC18の電極端子19と透明基板12に形成された端子部17aとの間で導通性を確保された液晶表示パネル10を製造することができる。
As a result, the
電極端子19と端子部17aとの間にない導電性粒子4は、隣接する電極端子19間の端子間スペース23においてバインダー樹脂に分散されており、電気的に絶縁した状態を維持している。これにより、液晶駆動用IC18の電極端子19と透明基板12の端子部17aとの間のみで電気的導通が図られる。なお、バインダー樹脂として、ラジカル重合反応系の速硬化タイプのものを用いることで、短い加熱時間によってもバインダー樹脂を速硬化させることができる。また、異方性導電フィルム1としては、熱硬化型に限らず、加圧接続を行うものであれば、光硬化型もしくは光熱併用型の接着剤を用いてもよい。
The
[導電性粒子間距離]
ここで、本発明においては、隣接する電極端子19間の端子間スペース23における導電性粒子4同士の粒子間距離は、電極端子19と端子部17aとの間に捕捉された導電性粒子4同士の粒子間距離よりも長い。したがって、液晶表示パネル10は、ファインピッチ化された電極端子19の端子間スペース23において導電性粒子4が連なることによる端子間ショートを防止することができる。
[Distance between conductive particles]
Here, in the present invention, the distance between the
すなわち、本発明においては、異方性導電フィルム1の導電性粒子4が規則的に配置されている。また、熱圧着ヘッド33による熱加圧時において、液晶駆動用IC18は、電極端子19上よりも、端子間スペース23の方がバインダー樹脂の流動性が高く流動しやすい。さらに、電極端子19と端子部17aとの間に捕捉された導電性粒子4は、バインダー樹脂の流動による影響が低い。
That is, in the present invention, the
一方、端子間スペース23における導電性粒子4は、電極端子19や端子部17aに挟持されておらず、熱圧着ヘッド33による熱加圧によって流動するバインダー樹脂の影響を相対的に大きく受ける。このため、端子間スペース23における導電性粒子4は、粒子間距離が相対的に大きくなる。したがって、液晶表示パネル10は、電極端子19と端子部17aとの間に確実に導電性粒子4を捕捉して導通性を確保することができ、かつ、隣接する電極端子19間の端子間スペース23において、粒子間距離を保持するため、電極端子19間のショートを防止することができる。
On the other hand, the
また、上述したように、導電性粒子の個数密度は5000〜60000個/mm2とされていることが好ましい。当該個数密度を有することにより、液晶表示パネル10は、狭小化された端子間スペース23において導電性粒子4が連続することによる端子間ショートを防止するとともに、ファインピッチ化された電極端子19と端子部17aとの間に導電性粒子4を確実に捕捉し、導通性を向上させることができる。
Further, as described above, the number density of the conductive particles is preferably set to 5,000 to 60,000 particles / mm 2 . By having the number density, the liquid
図7は、導電性粒子4が規則的に配置された異方性導電フィルム1(個数密度:28000個/mm2)と導電性粒子がランダムに分散されている異方性導電フィルム(個数密度:60000個/mm2)とを用いてそれぞれ異方性導電接続された接続体における一つの電極端子19の導電性粒子捕捉数の分布を対比したグラフである。電極端子19のサイズは14μm×50μm(=700μm2)、電極端子19間の距離は14μmである。また、異方性導電フィルム1のバインダー及び接続条件は、下記の実施例及び比較例に準ずる。
FIG. 7 shows an anisotropic
図7に示すように、異方性導電フィルム1を用いて製造された接続体では、捕捉の確実性が向上されていることがわかる。
As shown in FIG. 7, it can be seen that the connection body manufactured using the anisotropic
[フィルム長手方向に疎密配列]
また、図8(A)に示すように、異方性導電フィルム1は、端子部17a及び電極端子19の配列方向を長手方向とするフィルム状に形成され、導電性粒子4が、長手方向にわたって疎、幅方向に亘って密に配列されていてもよい。
[Dense and dense arrangement in the film longitudinal direction]
Further, as shown in FIG. 8A, the anisotropic
異方性導電フィルム1は、長手方向を端子部17a及び電極端子19の配列方向に沿って貼着される。したがって、異方性導電フィルム1は、COG実装部20に貼り合われることにより、導電性粒子4が端子部17a及び電極端子19の配列方向にわたって疎に配列され、端子部17a及び電極端子19の長さ方向にわたって密に配列される。
The anisotropic
このような異方性導電フィルム1は、相対的に導電性粒子4が端子部17a及び電極端子19の配列方向にわたって疎に配列されることにより、端子間スペース23において隣接する電極端子19間にわたる導電性粒子4の数が減り、粒子間距離が広がるため、より電極端子19間のショートを防止することができる。
In such an anisotropic
また、異方性導電フィルム1は、相対的に導電性粒子4が幅方向に亘って密に配列されているため、端子部17a及び電極端子19の間における導電性粒子4の粒子捕捉率が上がる。したがって、液晶駆動用IC18との導通性を損なうこともない。
Further, in the anisotropic
なお、図8(B)に示すように、異方性導電フィルム1は、端子部17a及び電極端子19の配列方向を長手方向とするフィルム状に形成され、導電性粒子4が、長手方向にわたって密、幅方向に亘って疎に配列されていてもよい。
As shown in FIG. 8 (B), the anisotropic
この場合も、端子間スペース23における導電性粒子4は、熱圧着ヘッド33による熱加圧によって流動するバインダー樹脂の影響を大きく受け、粒子間距離が相対的に大きくなる。そのため、液晶表示パネル10は、電極端子19間のショートを防止することができる。
Also in this case, the
また、液晶表示パネル10は、相対的に導電性粒子4がフィルムの長さ方向に亘って密に配列されているため、端子部17a及び電極端子19の間において導電性粒子4を確実に捕捉することができ、液晶駆動用IC18との導通性を損なうこともない。
Further, in the liquid
[高密度充填配列]
また、図9〜図11に示すように、異方性導電フィルム1は、フィルムの長手方向Lfと直交する幅方向Ltに対して、導電性粒子4を傾斜させて配列し、フィルムの長手方向Lfを端子部17aの配列方向と平行、且つフィルムの幅方向Ltを端子部17aの長手方向と平行に配置させることにより、異方導電性フィルム1の長手方向Lfに直交する方向の、導電性粒子Pの外接線(二点鎖線)が、その導電性粒子Pに隣接する導電性粒子Pc、Peを貫いてもよい。
[High density packing arrangement]
As shown in FIGS. 9 to 11, the anisotropic
これにより、透明電極17の端子部17aに異方導電性フィルム1を重ねた平面図において、端子部17aの幅方向(フィルムの長手方向Lf)に対する隣接する導電性粒子4の粒子間距離が密となり、ファインピッチ化された端子部17aの接続面に占める導電性粒子4の捕捉率を向上することができる。よって、異方性導電フィルム1は、異方導電接続時に対向する電極端子19との間で挟持されて端子部17aに押し込まれ、電極端子19と端子部17aとの間を導通させる導電性粒子Pの数が不十分になることを防止することができる。
Accordingly, in the plan view in which the anisotropic
なお、図9〜図11に示す異方性導電フィルム1は、導電性粒子がフィルム幅方向Ltへの第2配列方向L2がフィルム幅方向Ltに対して傾斜するとともに、フィルムの長手方向Lfへの第1配列方向L1がフィルム長手方向Lfに対して傾斜することにより、端子部17aの幅方向及び長手方向に対する隣接する導電性粒子間距離が密とされ、より捕捉率が向上されている。
In the anisotropic
次いで、本発明の実施例について説明する。本実施例では、導電性粒子が規則配列された異方性導電フィルムと、導電性粒子がランダムに分散された異方性導電フィルムを用いて、評価用ガラス基板に評価用ICを接続した接続体サンプルを作成し、それぞれ評価用ガラス基板に形成された基板電極と評価用ICに形成されたICバンプとの間に捕捉された導電性粒子の数及び導電性粒子の最も近接する粒子との距離(粒子間距離)、隣接するICバンプ間に亘るバンプ間スペースにおける導電性粒子の数及び導電性粒子の最も近接する粒子との距離(粒子間距離)、初期導通抵抗、隣接するICバンプ間のショート発生率を測定した。 Next, examples of the present invention will be described. In this example, a connection is made by connecting an evaluation IC to a glass substrate for evaluation using an anisotropic conductive film in which conductive particles are regularly arranged and an anisotropic conductive film in which conductive particles are randomly dispersed. A body sample was prepared, and the number of conductive particles captured between the substrate electrode formed on the glass substrate for evaluation and the IC bump formed on the IC for evaluation, respectively, Distance (inter-particle distance), number of conductive particles in the inter-bump space between adjacent IC bumps, distance of conductive particles to the closest particle (inter-particle distance), initial conduction resistance, between adjacent IC bumps Was measured for short-circuit occurrence rate.
[異方性導電フィルム]
評価用ICの接続に用いる異方性導電フィルムのバインダー樹脂層は、フェノキシ樹脂(商品名:YP50、新日鐵化学社製)60質量部、エポキシ樹脂(商品名:jER828、三菱化学社製)40質量部、カチオン系硬化剤(商品名:SI‐60L、三新化学工業社製)2質量部を溶剤に加えたバインダー樹脂組成物を調整し、このバインダー樹脂組成物を剥離フィルム上に塗布、焼成することにより形成した。
[Anisotropic conductive film]
The binder resin layer of the anisotropic conductive film used for connection of the evaluation IC is composed of 60 parts by mass of a phenoxy resin (trade name: YP50, manufactured by Nippon Steel Chemical Co., Ltd.) and an epoxy resin (trade name: jER828, manufactured by Mitsubishi Chemical Corporation). A binder resin composition was prepared by adding 40 parts by mass and 2 parts by mass of a cationic curing agent (trade name: SI-60L, manufactured by Sanshin Chemical Industry Co., Ltd.) to a solvent, and this binder resin composition was applied on a release film. And formed by firing.
[評価用IC]
評価素子として、外形;1.8mm×20mm、厚み0.5mm、バンプ(Au‐plated);幅30μ×長さ85μm、高さ15μm、バンプ間スペース幅;50μmの評価用ICを用いた。
[Evaluation IC]
As an evaluation element, an evaluation IC having an outer shape of 1.8 mm × 20 mm, a thickness of 0.5 mm, a bump (Au-plated); a width of 30 μ × 85 μm, a height of 15 μm, and a space width between bumps of 50 μm was used.
[評価用ガラス基板]
評価用ICが接続される評価用ガラス基板として、外形;30mm×50mm、厚み0.5mm、評価用ICのバンプと同サイズ同ピッチの櫛歯状の電極パターンが形成されたITOパターングラスを用いた。
[Evaluation glass substrate]
As an evaluation glass substrate to which the evaluation IC is connected, an ITO pattern glass having an outer shape; 30 mm × 50 mm, a thickness of 0.5 mm, and a comb-tooth electrode pattern having the same size and pitch as the evaluation IC bumps is used. Was.
この評価用ガラス基板に異方性導電フィルムを仮貼りした後、ICバンプと基板電極とのアライメントを取りながら評価用ICを搭載し、熱圧着ヘッドにより180℃、80MPa、5secの条件で熱圧着することにより接続体サンプルを作成した。各接続体サンプルについて、ICバンプと基板電極との間に挟持されている導電性粒子の捕捉数及び粒子間距離、隣接するICバンプ間に亘るバンプ間スペースにある導電性粒子の数及び粒子間距離、初期導通抵抗、隣接するICバンプ間のショート発生率を測定した。 After temporarily attaching the anisotropic conductive film to the glass substrate for evaluation, the IC for evaluation is mounted while aligning the IC bumps and the substrate electrodes, and thermocompression bonding is performed by a thermocompression head at 180 ° C., 80 MPa, and 5 sec. Then, a connected body sample was prepared. For each connected body sample, the number of captured conductive particles sandwiched between the IC bump and the substrate electrode and the distance between the particles, the number of conductive particles in the inter-bump space between adjacent IC bumps, and the distance between the particles The distance, initial conduction resistance, and short-circuit occurrence rate between adjacent IC bumps were measured.
ICバンプと基板電極との間に挟持されている導電性粒子の捕捉数は、各接続体サンプルについて、基板電極に現れる圧痕を評価用ガラス基板の裏面から観察し、1対のICバンプ及び基板電極の間に捕捉された導電性粒子の数を、任意の100個のICバンプ及び基板電極について計測して、その平均を求めた。同様に、ICバンプと基板電極との間に捕捉された導電性粒子の粒子間距離は、基板電極に現れる圧痕を評価用ガラス基板の裏面から観察し、任意の100個のICバンプ及び基板電極について計測し、その平均及び最小距離を求めた。 The number of captured conductive particles held between the IC bump and the substrate electrode can be determined by observing the indentation appearing on the substrate electrode from the back surface of the evaluation glass substrate for each of the connected body samples. The number of conductive particles trapped between the electrodes was measured for an arbitrary 100 IC bumps and substrate electrodes, and the average was determined. Similarly, the distance between the conductive particles trapped between the IC bump and the substrate electrode can be determined by observing the indentation appearing on the substrate electrode from the back surface of the evaluation glass substrate, and selecting any 100 IC bumps and substrate electrodes. Was measured, and the average and minimum distance were obtained.
バンプ間スペースにある導電性粒子の数は、各接続体サンプルについて、評価用ガラス基板の裏面から観察し、任意の100個のバンプ間スペースについて計測し、その平均を求めた。同様に、バンプ間スペースにある導電性粒子の粒子間距離は、評価用ガラス基板の裏面から観察し、任意の100個のバンプ間スペースについて計測し、その平均及び最小距離を求めた。なお、同一観察面において深さ方向でずれているものは、計測値から概算して求めた。 The number of conductive particles in the inter-bump space was determined by observing each connected body sample from the back surface of the glass substrate for evaluation and measuring an arbitrary 100 inter-bump spaces, and calculating the average. Similarly, the distance between the conductive particles in the space between the bumps was observed from the back surface of the glass substrate for evaluation, measured for any 100 spaces between the bumps, and the average and the minimum distance were obtained. In addition, what shifted | deviated in the depth direction in the same observation surface was calculated and estimated from the measured value.
また、各接続体サンプルは、初期導通抵抗が0.5Ω以下、ICバンプ間のショート発生率が50ppm以下を良好と評価した。 In addition, each connection body sample was evaluated as good when the initial conduction resistance was 0.5Ω or less and the short circuit occurrence rate between IC bumps was 50ppm or less.
[実施例1]
実施例1では、導電性粒子がバインダー樹脂層に規則配列された異方性導電フィルムを用いた。実施例1で用いた異方性導電フィルムは、延伸可能なシート上に粘着剤を塗布し、その上に導電性粒子を格子状かつ均等に単層配列した後、当該シートを所望の延伸倍率で延伸させた状態で、バインダー樹脂層をラミネートすることにより製造した。使用した導電性粒子(商品名:AUL704、積水化学工業社製)は粒子径4μmで、接続前における粒子間距離は0.5μm、粒子個数密度は28000個/mm2である。
[Example 1]
In Example 1, an anisotropic conductive film in which conductive particles were regularly arranged in a binder resin layer was used. The anisotropic conductive film used in Example 1 was prepared by applying a pressure-sensitive adhesive on a stretchable sheet, and arranging conductive particles on the sheet in a lattice-like and uniform monolayer. In a state where the film was stretched in the above, a binder resin layer was laminated. The used conductive particles (trade name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) have a particle diameter of 4 μm, a distance between particles before connection is 0.5 μm, and a particle number density is 28,000 particles / mm 2 .
[実施例2]
実施例2では、接続前における粒子間距離が1μm、粒子個数密度が16000個/mm2の異方性導電フィルムを用いた他は、実施例1と同じ条件とした。
[Example 2]
In Example 2, the same conditions as in Example 1 were used, except that the distance between particles before connection was 1 μm, and the number density of particles was 16,000 particles / mm 2 .
[実施例3]
実施例3では、接続前における粒子間距離が1.5μm、粒子個数密度が10500個/mm2の異方性導電フィルムを用いた他は、実施例1と同じ条件とした。
[Example 3]
In Example 3, the same conditions as in Example 1 were used, except that the distance between particles before connection was 1.5 μm, and the number density of particles was 10500 particles / mm 2 .
[実施例4]
実施例4では、接続前における粒子間距離が3μm、粒子個数密度が5200個/mm2の異方性導電フィルムを用いた他は、実施例1と同じ条件とした。
[Example 4]
In Example 4, the same conditions as in Example 1 were used, except that the distance between particles before connection was 3 μm, and the particle number density was 5200 particles / mm 2 .
[実施例5]
実施例5では、接続前における粒子間距離が0.5μm、粒子個数密度が50000個/mm2の異方性導電フィルムを用いた他は、実施例1と同じ条件とした。
[Example 5]
In Example 5, the same conditions as in Example 1 were used, except that the distance between particles before connection was 0.5 μm and the particle number density was 50,000 / mm 2 .
[比較例1]
比較例1では、バインダー樹脂組成物に導電性粒子を加えて調整し、剥離フィルム上に塗布、焼成することにより、バインダー樹脂層に導電性粒子がランダムに分散されている異方性導電フィルムを用いた。使用した導電性粒子(商品名:AUL704、積水化学工業社製)は粒子径4μmで、粒子個数密度は100000個/mm2である。
[Comparative Example 1]
In Comparative Example 1, an anisotropic conductive film in which conductive particles were randomly dispersed in a binder resin layer was prepared by adding and adjusting conductive particles to a binder resin composition, applying the particles on a release film, and baking. Using. The conductive particles (trade name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) used had a particle diameter of 4 μm and a particle number density of 100,000 particles / mm 2 .
[比較例2]
比較例2では、粒子個数密度は16000個/mm2である他は、比較例1と同じ条件とした。
[Comparative Example 2]
In Comparative Example 2, the same conditions as in Comparative Example 1 were used except that the particle number density was 16000 particles / mm 2 .
表1に示すように、実施例1〜5に係る接続体サンプルでは、1対の評価用ICのICバンプ及び評価用ガラス基板の基板電極の間に挟持された導電性粒子の数が平均8.1以上であり、初期導通抵抗が0.4Ω以下と良好であった。1対のICバンプ及び基板電極の間に挟持された導電性粒子の粒子間距離は、平均1.2μm以上で、最小でも0.2μm以上であった。 As shown in Table 1, in the connection body samples according to Examples 1 to 5, the average number of conductive particles sandwiched between the pair of IC bumps of the evaluation IC and the substrate electrode of the evaluation glass substrate was eight. 0.1 or more, and the initial conduction resistance was as good as 0.4 Ω or less. The distance between the conductive particles sandwiched between the pair of IC bumps and the substrate electrode was 1.2 μm or more on average and 0.2 μm or more at minimum.
また、実施例1〜5に係る接続体サンプルでは、隣接するICバンプ間に亘るバンプ間スペースにおける導電性粒子の数が平均で14.3〜194.2と分かれたが、導電性粒子の粒子間距離は、平均で1.4μm以上、最小でも0.3μmとなり、ICバンプ間のショート発生率は50ppmよりも低く、絶縁性も良好であった。 In the connection body samples according to Examples 1 to 5, the number of conductive particles in the inter-bump space between adjacent IC bumps was 14.1 to 194.2 on average. The distance between them was 1.4 μm or more on average, and 0.3 μm at minimum. The short-circuit occurrence rate between IC bumps was lower than 50 ppm, and the insulation was good.
一方、比較例1では、個数密度が100000個/mm2で充填された導電性粒子がバインダー樹脂層にランダムに分散されているため、基板電極とICバンプとの間に挟持された導電性粒子数は平均48個、粒子間距離は、平均で0.5μm、最小距離は0μmであり、初期導通抵抗は0.2Ωと問題は無かった。一方、バンプ間スペースにおいては、導電性粒子の数が平均80個、粒子間距離は平均で0.7μm、最小距離は0μm、すなわち導電性粒子同士の接触がみられ、バンプ間ショートの発生率が1000ppm以上となった。 On the other hand, in Comparative Example 1, since the conductive particles filled at a number density of 100,000 particles / mm 2 were randomly dispersed in the binder resin layer, the conductive particles sandwiched between the substrate electrode and the IC bump were used. The number was 48 on average, the distance between particles was 0.5 μm on average, and the minimum distance was 0 μm. On the other hand, in the space between bumps, the average number of conductive particles is 80, the distance between particles is 0.7 μm on average, and the minimum distance is 0 μm. Became 1000 ppm or more.
また、比較例2では、個数密度が16000個/mm2で充填された導電性粒子がランダムに分散されているため、バンプ間スペースにおいては、導電性粒子の数が平均12.8個、粒子間距離は平均で2.6μm、最小距離は0μm、すなわち導電性粒子同士の接触がみられたが、バンプ間ショートの発生率は50ppm以下となった。一方、基板電極とICバンプとの間に挟持された導電性粒子数は平均7.7個、粒子間距離は、平均で2.1μm、最小距離は0μmであり、導通抵抗が5Ωと高くなった。 In Comparative Example 2, since the conductive particles filled at a number density of 16000 particles / mm 2 were randomly dispersed, in the space between bumps, the average number of conductive particles was 12.8, The average distance was 2.6 μm and the minimum distance was 0 μm, that is, contact between the conductive particles was observed, but the occurrence rate of short-circuit between bumps was 50 ppm or less. On the other hand, the average number of conductive particles sandwiched between the substrate electrode and the IC bump is 7.7, the distance between the particles is 2.1 μm on average, the minimum distance is 0 μm, and the conduction resistance is as high as 5Ω. Was.
なお、実施例4では、導電性粒子の個数密度が5000個/mm2であるが、導通抵抗が0.5Ωより大きい場合が不良であるところ、0.4Ωであり、実用上問題なかった。また実施例5では、導電性粒子の個数密度が50000個/mm2であるが、バンプ間のショート数が50ppmより大きい場合が不良であるところ、50ppm以下であり、実用上問題なかった。すなわち、異方性導電フィルムの接着前における導電性粒子の個数密度は、5000〜60000個/mm2とすることが好ましいことが分かる。 In Example 4, the number density of the conductive particles was 5000 particles / mm 2 , but when the conduction resistance was larger than 0.5Ω, it was 0.4 Ω, which was not a problem in practical use. In Example 5, the number density of the conductive particles was 50,000 / mm 2 , but when the number of shorts between the bumps was greater than 50 ppm, it was poor. That is, it is found that the number density of the conductive particles before bonding the anisotropic conductive film is preferably 5,000 to 60,000 / mm 2 .
なお、圧痕からバンプに捕捉された導電性粒子の個数をカウントする場合、上述のように基板側から観察するのが一般的である。このとき、バンプ間スペースの導電性粒子は、バンプに捕捉された導電性粒子と同一平面上に存在しているものは少ない。これは、流動による影響と推測される。 In addition, when counting the number of conductive particles captured by the bump from the indentation, it is general to observe from the substrate side as described above. At this time, the conductive particles in the space between the bumps are rarely present on the same plane as the conductive particles captured by the bumps. This is presumed to be the effect of the flow.
1 異方性導電フィルム、2 剥離フィルム、3 バインダー樹脂層、4 導電性粒子、6 巻取リール、10 液晶表示パネル、11,12 透明基板、12a 縁部、13 シール、14 液晶、15 パネル表示部、16,17 透明電極、17a 端子部、18 液晶駆動用IC、18a 実装面、19 電極端子、20 COG実装部、21 基板側アライメントマーク、22 IC側アライメントマーク、23 端子間スペース、33 熱圧着ヘッド
Claims (10)
上記異方性導電接着剤は、バインダー樹脂に導電性粒子が配列され、
上記電子部品に形成された接続電極間のスペースにおける導電性粒子同士の粒子間距離は、上記回路基板に形成された基板電極と上記接続電極との間に捕捉された上記導電性粒子同士の粒子間距離よりも長く、
上記基板電極及び上記接続電極の配列方向において、上記導電性粒子が、上記配列方向にわたって疎、上記配列方向と直交する方向に亘って密に配列されている接続体。 In a connection body in which electronic components are connected via an anisotropic conductive adhesive on a circuit board,
The anisotropic conductive adhesive, conductive particles are arranged in the binder resin,
The distance between the conductive particles in the space between the connection electrodes formed on the electronic component is the distance between the conductive particles captured between the substrate electrode formed on the circuit board and the connection electrode. Longer than the distance,
A connection body in which the conductive particles are sparse in the arrangement direction and densely arranged in a direction orthogonal to the arrangement direction in the arrangement direction of the substrate electrode and the connection electrode.
上記異方性導電接着剤は、バインダー樹脂に導電性粒子が配列され、
上記電子部品に形成された接続電極間のスペースにおける導電性粒子同士の粒子間距離は、上記回路基板に形成された基板電極と上記接続電極との間に捕捉された上記導電性粒子同士の粒子間距離よりも長く、
上記基板電極及び上記接続電極の配列方向において、上記導電性粒子が、上記配列方向にわたって密、上記配列方向と直交する方向に亘って疎に配列されている接続体。 In a connection body where electronic components are connected via an anisotropic conductive adhesive on a circuit board,
The anisotropic conductive adhesive, conductive particles are arranged in the binder resin,
The distance between the conductive particles in the space between the connection electrodes formed on the electronic component is the distance between the conductive particles captured between the substrate electrode formed on the circuit board and the connection electrode. Longer than the distance,
A connection body in which the conductive particles are densely arranged in the arrangement direction and sparsely arranged in a direction orthogonal to the arrangement direction in the arrangement direction of the substrate electrodes and the connection electrodes.
上記導電性粒子は、フィルム幅方向への配列方向が該フィルム幅方向に対して傾斜するとともに、フィルム長手方向への配列方向が該フィルム長手方向に対して傾斜している請求項1〜4のいずれか1項に記載の接続体。 The anisotropic conductive adhesive is an anisotropic conductive film in which the conductive particles are regularly arranged,
5. The conductive particles according to claim 1, wherein the arrangement direction in the film width direction is inclined with respect to the film width direction, and the arrangement direction in the film longitudinal direction is inclined with respect to the film longitudinal direction. 6. The connector according to any one of claims 1 to 7.
上記電子部品を上記回路基板に対して押圧するとともに、上記接着剤を硬化させることにより、上記電子部品を上記回路基板上に接続する接続体の製造方法において、
上記接着剤は、バインダー樹脂に導電性粒子が配列され、
上記接続電極間のスペースにおける導電性粒子同士の粒子間距離は、上記回路基板に形成された基板電極と上記電子部品に形成された接続電極との間に捕捉された上記導電性粒子同士の粒子間距離よりも長く、
上記基板電極及び上記接続電極の配列方向において、上記導電性粒子が、上記配列方向にわたって疎、上記配列方向と直交する方向に亘って密に配列される接続体の製造方法。 On the circuit board, electronic components are mounted via an adhesive containing conductive particles,
While pressing the electronic component against the circuit board, by curing the adhesive, in a method of manufacturing a connector for connecting the electronic component on the circuit board,
The adhesive has conductive particles arranged in a binder resin,
The distance between the conductive particles in the space between the connection electrodes is the particle of the conductive particles captured between the substrate electrode formed on the circuit board and the connection electrode formed on the electronic component. Longer than the distance,
A method for manufacturing a connector in which the conductive particles are sparsely arranged in the arrangement direction and densely arranged in a direction orthogonal to the arrangement direction in the arrangement direction of the substrate electrode and the connection electrode.
上記電子部品を上記回路基板に対して押圧するとともに、上記接着剤を硬化させることにより、上記電子部品を上記回路基板上に接続する接続体の製造方法において、
上記接着剤は、バインダー樹脂に導電性粒子が配列され、
上記接続電極間のスペースにおける導電性粒子同士の粒子間距離は、上記回路基板に形成された基板電極と上記電子部品に形成された接続電極との間に捕捉された上記導電性粒子同士の粒子間距離よりも長く、
上記基板電極及び上記接続電極の配列方向において、上記導電性粒子が、上記配列方向にわたって密、上記配列方向と直交する方向に亘って疎に配列される接続体の製造方法。 On the circuit board, electronic components are mounted via an adhesive containing conductive particles,
While pressing the electronic component against the circuit board, by curing the adhesive, in a method of manufacturing a connector for connecting the electronic component on the circuit board,
The adhesive has conductive particles arranged in a binder resin,
The distance between the conductive particles in the space between the connection electrodes is the particle of the conductive particles captured between the substrate electrode formed on the circuit board and the connection electrode formed on the electronic component. Longer than the distance,
A method of manufacturing a connector in which the conductive particles are densely arranged in the arrangement direction and sparsely arranged in a direction orthogonal to the arrangement direction in the arrangement direction of the substrate electrode and the connection electrode.
上記導電性粒子は、フィルム幅方向への配列方向が該フィルム幅方向に対して傾斜するとともに、フィルム長手方向への配列方向が該フィルム長手方向に対して傾斜している請求項6〜9のいずれか1項に記載の接続体の製造方法。
The adhesive is an anisotropic conductive film in which the conductive particles are regularly arranged,
10. The conductive particles according to claim 6, wherein the arrangement direction in the film width direction is inclined with respect to the film width direction, and the arrangement direction in the film longitudinal direction is inclined with respect to the film longitudinal direction. A method for manufacturing the connector according to any one of the preceding claims.
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