US3149897A
(en)
|
1961-08-29 |
1964-09-22 |
Hans G Martineck |
Printed cable connector
|
US3413613A
(en)
|
1966-06-17 |
1968-11-26 |
Gen Electric |
Reconfigurable data processing system
|
US3482201A
(en)
|
1967-08-29 |
1969-12-02 |
Thomas & Betts Corp |
Controlled impedance connector
|
US4240021A
(en)
|
1977-05-20 |
1980-12-16 |
Citizen Watch Co., Ltd. |
Solar cell battery charging control system
|
US4298237A
(en)
|
1979-12-20 |
1981-11-03 |
Bell Telephone Laboratories, Incorporated |
Printed wiring board interconnection apparatus
|
US4400049A
(en)
|
1981-08-12 |
1983-08-23 |
Ncr Corporation |
Connector for interconnecting circuit boards
|
US4419626A
(en)
*
|
1981-08-25 |
1983-12-06 |
Daymarc Corporation |
Broad band contactor assembly for testing integrated circuit devices
|
JPS5863927A
(en)
|
1981-10-13 |
1983-04-16 |
Canon Inc |
Flash photography capable of test emission of light
|
US4517512A
(en)
|
1982-05-24 |
1985-05-14 |
Micro Component Technology, Inc. |
Integrated circuit test apparatus test head
|
US4591217A
(en)
|
1983-08-29 |
1986-05-27 |
Gte Communication Systems Corporation |
Low insertion force connection arrangement
|
JPS60242025A
(en)
*
|
1984-05-09 |
1985-12-02 |
Mitsubishi Heavy Ind Ltd |
Control of injection molding
|
US4608679A
(en)
|
1984-07-11 |
1986-08-26 |
Filenet Corporation |
Optical storage and retrieval device
|
JPH06105417B2
(en)
|
1984-09-06 |
1994-12-21 |
日本電気株式会社 |
Fault detection method for multiplexed power supply
|
US4582386A
(en)
|
1984-11-01 |
1986-04-15 |
Elfab Corp. |
Connector with enlarged power contact
|
SU1247600A1
(en)
|
1985-01-14 |
1986-07-30 |
Всесоюзный научно-исследовательский и конструкторско-технологический институт компрессорного машиностроения |
Device for testing seals
|
US4719411A
(en)
|
1985-05-13 |
1988-01-12 |
California Institute Of Technology |
Addressable test matrix for measuring analog transfer characteristics of test elements used for integrated process control and device evaluation
|
US4814573A
(en)
|
1986-04-07 |
1989-03-21 |
Ex-Cell-O Corporation |
Electrical discharge machining apparatus with exchangeable electrode refeed cartridge
|
US5247521A
(en)
|
1986-04-23 |
1993-09-21 |
Hitachi, Ltd. |
Data processor
|
US4816754A
(en)
|
1986-04-29 |
1989-03-28 |
International Business Machines Corporation |
Contactor and probe assembly for electrical test apparatus
|
JP2578084B2
(en)
*
|
1986-11-25 |
1997-02-05 |
東京エレクトロン株式会社 |
Wafer prober
|
US4899208A
(en)
|
1987-12-17 |
1990-02-06 |
International Business Machines Corporation |
Power distribution for full wafer package
|
FR2631165B1
(en)
|
1988-05-05 |
1992-02-21 |
Moulene Daniel |
TEMPERATURE CONDITIONING MEDIUM FOR SMALL OBJECTS SUCH AS SEMICONDUCTOR COMPONENTS AND THERMAL REGULATION METHOD USING THE SAME
|
JPH0238808A
(en)
|
1988-07-27 |
1990-02-08 |
Tokyo Seimitsu Co Ltd |
Photosensor
|
DE3914669C2
(en)
|
1989-05-03 |
1999-07-15 |
Max Liebich |
Device and method for the self-production of cigarettes by the consumer
|
US4995814A
(en)
|
1989-12-15 |
1991-02-26 |
Amp Incorporated |
Connector for mating blade-shaped members
|
US4981449A
(en)
|
1990-04-27 |
1991-01-01 |
Amp Incorporated |
Connector for mating multi-layer blade-shaped members
|
US5086269A
(en)
|
1991-03-08 |
1992-02-04 |
Hewlett-Packard Company |
Burn-in process and apparatus
|
US5108302A
(en)
|
1991-06-17 |
1992-04-28 |
Pfaff Wayne |
Test socket
|
US5220820A
(en)
*
|
1991-10-21 |
1993-06-22 |
Teledyne Industries Inc. |
Apparatus and method for cushioning movement of a member in a press
|
JPH0677296A
(en)
*
|
1992-05-29 |
1994-03-18 |
Eejingu Tesuta Kaihatsu Kyodo Kumiai |
Probing electrode for integrated circuit element wafer
|
JPH06186283A
(en)
|
1992-11-30 |
1994-07-08 |
Ando Electric Co Ltd |
Cooling controller for test head
|
US5461326A
(en)
|
1993-02-25 |
1995-10-24 |
Hughes Aircraft Company |
Self leveling and self tensioning membrane test probe
|
JPH0792479B2
(en)
|
1993-03-18 |
1995-10-09 |
東京エレクトロン株式会社 |
Parallelism adjustment method for probe device
|
JP3308346B2
(en)
|
1993-06-08 |
2002-07-29 |
日置電機株式会社 |
Air probe pin board for board inspection equipment
|
JPH0763788A
(en)
|
1993-08-21 |
1995-03-10 |
Hewlett Packard Co <Hp> |
Probe, electrical part / circuit inspecting device and electrical part / method of circuit inspection
|
US5467024A
(en)
|
1993-11-01 |
1995-11-14 |
Motorola, Inc. |
Integrated circuit test with programmable source for both AC and DC modes of operation
|
KR0140034B1
(en)
|
1993-12-16 |
1998-07-15 |
모리시다 요이치 |
Semiconductor wafer case, connection method and apparatus, and inspection method for semiconductor integrated circuit, probe card, and its manufacturing method
|
JP2544084B2
(en)
|
1993-12-28 |
1996-10-16 |
山一電機株式会社 |
Connector for electrical parts
|
JP2925964B2
(en)
|
1994-04-21 |
1999-07-28 |
松下電器産業株式会社 |
Semiconductor wafer container and method of inspecting semiconductor integrated circuit
|
US5515126A
(en)
|
1994-09-28 |
1996-05-07 |
Eastman Kodak Company |
Convertible flash camera and method
|
US5550466A
(en)
|
1994-09-30 |
1996-08-27 |
Hewlett-Packard Company |
Hinged conduit for routing cables in an electronic circuit tester
|
US6421754B1
(en)
|
1994-12-22 |
2002-07-16 |
Texas Instruments Incorporated |
System management mode circuits, systems and methods
|
US5773986A
(en)
|
1995-04-03 |
1998-06-30 |
Motorola, Inc |
Semiconductor wafer contact system and method for contacting a semiconductor wafer
|
JPH08340030A
(en)
|
1995-04-13 |
1996-12-24 |
Tokyo Electron Ltd |
Burn-in equipment and wafer tray for burn-in
|
US5666288A
(en)
|
1995-04-21 |
1997-09-09 |
Motorola, Inc. |
Method and apparatus for designing an integrated circuit
|
JP3106102B2
(en)
|
1995-05-19 |
2000-11-06 |
松下電器産業株式会社 |
Inspection method for semiconductor device
|
US5600257A
(en)
|
1995-08-09 |
1997-02-04 |
International Business Machines Corporation |
Semiconductor wafer test and burn-in
|
DE19581894C2
(en)
|
1995-11-06 |
1999-12-23 |
Advantest Corp |
Device for changing the orientation of ICs
|
US5851143A
(en)
|
1996-05-10 |
1998-12-22 |
Thermal Industries |
Disk drive test chamber
|
US5808896A
(en)
|
1996-06-10 |
1998-09-15 |
Micron Technology, Inc. |
Method and system for creating a netlist allowing current measurement through a sub-circuit
|
JPH10116867A
(en)
|
1996-10-11 |
1998-05-06 |
Orion Mach Co Ltd |
Method for testing semiconductor wafer and temperature controller for testing equipment
|
US5894225A
(en)
|
1996-10-31 |
1999-04-13 |
Coffin; Harry S. |
Test fixture
|
US5886535A
(en)
|
1996-11-08 |
1999-03-23 |
W. L. Gore & Associates, Inc. |
Wafer level burn-in base unit substrate and assembly
|
US7468075B2
(en)
|
2001-05-25 |
2008-12-23 |
Conformis, Inc. |
Methods and compositions for articular repair
|
US5949246A
(en)
|
1997-01-28 |
1999-09-07 |
International Business Machines |
Test head for applying signals in a burn-in test of an integrated circuit
|
EP0860704A3
(en)
|
1997-02-24 |
2000-01-19 |
Tokyo Electron Limited |
Method and apparatus for inspecting semiconductor integrated circuits, and contactor incorporated in the apparatus
|
JPH10256325A
(en)
|
1997-03-07 |
1998-09-25 |
Orion Mach Co Ltd |
Temperature controlling plate for semiconductor wafer tester
|
US5821440A
(en)
|
1997-04-30 |
1998-10-13 |
Credence Systems Corporation |
Cable tray assembly for testing device
|
US6023173A
(en)
|
1997-04-30 |
2000-02-08 |
Credence Systems Corporation |
Manipulator with expanded range of motion
|
JPH1123615A
(en)
*
|
1997-05-09 |
1999-01-29 |
Hitachi Ltd |
Connector and inspection system
|
JP4246812B2
(en)
|
1997-06-12 |
2009-04-02 |
パナソニック株式会社 |
Semiconductor circuit and control method thereof
|
US6040700A
(en)
|
1997-09-15 |
2000-03-21 |
Credence Systems Corporation |
Semiconductor tester system including test head supported by wafer prober frame
|
MY128129A
(en)
|
1997-09-16 |
2007-01-31 |
Tan Yin Leong |
Electrical contactor for testing integrated circuit devices
|
CN1274425A
(en)
|
1997-10-07 |
2000-11-22 |
可靠公司 |
Burn-in board with adaptable heat sink device
|
JP3364134B2
(en)
*
|
1997-10-20 |
2003-01-08 |
松下電器産業株式会社 |
Wafer cassette
|
JPH11121569A
(en)
|
1997-10-21 |
1999-04-30 |
Matsushita Electric Ind Co Ltd |
Burn-in device
|
US5928036A
(en)
|
1997-10-30 |
1999-07-27 |
The Whitaker Corporation |
Dual row memory card connector
|
JPH11145216A
(en)
|
1997-11-12 |
1999-05-28 |
Matsushita Electric Ind Co Ltd |
Wafer burn-in device, board for testing, and pogo pin
|
US5973285A
(en)
*
|
1997-11-26 |
1999-10-26 |
Computer Service Technology, Inc. |
Connector alignment assembly for an electronic memory module tester
|
JPH11163066A
(en)
|
1997-11-29 |
1999-06-18 |
Tokyo Electron Ltd |
Wafer tester
|
US6091060A
(en)
|
1997-12-31 |
2000-07-18 |
Temptronic Corporation |
Power and control system for a workpiece chuck
|
US6309915B1
(en)
|
1998-02-05 |
2001-10-30 |
Tessera, Inc. |
Semiconductor chip package with expander ring and method of making same
|
US6057696A
(en)
|
1998-03-24 |
2000-05-02 |
Cypress Semiconductor Corp. |
Apparatus, method and kit for aligning an integrated circuit to a test socket
|
JP3430015B2
(en)
|
1998-05-20 |
2003-07-28 |
東京エレクトロン株式会社 |
Reliability test system
|
TW432221B
(en)
|
1998-05-29 |
2001-05-01 |
Advantest Corp |
Tray for electronic device, the transporting apparatus of tray for electronic device and testing apparatus for electronic device
|
US6625557B1
(en)
|
1998-07-10 |
2003-09-23 |
Ltx Corporation |
Mixed signal device under test board interface
|
US6644982B1
(en)
|
1998-12-04 |
2003-11-11 |
Formfactor, Inc. |
Method and apparatus for the transport and tracking of an electronic component
|
WO2000036410A1
(en)
|
1998-12-11 |
2000-06-22 |
Symyx Technologies, Inc. |
Sensor array-based system and method for rapid materials characterization
|
CZ20012007A3
(en)
|
1998-12-14 |
2002-03-13 |
Deutsches Krebsforschungszentrum Stiftung des öffentlichen Rechts |
Processes and apparatus for applying substances to a support, in particular monomers for combinatory synthesis of molecular libraries
|
US6137303A
(en)
|
1998-12-14 |
2000-10-24 |
Sony Corporation |
Integrated testing method and apparatus for semiconductor test operations processing
|
US6957327B1
(en)
|
1998-12-31 |
2005-10-18 |
Stmicroelectronics, Inc. |
Block-based branch target buffer
|
US6888343B1
(en)
|
1999-01-13 |
2005-05-03 |
Intest Ip Corporation |
Test head manipulator
|
US6304733B1
(en)
|
1999-05-19 |
2001-10-16 |
Minolta Co., Ltd. |
Image forming apparatus capable of outputting a present time
|
US7382142B2
(en)
|
2000-05-23 |
2008-06-03 |
Nanonexus, Inc. |
High density interconnect system having rapid fabrication cycle
|
AU7329200A
(en)
|
1999-07-14 |
2001-01-30 |
Aehr Test Systems Inc. |
Wafer level burn-in and electrical test system and method
|
AU6747300A
(en)
*
|
1999-07-14 |
2001-01-30 |
Aehr Test Systems Inc. |
Wafer-level burn-in and test cartridge and methods
|
US6340895B1
(en)
|
1999-07-14 |
2002-01-22 |
Aehr Test Systems, Inc. |
Wafer-level burn-in and test cartridge
|
US6562636B1
(en)
|
1999-07-14 |
2003-05-13 |
Aehr Test Systems |
Wafer level burn-in and electrical test system and method
|
US6318243B1
(en)
|
1999-08-31 |
2001-11-20 |
D. Kent Jones |
Two-piece piston assembly
|
US6255834B1
(en)
|
1999-10-21 |
2001-07-03 |
Dell Usa, L.P. |
Test fixture having a floating self-centering connector
|
US6358061B1
(en)
|
1999-11-09 |
2002-03-19 |
Molex Incorporated |
High-speed connector with shorting capability
|
JP2001166006A
(en)
|
1999-12-09 |
2001-06-22 |
Nec Corp |
Fixture and method for connecting it to mounting substrate
|
US7324019B2
(en)
|
2000-01-03 |
2008-01-29 |
Levenson David J |
Adjustable ergonomic keyboard for use with stationary palm and elements thereof
|
JP2001203244A
(en)
|
2000-01-19 |
2001-07-27 |
Matsushita Electric Ind Co Ltd |
Inspection method and device of semiconductor integrated circuit, and aligning device
|
JP2001242014A
(en)
|
2000-02-29 |
2001-09-07 |
Tokyo Electron Ltd |
Method for measuring temperature of substrate and method for processing
|
US6509751B1
(en)
|
2000-03-17 |
2003-01-21 |
Formfactor, Inc. |
Planarizer for a semiconductor contactor
|
US7262611B2
(en)
*
|
2000-03-17 |
2007-08-28 |
Formfactor, Inc. |
Apparatuses and methods for planarizing a semiconductor contactor
|
JP2001313388A
(en)
|
2000-05-01 |
2001-11-09 |
Seiko Epson Corp |
Semiconductor device and method of manufacturing the same
|
DE10026121A1
(en)
|
2000-05-26 |
2001-11-29 |
Alstom Power Nv |
Device for damping acoustic vibrations in a combustion chamber
|
EP1158282B1
(en)
|
2000-05-26 |
2008-07-09 |
Terraillon Holdings Limited |
Weighing scale
|
EP1356499A2
(en)
|
2000-07-10 |
2003-10-29 |
Temptronic Corporation |
Wafer chuck with interleaved heating and cooling elements
|
US20020005040A1
(en)
|
2000-07-13 |
2002-01-17 |
Moody Eugene I. |
Method of and system for heat recovery for an internal combustion engine
|
US6626290B2
(en)
|
2000-07-18 |
2003-09-30 |
Nexpak Corporation |
Storage container for recorded media
|
JP2002043381A
(en)
|
2000-07-19 |
2002-02-08 |
Tokyo Electron Ltd |
Water temperature controller
|
US6822469B1
(en)
|
2000-07-31 |
2004-11-23 |
Eaglestone Partners I, Llc |
Method for testing multiple semiconductor wafers
|
DE10042224C2
(en)
|
2000-08-28 |
2003-09-25 |
Infineon Technologies Ag |
Module test socket for test adapters
|
JP2002151558A
(en)
*
|
2000-08-31 |
2002-05-24 |
Seiko Epson Corp |
Semiconductor inspection apparatus and manufacturing method therefor as well as inspection method for semiconductor device
|
JP2002090426A
(en)
|
2000-09-14 |
2002-03-27 |
Advantest Corp |
Semiconductor testing device
|
JP2002111267A
(en)
|
2000-09-26 |
2002-04-12 |
Ando Electric Co Ltd |
Substrate cooler
|
US6828810B2
(en)
|
2000-10-03 |
2004-12-07 |
Renesas Technology Corp. |
Semiconductor device testing apparatus and method for manufacturing the same
|
JP3857871B2
(en)
*
|
2000-11-06 |
2006-12-13 |
オリオン機械株式会社 |
Semiconductor wafer inspection equipment
|
US6640610B2
(en)
|
2001-03-30 |
2003-11-04 |
Analog Devices, Inc. |
Automatic integrated mechanical and electrical angular motion detector test system
|
WO2002102584A1
(en)
|
2001-05-23 |
2002-12-27 |
The Regents Of The University Of California |
Composite material having low electromagnetic reflection and refraction
|
US6628897B2
(en)
|
2001-06-20 |
2003-09-30 |
Sony Corporation |
Camera system
|
JP4119104B2
(en)
|
2001-07-12 |
2008-07-16 |
株式会社アドバンテスト |
Pusher with heater, electronic component handling apparatus, and electronic component temperature control method
|
US20030023706A1
(en)
|
2001-07-14 |
2003-01-30 |
Zimmel Sheri L. |
Apparatus and method for optimizing telecommunications network design using weighted span classification and rerouting rings that fail to pass a cost therehold
|
US6512387B1
(en)
|
2001-07-31 |
2003-01-28 |
Agilent Technologies, Inc. |
Pressure-sensitive system and method of testing electronic device interconnections
|
US6817823B2
(en)
|
2001-09-11 |
2004-11-16 |
Marian Corporation |
Method, device and system for semiconductor wafer transfer
|
US6861859B1
(en)
|
2001-10-22 |
2005-03-01 |
Electroglas, Inc. |
Testing circuits on substrates
|
JP3543089B2
(en)
|
2001-10-31 |
2004-07-14 |
株式会社コガネイ |
Contact unit
|
KR100448913B1
(en)
|
2002-01-07 |
2004-09-16 |
삼성전자주식회사 |
Test system for semiconductor device
|
US6628520B2
(en)
|
2002-02-06 |
2003-09-30 |
Hewlett-Packard Development Company, L.P. |
Method, apparatus, and system for cooling electronic components
|
US7412049B1
(en)
|
2002-05-31 |
2008-08-12 |
At&T Delaware Intellectual Property, Inc. |
System and method for real-time blocking of a telephone call
|
JP3993027B2
(en)
|
2002-06-04 |
2007-10-17 |
富士フイルム株式会社 |
Digital camera and photographing system
|
US7694246B2
(en)
|
2002-06-19 |
2010-04-06 |
Formfactor, Inc. |
Test method for yielding a known good die
|
US6815966B1
(en)
|
2002-06-27 |
2004-11-09 |
Aehr Test Systems |
System for burn-in testing of electronic devices
|
KR20050024395A
(en)
|
2002-06-27 |
2005-03-10 |
에어 테스트 시스템즈 |
A system for burn-in testing of electronic devices
|
US6853209B1
(en)
|
2002-07-16 |
2005-02-08 |
Aehr Test Systems |
Contactor assembly for testing electrical circuits
|
US6867608B2
(en)
*
|
2002-07-16 |
2005-03-15 |
Aehr Test Systems |
Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component
|
KR20050029215A
(en)
|
2002-07-16 |
2005-03-24 |
에어 테스트 시스템즈 |
Assembly for connecting a test device to an object to be tested
|
US8074649B2
(en)
|
2002-07-18 |
2011-12-13 |
Aeon Research And Technology, Inc. |
Endotracheal tube with feature for delivering aerosolized medication
|
JP3657250B2
(en)
|
2002-09-03 |
2005-06-08 |
ホシデン株式会社 |
connector
|
WO2004031732A2
(en)
|
2002-10-03 |
2004-04-15 |
The Board Of Trustees Of The University Of Arkansas |
Nanocrystals in ligand boxes exhibiting enhanced chemical, photochemical, and thermal stability, and methods of making the same
|
JP4659328B2
(en)
|
2002-10-21 |
2011-03-30 |
東京エレクトロン株式会社 |
Probe device for controlling the temperature of an object to be inspected
|
US20040086579A1
(en)
|
2002-11-05 |
2004-05-06 |
Higgins James W. |
Dietary supplement comprising parthenolide
|
JP3820226B2
(en)
|
2003-01-22 |
2006-09-13 |
オリオン機械株式会社 |
Semiconductor wafer inspection equipment
|
JP4791350B2
(en)
|
2003-01-28 |
2011-10-12 |
インテスト コーポレイション |
Wrist joint for test head positioning
|
US7400264B2
(en)
|
2003-02-14 |
2008-07-15 |
Energy Technology Group, Inc. |
Automated meter reading system, communication and control network for automated meter reading, meter data collector, and associated methods
|
US7235964B2
(en)
|
2003-03-31 |
2007-06-26 |
Intest Corporation |
Test head positioning system and method
|
US6998862B2
(en)
|
2003-04-28 |
2006-02-14 |
Micron Technology, Inc. |
Test socket for semiconductor components having serviceable nest
|
US7131040B2
(en)
|
2003-05-12 |
2006-10-31 |
Kingston Technology Corp. |
Manifold-Distributed Air Flow Over Removable Test Boards in a Memory-Module Burn-In System With Heat Chamber Isolated by Backplane
|
JP2004363558A
(en)
|
2003-05-13 |
2004-12-24 |
Toshiba Corp |
Manufacturing method of semiconductor device, and cleaning method of plasma etching device
|
FR2855776B1
(en)
|
2003-06-05 |
2005-07-22 |
Prospection & Inventions |
TELE BORE ACTUATION OF A HAND TOOL
|
EP1649125A1
(en)
|
2003-07-29 |
2006-04-26 |
Hoedtke GmbH & Co. KG |
Sliding door comprising a guide for a door leaf
|
US20070027321A1
(en)
|
2003-09-02 |
2007-02-01 |
Kamenecka Theodore M |
Bipyridyl amines and ethers as modulators of metabotropic glutamate receptor-5
|
US6891132B2
(en)
|
2003-10-09 |
2005-05-10 |
Micro Control Company |
Shutters for burn-in-board connector openings
|
US20050111944A1
(en)
|
2003-11-25 |
2005-05-26 |
Marc Aho |
Compact wafer handling system with single axis robotic arm and prealigner-cassette elevator
|
US6994563B2
(en)
|
2003-12-19 |
2006-02-07 |
Lenovo (Singapore) Pte. Ltd. |
Signal channel configuration providing increased capacitance at a card edge connection
|
US7260303B2
(en)
|
2004-01-02 |
2007-08-21 |
Finisar Corporation |
Systems, devices and methods for thermal testing of an optoelectronic module
|
US6876321B1
(en)
|
2004-02-06 |
2005-04-05 |
The United States Of America As Represented By The Secretary Of The Navy |
Pulse descriptor word collector
|
JP2005265786A
(en)
|
2004-03-22 |
2005-09-29 |
Seiko Epson Corp |
Pressing method, pressing device, ic handler, and ic inspection device
|
US7697260B2
(en)
|
2004-03-31 |
2010-04-13 |
Applied Materials, Inc. |
Detachable electrostatic chuck
|
TWI240110B
(en)
|
2004-07-15 |
2005-09-21 |
Au Optronics Corp |
A liquid crystal display and method thereof
|
JP2006032593A
(en)
|
2004-07-15 |
2006-02-02 |
Renesas Technology Corp |
Probe cassette, semiconductor tester and method for manufacturing semiconductor device
|
US7043189B2
(en)
|
2004-07-20 |
2006-05-09 |
Lexmark International, Inc. |
Methods and devices for moving waste toner within an image forming device
|
EP1622009A1
(en)
|
2004-07-27 |
2006-02-01 |
Texas Instruments Incorporated |
JSM architecture and systems
|
US7108517B2
(en)
|
2004-09-27 |
2006-09-19 |
Wells-Cti, Llc |
Multi-site chip carrier and method
|
JP2006098064A
(en)
*
|
2004-09-28 |
2006-04-13 |
Elpida Memory Inc |
Probe card
|
JPWO2006038257A1
(en)
|
2004-09-30 |
2008-05-15 |
株式会社ルネサステクノロジ |
Manufacturing method of semiconductor device
|
US8306821B2
(en)
|
2004-10-26 |
2012-11-06 |
Qnx Software Systems Limited |
Sub-band periodic signal enhancement system
|
JP3945527B2
(en)
|
2004-11-30 |
2007-07-18 |
住友電気工業株式会社 |
Wafer holder for wafer prober and wafer prober equipped with the same
|
US7053644B1
(en)
|
2004-12-15 |
2006-05-30 |
Aehr Test Systems |
System for testing and burning in of integrated circuits
|
EP1828677B1
(en)
|
2004-12-23 |
2015-10-14 |
Nualight Limited |
Display cabinet illumination
|
JP4145293B2
(en)
|
2004-12-28 |
2008-09-03 |
株式会社ルネサステクノロジ |
Semiconductor inspection apparatus and semiconductor device manufacturing method
|
US7245134B2
(en)
|
2005-01-31 |
2007-07-17 |
Formfactor, Inc. |
Probe card assembly including a programmable device to selectively route signals from channels of a test system controller to probes
|
DE102005005101A1
(en)
|
2005-02-04 |
2006-08-17 |
Infineon Technologies Ag |
Integrated circuit`s semiconductor components testing system, has control unit that switches switching device based on power consumption information to connect or separate integrated circuits with or from supply unit
|
CN101137947A
(en)
|
2005-03-04 |
2008-03-05 |
天普桑尼克公司 |
Apparatus and method for controlling temperature in a chuck system
|
JP2008537322A
(en)
|
2005-03-04 |
2008-09-11 |
テンプトロニック コーポレイション |
Apparatus and method for temperature control in a chuck system
|
TWI372749B
(en)
|
2005-03-10 |
2012-09-21 |
Theravance Inc |
Crystalline forms of a biphenyl compound
|
US7285968B2
(en)
|
2005-04-19 |
2007-10-23 |
Formfactor, Inc. |
Apparatus and method for managing thermally induced motion of a probe card assembly
|
EP2273279A1
(en)
*
|
2005-04-27 |
2011-01-12 |
Aehr Test Systems, Inc. |
Apparatus for testing electronic devices
|
US7492765B2
(en)
|
2005-06-15 |
2009-02-17 |
Cisco Technology Inc. |
Methods and devices for networking blade servers
|
US7620139B2
(en)
|
2005-06-30 |
2009-11-17 |
Global Nuclear Fuel - Americas, Llc |
Method of improving nuclear reactor performance during reactor core operation
|
JP4602181B2
(en)
|
2005-07-19 |
2010-12-22 |
株式会社シスウェーブ |
Socket for semiconductor inspection
|
KR20100017958A
(en)
|
2005-07-21 |
2010-02-16 |
가부시키가이샤 어드밴티스트 |
Pusher
|
JP2007042911A
(en)
|
2005-08-04 |
2007-02-15 |
Sumitomo Electric Ind Ltd |
Wafer holder and wafer prober mounted with the same
|
US7851945B2
(en)
|
2005-08-08 |
2010-12-14 |
Hewlett-Packard Development Company, L.P. |
System and method of providing power
|
JP2007073762A
(en)
*
|
2005-09-07 |
2007-03-22 |
Matsushita Electric Ind Co Ltd |
Method of releasing in burn-in test and alignment device for use in burn-in test
|
WO2007069163A1
(en)
|
2005-12-12 |
2007-06-21 |
Koninklijke Philips Electronics N. V. |
Light system and method for creating a localized light
|
US20070273216A1
(en)
|
2006-05-24 |
2007-11-29 |
Farbarik John M |
Systems and Methods for Reducing Power Losses in a Medical Device
|
US7557592B2
(en)
|
2006-06-06 |
2009-07-07 |
Formfactor, Inc. |
Method of expanding tester drive and measurement capability
|
JP4724060B2
(en)
|
2006-06-30 |
2011-07-13 |
株式会社東芝 |
Magnetic disk unit
|
US7826995B2
(en)
*
|
2006-09-14 |
2010-11-02 |
Aehr Test Systems |
Apparatus for testing electronic devices
|
DE102006048740A1
(en)
|
2006-10-12 |
2008-04-17 |
Henkel Kgaa |
tint foam
|
US7646093B2
(en)
|
2006-12-20 |
2010-01-12 |
Intel Corporation |
Thermal management of dies on a secondary side of a package
|
JP2008166306A
(en)
|
2006-12-26 |
2008-07-17 |
Stk Technology Co Ltd |
Inspection apparatus for semiconductor device
|
TWI490513B
(en)
|
2006-12-29 |
2015-07-01 |
Intest Corp |
Load positioning system for translating load along axis of translation and method of balancing load
|
JP2008185403A
(en)
|
2007-01-29 |
2008-08-14 |
Advantest Corp |
Testing device
|
KR100843273B1
(en)
|
2007-02-05 |
2008-07-03 |
삼성전자주식회사 |
Test socket for testing semiconductor chip and test apparatus including the same, method for testing the semiconductor chip
|
MY152599A
(en)
|
2007-02-14 |
2014-10-31 |
Eles Semiconductor Equipment S P A |
Test of electronic devices at package level using test boards without sockets
|
CN101952733B
(en)
|
2007-04-05 |
2014-02-12 |
雅赫测试***公司 |
Method for testing microelectronic circuit, tester device and portable assembly device
|
US20090001528A1
(en)
|
2007-06-27 |
2009-01-01 |
Henning Braunisch |
Lowering resistance in a coreless package
|
US7862730B2
(en)
|
2007-07-10 |
2011-01-04 |
M-I L.L.C. |
Systems and methods for separating hydrocarbons from water
|
WO2009048618A1
(en)
|
2007-10-11 |
2009-04-16 |
Veraconnex, Llc |
Probe card test apparatus and method
|
US20120022915A1
(en)
|
2007-10-23 |
2012-01-26 |
Pierre Carion |
Method and system for collection and use of wireless application activity information
|
US7800382B2
(en)
*
|
2007-12-19 |
2010-09-21 |
AEHR Test Ststems |
System for testing an integrated circuit of a device and its method of use
|
JP5088167B2
(en)
|
2008-02-22 |
2012-12-05 |
東京エレクトロン株式会社 |
PROBE DEVICE, PROBING METHOD, AND STORAGE MEDIUM
|
EP3484135A1
(en)
|
2008-04-02 |
2019-05-15 |
Twilio Inc. |
System and method for processing telephony sessions
|
JP5173660B2
(en)
|
2008-08-04 |
2013-04-03 |
株式会社フジクラ |
Manufacturing method of optical fiber preform
|
JP5538697B2
(en)
|
2008-09-10 |
2014-07-02 |
ルネサスエレクトロニクス株式会社 |
Semiconductor device test method
|
DE112008003714T5
(en)
|
2008-10-29 |
2010-11-25 |
Advantest Corp. |
Temperature control for electronic components
|
JP2010151794A
(en)
|
2008-11-27 |
2010-07-08 |
Panasonic Corp |
Electronic component tester
|
US8030957B2
(en)
*
|
2009-03-25 |
2011-10-04 |
Aehr Test Systems |
System for testing an integrated circuit of a device and its method of use
|
JP5391776B2
(en)
|
2009-03-27 |
2014-01-15 |
富士通株式会社 |
heatsink
|
US7969175B2
(en)
*
|
2009-05-07 |
2011-06-28 |
Aehr Test Systems |
Separate test electronics and blower modules in an apparatus for testing an integrated circuit
|
US8267180B2
(en)
|
2009-07-02 |
2012-09-18 |
Baker Hughes Incorporated |
Remotely controllable variable flow control configuration and method
|
JP2011035724A
(en)
|
2009-08-03 |
2011-02-17 |
Canon Inc |
Information processing apparatus, data processing method, and program
|
WO2011016096A1
(en)
|
2009-08-07 |
2011-02-10 |
株式会社アドバンテスト |
Testing device and testing method
|
US8465327B2
(en)
|
2009-11-02 |
2013-06-18 |
Apple Inc. |
High-speed memory connector
|
CA2689868A1
(en)
|
2010-01-08 |
2011-07-08 |
Daniel Baroux |
Hockey sticks and method of manufacture thereof
|
KR101641108B1
(en)
|
2010-04-30 |
2016-07-20 |
삼성전자주식회사 |
Target device providing debugging functionality and test system comprising the same
|
US8279606B2
(en)
|
2010-05-07 |
2012-10-02 |
Dell Products L.P. |
Processor loading system including a heat dissipater
|
US8958270B2
(en)
|
2010-07-07 |
2015-02-17 |
California Institute Of Technology |
Monolithic flexure pre-stressed ultrasonic horns
|
US8057263B1
(en)
|
2010-07-12 |
2011-11-15 |
Tyco Electronics Corporation |
Edge connectors having stamped signal contacts
|
US8454105B2
(en)
|
2010-07-15 |
2013-06-04 |
James M. Smelser |
Automated beam marker
|
DE102010032866A1
(en)
|
2010-07-30 |
2012-02-02 |
Profil Verbindungstechnik Gmbh & Co. Kg |
Self-piercing nut member and assembly part consisting of the nut member and a sheet metal part
|
US8472190B2
(en)
|
2010-09-24 |
2013-06-25 |
Ati Technologies Ulc |
Stacked semiconductor chip device with thermal management
|
US8465312B2
(en)
|
2010-12-07 |
2013-06-18 |
Centipede Systems, Inc. |
Socket cartridge and socket cartridge assembly
|
KR101228207B1
(en)
|
2010-12-08 |
2013-01-30 |
세크론 주식회사 |
Pushing apparatus for testing a semiconductor device and test handler including the same
|
KR20120102451A
(en)
|
2011-03-08 |
2012-09-18 |
삼성전자주식회사 |
Test interface board and test system including the same
|
JP5851878B2
(en)
|
2012-02-21 |
2016-02-03 |
ルネサスエレクトロニクス株式会社 |
Manufacturing method of semiconductor module
|
KR20140000855A
(en)
|
2012-06-26 |
2014-01-06 |
삼성전자주식회사 |
Test interface board and test system
|
US9766285B2
(en)
|
2012-06-29 |
2017-09-19 |
Eles Semiconductor Equipment S.P.A. |
Test board with local thermal conditioning elements
|
ITMI20121157A1
(en)
|
2012-06-29 |
2013-12-30 |
Eles Semiconductor Equipment S P A |
TESTING OF ELECTRONIC DEVICES WITH HEATERS AVAILABLE BETWEEN TEST CARDS AND ELECTRONIC DEVICES TO TEST
|
JP5675722B2
(en)
|
2012-07-23 |
2015-02-25 |
東芝テック株式会社 |
Recognition dictionary processing apparatus and recognition dictionary processing program
|
US20140125371A1
(en)
|
2012-11-05 |
2014-05-08 |
Hermes Testing Solutions Inc. |
Stand alone multi-cell probe card for at-speed functional testing
|
JP5737536B2
(en)
|
2013-11-21 |
2015-06-17 |
株式会社東京精密 |
Prober
|
US10297339B2
(en)
|
2014-02-19 |
2019-05-21 |
Advantest Corporation |
Integrated cooling system for electronics testing apparatus
|
US9594113B2
(en)
|
2014-02-21 |
2017-03-14 |
Sensata Technologies, Inc. |
Package on package thermal forcing device
|
TWM480762U
(en)
|
2014-03-12 |
2014-06-21 |
Chroma Ate Inc |
Stacked package structure testing device with heat dissipation module
|
US9791049B2
(en)
|
2014-07-14 |
2017-10-17 |
Lavelle Industries, Inc. |
Toilet flapper valve with adjustable mounts and assembly
|
KR102433967B1
(en)
|
2014-11-28 |
2022-08-22 |
(주)테크윙 |
Handler for electric device test
|
JP6447553B2
(en)
|
2016-03-18 |
2019-01-09 |
株式会社東京精密 |
Prober
|
WO2017210108A1
(en)
|
2016-06-02 |
2017-12-07 |
Kes Systems, Inc. |
System and methods for semiconductor burn-in test
|
US9911678B2
(en)
|
2016-06-13 |
2018-03-06 |
Qorvo Us, Inc. |
Substrate with integrated heat spreader
|