SG10201903641TA - Method of bonding a first substrate and a second substrate - Google Patents

Method of bonding a first substrate and a second substrate

Info

Publication number
SG10201903641TA
SG10201903641TA SG10201903641TA SG10201903641TA SG10201903641TA SG 10201903641T A SG10201903641T A SG 10201903641TA SG 10201903641T A SG10201903641T A SG 10201903641TA SG 10201903641T A SG10201903641T A SG 10201903641TA SG 10201903641T A SG10201903641T A SG 10201903641TA
Authority
SG
Singapore
Prior art keywords
substrate
bonding
connection
adhesive material
fabricating
Prior art date
Application number
SG10201903641TA
Inventor
Ling Xie
Sunil Wickramanayaka
Original Assignee
Agency Science Tech & Res
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency Science Tech & Res filed Critical Agency Science Tech & Res
Publication of SG10201903641TA publication Critical patent/SG10201903641TA/en

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    • H01L2924/3841—Solder bridging

Abstract

Title of Invention: Method of Bonding a First Substrate and a Second Substrate A method for bonding a first substrate and a second substrate, the first substrate having at least one first connection extending from one side of the first substrate, the method comprising fabricating a first adhesive material around and along a height of the at least one first connection; and bonding the at least one first connection, the first adhesive material, and the second substrate. [FIG. A] 29
SG10201903641TA 2014-10-23 2015-10-23 Method of bonding a first substrate and a second substrate SG10201903641TA (en)

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WO2016064350A1 (en) 2016-04-28
SG11201703125WA (en) 2017-05-30

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