SG10201705697RA - Dicing-tape-integrated film for semiconductor back surface, and method for producing semiconductor device - Google Patents
Dicing-tape-integrated film for semiconductor back surface, and method for producing semiconductor deviceInfo
- Publication number
- SG10201705697RA SG10201705697RA SG10201705697RA SG10201705697RA SG10201705697RA SG 10201705697R A SG10201705697R A SG 10201705697RA SG 10201705697R A SG10201705697R A SG 10201705697RA SG 10201705697R A SG10201705697R A SG 10201705697RA SG 10201705697R A SG10201705697R A SG 10201705697RA
- Authority
- SG
- Singapore
- Prior art keywords
- dicing
- tape
- back surface
- semiconductor device
- integrated film
- Prior art date
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016150061A JP2018019022A (en) | 2016-07-29 | 2016-07-29 | Dicing tape integrated semiconductor rear face film and method of manufacturing semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201705697RA true SG10201705697RA (en) | 2018-02-27 |
Family
ID=61082018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201705697RA SG10201705697RA (en) | 2016-07-29 | 2017-07-11 | Dicing-tape-integrated film for semiconductor back surface, and method for producing semiconductor device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2018019022A (en) |
| KR (1) | KR20180013715A (en) |
| CN (1) | CN107665853A (en) |
| SG (1) | SG10201705697RA (en) |
| TW (1) | TW201816862A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7075326B2 (en) * | 2018-10-05 | 2022-05-25 | 日東電工株式会社 | Dicing die bond film |
| KR102012905B1 (en) * | 2018-10-19 | 2019-08-22 | (주)엠티아이 | Tape for processing wafer |
| KR20200143259A (en) * | 2019-06-13 | 2020-12-23 | 닛토덴코 가부시키가이샤 | Dicing tape and dicing die-bonding film |
| WO2021167091A1 (en) * | 2020-02-21 | 2021-08-26 | 日東電工株式会社 | Adhesive composition layer, layered product, optical layered product, optical device, and method for producing optical layered product |
| WO2023022185A1 (en) | 2021-08-20 | 2023-02-23 | 日東電工株式会社 | Adhesive sheet |
| JP7276555B1 (en) | 2021-11-08 | 2023-05-18 | 大日本印刷株式会社 | Adhesive tape for semiconductor processing |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4717051B2 (en) * | 2007-11-08 | 2011-07-06 | 日東電工株式会社 | Dicing die bond film |
| JP5143196B2 (en) * | 2009-09-28 | 2013-02-13 | 日東電工株式会社 | Film for semiconductor devices |
| JP5513866B2 (en) * | 2009-12-11 | 2014-06-04 | リンテック株式会社 | Adhesive sheet for processing electronic parts |
| JP2011151362A (en) * | 2009-12-24 | 2011-08-04 | Nitto Denko Corp | Dicing tape-integrated film for semiconductor back surface |
| JP5681374B2 (en) * | 2010-04-19 | 2015-03-04 | 日東電工株式会社 | Dicing tape integrated semiconductor backside film |
| JP5439264B2 (en) * | 2010-04-19 | 2014-03-12 | 日東電工株式会社 | Dicing tape integrated semiconductor backside film |
| JP4991921B2 (en) * | 2010-09-06 | 2012-08-08 | 日東電工株式会社 | Film for semiconductor device and semiconductor device |
| JP5944155B2 (en) * | 2011-12-12 | 2016-07-05 | 日東電工株式会社 | LAMINATED SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING LAMINATED SHEET |
| MY172228A (en) * | 2012-08-03 | 2019-11-18 | Lintec Corp | Dicing sheet and method for manufacturing device chips |
| JP5978246B2 (en) * | 2014-05-13 | 2016-08-24 | 日東電工株式会社 | Dicing tape-integrated film for semiconductor back surface and method for manufacturing semiconductor device |
| JP6272729B2 (en) * | 2014-05-16 | 2018-01-31 | 日東電工株式会社 | Dicing tape-integrated film for semiconductor back surface and method for manufacturing semiconductor device |
-
2016
- 2016-07-29 JP JP2016150061A patent/JP2018019022A/en active Pending
-
2017
- 2017-07-11 SG SG10201705697RA patent/SG10201705697RA/en unknown
- 2017-07-13 KR KR1020170088754A patent/KR20180013715A/en unknown
- 2017-07-26 TW TW106125058A patent/TW201816862A/en unknown
- 2017-07-28 CN CN201710632480.7A patent/CN107665853A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018019022A (en) | 2018-02-01 |
| KR20180013715A (en) | 2018-02-07 |
| CN107665853A (en) | 2018-02-06 |
| TW201816862A (en) | 2018-05-01 |
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