SG10201602156SA - Non-linear vertical leaf spring - Google Patents
Non-linear vertical leaf springInfo
- Publication number
- SG10201602156SA SG10201602156SA SG10201602156SA SG10201602156SA SG10201602156SA SG 10201602156S A SG10201602156S A SG 10201602156SA SG 10201602156S A SG10201602156S A SG 10201602156SA SG 10201602156S A SG10201602156S A SG 10201602156SA SG 10201602156S A SG10201602156S A SG 10201602156SA
- Authority
- SG
- Singapore
- Prior art keywords
- leaf spring
- linear vertical
- vertical leaf
- linear
- spring
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161454910P | 2011-03-21 | 2011-03-21 | |
US13/288,925 US9702904B2 (en) | 2011-03-21 | 2011-11-03 | Non-linear vertical leaf spring |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201602156SA true SG10201602156SA (en) | 2016-04-28 |
Family
ID=46876820
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013070057A SG193914A1 (en) | 2011-03-21 | 2012-03-01 | Non-linear vertical leaf spring |
SG10201602156SA SG10201602156SA (en) | 2011-03-21 | 2012-03-01 | Non-linear vertical leaf spring |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013070057A SG193914A1 (en) | 2011-03-21 | 2012-03-01 | Non-linear vertical leaf spring |
Country Status (6)
Country | Link |
---|---|
US (1) | US9702904B2 (en) |
JP (1) | JP5995953B2 (en) |
KR (1) | KR101906626B1 (en) |
SG (2) | SG193914A1 (en) |
TW (1) | TWI592587B (en) |
WO (1) | WO2012128907A2 (en) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE43503E1 (en) | 2006-06-29 | 2012-07-10 | Microprobe, Inc. | Probe skates for electrical testing of convex pad topologies |
US7759949B2 (en) | 2004-05-21 | 2010-07-20 | Microprobe, Inc. | Probes with self-cleaning blunt skates for contacting conductive pads |
US8988091B2 (en) | 2004-05-21 | 2015-03-24 | Microprobe, Inc. | Multiple contact probes |
US9476911B2 (en) | 2004-05-21 | 2016-10-25 | Microprobe, Inc. | Probes with high current carrying capability and laser machining methods |
US8907689B2 (en) | 2006-10-11 | 2014-12-09 | Microprobe, Inc. | Probe retention arrangement |
US7514948B2 (en) | 2007-04-10 | 2009-04-07 | Microprobe, Inc. | Vertical probe array arranged to provide space transformation |
US8230593B2 (en) | 2008-05-29 | 2012-07-31 | Microprobe, Inc. | Probe bonding method having improved control of bonding material |
US10006938B2 (en) * | 2012-01-04 | 2018-06-26 | Formfactor, Inc. | Probes with programmable motion |
CA2877821C (en) * | 2012-06-29 | 2018-01-09 | Hydrovision Asia Pte Ltd | An improved suspended sediment meter |
US20140043054A1 (en) * | 2012-08-09 | 2014-02-13 | Formfactor, Inc. | Vertical probes for multi-pitch full grid contact array |
JP5936510B2 (en) * | 2012-10-05 | 2016-06-22 | 三菱電機株式会社 | Laminated probe |
CN104823330B (en) * | 2012-10-10 | 2018-03-30 | 安费诺有限公司 | Direct-connected orthogonal connection system |
CN108333394B (en) * | 2012-12-04 | 2020-06-09 | 日本电子材料株式会社 | Contact probe |
JP2014182041A (en) * | 2013-03-21 | 2014-09-29 | Totoku Electric Co Ltd | Probe pin and contact probe |
JP6042761B2 (en) * | 2013-03-28 | 2016-12-14 | 東京エレクトロン株式会社 | Probe device |
WO2014182633A1 (en) | 2013-05-06 | 2014-11-13 | Formfactor | A probe card assembly for testing electronic devices |
US10132833B2 (en) | 2013-07-09 | 2018-11-20 | Formfactor, Inc. | Multipath electrical probe and probe assemblies with signal paths through secondary paths between electrically conductive guide plates |
SG11201510255QA (en) * | 2013-07-11 | 2016-01-28 | Johnstech Int Corp | Testing apparatus for wafer level ic testing |
CN106463859B (en) | 2014-01-22 | 2019-05-17 | 安费诺有限公司 | Ultrahigh speed high density electric interconnection system with edge to broadside transition |
WO2015171227A1 (en) * | 2014-05-06 | 2015-11-12 | Mems Drive, Inc. | Low stiffness flexure |
US9621775B2 (en) | 2014-05-06 | 2017-04-11 | Mems Drive, Inc. | Electrical bar latching for low stiffness flexure MEMS actuator |
JP6320285B2 (en) * | 2014-12-16 | 2018-05-09 | 三菱電機株式会社 | Integrated multi-contact, inspection jig and inspection apparatus including the same, and inspection method |
JP6752829B2 (en) * | 2015-03-13 | 2020-09-09 | テクノプローベ エス.ピー.エー. | Test head with vertical probe suitable for high frequency application |
CN107430151B (en) * | 2015-03-31 | 2021-06-15 | 泰克诺探头公司 | Vertical contact probe, particularly for high-frequency applications, and test head comprising same |
WO2016156002A1 (en) * | 2015-03-31 | 2016-10-06 | Technoprobe S.P.A. | Contact probe and corresponding testing head with vertical probes, particularly for high frequency applications |
TWI702402B (en) * | 2015-05-07 | 2020-08-21 | 義大利商探針科技公司 | Testing head having vertical probes, in particular for reduced pitch applications |
CN113708116B (en) | 2015-07-23 | 2023-09-12 | 安费诺有限公司 | Extender module for modular connector |
JP6855185B2 (en) * | 2016-07-27 | 2021-04-07 | 株式会社日本マイクロニクス | Electrical connection device |
DE102017206146A1 (en) * | 2016-12-15 | 2018-06-21 | Continental Automotive Gmbh | High current contact pin, high current receptacle and high current plug assembly with a high current contact pin |
CN108459255B (en) * | 2017-02-16 | 2021-10-22 | 豪威科技股份有限公司 | Test socket for fine-pitch packaging test |
DE102017002150A1 (en) * | 2017-03-06 | 2018-09-06 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Electrical contact element |
JP2018179721A (en) * | 2017-04-12 | 2018-11-15 | 株式会社日本マイクロニクス | Electrical connection device |
JP6872960B2 (en) * | 2017-04-21 | 2021-05-19 | 株式会社日本マイクロニクス | Electrical connection device |
KR101860519B1 (en) * | 2017-05-02 | 2018-05-24 | 주식회사 마이크로이즈 | Electrically conductive probe device and method for manufacturing the same |
DE102017209510A1 (en) * | 2017-06-06 | 2018-12-06 | Feinmetall Gmbh | Contact Element System |
KR20190021101A (en) | 2017-08-22 | 2019-03-05 | 삼성전자주식회사 | Probe card, test apparatus comprising the probe card, testing method for testing and manufacturing semiconductor using the probe card |
EP3499653B1 (en) * | 2017-12-12 | 2021-08-18 | Rasco GmbH | Contactor spring and contactor socket |
US11973301B2 (en) | 2018-09-26 | 2024-04-30 | Microfabrica Inc. | Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making |
US11768227B1 (en) | 2019-02-22 | 2023-09-26 | Microfabrica Inc. | Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers |
US11289830B2 (en) | 2019-05-20 | 2022-03-29 | Amphenol Corporation | High density, high speed electrical connector |
US11867721B1 (en) | 2019-12-31 | 2024-01-09 | Microfabrica Inc. | Probes with multiple springs, methods for making, and methods for using |
US11761982B1 (en) | 2019-12-31 | 2023-09-19 | Microfabrica Inc. | Probes with planar unbiased spring elements for electronic component contact and methods for making such probes |
TWI736361B (en) * | 2020-07-15 | 2021-08-11 | 中華精測科技股份有限公司 | Probe card device and fence-like probe thereof |
US11774467B1 (en) | 2020-09-01 | 2023-10-03 | Microfabrica Inc. | Method of in situ modulation of structural material properties and/or template shape |
TWI745182B (en) * | 2020-11-30 | 2021-11-01 | 中華精測科技股份有限公司 | Probe card device and dual-arm probe |
KR102509528B1 (en) | 2021-02-05 | 2023-03-14 | (주)포인트엔지니어링 | The Electro-conductive Contact Pin |
JPWO2022249954A1 (en) * | 2021-05-28 | 2022-12-01 | ||
JP2023104519A (en) * | 2022-01-18 | 2023-07-28 | 株式会社日本マイクロニクス | probe |
WO2023188369A1 (en) * | 2022-03-31 | 2023-10-05 | 日本電子材料株式会社 | Probe pin and probe card |
TWI825798B (en) * | 2022-06-22 | 2023-12-11 | 吳俊杰 | Elastic probe and circuit test device |
JP2024010473A (en) * | 2022-07-12 | 2024-01-24 | 山一電機株式会社 | Contact pin and inspection socket |
JP2024010472A (en) * | 2022-07-12 | 2024-01-24 | 山一電機株式会社 | Contact pin and inspection socket |
KR20240017651A (en) * | 2022-08-01 | 2024-02-08 | (주)포인트엔지니어링 | The Electro-conductive Contact Pin and Method for Manufacturing the Same |
WO2024062560A1 (en) * | 2022-09-21 | 2024-03-28 | 日本電子材料株式会社 | Probe for probe cards |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4027935A (en) * | 1976-06-21 | 1977-06-07 | International Business Machines Corporation | Contact for an electrical contactor assembly |
US4618821A (en) | 1983-09-19 | 1986-10-21 | Lenz Seymour S | Test probe assembly for microelectronic circuits |
US5917707A (en) * | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
JPH07109780B2 (en) | 1991-02-19 | 1995-11-22 | 山一電機株式会社 | Contacts in sockets for electrical components |
JP2734412B2 (en) | 1995-06-29 | 1998-03-30 | 日本電気株式会社 | Semiconductor device socket |
US7063541B2 (en) | 1997-03-17 | 2006-06-20 | Formfactor, Inc. | Composite microelectronic spring structure and method for making same |
US6672875B1 (en) | 1998-12-02 | 2004-01-06 | Formfactor, Inc. | Spring interconnect structures |
EP1135690B1 (en) * | 1998-12-02 | 2003-06-04 | Formfactor, Inc. | Lithographic contact elements |
US6491968B1 (en) | 1998-12-02 | 2002-12-10 | Formfactor, Inc. | Methods for making spring interconnect structures |
US6888362B2 (en) * | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
US6252415B1 (en) | 1999-09-14 | 2001-06-26 | Advantest Corp. | Pin block structure for mounting contact pins |
US7265565B2 (en) | 2003-02-04 | 2007-09-04 | Microfabrica Inc. | Cantilever microprobes for contacting electronic components and methods for making such probes |
JP2004156993A (en) | 2002-11-06 | 2004-06-03 | Micronics Japan Co Ltd | Probe and electrical connector device using this |
US6945827B2 (en) * | 2002-12-23 | 2005-09-20 | Formfactor, Inc. | Microelectronic contact structure |
US20080211524A1 (en) * | 2003-02-04 | 2008-09-04 | Microfabrica Inc. | Electrochemically Fabricated Microprobes |
US7579856B2 (en) * | 2006-04-21 | 2009-08-25 | Formfactor, Inc. | Probe structures with physically suspended electronic components |
JP2008032400A (en) | 2006-07-26 | 2008-02-14 | Fujifilm Corp | Contact pin for ic socket |
US7786740B2 (en) * | 2006-10-11 | 2010-08-31 | Astria Semiconductor Holdings, Inc. | Probe cards employing probes having retaining portions for potting in a potting region |
US7825675B2 (en) * | 2006-11-01 | 2010-11-02 | Formfactor, Inc. | Method and apparatus for providing active compliance in a probe card assembly |
US7384277B1 (en) | 2006-12-17 | 2008-06-10 | Formfactor, Inc. | Reinforced contact elements |
US7851794B2 (en) | 2006-12-28 | 2010-12-14 | Formfactor, Inc. | Rotating contact element and methods of fabrication |
JP5099487B2 (en) | 2007-08-03 | 2012-12-19 | 軍生 木本 | Multi-beam composite contact |
US20090079455A1 (en) * | 2007-09-26 | 2009-03-26 | Formfactor, Inc. | Reduced scrub contact element |
US8149007B2 (en) * | 2007-10-13 | 2012-04-03 | Formfactor, Inc. | Carbon nanotube spring contact structures with mechanical and electrical components |
DE102008023761B9 (en) | 2008-05-09 | 2012-11-08 | Feinmetall Gmbh | Electrical contact element for contact contacting of electrical specimens and corresponding contacting arrangement |
JPWO2010061857A1 (en) * | 2008-11-25 | 2012-04-26 | 日本発條株式会社 | Contact probe, probe unit and assembling method of probe unit |
-
2011
- 2011-11-03 US US13/288,925 patent/US9702904B2/en active Active
-
2012
- 2012-03-01 SG SG2013070057A patent/SG193914A1/en unknown
- 2012-03-01 KR KR1020137027247A patent/KR101906626B1/en active IP Right Grant
- 2012-03-01 WO PCT/US2012/027216 patent/WO2012128907A2/en active Application Filing
- 2012-03-01 JP JP2014501086A patent/JP5995953B2/en active Active
- 2012-03-01 SG SG10201602156SA patent/SG10201602156SA/en unknown
- 2012-03-21 TW TW101109678A patent/TWI592587B/en active
Also Published As
Publication number | Publication date |
---|---|
US9702904B2 (en) | 2017-07-11 |
WO2012128907A3 (en) | 2012-11-08 |
KR101906626B1 (en) | 2018-10-10 |
JP2014510283A (en) | 2014-04-24 |
JP5995953B2 (en) | 2016-09-21 |
US20120242363A1 (en) | 2012-09-27 |
TW201303182A (en) | 2013-01-16 |
TWI592587B (en) | 2017-07-21 |
SG193914A1 (en) | 2013-11-29 |
WO2012128907A2 (en) | 2012-09-27 |
KR20140019799A (en) | 2014-02-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201602156SA (en) | Non-linear vertical leaf spring | |
EP2740774A4 (en) | Dispersion | |
EP2697943A4 (en) | Transaction gateway | |
PL2525032T3 (en) | Hinge | |
SI2412243T1 (en) | Spring form | |
GB2490343B (en) | Hinge | |
EP2669731A4 (en) | Glasses | |
EP2709853A4 (en) | Binder | |
PL2861888T3 (en) | Damper for hinges | |
EP2529947A4 (en) | Binder | |
EP2816130A4 (en) | Spring steel | |
EP2794307A4 (en) | Front leaf spring | |
PL2476836T3 (en) | Hinge | |
EP2740965A4 (en) | Damper | |
EP2882046A4 (en) | Spring catch structure | |
GB201207837D0 (en) | Leaf seal | |
EP2663458A4 (en) | Leaf spring system | |
EP2766549A4 (en) | Door leaf | |
GB2493325B (en) | Hinge element | |
GB201102376D0 (en) | Doors | |
GB2494304B (en) | Spacer | |
PL2657562T3 (en) | Compression spring | |
GB201109653D0 (en) | Dispersion | |
AU339108S (en) | Spring retainer | |
PL120188U1 (en) | Roof-window hinge |