SG10201503001XA - Method For Simultaneously Cutting A Multiplicity Of Slices Of Particularly Uniform Thickness From A Workpiece - Google Patents

Method For Simultaneously Cutting A Multiplicity Of Slices Of Particularly Uniform Thickness From A Workpiece

Info

Publication number
SG10201503001XA
SG10201503001XA SG10201503001XA SG10201503001XA SG10201503001XA SG 10201503001X A SG10201503001X A SG 10201503001XA SG 10201503001X A SG10201503001X A SG 10201503001XA SG 10201503001X A SG10201503001X A SG 10201503001XA SG 10201503001X A SG10201503001X A SG 10201503001XA
Authority
SG
Singapore
Prior art keywords
slices
multiplicity
workpiece
uniform thickness
particularly uniform
Prior art date
Application number
SG10201503001XA
Inventor
Georg Pietsch
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG10201503001XA publication Critical patent/SG10201503001XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG10201503001XA 2014-04-30 2015-04-16 Method For Simultaneously Cutting A Multiplicity Of Slices Of Particularly Uniform Thickness From A Workpiece SG10201503001XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014208187.4A DE102014208187B4 (en) 2014-04-30 2014-04-30 Process for the simultaneous cutting of a large number of slices with a particularly uniform thickness from a workpiece

Publications (1)

Publication Number Publication Date
SG10201503001XA true SG10201503001XA (en) 2015-11-27

Family

ID=54326027

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201503001XA SG10201503001XA (en) 2014-04-30 2015-04-16 Method For Simultaneously Cutting A Multiplicity Of Slices Of Particularly Uniform Thickness From A Workpiece

Country Status (7)

Country Link
US (1) US9573296B2 (en)
JP (3) JP2015212007A (en)
KR (3) KR101689302B1 (en)
CN (2) CN105034181B (en)
DE (1) DE102014208187B4 (en)
SG (1) SG10201503001XA (en)
TW (1) TWI578392B (en)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013219468B4 (en) * 2013-09-26 2015-04-23 Siltronic Ag A method of simultaneously separating a plurality of slices from a workpiece
TWM481811U (en) * 2014-02-11 2014-07-11 Green Energy Technology Inc Slicing device
US9873159B2 (en) * 2014-12-30 2018-01-23 Corner Star Limited Systems and methods for manufacturing diamond coated wires
JP6304118B2 (en) * 2015-05-01 2018-04-04 信越半導体株式会社 Wire saw equipment
JP6402700B2 (en) * 2015-10-20 2018-10-10 信越半導体株式会社 Work cutting method and wire saw
FR3048903B1 (en) * 2016-03-15 2018-04-13 Saint-Gobain Placo METHOD AND DEVICE FOR CUTTING A PLATE OR A PANEL OF POROUS CONSTRUCTION MATERIAL
CN105904027A (en) * 2016-04-27 2016-08-31 藤县正钻门业有限公司 Jigsaw machine provided with numeric control clamp
CN106444630A (en) * 2016-11-24 2017-02-22 常州协鑫光伏科技有限公司 On-line regulation method and apparatus of mortar
JP3215089U (en) * 2017-01-09 2018-03-01 べカルト ビンジャン スチール コード カンパニー．，リミテッドＢｅｋａｅｒｔ Ｂｉｎｊｉａｎｇ Ｓｔｅｅｌ Ｃｏｒｄ Ｃｏ．，Ｌｔｄ Saw wire spool with elastic and plastic rotation
CN108284529B (en) * 2017-01-09 2024-07-16 江阴贝卡尔特合金材料有限公司 Reel with elastic and plastic rotating saw wire
DE102017202314A1 (en) * 2017-02-14 2018-08-16 Siltronic Ag Wire saw, wire guide roller, and method of simultaneously separating a plurality of disks from a rod
JP6222393B1 (en) * 2017-03-21 2017-11-01 信越半導体株式会社 Ingot cutting method
JP6249319B1 (en) * 2017-03-30 2017-12-20 パナソニックＩｐマネジメント株式会社 Saw wire and cutting device
JP6835213B2 (en) * 2017-05-02 2021-02-24 信越半導体株式会社 Work cutting method and joining member
CN107199643B (en) * 2017-06-28 2019-10-01 苏州阿特斯阳光电力科技有限公司 A kind of method of diamond wire cutting silicon rod
WO2019008530A1 (en) * 2017-07-07 2019-01-10 Meyer Burger (Switzerland) Ag Method of winding a cutting wire
JP6751900B2 (en) * 2018-01-29 2020-09-09 パナソニックＩｐマネジメント株式会社 Metal wire and saw wire
DE102018221921A1 (en) * 2018-12-17 2020-06-18 Siltronic Ag Method for manufacturing semiconductor wafers using a wire saw
DE102018221922A1 (en) * 2018-12-17 2020-06-18 Siltronic Ag Method for producing semiconductor wafers using a wire saw, wire saw and semiconductor wafer made of single-crystal silicon
CN113710398B (en) * 2019-04-18 2022-09-27 三菱电机株式会社 Wire electric discharge machining apparatus
CN110000942A (en) * 2019-05-14 2019-07-12 玉田县昌通电子有限公司 A kind of the roller method for winding and its roller winding structure of multi-line cutting machine
DE102019207719A1 (en) * 2019-05-27 2020-12-03 Siltronic Ag Method for severing a multiplicity of wafers from workpieces during a number of severing operations by means of a wire saw and semiconductor wafer made of monocrystalline silicon
JP7103305B2 (en) * 2019-05-29 2022-07-20 信越半導体株式会社 How to cut the ingot
CN110253775A (en) * 2019-07-26 2019-09-20 内蒙古中环光伏材料有限公司 A kind of slicer tension arm measure and control device and slice process
CN112793021A (en) * 2019-10-28 2021-05-14 洛阳阿特斯光伏科技有限公司 Silicon rod splicing method, spliced silicon rod and cutting method of spliced silicon rod
JP6761917B1 (en) * 2019-11-29 2020-09-30 Ｊｘ金属株式会社 Method for manufacturing indium phosphide substrate, semiconductor epitaxial wafer, and indium phosphide substrate
EP3858569A1 (en) * 2020-01-28 2021-08-04 Siltronic AG Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation operations
CN111421688A (en) * 2020-05-09 2020-07-17 西安奕斯伟硅片技术有限公司 Multi-wire cutting device and multi-wire cutting method
EP3922386A1 (en) * 2020-06-10 2021-12-15 Siltronic AG Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation operations
EP3922389A1 (en) 2020-06-10 2021-12-15 Siltronic AG Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation operations
KR102350628B1 (en) 2020-11-25 2022-01-14 주식회사 원광에스앤티 Solar panel cutting unit
CN113059707B (en) * 2021-02-23 2022-05-17 厦门大学 Device for adjusting wire mesh spacing in wire saw machining process and machining method
JP7198881B2 (en) * 2021-05-14 2023-01-04 日揚科技股▲分▼有限公司 Hard material processing system
CN113370406A (en) * 2021-05-24 2021-09-10 福州天瑞线锯科技有限公司 Bidirectional cutting method for silicon crystal bar
US11717930B2 (en) * 2021-05-31 2023-08-08 Siltronic Corporation Method for simultaneously cutting a plurality of disks from a workpiece
CN113799277B (en) * 2021-08-10 2024-04-19 威科赛乐微电子股份有限公司 Crystal multi-line cutting method
TWI803972B (en) * 2021-09-11 2023-06-01 環球晶圓股份有限公司 Ingot cutting method
CN114290542A (en) * 2021-12-17 2022-04-08 中国船舶重工集团公司第七一五研究所 1-3 composite material preparation method based on multi-wire cutting technology
CN114474443B (en) * 2022-02-22 2023-03-21 河北同光半导体股份有限公司 Offset cutting method of crystal
CN115056151A (en) * 2022-04-18 2022-09-16 安徽琼钰刷业有限公司 Twill polishing roller brush and production process thereof
CN114799498A (en) * 2022-04-18 2022-07-29 江苏中邦木业有限公司 Laser cutting device capable of quickly cutting floor
CN115275873A (en) * 2022-08-04 2022-11-01 国网福建省电力有限公司 Tension adjusting method for outlet tension of tension machine for transmission line tension paying-off walking plate to pass through corner tower
CN115791536A (en) * 2022-11-08 2023-03-14 西安奕斯伟材料科技有限公司 System and method for inspecting contamination particles in wire slots of a rotating shaft of a multi-wire saw

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01193165A (en) * 1988-01-28 1989-08-03 Osaka Titanium Co Ltd Wire saw machine
JP3396291B2 (en) * 1994-04-28 2003-04-14 株式会社日平トヤマ Wire saw and wire saw cutting method
JPH0938854A (en) * 1995-07-31 1997-02-10 Sharp Corp Wire supply device for multi-wire saw
MY120514A (en) * 1996-03-26 2005-11-30 Shinetsu Handotai Kk Wire saw and method of slicing a cylindrical workpiece
JP3202591B2 (en) * 1996-03-26 2001-08-27 信越半導体株式会社 How to cut wire saws and cylindrical workpieces
EP1287958A1 (en) 1996-03-26 2003-03-05 Shin-Etsu Handotai Co., Ltd Wire saw and method of slicing a cylindrical workpiece
JP3566449B2 (en) * 1996-03-27 2004-09-15 信越半導体株式会社 Workpiece cutting method with wire saw
JPH10166256A (en) * 1996-12-11 1998-06-23 Nippei Toyama Corp Wire saw
JPH10175153A (en) * 1996-12-17 1998-06-30 Nippei Toyama Corp Wire saw and cutting method of work
JPH1193165A (en) 1997-09-17 1999-04-06 Mitsubishi Heavy Ind Ltd Underwater fixing method for pile and underwater setting type structure
JP3660124B2 (en) * 1998-05-06 2005-06-15 株式会社日平トヤマ Ingot processing method using wire saw and wire saw
JP3389141B2 (en) * 1999-04-26 2003-03-24 株式会社スーパーシリコン研究所 Evaluation method of slurry for slicing and slurry
CN1175961C (en) * 1999-09-17 2004-11-17 株式会社新王磁材 Method and device for cutting rare-earth alloy
JP2001232550A (en) 2000-02-21 2001-08-28 Toyo Advanced Technologies Co Ltd Cutting method using wire saw and wire saw
JP4268765B2 (en) * 2001-02-27 2009-05-27 コマツＮｔｃ株式会社 Wire saw wire feeding method and feeder
JP2004243492A (en) 2003-02-14 2004-09-02 Kanai Hiroaki Saw wire for single wire saw
JP4236540B2 (en) * 2003-09-02 2009-03-11 株式会社ノリタケスーパーアブレーシブ Wire saw
JP2005153031A (en) * 2003-11-20 2005-06-16 Yasunaga Corp Wire saw and working fluid feed method of wire saw
LU91126B1 (en) 2004-12-23 2006-06-26 Trefilarbed Bettembourg S A Monofilament metal saw wire
CN100348391C (en) * 2005-09-13 2007-11-14 山东大学 Great diameter SiC monocrystal cutting method
JP2008023644A (en) * 2006-07-20 2008-02-07 Hitachi Cable Ltd Manufacturing method of substrate and wire saw device
WO2009041266A1 (en) * 2007-09-28 2009-04-02 Sharp Kabushiki Kaisha Solar cell wafer manufacturing method
KR101486302B1 (en) 2007-12-19 2015-01-26 신에쯔 한도타이 가부시키가이샤 Method for cutting work by wire saw and wire saw
JP5430144B2 (en) * 2008-04-24 2014-02-26 京セラ株式会社 Substrate manufacturing method and solar cell element
JP5007706B2 (en) 2008-06-30 2012-08-22 信越半導体株式会社 Work cutting method
JP4512155B2 (en) * 2008-09-02 2010-07-28 トーヨーエイテック株式会社 Wire saw operating method and wire saw
CN201317063Y (en) * 2008-09-03 2009-09-30 林丽美 Recovery device for powder from wafer cutting and grinding discharge water
GB2476658A (en) 2009-12-30 2011-07-06 Rec Wafer Norway As Process for cutting a block using a planar array of wires
US8991381B2 (en) 2010-02-08 2015-03-31 Toyo Advanced Technologies Co., Ltd. Method of cutting workpiece with wire saw, and wire saw
US8881716B2 (en) * 2010-02-08 2014-11-11 Toyo Advanced Technologies Co., Ltd. Wire saw with tension detecting means and guide roller speed control
JP2011230274A (en) * 2010-04-30 2011-11-17 Sharp Corp Saw wire and method for cutting silicon ingot using the same
CN201881053U (en) * 2010-10-25 2011-06-29 苏州德龙激光有限公司 Light-emitting diode (LED) wafer laser internal cutting scribing device
JP2012121101A (en) 2010-12-08 2012-06-28 Japan Fine Steel Co Ltd Fixed abrasive grain wire
WO2013041140A1 (en) * 2011-09-22 2013-03-28 APPLIED MATERIALS SWITZERLAND SàRL Method and apparatus for cutting semiconductor workpieces
JP5590001B2 (en) 2011-10-04 2014-09-17 信越半導体株式会社 Work cutting method and wire saw
EP2583778A1 (en) * 2011-10-20 2013-04-24 Applied Materials Switzerland Sàrl Method and apparatus for measuring wire-web bow in a wire saw
JP2013111674A (en) * 2011-11-25 2013-06-10 Jfe Steel Corp Machining method using fixed abrasive wire saw, and wafer
DE102012201938B4 (en) * 2012-02-09 2015-03-05 Siltronic Ag A method of simultaneously separating a plurality of slices from a workpiece
DE102012209974B4 (en) * 2012-06-14 2018-02-15 Siltronic Ag A method of simultaneously separating a plurality of slices from a cylindrical workpiece
CN103302754B (en) * 2013-06-19 2015-02-11 中国有色桂林矿产地质研究院有限公司 Diamond fretsaw cutting method and device

Also Published As

Publication number Publication date
CN107052452B (en) 2019-10-15
KR20160070738A (en) 2016-06-20
KR20160069512A (en) 2016-06-16
DE102014208187A1 (en) 2015-11-05
JP2015212007A (en) 2015-11-26
JP2016174173A (en) 2016-09-29
KR20150125577A (en) 2015-11-09
US9573296B2 (en) 2017-02-21
US20150314484A1 (en) 2015-11-05
DE102014208187B4 (en) 2023-07-06
KR101685329B1 (en) 2016-12-09
JP6366783B2 (en) 2018-08-01
JP2017208553A (en) 2017-11-24
CN105034181B (en) 2018-05-18
TW201545225A (en) 2015-12-01
CN107052452A (en) 2017-08-18
KR101715565B1 (en) 2017-03-13
TWI578392B (en) 2017-04-11
KR101689302B1 (en) 2016-12-23
JP6590756B2 (en) 2019-10-16
CN105034181A (en) 2015-11-11

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