SG10201406877WA - Method for chemical mechanical polishing silicon wafers - Google Patents

Method for chemical mechanical polishing silicon wafers

Info

Publication number
SG10201406877WA
SG10201406877WA SG10201406877WA SG10201406877WA SG10201406877WA SG 10201406877W A SG10201406877W A SG 10201406877WA SG 10201406877W A SG10201406877W A SG 10201406877WA SG 10201406877W A SG10201406877W A SG 10201406877WA SG 10201406877W A SG10201406877W A SG 10201406877WA
Authority
SG
Singapore
Prior art keywords
mechanical polishing
chemical mechanical
silicon wafers
polishing silicon
wafers
Prior art date
Application number
SG10201406877WA
Inventor
Itai Yasuyuki
Qian Bainian
Nakano Hiroyuki
B James David
Kawai Naoko
Kawabata Katsumasa
Yoshida Koichi
Miyamoto Kazutaka
Murnane James
Yeh Fengji
W Degroot Marty
Original Assignee
Rohm & Haas Elect Mat
Nitta Haas Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat, Nitta Haas Inc filed Critical Rohm & Haas Elect Mat
Publication of SG10201406877WA publication Critical patent/SG10201406877WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polyurethanes Or Polyureas (AREA)
SG10201406877WA 2013-10-24 2014-10-23 Method for chemical mechanical polishing silicon wafers SG10201406877WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/062,060 US8980749B1 (en) 2013-10-24 2013-10-24 Method for chemical mechanical polishing silicon wafers

Publications (1)

Publication Number Publication Date
SG10201406877WA true SG10201406877WA (en) 2015-05-28

Family

ID=52632216

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201406877WA SG10201406877WA (en) 2013-10-24 2014-10-23 Method for chemical mechanical polishing silicon wafers

Country Status (8)

Country Link
US (1) US8980749B1 (en)
JP (1) JP6463618B2 (en)
KR (1) KR102359116B1 (en)
CN (1) CN104551977B (en)
DE (1) DE102014015664A1 (en)
MY (1) MY172804A (en)
SG (1) SG10201406877WA (en)
TW (1) TWI621166B (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9314897B2 (en) * 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259821B2 (en) * 2014-06-25 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
CN113579992A (en) 2014-10-17 2021-11-02 应用材料公司 CMP pad construction with composite material properties using additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
WO2017074773A1 (en) 2015-10-30 2017-05-04 Applied Materials, Inc. An apparatus and method of forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
JP6697931B2 (en) * 2016-04-01 2020-05-27 富士紡ホールディングス株式会社 Polishing pad, polishing pad manufacturing method and polishing method
US20180281149A1 (en) 2017-03-31 2018-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. Abrasive delivery polishing pads and manufacturing methods thereof
JP7113626B2 (en) * 2018-01-12 2022-08-05 ニッタ・デュポン株式会社 polishing pad
KR20210042171A (en) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 Formulations for advanced polishing pads
CN110528287B (en) * 2019-08-08 2022-03-08 安徽安利材料科技股份有限公司 Brush type high-durability chemical mechanical polishing polyurethane material and preparation method thereof
CN110977756B (en) * 2019-12-27 2021-09-07 万华化学集团电子材料有限公司 Polishing layer of chemical mechanical polishing pad and application thereof
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN113214741B (en) * 2021-04-24 2022-03-11 深圳市撒比斯科技有限公司 High-stability CMP polishing solution

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283515A (en) 1992-03-31 1993-10-29 Nec Kansai Ltd Manufacture of semiconductor device
JP3055471B2 (en) 1996-10-03 2000-06-26 日本電気株式会社 Method for manufacturing semiconductor substrate and apparatus for manufacturing the same
JPH11277408A (en) 1998-01-29 1999-10-12 Shin Etsu Handotai Co Ltd Cloth, method and device for polishing mirror finished surface of semi-conductor wafer
GB2334205B (en) 1998-02-12 2001-11-28 Shinetsu Handotai Kk Polishing method for semiconductor wafer and polishing pad used therein
KR100685010B1 (en) 1999-08-31 2007-02-20 신에쯔 한도타이 가부시키가이샤 Method And Device For Polishing Semiconductor Wafer
US6189546B1 (en) 1999-12-29 2001-02-20 Memc Electronic Materials, Inc. Polishing process for manufacturing dopant-striation-free polished silicon wafers
JP2002292556A (en) 2001-03-29 2002-10-08 Sumitomo Osaka Cement Co Ltd Slurry, grindstone, pad and abrasive fluid for mirror polishing of silicon wafer, and mirror polishing method using these materials
JP2003037089A (en) * 2001-07-26 2003-02-07 Shin Etsu Handotai Co Ltd Method for polishing wafer
US6783436B1 (en) 2003-04-29 2004-08-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with optimized grooves and method of forming same
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
KR100709392B1 (en) * 2005-07-20 2007-04-20 에스케이씨 주식회사 Polishing Pad Containing Interpenetrating Liquified Vinyl Monomer Network With Polyurethane Matrix Therein
JP5019417B2 (en) * 2006-06-22 2012-09-05 東洋ゴム工業株式会社 Polishing pad manufacturing method and polishing pad
US7371160B1 (en) * 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
JP4986129B2 (en) * 2007-01-15 2012-07-25 東洋ゴム工業株式会社 Polishing pad
SG177963A1 (en) * 2007-01-15 2012-02-28 Toyo Tire & Rubber Co Polishing pad and method for producing the same
JP5297096B2 (en) 2007-10-03 2013-09-25 富士紡ホールディングス株式会社 Polishing cloth
JP5484145B2 (en) * 2010-03-24 2014-05-07 東洋ゴム工業株式会社 Polishing pad
JP5534907B2 (en) * 2010-03-31 2014-07-02 富士紡ホールディングス株式会社 Polishing pad and method of manufacturing polishing pad
CN102310366B (en) * 2010-07-08 2014-03-05 罗门哈斯电子材料Cmp控股股份有限公司 Chemical mechanical polishing pad with low-defect overall window
US20120264303A1 (en) 2011-04-15 2012-10-18 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing slurry, system and method
KR20140039043A (en) * 2011-07-15 2014-03-31 도레이 카부시키가이샤 Polishing pad
US9144880B2 (en) * 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad

Also Published As

Publication number Publication date
JP6463618B2 (en) 2019-02-06
DE102014015664A1 (en) 2015-04-30
US8980749B1 (en) 2015-03-17
CN104551977A (en) 2015-04-29
CN104551977B (en) 2018-01-09
KR20150047444A (en) 2015-05-04
KR102359116B1 (en) 2022-02-08
MY172804A (en) 2019-12-12
TW201535496A (en) 2015-09-16
TWI621166B (en) 2018-04-11
JP2015109437A (en) 2015-06-11

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