SE9701981D0 - Application of molten metal droplets together with secondary liquid on a substrate - Google Patents

Application of molten metal droplets together with secondary liquid on a substrate

Info

Publication number
SE9701981D0
SE9701981D0 SE9701981A SE9701981A SE9701981D0 SE 9701981 D0 SE9701981 D0 SE 9701981D0 SE 9701981 A SE9701981 A SE 9701981A SE 9701981 A SE9701981 A SE 9701981A SE 9701981 D0 SE9701981 D0 SE 9701981D0
Authority
SE
Sweden
Prior art keywords
solder
fluxing agent
enclosure
jet
space filled
Prior art date
Application number
SE9701981A
Other languages
Swedish (sv)
Other versions
SE515672C2 (en
SE9701981L (en
Inventor
Jens Hansson
Kenth Nilsson
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Priority to SE9701981A priority Critical patent/SE515672C2/en
Publication of SE9701981D0 publication Critical patent/SE9701981D0/en
Priority to AU76829/98A priority patent/AU7682998A/en
Priority to PCT/SE1998/001002 priority patent/WO1998053946A1/en
Publication of SE9701981L publication Critical patent/SE9701981L/en
Publication of SE515672C2 publication Critical patent/SE515672C2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/34—Applying different liquids or other fluent materials simultaneously
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating Apparatus (AREA)
  • Molten Solder (AREA)

Abstract

When applying solder paste to substrates, for example circuit boards, a jet comprising a fluxing agent (15) on top of a core of molten solder (11) is used. It is achieved by making a jet of molten solder (11) pass through a space filled with the fluxing agent. For suitable conditions the jet (19) is divided into drops (21), when it has passed out of the space filled with fluxing agent. Those drops, which hit the substrate, the consist of a core (22) of solidified solder surrounded by an enclosure (25) of fluxing agent. The applied solder paste thereby becomes completely fresh, which means that only an extremely small amount of oxide exists in the paste. Furthermore, in the corresponding way individual drops of solder can be ejected through the space filled with fluxing agent, which allows a very accurate dosing of the amount of solder paste, since the amount is determined by the number of solder balls and this number can be digitally controlled. This method can generally be used to apply a first liquid material having an enclosure of another liquid material, the first material advantageously being a material such as molten metal, which is significantly more heavy than the material of the enclosure.
SE9701981A 1997-05-27 1997-05-27 Application of molten metal droplets together with secondary liquid on a substrate SE515672C2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE9701981A SE515672C2 (en) 1997-05-27 1997-05-27 Application of molten metal droplets together with secondary liquid on a substrate
AU76829/98A AU7682998A (en) 1997-05-27 1998-05-27 Applying drops of a primary liquid together with a secondary liquid to a substrate
PCT/SE1998/001002 WO1998053946A1 (en) 1997-05-27 1998-05-27 Applying drops of a primary liquid together with a secondary liquid to a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9701981A SE515672C2 (en) 1997-05-27 1997-05-27 Application of molten metal droplets together with secondary liquid on a substrate

Publications (3)

Publication Number Publication Date
SE9701981D0 true SE9701981D0 (en) 1997-05-27
SE9701981L SE9701981L (en) 1998-11-28
SE515672C2 SE515672C2 (en) 2001-09-24

Family

ID=20407105

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9701981A SE515672C2 (en) 1997-05-27 1997-05-27 Application of molten metal droplets together with secondary liquid on a substrate

Country Status (3)

Country Link
AU (1) AU7682998A (en)
SE (1) SE515672C2 (en)
WO (1) WO1998053946A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60108413T2 (en) 2000-11-10 2005-06-02 Unitive Electronics, Inc. METHOD FOR POSITIONING COMPONENTS WITH THE HELP OF LIQUID DRIVES AND STRUCTURES THEREFOR
SE0102088D0 (en) * 2001-06-13 2001-06-13 Thomas Laurell Device for compound dispensing
US20070164089A1 (en) * 2006-01-19 2007-07-19 Nordson Corporation Method of dispensing small amounts of liquid material
GB0712860D0 (en) 2007-07-03 2007-08-08 Eastman Kodak Co continuous inkjet drop generation device
GB0712861D0 (en) * 2007-07-03 2007-08-08 Eastman Kodak Co Continuous ink jet printing of encapsulated droplets
US8939551B2 (en) 2012-03-28 2015-01-27 Eastman Kodak Company Digital drop patterning device and method
US8936353B2 (en) 2012-03-28 2015-01-20 Eastman Kodak Company Digital drop patterning device and method
US8936354B2 (en) 2012-03-28 2015-01-20 Eastman Kodak Company Digital drop patterning device and method
US8602535B2 (en) 2012-03-28 2013-12-10 Eastman Kodak Company Digital drop patterning device and method
SE2150599A1 (en) * 2021-05-11 2022-06-20 Mycronic AB Liquid metal jetting

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE400841B (en) * 1976-02-05 1978-04-10 Hertz Carl H WAY TO CREATE A LIQUID RAY AND DEVICE FOR IMPLEMENTING THE SET
DE3637631C1 (en) * 1986-11-05 1987-08-20 Philips Patentverwaltung Process for applying small amounts of molten, drop-shaped solder from a nozzle to surfaces to be wetted and device for carrying out the process
DK648187D0 (en) * 1987-12-09 1987-12-09 Linkease Test Systems A S METHOD AND APPARATUS FOR CIRCUIT MANUFACTURING
US5560543A (en) * 1994-09-19 1996-10-01 Board Of Regents, The University Of Texas System Heat-resistant broad-bandwidth liquid droplet generators

Also Published As

Publication number Publication date
SE515672C2 (en) 2001-09-24
AU7682998A (en) 1998-12-30
WO1998053946A1 (en) 1998-12-03
SE9701981L (en) 1998-11-28

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