DK648187D0 - METHOD AND APPARATUS FOR CIRCUIT MANUFACTURING - Google Patents

METHOD AND APPARATUS FOR CIRCUIT MANUFACTURING

Info

Publication number
DK648187D0
DK648187D0 DK648187A DK648187A DK648187D0 DK 648187 D0 DK648187 D0 DK 648187D0 DK 648187 A DK648187 A DK 648187A DK 648187 A DK648187 A DK 648187A DK 648187 D0 DK648187 D0 DK 648187D0
Authority
DK
Denmark
Prior art keywords
circuit manufacturing
manufacturing
circuit
Prior art date
Application number
DK648187A
Other languages
Danish (da)
Inventor
Rene Hammershoej
Allan Boeegh-Petersen
Original Assignee
Linkease Test Systems A S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linkease Test Systems A S filed Critical Linkease Test Systems A S
Priority to DK648187A priority Critical patent/DK648187D0/en
Publication of DK648187D0 publication Critical patent/DK648187D0/en
Priority to PCT/DK1988/000206 priority patent/WO1989005567A1/en
Priority to AU28190/89A priority patent/AU2819089A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • B41J3/4073—Printing on three-dimensional objects not being in sheet or web form, e.g. spherical or cubic objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/76—Apparatus for connecting with build-up interconnects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24226—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/76—Apparatus for connecting with build-up interconnects
    • H01L2224/7615—Means for depositing
    • H01L2224/76151—Means for direct writing
    • H01L2224/76155—Jetting means, e.g. ink jet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H01L2224/821—Forming a build-up interconnect
    • H01L2224/82101—Forming a build-up interconnect by additive methods, e.g. direct writing
    • H01L2224/82102—Forming a build-up interconnect by additive methods, e.g. direct writing using jetting, e.g. ink jet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
DK648187A 1987-12-09 1987-12-09 METHOD AND APPARATUS FOR CIRCUIT MANUFACTURING DK648187D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DK648187A DK648187D0 (en) 1987-12-09 1987-12-09 METHOD AND APPARATUS FOR CIRCUIT MANUFACTURING
PCT/DK1988/000206 WO1989005567A1 (en) 1987-12-09 1988-12-09 A method of producing an electronic circuit part and an apparatus for producing an electronic circuit part
AU28190/89A AU2819089A (en) 1987-12-09 1988-12-09 A method of producing an electronic circuit part and an apparatus for producing an electronic circuit part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DK648187A DK648187D0 (en) 1987-12-09 1987-12-09 METHOD AND APPARATUS FOR CIRCUIT MANUFACTURING

Publications (1)

Publication Number Publication Date
DK648187D0 true DK648187D0 (en) 1987-12-09

Family

ID=8148787

Family Applications (1)

Application Number Title Priority Date Filing Date
DK648187A DK648187D0 (en) 1987-12-09 1987-12-09 METHOD AND APPARATUS FOR CIRCUIT MANUFACTURING

Country Status (3)

Country Link
AU (1) AU2819089A (en)
DK (1) DK648187D0 (en)
WO (1) WO1989005567A1 (en)

Families Citing this family (25)

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US4901095A (en) * 1988-11-10 1990-02-13 Markem Corporation Ink jet printing apparatus with adjustable print head
DE19502434A1 (en) * 1994-04-29 1995-11-02 Hewlett Packard Co System and method for incrementally manufacturing circuit boards
JPH10278379A (en) 1997-04-09 1998-10-20 Seiko Epson Corp Printer printing method, and recording medium
SE515672C2 (en) * 1997-05-27 2001-09-24 Mydata Automation Ab Application of molten metal droplets together with secondary liquid on a substrate
JP2000033712A (en) * 1997-09-30 2000-02-02 Seiko Epson Corp Method for forming micro-sensor device and method for evaluating liquid function using the same
GB2330331B (en) * 1997-10-14 2002-04-10 Patterning Technologies Ltd Method of forming a circuit element on a surface
EP1027723B1 (en) 1997-10-14 2009-06-17 Patterning Technologies Limited Method of forming an electric capacitor
JP4003273B2 (en) 1998-01-19 2007-11-07 セイコーエプソン株式会社 Pattern forming method and substrate manufacturing apparatus
US7323634B2 (en) 1998-10-14 2008-01-29 Patterning Technologies Limited Method of forming an electronic device
WO2001029341A2 (en) * 1999-10-15 2001-04-26 Herman Miller, Inc. Methods and apparatus for decorating interior environments
GB2360489A (en) 2000-03-23 2001-09-26 Seiko Epson Corp Deposition of soluble materials
GB0030095D0 (en) * 2000-12-09 2001-01-24 Xaar Technology Ltd Method of ink jet printing
SE519904C2 (en) * 2000-12-29 2003-04-22 Amc Centurion Ab Manufacture of antenna devices
JP3958972B2 (en) * 2001-01-19 2007-08-15 矢崎総業株式会社 Circuit body manufacturing method and circuit body manufacturing apparatus
GB2382798A (en) * 2001-12-04 2003-06-11 Qinetiq Ltd Inkjet printer which deposits at least two fluids on a substrate such that the fluids react chemically to form a product thereon
ATE435589T1 (en) * 2003-09-02 2009-07-15 Pixdro Ltd METHOD AND SYSTEM FOR CREATING FINE LINES USING INKJET TECHNOLOGY
US20060190917A1 (en) * 2005-01-14 2006-08-24 Cabot Corporation System and process for manufacturing application specific printable circuits (ASPC'S) and other custom electronic devices
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US20060176350A1 (en) * 2005-01-14 2006-08-10 Howarth James J Replacement of passive electrical components
WO2006076608A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
GB0516278D0 (en) * 2005-08-08 2005-09-14 Xaar Technology Ltd Device and method of forming a device
EP2348525A4 (en) * 2008-06-30 2014-11-05 Konica Minolta Holdings Inc Wiring forming method
US20100085401A1 (en) * 2008-10-03 2010-04-08 Videojet Technologies Inc. Adjustable print head
WO2014140192A2 (en) * 2013-03-15 2014-09-18 Micronic Mydata AB Methods and devices for jetting viscous medium on workpieces
WO2015153223A2 (en) 2014-03-31 2015-10-08 Videojet Technologies Inc. Binary array inkjet printhead

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2316178C3 (en) * 1973-03-31 1975-09-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Process for the production of multi-layer conductor track structures on a substrate by means of a program-controlled tool used for the production of conductor tracks
SE400841B (en) * 1976-02-05 1978-04-10 Hertz Carl H WAY TO CREATE A LIQUID RAY AND DEVICE FOR IMPLEMENTING THE SET
DE3326508A1 (en) * 1983-07-22 1985-02-07 Bayer Ag, 5090 Leverkusen METHOD FOR ACTIVATING SUBSTRATE SURFACES FOR THE DIRECT PARTIAL METALIZATION OF CARRIER MATERIALS
DE3434334A1 (en) * 1984-09-19 1986-03-27 Robert Bosch Gmbh, 7000 Stuttgart METHOD FOR APPLYING SUSPENSIONS OF BURNABLE SOLIDS TO CERAMIC OR GLASS SUBSTRATES, AND DEVICE FOR CARRYING OUT THE METHOD
DE3539781A1 (en) * 1985-11-09 1987-05-14 Esme Tech Engineering & Elektr Method and device for producing an electrically conducting structure

Also Published As

Publication number Publication date
WO1989005567A1 (en) 1989-06-15
AU2819089A (en) 1989-07-05

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