SE9402854D0 - Self-locking heat sinks for surface mount devices - Google Patents

Self-locking heat sinks for surface mount devices

Info

Publication number
SE9402854D0
SE9402854D0 SE9402854A SE9402854A SE9402854D0 SE 9402854 D0 SE9402854 D0 SE 9402854D0 SE 9402854 A SE9402854 A SE 9402854A SE 9402854 A SE9402854 A SE 9402854A SE 9402854 D0 SE9402854 D0 SE 9402854D0
Authority
SE
Sweden
Prior art keywords
heat sink
self
surface mount
heat sinks
mount devices
Prior art date
Application number
SE9402854A
Other languages
English (en)
Other versions
SE9402854L (sv
Inventor
Christopher A Soule
Gary F Kuzmin
Original Assignee
Aavid Eng Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Eng Inc filed Critical Aavid Eng Inc
Publication of SE9402854D0 publication Critical patent/SE9402854D0/sv
Publication of SE9402854L publication Critical patent/SE9402854L/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/42—Independent, headed, aperture pass-through fastener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/45—Separable-fastener or required component thereof [e.g., projection and cavity to complete interlock]
    • Y10T24/45225—Separable-fastener or required component thereof [e.g., projection and cavity to complete interlock] including member having distinct formations and mating member selectively interlocking therewith
    • Y10T24/45597—Projection member including noninserted spring for engaging and pushing against receiving member

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SE9402854A 1992-02-28 1994-08-26 Anordning för att fästa ett kyldon till en elektronisk förpackning SE9402854L (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US84346292A 1992-02-28 1992-02-28
PCT/US1993/001678 WO1993017536A1 (en) 1992-02-28 1993-02-25 Self-locking heat sinks for surface mount devices

Publications (2)

Publication Number Publication Date
SE9402854D0 true SE9402854D0 (sv) 1994-08-26
SE9402854L SE9402854L (sv) 1994-10-26

Family

ID=25290056

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9402854A SE9402854L (sv) 1992-02-28 1994-08-26 Anordning för att fästa ett kyldon till en elektronisk förpackning

Country Status (9)

Country Link
US (1) US5384940A (sv)
CA (1) CA2129336C (sv)
DE (1) DE4390783C1 (sv)
GB (1) GB2278503B (sv)
NL (1) NL193740C (sv)
NO (1) NO943158D0 (sv)
RU (1) RU94045886A (sv)
SE (1) SE9402854L (sv)
WO (1) WO1993017536A1 (sv)

Families Citing this family (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9404266U1 (de) * 1994-03-14 1994-05-19 Siemens Nixdorf Informationssysteme AG, 33106 Paderborn Kühl- und Abschirmvorrichtung für eine integrierte Schaltung
US5586005A (en) * 1995-03-16 1996-12-17 International Business Machines Corporation Removable heat sink assembly for a chip package
US5640305A (en) * 1995-06-07 1997-06-17 Thermalloy, Inc. Anchor for securing a heat sink to a printed circuit board
GB2309827B (en) * 1996-01-30 1998-04-22 Samsung Electronics Co Ltd Surface complemental heat dissipation device
US5754401A (en) * 1996-02-16 1998-05-19 Sun Microsystems, Inc. Pressure compliantly protected heatsink for an electronic device
US5710694A (en) * 1996-04-30 1998-01-20 Evercool Technology Co., Ltd. Adjustable radiation fin fastening device for an integrated circuit chip
US5757621A (en) * 1996-06-06 1998-05-26 Lucent Technologies Inc. Heat sink assembly employing spring-loaded standoffs
US5761041A (en) * 1996-06-25 1998-06-02 Sun Microsystems, Inc. Mechanical heat sink attachment
US5847928A (en) * 1996-07-09 1998-12-08 Thermalloy, Inc. Strap spring for attaching heat sinks to circuit boards
TW346209U (en) * 1996-08-29 1998-11-21 Chuan Hsiang Co Ltd Elastic fastener for radiator of computer CPU
US5870285A (en) * 1996-10-25 1999-02-09 International Business Machines Corporation Assembly mounting techniques for heat sinks in electronic packaging
US5832987A (en) * 1997-03-21 1998-11-10 Lowry; David A. Rotatable heat transfer coupling
US6362516B1 (en) * 1997-04-03 2002-03-26 Motorola, Inc. Electronic apparatus
US5977622A (en) * 1997-04-25 1999-11-02 Lsi Logic Corporation Stiffener with slots for clip-on heat sink attachment
US5898571A (en) * 1997-04-28 1999-04-27 Lsi Logic Corporation Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages
US6011304A (en) * 1997-05-05 2000-01-04 Lsi Logic Corporation Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid
US6872053B2 (en) * 1997-05-05 2005-03-29 King Of Fans Quick install blade arms for ceiling fans
US6352411B1 (en) * 1997-05-05 2002-03-05 King Of Fans, Inc. Quick install blade arms for ceiling fans
DE29709210U1 (de) * 1997-05-26 1997-07-31 MAN Roland Druckmaschinen AG, 63075 Offenbach Verbindungselementekombination
US5870286A (en) * 1997-08-20 1999-02-09 International Business Machines Corporation Heat sink assembly for cooling electronic modules
US5978223A (en) * 1998-02-09 1999-11-02 International Business Machines Corporation Dual heat sink assembly for cooling multiple electronic modules
US5912804A (en) * 1998-05-08 1999-06-15 Schumacher Electric Corporation Diode holder with spring clamped heat sink
EP1002955A1 (en) 1998-11-17 2000-05-24 San-Chi Wu Connecting device for connecting a fan blade to a rotor of a motor of a ceiling fan
US6301113B1 (en) 1999-05-07 2001-10-09 Psc Computer Products, Inc. Retainer clip for heat sink for electronic components
TW443715U (en) * 1999-06-17 2001-06-23 Foxconn Prec Components Co Ltd Fastener of heat dissipation device
US6169660B1 (en) * 1999-11-01 2001-01-02 Thermal Corp. Stress relieved integrated circuit cooler
US20030175091A1 (en) * 2000-03-10 2003-09-18 Aukzemas Thomas V. Floating captive screw
GB2361585B (en) * 2000-04-18 2004-02-25 Sunonwealth Electr Mach Ind Co A heat-dissipating device for a heat-generating element
TW585387U (en) * 2000-04-20 2004-04-21 Foxconn Prec Components Co Ltd Heat sink locking device
TW468941U (en) * 2000-05-25 2001-12-11 Foxconn Prec Components Co Ltd Fastening device of thermal dissipative device
US6386785B1 (en) * 2000-06-22 2002-05-14 Sunonwealth Electric Machine Industry Co., Ltd. Engaging post for a heat-dissipating device
US6507981B1 (en) * 2000-11-20 2003-01-21 International Business Machines Corporation Fastener carrier
DE10124274A1 (de) * 2001-05-18 2002-11-21 Daimler Chrysler Ag Schaltvorrichtung für ein Kraftfahrzeuggetriebe
US6392889B1 (en) * 2001-08-21 2002-05-21 Foxconn Precision Components Co., Ltd. Fastener for heat sink
US6496372B1 (en) * 2001-09-26 2002-12-17 Intel Corporation Heat sink fastener for an electronic device
US6545879B1 (en) 2002-01-10 2003-04-08 Tyco Electronics Corporation Method and apparatus for mounting a lidless semiconductor device
JP2003249607A (ja) * 2002-02-26 2003-09-05 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
DE10214311A1 (de) * 2002-03-28 2003-10-09 Marconi Comm Gmbh Kühlanordnung für ein elektronisches Bauelement
TW540988U (en) * 2002-10-04 2003-07-01 Hon Hai Prec Ind Co Ltd A heat dissipating assembly
DE10254720A1 (de) * 2002-11-23 2004-06-03 Endress + Hauser Gmbh + Co. Kg Messgerät
TW545885U (en) * 2002-11-29 2003-08-01 Hon Hai Prec Ind Co Ltd Heat dissipation assembly
GB2396482A (en) * 2002-12-18 2004-06-23 First Int Computer Inc Heat sink for CPU comprising resilient mounting
US6697256B1 (en) * 2003-02-06 2004-02-24 Sunonwealth Electric Machine Industry Co., Ltd. Fastening device for attaching a heat sink to heat producer
JP4272169B2 (ja) * 2003-04-16 2009-06-03 富士通株式会社 電子部品パッケージ組立体およびプリント基板ユニット
TWM244719U (en) * 2003-08-27 2004-09-21 Hon Hai Prec Ind Co Ltd Heat sink
TWM246964U (en) * 2003-09-30 2004-10-11 Hon Hai Prec Ind Co Ltd Clip for heat sink
CN2672712Y (zh) * 2003-11-21 2005-01-19 鸿富锦精密工业（深圳）有限公司 固定装置
US20050207119A1 (en) * 2004-03-17 2005-09-22 Huang Ming T Heat dissipation module of an interface card
JP4212511B2 (ja) * 2004-05-06 2009-01-21 富士通株式会社 半導体装置及び半導体装置の組立方法
US7344345B2 (en) * 2004-05-27 2008-03-18 Southco, Inc. Captive shoulder nut having spring tie-down
TWI251917B (en) * 2004-09-02 2006-03-21 Advanced Semiconductor Eng Chip package for fixing heat spreader and method for packaging the same
JP4498163B2 (ja) 2005-02-08 2010-07-07 株式会社東芝 電子機器の放熱装置
JP2006222388A (ja) * 2005-02-14 2006-08-24 Toshiba Corp 電子機器の放熱装置及び放熱方法
JP2006229046A (ja) * 2005-02-18 2006-08-31 Toshiba Corp 電子機器の放熱装置及び放熱方法
JP4445409B2 (ja) * 2005-02-23 2010-04-07 株式会社東芝 電子機器の放熱装置
CN2810112Y (zh) * 2005-05-20 2006-08-23 富准精密工业(深圳)有限公司 散热装置
US7342796B2 (en) * 2005-06-03 2008-03-11 Southco, Inc. Captive shoulder nut assembly
DE102005026233B4 (de) * 2005-06-07 2008-08-07 Tyco Electronics Ec Kft Elektrisches Leistungsmodul
DE102005028431A1 (de) * 2005-06-17 2006-12-21 Bosch Rexroth Ag Wärmeableitvorrichtung
US7870888B2 (en) * 2005-08-26 2011-01-18 Illinois Tool Works Inc. Base for heat radiator, heat dissipation assembly for central processing unit, and method of using the same
US20070063539A1 (en) * 2005-09-12 2007-03-22 Dimario Joseph Snap-in mounting clip, panel having a snap-in mounting clip, and method of mounting the panel
US7310226B2 (en) * 2005-11-22 2007-12-18 Super Micro Computer, Inc. Modularized redundant heat sink for dissipating heat generated from chips
DE102006027751A1 (de) * 2006-06-16 2007-12-20 Robert Bosch Gmbh Befestigungselement zur Befestigung und/oder Vorfixierung eines Bauteils an einer mit einer Öffnung versehenen Halterung sowie Bauteil mit Befestigungselement
CN100469226C (zh) * 2006-07-12 2009-03-11 鸿富锦精密工业（深圳）有限公司 散热装置组合及其所使用的扣具
CN100574582C (zh) * 2006-08-11 2009-12-23 鸿富锦精密工业（深圳）有限公司 散热装置组合及其所使用的扣具
US20080068805A1 (en) * 2006-09-15 2008-03-20 Foxconn Technology Co., Ltd. Heat sink assembly for multiple electronic components
US9028087B2 (en) 2006-09-30 2015-05-12 Cree, Inc. LED light fixture
US9243794B2 (en) 2006-09-30 2016-01-26 Cree, Inc. LED light fixture with fluid flow to and from the heat sink
US7952262B2 (en) * 2006-09-30 2011-05-31 Ruud Lighting, Inc. Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules
US20090086491A1 (en) * 2007-09-28 2009-04-02 Ruud Lighting, Inc. Aerodynamic LED Floodlight Fixture
US7686469B2 (en) 2006-09-30 2010-03-30 Ruud Lighting, Inc. LED lighting fixture
KR100834032B1 (ko) 2006-10-20 2008-05-30 삼성전기주식회사 히트 싱크
TW200822841A (en) * 2006-11-13 2008-05-16 Ama Precision Inc Fastener and heat dissipation module having the same
US7405938B2 (en) * 2006-11-30 2008-07-29 Hon Hai Precision Industry Co., Ltd. Heat sink clip
US7609522B2 (en) * 2006-12-01 2009-10-27 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly
US7848002B2 (en) * 2006-12-26 2010-12-07 Silicon Quest Kabushiki-Kaisha Method for aligning die to substrate
US7489511B2 (en) * 2006-12-28 2009-02-10 Hon Hai Precision Industry Co., Ltd. Heat sink clip
US20080192440A1 (en) * 2007-02-14 2008-08-14 Asustek Computer Inc. Connection assembly
US8112884B2 (en) 2007-10-08 2012-02-14 Honeywell International Inc. Method for providing an efficient thermal transfer through a printed circuit board
US20090308572A1 (en) * 2008-06-11 2009-12-17 Adc Telecommunications, Inc. Apparatus for accepting a self-drilling screw
US8063485B1 (en) 2008-06-27 2011-11-22 Advanced Thermal Solutions, Inc. Electronics package with integrated lugs for cooling attachment
TWI398582B (zh) * 2009-04-01 2013-06-11 Kuo Chung Wang Fixtures
CN102056458A (zh) * 2009-10-30 2011-05-11 鸿富锦精密工业（深圳）有限公司 扣具及使用该扣具的散热装置及电子装置
CA2786119A1 (en) * 2009-12-30 2011-07-07 Lumenpulse Lighting Inc. High powered light emitting diode lighting unit
CN201725266U (zh) * 2010-06-17 2011-01-26 深圳富泰宏精密工业有限公司 内存条散热组件
TW201216038A (en) * 2010-10-14 2012-04-16 Hon Hai Prec Ind Co Ltd Radiation element and electronic device using same
CN102458038A (zh) * 2010-10-18 2012-05-16 鸿富锦精密工业（深圳）有限公司 散热件及具有该散热件的电子装置
US8974077B2 (en) 2012-07-30 2015-03-10 Ultravision Technologies, Llc Heat sink for LED light source
US8870410B2 (en) 2012-07-30 2014-10-28 Ultravision Holdings, Llc Optical panel for LED light source
US9062873B2 (en) 2012-07-30 2015-06-23 Ultravision Technologies, Llc Structure for protecting LED light source from moisture
CN104516428A (zh) * 2013-09-30 2015-04-15 辉达公司 推销和具有该推销的显卡
US9883612B2 (en) 2015-06-02 2018-01-30 International Business Machines Corporation Heat sink attachment on existing heat sinks
EP3163341A1 (en) 2015-10-27 2017-05-03 CCS Technology, Inc. Distribution point unit for coupling external electrical and optical cables
WO2019034246A1 (en) 2017-08-16 2019-02-21 Arcelik Anonim Sirketi SURFACE MOUNTING THERMAL DISSIPATORS FOR PRINTED CIRCUIT BOARDS AND METHOD OF ASSEMBLING THE SAME
JP6673889B2 (ja) * 2017-10-31 2020-03-25 ファナック株式会社 電子装置
TWI669480B (zh) * 2019-01-22 2019-08-21 奇鋐科技股份有限公司 固定結構之承載單元及散熱總成之固定結構

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2567508A (en) * 1947-12-19 1951-09-11 Lawrence E Carson Fastener
US3154281A (en) * 1962-02-20 1964-10-27 Frank Charles Holder for electronic components
DE1580630A1 (de) * 1966-07-20 1971-03-04 Raymond A Fa Befestigungsklemme
US3688635A (en) * 1971-03-04 1972-09-05 Richco Plastic Co Circuit board support
US3764729A (en) * 1971-11-29 1973-10-09 Admiral Corp Releasable lock support for printed circuit module
US4224663A (en) * 1979-02-01 1980-09-23 Power Control Corporation Mounting assembly for semiconductive controlled rectifiers
FR2541738B1 (fr) * 1983-02-28 1985-06-07 Alsthom Cgee Dispositif de fixation d'un objet sur une paroi
DE3409037A1 (de) * 1984-03-13 1985-09-19 Robert Bosch Gmbh, 7000 Stuttgart Elektrisches schaltgeraet
GB8421499D0 (en) * 1984-08-24 1984-09-26 British Telecomm Heat sink
US4934885A (en) * 1985-02-25 1990-06-19 The Boeing Company Tack fastener
DE3531958C2 (de) * 1985-09-07 1994-03-24 Bosch Gmbh Robert Vorrichtung zum Abstützen von in ein Gehäuse einschiebbaren Leiterplatten
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
US4710852A (en) * 1986-09-26 1987-12-01 General Motors Corporation Spring retainer for encapsulated semiconductor device
US4709302A (en) * 1986-12-16 1987-11-24 Thermalloy Incorporated Alignment apparatus for electronic device package
US4760495A (en) * 1987-04-16 1988-07-26 Prime Computer Inc. Stand-off device
US4878108A (en) * 1987-06-15 1989-10-31 International Business Machines Corporation Heat dissipation package for integrated circuits
FR2629153B1 (fr) * 1988-03-22 1990-05-04 Bull Sa Dispositif de fixation a pression de deux pieces l'une a l'autre
US4981322A (en) * 1988-06-10 1991-01-01 United Technologies Corporation, Inc. Assist strap for a motor vehicle
US4872089A (en) * 1988-12-19 1989-10-03 Motorola Inc. Heat sink assembly for densely packed transistors
DE4020194C1 (en) * 1990-06-25 1991-10-02 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De Heat sink for open chip - has flange in which hook-shaped gripping arms joined to tubular base engage
US5124883A (en) * 1990-10-31 1992-06-23 Elcon Products International Company Printed circuit board power plug contact

Also Published As

Publication number Publication date
NL193740C (nl) 2000-08-04
NL9320023A (nl) 1995-01-02
NL193740B (nl) 2000-04-03
GB9415403D0 (en) 1994-09-28
GB2278503B (en) 1995-08-23
DE4390783C1 (de) 1999-11-25
WO1993017536A1 (en) 1993-09-02
CA2129336A1 (en) 1993-09-02
SE9402854L (sv) 1994-10-26
CA2129336C (en) 1998-05-05
GB2278503A (en) 1994-11-30
NO943158L (no) 1994-08-26
NO943158D0 (no) 1994-08-26
RU94045886A (ru) 1996-06-10
US5384940A (en) 1995-01-31

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