SE8505725L - Invarfolie - Google Patents
InvarfolieInfo
- Publication number
- SE8505725L SE8505725L SE8505725A SE8505725A SE8505725L SE 8505725 L SE8505725 L SE 8505725L SE 8505725 A SE8505725 A SE 8505725A SE 8505725 A SE8505725 A SE 8505725A SE 8505725 L SE8505725 L SE 8505725L
- Authority
- SE
- Sweden
- Prior art keywords
- invarfolie
- invar
- foil
- electro
- production
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE8505725A SE8505725L (sv) | 1985-12-04 | 1985-12-04 | Invarfolie |
JP28975186A JPS63149393A (ja) | 1985-12-04 | 1986-12-04 | インバ−ル・ホイル |
EP86116848A EP0224922A3 (en) | 1985-12-04 | 1986-12-04 | Invar foil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE8505725A SE8505725L (sv) | 1985-12-04 | 1985-12-04 | Invarfolie |
Publications (2)
Publication Number | Publication Date |
---|---|
SE8505725D0 SE8505725D0 (sv) | 1985-12-04 |
SE8505725L true SE8505725L (sv) | 1987-06-05 |
Family
ID=20362332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8505725A SE8505725L (sv) | 1985-12-04 | 1985-12-04 | Invarfolie |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0224922A3 (sv) |
JP (1) | JPS63149393A (sv) |
SE (1) | SE8505725L (sv) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5073840A (en) * | 1988-10-06 | 1991-12-17 | Microlithics Corporation | Circuit board with coated metal support structure and method for making same |
JPH03229892A (ja) * | 1990-02-05 | 1991-10-11 | Mitsui Mining & Smelting Co Ltd | 電解インバー複合箔 |
JP6084899B2 (ja) * | 2013-06-07 | 2017-02-22 | 株式会社Jcu | 低熱膨張係数および高硬度を有する鉄−ニッケル合金用電気メッキ浴およびこれを用いた電気メッキ方法 |
US20160192488A1 (en) * | 2014-12-30 | 2016-06-30 | Samsung Electro-Mechanics Co., Ltd. | Circuit board, multilayered substrate having the circuit board and method of manufacturing the circuit board |
-
1985
- 1985-12-04 SE SE8505725A patent/SE8505725L/sv not_active Application Discontinuation
-
1986
- 1986-12-04 JP JP28975186A patent/JPS63149393A/ja active Pending
- 1986-12-04 EP EP86116848A patent/EP0224922A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JPS63149393A (ja) | 1988-06-22 |
EP0224922A2 (en) | 1987-06-10 |
SE8505725D0 (sv) | 1985-12-04 |
EP0224922A3 (en) | 1987-09-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |
Ref document number: 8505725-5 Effective date: 19881216 Format of ref document f/p: F |